SN54LVTH16244A,, SN74LVTH16244A 3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com FEATURES • • • • • • • • • Members of the Texas Instruments Widebus™ Family State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC) Support Unregulated Battery Operation Down to 2.7 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Ioff and Power-Up 3-State Support Hot Insertion Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Latch-Up Performance Exceeds 500 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) SCBS142T – MAY 1992 – REVISED NOVEMBER 2006 SN54LVTH16244A . . . WD PACKAGE SN74LVTH16244A . . . DGG, DGV, OR DL PACKAGE (TOP VIEW) 1OE 1Y1 1Y2 GND 1Y3 1Y4 VCC 2Y1 2Y2 GND 2Y3 2Y4 3Y1 3Y2 GND 3Y3 3Y4 VCC 4Y1 4Y2 GND 4Y3 4Y4 4OE 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 2OE 1A1 1A2 GND 1A3 1A4 VCC 2A1 2A2 GND 2A3 2A4 3A1 3A2 GND 3A3 3A4 VCC 4A1 4A2 GND 4A3 4A4 3OE DESCRIPTION/ORDERING INFORMATION The 'LVTH16244A devices are 16-bit buffers and line drivers designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical active-low output-enable (OE) inputs. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1992–2006, Texas Instruments Incorporated SN54LVTH16244A,, SN74LVTH16244A 3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCBS142T – MAY 1992 – REVISED NOVEMBER 2006 ORDERING INFORMATION PACKAGE (1) TA FBGA – GRD FBGA – ZRD (Pb-free) ORDERABLE PART NUMBER Reel of 1000 Tube of 25 SSOP – DL Reel of 1000 –40°C to 85°C SN74LVTH16244AGRDR SN74LVTH16244AZRDR TOP-SIDE MARKING LL244A SN74LVTH16244ADL SN74LVTH16244ADLG4 SN74LVTH16244ADLR LVTH16244A 74LVTH16244ADLRG4 SN74LVTH16244ADGGR TSSOP – DGG Reel of 2000 74LVTH16244ADGGRE4 LVTH16244A 74LVTH16244ADGGRG4 TVSOP – DGV VFBGA – GQL VFBGA – ZQL (Pb-free) –55°C to 125°C (1) 2 CFP – WD Reel of 2000 Reel of 1000 Tube SN74LVTH16244ADGVR 74LVTH16244ADGVRE4 SN74LVTH16244AGQLR SN74LVTH16244AZQLR SNJ54LVTH16244AWD LL244A LL244A SNJ54LVTH16244AWD Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Submit Documentation Feedback SN54LVTH16244A,, SN74LVTH16244A 3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCBS142T – MAY 1992 – REVISED NOVEMBER 2006 TERMINAL ASSIGNMENTS (1) (56-Ball GQL/ZQL Package) GQL OR ZQL PACKAGE (TOP VIEW) 1 2 3 4 5 6 A B C D E F G H J K 1 2 3 4 5 6 A 1OE NC NC NC NC 2OE B 1Y2 1Y1 GND GND 1A1 1A2 C 1Y4 1Y3 VCC VCC 1A3 1A4 D 2Y2 2Y1 GND GND 2A1 2A2 E 2Y4 2Y3 2A3 2A4 F 3Y1 3Y2 3A2 3A1 G 3Y3 3Y4 GND GND 3A4 3A3 H 4Y1 4Y2 VCC VCC 4A2 4A1 J 4Y3 4Y4 GND GND 4A4 4A3 K 4OE NC NC NC NC 3OE blk blk blk (1) NC – No internal connection xxxxx xxxxx xxxxx GRD OR ZRD PACKAGE (TOP VIEW) 1 2 3 4 5 6 TERMINAL ASSIGNMENTS (1) (54-Ball GRD/ZRD Package) 1 2 3 4 5 6 A 1Y1 NC 1OE 2OE NC 1A1 B 1Y3 1Y2 NC NC 1A2 1A3 C 2Y1 1Y4 VCC VCC 1A4 2A1 C D 2Y3 2Y2 GND GND 2A2 2A3 D E 3Y1 2Y4 GND GND 2A4 3A1 F 3Y3 3Y2 GND GND 3A2 3A3 G 4Y1 3Y4 VCC VCC 3A4 4A1 H 4Y3 4Y2 NC NC 4A2 4A3 J 4Y4 NC 4OE 3OE NC 4A4 A B E F G H J (1) NC – No internal connection Submit Documentation Feedback 3 SN54LVTH16244A,, SN74LVTH16244A 3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCBS142T – MAY 1992 – REVISED NOVEMBER 2006 FUNCTION TABLE (EACH 4-BIT BUFFER) INPUTS OE A OUTPUT Y L H H L L L H X Z LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1A1 1A2 1A3 1A4 2OE 2A1 2A2 2A3 2A4 1 3OE 47 2 46 3 44 5 43 6 1Y1 3A1 1Y2 3A2 1Y3 3A3 1Y4 3A4 48 4OE 41 8 40 9 38 11 37 12 2Y1 4A1 2Y2 4A2 2Y3 4A3 2Y4 4A4 25 36 13 35 14 33 16 32 17 3Y2 3Y3 3Y4 24 30 19 29 20 27 22 26 23 Pin numbers shown are for the DGG, DGV, DL, and WD packages. 