ICS9112-27 Integrated Circuit Systems, Inc. Preliminary Product Preview Low Skew PCI / PCI-X Buffer General Description Features The ICS9112-27 is a high performance, low skew, low jitter PCI / PCI-X clock driver. It is designed to distribute high speed signals in PCI / PCI-X applications operating at speeds from 0 to 140 MHz. • • • • The ICS9112-27 is characterized for operation from -40°C to 85°C for automotive and industrial applications. • • Frequency range 0 - 140 MHz (3.3V) Less than 200 ps Jitter between outputs Skew controlled outputs < 100 ps Distribute one clock input to one bank of four outputs 3.3V ±10% operation Available in 8 pin TSSOP, and SOIC packages. Block Diagram LOGIC CONTROL CLK0 CLK1 CLK_IN CLK2 CLK_IN 1 OE 2 CLK0 3 GND 4 ICS9112-27 OE Pin Configuration 8 CLK3 7 CLK2 6 VDD 5 CLK1 8 pin TSSOP & SOIC Functionality Table CLK3 INPUTS Pin Descriptions OUTPUTS CLK_IN OE CLK(3:0) 0 0 0 0 1 0 1 0 0 1 1 1 PIN NUMBER PIN NAME TYPE 1 CLK_IN IN Input reference frequency. DESCRIPTION 2 OE IN Output enable (has internal pull_up.) when OE is low, it tristates the clock outputs 3 CLK0 OUT Buffered clock output 4 GND PWR Ground Buffered clock output 5 CLK1 OUT 6 VDD PWR Power supply for 3.3V 7 CLK2 OUT Buffered clock output 8 CLK3 OUT Buffered clock output 9112-27 Rev B 02/27/01 PRODUCT PREVIEW documents contain information on new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice. ICS9112-27 Preliminary Product Preview Absolute Maximum Ratings Supply voltage range VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.3 V Input voltage rangeVI (see notes 1 & 2) . . . . . . . . . . . . -0.5V to VDD + 0.5V Output voltage range V O (see notes 1 & 2) . . . . . . . . . -0.5V to VDD + 0.5V Input clamp current IIK (VI< 0 or VI >VDD) . . . . . . . . . . . . . . . . . . . ±50 mA Output clamp current IOK (VO< 0 or VO) . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous total output current, IO (VO = 0 to VDD) . . . . . . . . . . . ±50 mA Package thermal impedance ØJA (see note 3): PW package . . . 230.5°C/W Storage temperature rante, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only and functional operation of the device at these or any other conditions above those listed in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. Notes: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 4.6 V maximum. 3. The package thermal impedance is calculated in accordance with JESD 51. Terminal Functions Terminal No I/O 8, 7, 5, 3 O Buffered output clocks CLKIN 1 I Input reference frequency GND 4 PWR OE 2 I VDD 3.3V 6 PWR CLK (3-0) Description Ground Outputs enable control 3.3V supply Recommended Operating Conditions Supply voltage, VDD High-level input voltage, VIH Min Nom Max Unit 3 3.3 3.6 V 0.7XVDD V Low-level input voltage, VIL 0.3XVDD V VDD V High-level output current, IOH -24 mA Low-level output current, IOL 24 mA 85 °C Input voltage, VI 0 -40 Operating free-air temperature, TA Timing requirements over recommended ranges of supply voltage and operating free-air temperature Min 0 Clock frequency fCLK 2 Nom Max Unit 140 MHz ICS9112-27 Preliminary Product Preview Electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) Parameter Input voltage VIK Test Conditions Low-level output voltage VOL High-level output current IOH Low-level output current IOL Nom VDD = 3.3V, II = 18 mA VDD = min to max, IOH = -1 mA High-level output voltage VOH Min Max Unit -1.2 V VDD -0.2 V VDD = 3 V IOH = 24 mA 2 V VDD = 3 V IOH = 12 mA 2.4 V VDD = min to max, IOL = -1 mA 0.2 V VDD = 3 V IOL = 24 mA 0.8 V VDD = 3 V IOL= 12 mA 0.55 V VDD = 3 V VO = 1 V -50 mA VDD = 3.3 V VO = 1.65 V VDD = 3 V VO = 2 V -55 mA 60 mA VDD = 3.3 V VO = 1.65 V 70 mA Input current