SN74CB3Q3251 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS173A – AUGUST 2004 – REVISED MARCH 2005 • • (1) For additional information regarding the performance characteristics of the CB3Q family, refer to the TI application report, CBT-C, CB3T, and CB3Q Signal-Switch Families, literature number SCDA008. • • • • DBQ, DGV, OR PW PACKAGE (TOP VIEW) B4 B3 B2 B1 A NC OE GND 1 16 2 15 3 14 4 13 5 12 6 7 11 10 8 9 VCC B5 B6 B7 B8 S0 S1 S2 NC - No internal connection RGY PACKAGE (TOP VIEW) B3 B2 B1 A NC OE VCC • • 1 16 15 B5 14 B6 2 3 4 13 B7 12 B8 11 S0 5 6 10 S1 7 8 9 S2 • • • • Data and Control Inputs Provide Undershoot Clamp Diodes Low Power Consumption (ICC = 1 mA Typ) VCC Operating Range From 2.3 V to 3.6 V Data I/Os Support 0- to 5-V Signaling Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) Supports Both Digital and Analog Applications: PCI Interface, Differential Signal Interface, Memory Interleaving, Bus Isolation, Low-Distortion Signal Gating B4 • High-Bandwidth Data Path (up to 500 MHz (1)) Equivalent to IDTQS3VH251 Device 5-V Tolerant I/Os With Device Powered Up or Powered Down Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range (ron = 4 Ω Typ) Rail-to-Rail Switching on Data I/O Ports – 0- to 5-V Switching With 3.3-V VCC – 0- to 3.3-V Switching With 2.5-V VCC Bidirectional Data Flow With Near-Zero Propagation Delay Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 3.5 pF Typ) Fast Switching Frequency (fOE or fS = 20 MHz Max) GND • FEATURES • • • NC - No internal connection DESCRIPTION/ORDERING INFORMATION The SN74CB3Q3251 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus. Specifically designed to support high-bandwidth applications, the SN74CB3Q3251 provides an optimized interface solution ideally suited for broadband communications, networking, and data-intensive computing systems. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2005, Texas Instruments Incorporated SN74CB3Q3251 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS173A – AUGUST 2004 – REVISED MARCH 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) The SN74CB3Q3251 is a 1-of-8 multiplexer/demultiplexer with a single output-enable (OE) input. The select (S0, S1, S2) inputs control the data path of the multiplexer/demultiplexer. When OE is low, the multiplexer/demultiplexer is enabled, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the multiplexer/demultiplexer is disabled, and a high-impedance state exists between the A and B ports. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging current backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C TOP-SIDE MARKING QFN – RGY Tape and reel SN74CB3Q3251RGYR BU251 SSOP (QSOP) – DBQ Tape and reel SN74CB3Q3251DBQR BU251 Tube SN74CB3Q3251PW Tape and reel SN74CB3Q3251PWR Tape and reel SN74CB3Q3251DGVR TSSOP – PW TVSOP – DGV (1) ORDERABLE PART NUMBER BU251 BU251 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS 2 OE S2 S1 S0 INPUT/OUTPUT A FUNCTION L L L L B1 A port = B1 port L L L H B2 A port = B2 port L L H L B3 A port = B3 port L L H H B4 A port = B4 port L H L L B5 A port = B5 port L H L H B6 A port = B6 port L H H L B7 A port = B7 port L H H H B8 A port = B8 port H X X X Z Disconnect SN74CB3Q3251 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS173A – AUGUST 2004 – REVISED MARCH 2005 LOGIC DIAGRAM (POSITIVE LOGIC) A 5 4 SW 3 SW B1 B2 2 SW B3 1 B4 SW 15 SW B5 14 SW B6 13 B7 SW 12 SW B8 11 S0 10 S1 9 S2 OE 7 SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW) A B VCC Charge Pump EN(1) (1) EN is the internal enable signal applied to the switch. 3 SN74CB3Q3251 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS173A – AUGUST 2004 – REVISED MARCH 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VIN Control input voltage range (2) (3) –0.5 7 V VI/O Switch I/O voltage range (2) (3) (4) IIK Control input clamp current VIN < 0 –50 mA II/OK I/O port clamp current VI/O < 0 –50 mA ±64 mA ±100 mA II/O ON-state switch –0.5 7 current (5) Continuous current through VCC or GND θJA Package thermal impedance DBQ package (6) 90 DGV package (6) 120 PW package (6) 108 RGY package (7) Tstg (1) (2) (3) (4) (5) (6) (7) UNIT V °C/W 39 Storage temperature range –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Recommended Operating Conditions (1) VCC Supply voltage VIH High-level control input voltage VIL Low-level control input voltage VI/O Data input/output voltage TA Operating free-air temperature (1) 4 MIN MAX UNIT 2.3 3.6 VCC = 2.3 