4 3Y1 Submit Documentation Feedback 4Y1 4Y2 4Y3 4Y4 SN54LVTH16244A,, SN74LVTH16244A 3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCBS142T – MAY 1992 – REVISED NOVEMBER 2006 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VI Input voltage range (2) –0.5 7 V state (2) VO Voltage range applied to any output in the high-impedance or power-off VO Voltage range applied to any output in the high state (2) IO Current into any output in the low state IO Current into any output in the high state (3) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA θJA Package thermal Tstg (1) (2) (3) (4) impedance (4) –0.5 7 –0.5 VCC + 0.5 UNIT SN54LVTH16244A 96 SN74LVTH16244A 128 SN54LVTH16244A 48 SN74LVTH16244A 64 DGG package 70 DGV package 58 DL package 63 GQL/ZQL package 42 GRD/ZRD package 36 Storage temperature range –65 150 V V V °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The current flows only when the output is in the high state and VO > VCC. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) SN54LVTH16244A SN74LVTH16244A MIN MAX MIN MAX 2.7 3.6 2.7 3.6 UNIT VCC Supply voltage VIH High-level input voltage VIL Low-level input voltage 0.8 0.8 VI Input voltage 5.5 5.5 V IOH High-level output current –25 –32 mA IOL Low-level output current 48 64 mA ∆t/∆v Input transition rise or fall rate 10 10 ns/V ∆t/∆VCC Power-up ramp rate 200 TA Operating free-air temperature –55 (1) 2 Outputs enabled V 2 V µs/V 200 125 –40 V 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback 5 SN54LVTH16244A,, SN74LVTH16244A 3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCBS142T – MAY 1992 – REVISED NOVEMBER 2006 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH SN54LVTH16244A TEST CONDITIONS MIN TYP (1) VCC = 2.7 V, II = –18 mA VCC = 2.7 V to 3.6 V, IOL = –100 µA VCC = 2.7 V, IOH = –8 mA VCC = 3 V VCC = 2.7 V VOL VCC = 3 V IOH = –24 mA SN74LVTH16244A MAX MIN TYP (1) –1.2 II Data inputs VCC – 0.2 VCC – 0.2 2.4 2.4 IOH = –32 mA Ioff 2 IOL = 100 µA 0.2 0.2 IOL = 24 mA 0.5 0.5 IOL = 16 mA 0.4 0.4 IOL = 32 mA 0.5 0.5 IOL = 48 mA 0.55 II(hold) 10 VCC = 3.6 V, VI = VCC or GND ±1 ±1 1 1 Data inputs VCC = 3 V VI = VCC VI = 0 –5 VI = 2 V VI = 0 to 3.6 V IOZH VCC = 3.6 V, VO = 3 V IOZL VCC = 3.6 V, VO = 0.5 V µA –5 ±100 VI or VO = 0 to 4.5 V VCC = 3.6 V (2), 75 75 –75 –75 µA µA 500 – 750 5 5 µA –5 –5 µA IOZPU VCC = 0 to 1.5 V, VO = 0.5 V to 3 V, OE = don't care ±100 (3) ±100 µA IOZPD VCC = 1.5 V to 0, VO = 0.5 V to 3 V, OE = don't care ±100 (3) ±100 µA 0.19 0.19 ICC VCC = 3.6 V, IO = 0, VI = VCC or GND Outputs high Outputs low Outputs disabled 5 5 0.19 0.19 0.2 0.2 mA ∆ICC (4) VCC = 3 V to 3.6 V, One input at VCC – 0.6 V, Other inputs at VCC or GND Ci VI = 3 V or 0 V 4 4 pF Co VO = 3 V or 0 V 9 9 pF (1) (2) (3) (4) 6 50 VI = 0.8 V V 0.55 VI = 5.5 V VCC = 0, V V 2 VCC = 0 or 3.6 V, VCC = 3.6 V UNIT –1.2 IOL = 64 mA Control inputs MAX All typical values are at VCC = 3.3 V, TA = 25°C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. On products compliant to MIL-PRF-38535, this parameter does not apply. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. Submit Documentation Feedback mA SN54LVTH16244A,, SN74LVTH16244A 3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCBS142T – MAY 1992 – REVISED NOVEMBER 2006 Switching Characteristics over recommended operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1 ) SN54LVTH16244A PARAMETER tPLH tPHL tPZH tPZL tPHZ tPLZ (1) FROM (INPUT) TO (OUTPUT) A Y OE Y OE Y VCC = 3.3 V ± 0.3 V SN74LVTH16244A VCC = 2.7 V VCC = 3.3 V ± 0.3 V MIN TYP (1) VCC = 2.7 V MIN MAX MIN MAX 1.1 4.4 4.6 1.2 2.3 MAX 3.2 3.7 1.1 3.6 3.9 1.2 2 3.2 3.7 1.1 4.6 5.4 1.2 2.6 4 5 1.1 5.4 6.2 1.2 2.7 4 5 1.6 5.7 6.2 2.2 3.3 4.5 5 1.2 5 4.7 2 3.1 4.2 4.4 tsk(LH) 0.5 tsk(HL) 0.5 MIN UNIT MAX ns ns ns ns All typical values are at VCC = 3.3 V, TA = 25°C. Submit Documentation Feedback 7 SN54LVTH16244A,, SN74LVTH16244A 3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCBS142T – MAY 1992 – REVISED NOVEMBER 2006 PARAMETER MEASUREMENT INFORMATION 6V 500 Ω From Output Under Test S1 Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 6V GND 2.7 V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 