MICROCHIP DSPIC33FJ256MC510

dsPIC33FJXXXGPXXX/
dsPIC33FJXXXMCXXX
dsPIC33F Rev. A2 Silicon Errata
dsPIC33FJXXXGPXXX,
dsPIC33FJXXXMCXXX
(Rev. A2) Silicon Errata
The dsPIC33F devices (Rev. A2) you received were
found to conform to the specifications and functionality
described in the following documents:
• DS70165 – “dsPIC33F Family Data Sheet”
• DS70157 – “dsPIC30F/33F Programmer’s
Reference Manual”
• DS70046 – “dsPIC30F Family Reference Manual”
The exceptions to the specifications in the documents
listed above are described in this section. The specific
devices for which these exceptions are described are
listed below:
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dsPIC33FJ64GP206
dsPIC33FJ64GP306
dsPIC33FJ64GP310
dsPIC33FJ64GP706
dsPIC33FJ64GP708
dsPIC33FJ64GP710
dsPIC33FJ128GP206
dsPIC33FJ128GP306
dsPIC33FJ128GP310
dsPIC33FJ128GP706
dsPIC33FJ128GP708
dsPIC33FJ128GP710
dsPIC33FJ256GP506
dsPIC33FJ256GP510
dsPIC33FJ256GP710
dsPIC33FJ64MC506
dsPIC33FJ64MC508
dsPIC33FJ64MC510
dsPIC33FJ64MC706
dsPIC33FJ64MC710
dsPIC33FJ128MC506
dsPIC33FJ128MC510
dsPIC33FJ128MC706
dsPIC33FJ128MC708
dsPIC33FJ128MC710
dsPIC33FJ256MC510
dsPIC33FJ256MC710
© 2006 Microchip Technology Inc.
dsPIC33F Rev. A2 silicon is identified by performing a
“Reset and Connect” operation to the device using
MPLAB® ICD 2 with MPLAB IDE v7.40 or later. The
output window will show a successful connection to the
device specified in Configure>Select Device.
The errata described in this section will be addressed
in future revisions of silicon.
Silicon Errata Summary
The following list summarizes the errata described in
further detail through the remainder of this document:
1.
Doze Mode
When Doze mode is enabled, any writes to a
peripheral SFR can cause other updates to that
register to cease to function for the duration of the
current CPU clock cycle.
2.
12-bit Analog-to-Digital Converter (ADC) Module
For this revision of silicon, the 12-bit ADC module
INL, DNL and signal acquisition time parameters
are not within the published data sheet
specifications.
3.
10-bit ADC Module
For this revision of silicon, the 10-bit ADC module
DNL, conversion speed and signal acquisition time
parameters are not within the published data sheet
specifications.
4.
DMA Module: Interaction with EXCH Instruction
The EXCH instruction does not execute correctly
when one of the operands contains a value equal
to the address of the DMAC SFRs.
5.
DISI Instruction
The DISI instruction will not disable interrupts if a
DISI instruction is executed in the same instruction cycle that the DISI counter decrements to
zero.
6.
Motor Control PWM
There is a glitch in the PWMxL signal in SingleShot mode with complementary output. Another
glitch occurs when resuming from a Fault condition
in Free-Running mode with complementary
output.
DS80279B-page 1
dsPIC33F
7.
Output Compare Module
The output compare module will produce a glitch
on the output when an I/O pin is initially set high
and the module is configured to drive the pin low at
a specified time.
8.
Output Compare Module in PWM Mode
The output compare module will miss one compare event when the duty cycle register value is
updated from 0x0000 to 0x0001.
9.
SPI Module in Frame Master Mode
The SPI module will fail to generate frame
synchronization pulses in Frame Master mode.
10. SPI Module in Slave Select Mode
The SPI module Slave Select functionality will not
work correctly.
11. SPI Module
The SMP bit does not have any effect when the
SPI module is configured for a 1:1 prescale factor
in Master mode.
12. ECAN™ Module
1. Module: Oscillator: Doze Mode
Enabling Doze mode slows down the CPU but
allows peripherals to run at full speed. When the
CPU clock is slowed down by enabling Doze mode
(CLKDIV<11> = 1), any writes to a peripheral SFR
can cause other updates to that register to cease
to function for the duration of the current CPU
clock cycle. This is only an issue if the CPU
attempts to write to the same register as a
peripheral while in Doze mode.