V to 2.7 V 1.7 5.5 V VCC = 2.7 V to 3.6 V 2 5.5 VCC = 2.3 V to 2.7 V 0 0.7 VCC = 2.7 V to 3.6 V 0 0.8 0 5.5 V –40 85 °C V V All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74CB3Q3251 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS173A – AUGUST 2004 – REVISED MARCH 2005 Electrical Characteristics (1) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK MIN TYP (2) TEST CONDITIONS VCC = 3.6 V, II = –18 mA VCC = 3.6 V, VIN = 0 to 5.5 V IOZ (3) VCC = 3.6 V, VO = 0 to 5.5 V, VI = 0, Switch OFF, VIN = VCC or GND Ioff VCC = 0, VO = 0 to 5.5 V, VI = 0 ICC VCC = 3.6 V, II/O = 0, Switch ON or OFF, VIN = VCC or GND VCC = 3.6 V, One input at 3 V, Other inputs at VCC or GND Control input switching at 50% duty cycle IIN Control inputs ∆ICC (4) Control inputs µA 4 mA 1 4.5 pF VI/O = 5.5 V, 3.3 V, or 0 19.5 25 Switch OFF, VIN = VCC or GND, VI/O = 5.5 V, 3.3 V, or 0 3.5 4.5 Switch ON, VIN = VCC or GND, VI/O = 5.5 V, 3.3 V, or 0 15 19 VI = 0, IO = 30 mA 4 10 VI = 1.7 V, IO = –15 mA 4.5 11 VI = 0, IO = 30 mA 3.5 8 VI = 2.4 V, IO = –15 mA 4 10 VCC = 3.3 V, VIN = 5.5 V, 3.3 V, or 0 A port VCC = 3.3 V, Switch OFF, VIN = VCC or GND, B port VCC = 3.3 V, VCC = 3.3 V, (6) 1 2.5 Control inputs (1) (2) (3) (4) (5) µA 0.1 Cin VCC = 3 V ±1 0.03 A and B ports open, ron (6) µA µA VCC = 3.6 V, VCC = 2.3 V, TYP at VCC = 2.5 V V ±1 mA/ MHz ICCD (5) Cio(ON) UNIT –1.8 30 Per control input Cio(OFF) MAX pF pF Ω VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins. All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. For I/O ports, the parameter IOZ includes the input leakage current. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. This parameter specifies the dynamic power-supply current associated with the operating frequency of a single control input (see Figure 2). Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) VCC = 3.3 V ± 0.3 V TO (OUTPUT) fOE or fS (1) OE or S A or B 10 20 tpd (2) A or B B or A 0.12 0.18 ns tpd(s) S A 1.5 6.7 1.5 5.9 ns S B 1.5 6.7 1.5 5.9 OE A or B 1.5 6.7 1.5 5.9 S B 0.5 6.1 0.5 6.1 OE A or B 0.5 6.1 0.5 6.1 ten tdis (1) (2) VCC = 2.5 V ± 0.2 V FROM (INPUT) PARAMETER MIN MAX MIN UNIT MAX MHz ns ns Maximum switching frequency for control input (VO > VCC, VI = 5 V, RL ≥ 1 MΩ, CL = 0). The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). 5 SN74CB3Q3251 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS173A – AUGUST 2004 – REVISED MARCH 2005 TYPICAL ron vs VI ron − ON-State Resistance − Ω 16 VCC = 3.3 V TA = 25°C IO = −15 mA 14 12 10 8 6 4 2 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 VI − V Figure 1. Typical ron vs VI, VCC = 3.3 V and IO = –15 mA TYPICAL ICC vs CONTROL INPUT SWITCHING FREQUENCY 3 VCC = 3.3 V TA = 25°C A and B Ports Open 2.5 S Switching ICC − mA 2 OE Switching 1.5 1 0.5 0 0 5 10 15 20 OE or S Switching Frequency − MHz Figure 2. Typical ICC vs OE or S Switching Frequency, VCC = 3.3 V 6 25 SN74CB3Q3251 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS173A – AUGUST 2004 – REVISED MARCH 2005 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 × VCC Input Generator S1 RL VO VI 50 Ω 50 Ω VG2 CL (see Note A) RL TEST VCC S1 RL VI CL tpd(s) 2.5 V ± 0.2 V 3.3 V ± 0.3 V Open Open 500 Ω 500 Ω VCC or GND VCC or GND 30 pF 50 pF tPLZ/tPZL 2.5 V ± 0.2 V 3.3 V ± 0.3 V 2 × VCC 2 × VCC 500 Ω 500 Ω GND GND 30 pF 50 pF 0.15 V 0.3 V tPHZ/tPZH 2.5 V ± 0.2 V 3.3 V ± 0.3 V GND GND 500 Ω 500 Ω VCC VCC 30 pF 50 pF 0.15 V 0.3 V V∆ VCC Output Control (VIN) VCC/2 VCC VCC/2 VCC/2 0V tPLH VOH Output VCC/2 VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES (tpd(s)) Output Waveform 1 S1 at 2 × VCC (see Note B) tPLZ VCC VCC/2 VOL + V∆ VOL tPZH tPHL VCC/2 0V tPZL Output Control (VIN) Open GND Output Waveform 2 S1 at GND (see Note B) tPHZ VOH VCC/2 VOH − V∆ 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). H. All parameters and waveforms are not applicable to all devices. Figure 3. Test Circuit and Voltage Waveforms 7 PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN74CB3Q3251DBQR ACTIVE SSOP/ QSOP DBQ 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74CB3Q3251DGVR ACTIVE TVSOP DGV 16 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74CB3Q3251PW ACTIVE TSSOP PW 16 90 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74CB3Q3251PWR ACTIVE TSSOP PW 16 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74CB3Q3251RGYR PREVIEW QFN RGY 16 1000 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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