2.7 V Input 1.5 V th 2.7 V 1.5 V Data Input 1.5 V 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 2.7 V Input 1.5 V 1.5 V 0V tPHL tPLH VOH Output 1.5 V 1.5 V VOL tPHL Output Waveform 1 S1 at 6 V (see Note B) 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 1.5 V 0V tPZL tPLZ 3V 1.5 V tPZH tPLH VOH Output 2.7 V Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 8 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing 5962-9668501QXA ACTIVE CFP WD 48 1 TBD A42 N / A for Pkg Type 5962-9668501VXA ACTIVE CFP WD 48 1 TBD A42 N / A for Pkg Type 74LVTH16244ADGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74LVTH16244ADGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74LVTH16244ADGVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74LVTH16244ADGVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74LVTH16244ADLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH16244ADGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH16244ADGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH16244ADL ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH16244ADLG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH16244ADLR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH16244AGQLR NRND BGA MI CROSTA R JUNI OR GQL 56 1000 TBD SNPB Level-1-240C-UNLIM SN74LVTH16244AGRDR ACTIVE BGA MI CROSTA R JUNI OR GRD 54 1000 TBD SNPB Level-1-240C-UNLIM SN74LVTH16244AZQLR ACTIVE BGA MI CROSTA R JUNI OR ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM SN74LVTH16244AZRDR ACTIVE BGA MI CROSTA R JUNI OR ZRD 54 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM SNJ54LVTH16244AWD ACTIVE WD 48 CFP Pins Package Eco Plan (2) Qty 1 TBD Lead/Ball Finish A42 MSL Peak Temp (3) N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54LVTH16244A, SN54LVTH16244A-SP, SN74LVTH16244A : • Enhanced Product: SN74LVTH16244A-EP NOTE: Qualified Version Definitions: • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Aug-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.6 15.8 1.8 12.0 24.0 Q1 SN74LVTH16244ADGGR TSSOP DGG 48 2000 330.0 24.4 SN74LVTH16244ADGVR TVSOP DGV 48 2000 330.0 16.4 7.1 10.2 1.6 12.0 16.0 Q1 DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 SN74LVTH16244AGQLR BGA MI CROSTA R JUNI OR GQL 56 1000 330.0 16.4 4.8 7.3 1.45 8.0 16.0 Q1 SN74LVTH16244AGRDR BGA MI CROSTA R JUNI OR GRD 54 1000 330.0 16.4 5.8 8.3 1.55 8.0 16.0 Q1 SN74LVTH16244AZQLR BGA MI CROSTA R JUNI OR ZQL 56 1000 330.0 16.4 4.8 7.3 1.45 8.0 16.0 Q1 SN74LVTH16244AZRDR BGA MI CROSTA R JUNI OR ZRD 54 1000 330.0 16.4 5.8 8.3 1.55 8.0 16.0 Q1 SN74LVTH16244ADLR SSOP Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Aug-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVTH16244ADGGR TSSOP DGG 48 2000 346.0 346.0 41.0 SN74LVTH16244ADGVR TVSOP DGV 48 2000 346.0 346.0 33.0 SN74LVTH16244ADLR SSOP DL 48 1000 346.0 346.0 49.0 SN74LVTH16244AGQLR BGA MICROSTAR JUNIOR GQL 56 1000 346.0 346.0 33.0 SN74LVTH16244AGRDR BGA MICROSTAR JUNIOR GRD 54 1000 346.0 346.0 33.0 SN74LVTH16244AZQLR BGA MICROSTAR JUNIOR ZQL 56 1000 346.0 346.0 33.0 SN74LVTH16244AZRDR BGA MICROSTAR JUNIOR ZRD 54 1000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997 WD (R-GDFP-F**) CERAMIC DUAL FLATPACK 48 LEADS SHOWN 0.120 (3,05) 0.075 (1,91) 0.009 (0,23) 0.004 (0,10) 1.130 (28,70) 0.870 (22,10) 0.370 (9,40) 0.250 (6,35) 0.390 (9,91) 0.370 (9,40) 0.370 (9,40) 0.250 (6,35) 48 1 0.025 (0,635) A 0.014 (0,36) 0.008 (0,20) 25 24 NO. OF LEADS** 48 56 A MAX 0.640 (16,26) 0.740 (18,80) A MIN 0.610 (15,49) 0.710 (18,03) 4040176 / D 10/97 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification only Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO -146AA GDFP1-F56 and JEDEC MO -146AB POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP® Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2009, Texas Instruments Incorporated