For instance, if the ADC module is active and Doze
mode is enabled, the main program should avoid
writing to ADCCONx registers because these registers are being used by the ADC module. If the
CPU does make writes before the ADC module
does, then any attempts by the ADC module to
write to these registers will fail.
Work around
In Doze mode, avoid writing code that will modify
SFRs which may be written to by enabled
peripherals.
ECAN transmissions may be incorrect if multiple
transmit buffers are simultaneously queued for
transmission.
13. ECAN Module
Under specific conditions, the first five bits of a
transmitted identifier may not match the value in
the transmit buffer ID register.
14. ECAN Module Loopback Mode
The ECAN module (ECAN1 or ECAN2) does not
function correctly in Loopback mode.
15. I2C™ Module
The bus collision status bit does not get set when
a bus collision occurs during a Restart or Stop
event.
16. INT0, ADC and Sleep/Idle Mode
ADC event triggers from the INT0 pin will not
wake-up the device from Sleep or Idle mode if the
SMPI bits are non-zero.
17. Doze Mode and Traps
The address error trap, stack error trap, math error
trap and DMA error trap will not wake-up a device
from Doze mode.
18. JTAG Programming
JTAG programming does not work.
The following sections will describe the errata and work
around to these errata, where they may apply.
DS80279B-page 2
© 2006 Microchip Technology Inc.
dsPIC33F
2. Module: 12-bit ADC
When the ADC module is configured for 12-bit
operation, the specifications in the data sheets are
not met.
Work around
Implement the ADC module as an 11-bit ADC with
a maximum conversion rate of 300 Ksps.
1. The specifications provided below reflect 11-bit
ADC operation. RIN source impedance is recommended as 200 ohms and sample time is
recommended as 3 TAD to ensure compatibility
on future enhanced ADC modules. Missing
codes are possible every 27 codes.
2. When used as a 10-bit ADC, the INL is <±2
LSBs, and DNL is <±1 LSB with no missing
codes. Maximum conversion rate is 300 Ksps.
TABLE 1:
ADC PERFORMANCE (11-BIT OPERATION)
Param No.
Symbol
Min
Typical
Max
Units
Conditions
AD17
RIN
—
—
200
Ohm
12-bit
AD20a
Nr
ADC Accuracy – Measurements taken with External VREF+/VREF—
12 bits
—
Bits
AD21a
INL
-2
—
2
LSB
AD22a
DNL
-1.5
—
1
LSB
AD23a
GERR
1
5
10
LSB
AD24a
EOFF
1
3
6
LSB
AD21aa
INL
-2
AD22aa
DNL
-1.5
AD23aa
GERR
5
AD24aa
EOFF
3
6
ADC Accuracy – Measurements taken with Internal VREF+/VREF—
2
LSB
—
1
LSB
10
20
LSB
15
LSB
Dynamic Performance
AD33a
FNYQ
—
—
150
KHz
AD34a
ENOB
9.5
9.6
10.4
Bits
AD56a
FCNV
—
—
300
Ksps
AD57a
TSAMP
—
3 TAD
—
—
ADC Conversion Rate
© 2006 Microchip Technology Inc.
DS80279B-page 3
dsPIC33F
3. Module: 10-bit ADC
When the ADC module is configured for 10-bit
operation, the specifications in the data sheet are
not met for operation above 500 Ksps.
For 500 Ksps, the module meets specifications
except for Gain and Offset parameters AD23bb
and AD24bb.
For 600 Ksps operation, the module specifications
are shown in Table 2.
Work around
None. Future versions of the silicon will support
the ADC performance stated in the data sheet.
TABLE 2:
600 KSPS OPERATION
Param No.
AD17
Symbol
Min
Typ
Max
Units
Conditions
RIN
—
—
200
Ohm
10-bit
ADC Accuracy – Measurements taken with External VREF+/VREFAD20b
Nr
—
10 bits
—
Bits
AD21b
INL
-2
—
2
LSB
AD22b
DNL
-1.5
—
2
LSB
AD23b
GERR
1
3
6
LSB
AD24b
EOFF
1
2
5
LSB
ADC Accuracy – Measurements taken with Internal VREF+/VREFAD21bb
INL
-2
—
2
LSB
AD22bb
DNL
-1.5
—
2
LSB
AD23bb
GERR
1
6
12
LSB
AD24bb
EOFF
2
5
10
LSB
AD33b
FNYQ
—
—
300
KHz
AD34b
ENOB
8.5
9.7
9.8
Bits
Dynamic Performance
ADC Conversion Rate
AD56b
FCNV
—
—
600
Ksps
AD57b
TSAMP
—
3 TAD
—
—
4. Module: DMA Module: Interaction with
EXCH Instruction
The EXCH instruction does not execute correctly
when either of the two operands is numerically
equal to the address of any of the DMAC SFRs for
this revision of silicon.
If using the MPLAB C30 C compiler, check the disassembly listing (View>Disassembly Listing) for
the EXCH instruction. If used, make sure the operands are not equivalent to the DMA SFRs’
addresses.
Work around
If writing source code in assembly, the
recommended fix is to replace:
EXCH Wsource, Wdestination
with:
PUSH Wdestination
MOV Wsource, Wdestination
POP Wsource
DS80279B-page 4
© 2006 Microchip Technology Inc.
dsPIC33F
5. Module: DISI Instruction
When a user executes a DISI #7, for example,
this will disable interrupts for 7 + 1 cycles (7 + the
DISI instruction itself). In this case, the DISI
instruction uses a counter which counts down from
7 to 0. The counter is loaded with 7 at the end of
the DISI instruction.
If the user code executes another DISI on the
instruction cycle where the DISI counter has
become zero, the new DISI count is loaded, but
the DISI state machine does not properly reengage and continue to disable interrupts. At this
point, all interrupts are enabled. The next time the
user code executes a DISI instruction, the feature
will act normally and block interrupts.
In summary, it is only when a DISI execution is
coincident with the current DISI count = 0, that the
issue occurs. Executing a DISI instruction before
the DISI counter reaches zero will not produce
this error. In this case, the DISI counter is loaded
with the new value, and interrupts remain disabled
until the counter becomes zero.
Work around
When executing multiple DISI instructions within
the source code, make sure that subsequent DISI
instructions have at least one instruction cycle
between the time that the DISI counter decrements to zero and the next DISI instruction. Alternatively, make sure that subsequent DISI
instructions are called before the DISI counter
decrements to zero.
6. Module: Motor Control PWM
Devices in the motor control family have a glitch in
the PWMxL signal under certain conditions. The
glitch is a brief high pulse during the low portion of
the duty cycle. This error occurs when the module
is configured in Single-Shot mode (PTMOD<1:0>
= 01) with complementary output. It also occurs
when resuming from a Fault condition in
Free-Running mode (PTMOD<1:0) = 00) with
complementary output.
7. Module: Output Compare Module
A glitch will be produced on an output compare pin
under the following conditions:
• The user software initially drives the I/O pin
high using the output compare module or a
write to the associated PORT register.
• The output compare module is configured and
enabled to drive the pin low at some later time
(OCxCON = 0x0002 or OCxCON = 0x0003).
When these events occur, the output compare
module will drive the pin low for one instruction
cycle (TCY) after the module is enabled.
Work around
None. However, the user may use a timer interrupt
and write to the associated PORT register to
control the pin manually.
8. Module: Output Compare Module in PWM
Mode
The output compare module will miss a compare
event when the current duty cycle register
(OCxRS) value is 0x0000 (0% duty cycle) and the
OCxRS register is updated with a value of 0x0001.
The compare event is missed only the first time a
value of 0x0001 is written to OCxRS, and the
PWM output remains low for one PWM period.
Subsequent PWM high and low times occur as
expected.
Work around
None. If the current OCxRS register value is
0x0000, avoid writing a value of 0x0001 to
OCxRS. Instead, write a value of 0x0002; however, in this case the duty cycle will be slightly
different from the desired value.
Work around
None.
© 2006 Microchip Technology Inc.
DS80279B-page 5
dsPIC33F
9. Module: SPI Module in Frame Master
Mode
The SPI module will fail to generate frame synchronization pulses when configured in the Frame
Master mode (FRMEN = 1, SPIFSD = 0). However, the module functions correctly in Frame
Slave mode.
12. Module: ECAN Module
If multiple ECAN transmit buffers are queued for
transmission (multiple TXREQ bits are set to ‘1’
simultaneously), then the message transmissions
from the enabled buffers may interfere with one
another. As a result, incorrect ID and data
transmissions will occur intermittently.
Work around
Work around
If DMA is not being used, manually drive the SSx
pin (x = 1 or 2) high using the associated PORT
register, and then drive it low after the required 1
bit-time pulse width. This operation needs to be
performed when the transmit buffer is written.
Enable only one transmit buffer for transmission at
any given time. In the user application, this can be
ensured by checking that all other TXREQn bits
are clear before setting the TXREQn bit
corresponding to the buffer that is to be
transmitted.
If DMA is being used, and if no other peripheral
modules are using DMA transfers, use a timer
interrupt to periodically generate the frame synchronization pulse (using the method described
above) after every 8 or 16 bit periods (depending
on the data word size, configured using the
MODE16 bit).
10. Module: SPI Module in Slave Select Mode
The SPI module Slave Select functionality
(enabled by setting SSEN = 1) will not function correctly. Whether the SSx pin (x = 1 or 2) is high or
low, the SPI data transfer will be completed and an
interrupt will be generated.
Work around
If DMA is not being used, manually poll the SSx pin
state in the SPI interrupt by reading the
associated LAT bit:
• If the LAT bit is ‘0’, then perform the required
data read/write.
• If the LAT bit is ‘1’, then clear the SPI interrupt
flag (SPIxIF), perform a dummy read of the
SPIxBUF register, and return from the Interrupt
Service Routine.
If DMA is being used, there is no work around.
11. Module: SPI Module
13. Module: ECAN Module
Under specific conditions, the first five bits of a
transmitted identifier may not match the value in
the transmit buffer SID. If the ECAN module
detects a Start-of-Frame (SOF) in the third bit of
interframe space and if a message to be transmitted is pending, the first five bits of the transmitted
identifier may be corrupted.
Work around
None.
14. Module: ECAN Module Loopback Mode
The ECAN module (ECAN1 or ECAN2) does not
function correctly in Loopback mode.
Work around
Do not use Loopback mode.
15. Module: I2C Module
The Bus Collision Status bit (BCL) does not get set
when a bus collision occurs during a Restart or
Stop event. However, the BCL bit gets set when a
bus collision occurs during a Start event.
Work around
None.
The SMP bit (SPIxCON1<9>, where x = 1 or 2)
does not have any effect when the SPI module is
configured for a 1:1 prescale factor in Master
mode. In this mode, whether the SMP bit is set or
cleared, the data is always sampled at the end of
data output time.
Work around
If sampling at the middle of data output time is
required, then configure the SPI module to use a
clock prescale factor other than 1:1 using the
PPRE<1:0> and SPRE<2:0> bits in the
SPIxCON1 register.
DS80279B-page 6
© 2006 Microchip Technology Inc.
dsPIC33F
16. Module: INT0, ADC and Sleep/Idle Mode
ADC event triggers from the INT0 pin will not
wake-up the device from Sleep or Idle mode if the
SMPI bits are non-zero. This means that if the
ADC is configured to generate an interrupt after a
certain number of INT0 triggered conversions, the
ADC conversions will not be triggered and the
device will remain in Sleep. The ADC will perform
conversions and wake-up the device only if it is
configured to generate an interrupt after each INT0
triggered conversion (SMPI<3:0> = 0000).
Work around
None. If ADC event trigger from the INT0 pin is
required, initialize SMPI<3:0> to ‘0000’ (interrupt
on every conversion).
17. Module: Doze Mode and Traps
The address error trap, stack error trap, math error
trap and DMA error trap will not wake-up a device
from Doze mode.
Work around
None.
18. Module: JTAG Programming
JTAG programming does not work.
Work around
None.
© 2006 Microchip Technology Inc.
DS80279B-page 7
dsPIC33F
APPENDIX A:
REVISION HISTORY
Revision A (6/2006)
• Initial release of the document.
Revision B (12/2006)
• Added errata 7, 8, 9, 10, 11, 12, 13, 14, 15, 16
and 17.
DS80279B-page 8
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
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Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
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All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs,
microperipherals, nonvolatile memory and analog products. In addition,
Microchip’s quality system for the design and manufacture of
development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc.
DS80279B-page 9
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12/08/06
DS80279B-page 10
© 2006 Microchip Technology Inc.