II VI = VO or VDD ±5 µA Dynamic Current, see figure 5 IDD f = 67 MHz 37 mA Input capacitance Ci VDD = 3.3V VI = 0 V or VDD 3 pF Output capacitance Co VDD = 3.3V VI = 0 V or VDD 3.2 pF Switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 25 pF, VDD = 3.3 V (see note 6 and figures 1 and 2) Parameter High-to-low propagation delay tPLH Low-to-high propagation delay tPHL Test Conditions See figures 1 and 2 Min Nom Max Unit 1.8 2.5 3 ns 1.8 2.4 3 ns 100 ps 150 ps Output skew (see note 4) TSK (O) Pulse skew tSK (P) VIH = VDD, VIL = 0 V ns Process skew TSK (PR) CLK high time, see figure 4 Thigh CLK low time, see figure 4 Tlow 66 MHz 6 140 MHz 3 66 MHz 6 140 MHz 3 ns ns Output rise slew rate‡ Tr 0.2VDD to 0.6VDD 1.5 2.7 4 V/ns Output fall slew rate‡ Tf 0.6VDD to 0.2VDD 1.5 2.7 4 V/ns 3 ICS9112-27 Preliminary Product Preview Parameter Measurement Information VDD 140W CLKn 140W 10 pF Figure 1. Test Load Circuit VDD 50% VDD CLKIN 0V TPHL tPLH 0.6 VDD 0.6 VDD 50% VDD 50% VDD 0.2 VDD CLK0-CLK3 VOH 0.2 VDD tR VOL tf Figure 2. Voltage Thresholds for Propagation Delay (tpd) Measurements 50% VDD Any CLK 50% VDD Any CLK Figure 3. Output Skew Tsk(0) Paramameter Value Unit VIH(Min) 0.5 VDD V VIL(Max) 0.35 VDD V Vtest 0.4 VDD V tcyc thigh 0.6 VDD VIH(Min) tlow Vtest VIL(Max) 0.2 VDD Figure 4. Clock Waveform 0.4 VDD Peak to Peak (Minimum) Note: All parameters in Figure 4 are according to PCI-X 1.0 specifications. 4 ICS9112-27 Preliminary Product Preview Parameter Measurement Information Supply Current vs Frequency ICC - Supply Current - mA 60 VDD = 3.6 V TA = 85°C 50 40 20 0 20 40 60 80 100 120 140 160 F - Frequency - Mhz Figure 5 High Level Output Voltage vs High-Level Output Current VOH - High-Level Output Voltage - V 3.5 VDD = 3.3 V TA = 25°C 3.0 2.5 2.0 1.5 1.0 0.5 0 -100 -90 -80 -70 -60 -50 -40 -30 IOH-High-Level Output Current-mA Figure 6 5 -20 -10 0 ICS9112-27 Preliminary Product Preview Parameter Measurement Information Low Level Output Voltage vs Low-Level Output Current 3.5 VDD = 3.3 V TA = 25°C 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 IOL-Low-Level Output Current-mA Figure 7 6 80 100 120 ICS9112-27 Preliminary Product Preview SYMBOL In Millimeters In Inches COMMON DIMENSIONS COMMON DIMENSIONS MIN MAX MIN MAX A - 1.20 - .047 A1 0.05 0.15 .002 .006 A2 0.80 1.05 .032 .041 b 0.19 0.30 .007 .012 c 0.09 0.20 SEE VARIATIONS D .0035 .008 SEE VARIATIONS 6.40 BASIC E E1 4.30 e 0.252 BASIC 4.50 .169 0.65 BASIC L 0.45 0.75 SEE VARIATIONS N .177 0.0256 BASIC .018 .030 SEE VARIATIONS α 0° 8° 0° 8° aaa - 0.10 - .004 MIN MAX MIN 2.90 3.10 .114 .122 MO-153 JEDEC Doc.# 10-0038 7/6/00 Rev B VARIATIONS D mm. N 4.40 mm. Body, 0.65 mm. pitch TSSOP (0.0256 mil) (173 mil) 8 D (inch) MAX Ordering Information ICS9112yG-27-T Example: ICS XXXX y G - PPP - T Designation for tape and reel packaging Pattern Number (2 or 3 digit number for parts with ROM code patterns) Package Type G=TSSOP Revision Designator (will not correlate with datasheet revision) Device Type (consists of 3 or 4 digit numbers) Prefix ICS, AV = Standard Device 7 PRODUCT PREVIEW documents contain information on new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice. ICS9112-27 Preliminary Product Preview In Millimeters In Inches COMMON DIMENSIONS COMMON DIMENSIONS MIN MAX MIN MAX SYMBOL A 1.35 1.75 .0532 .0688 A1 0.10 0.25 .0040 .0098 B 0.33 0.51 .013 .020 C 0.19 0.25 SEE VARIATIONS .0075 .0098 SEE VARIATIONS e 3.80 4.00 1.27 BASIC .1497 .1574 0.050 BASIC H 5.80 6.20 .2284 .2440 h 0.25 0.50 .010 .020 L 0.40 1.27 SEE VARIATIONS D E N α 0° .016 .050 SEE VARIATIONS 8° 0° 8° MIN MAX MIN MAX 4.80 5.00 .1890 .1968 VARIATIONS D mm. N 8 D (inch) 10-0030 Rev A - MS-012 150 mil (Narrow Body) SOIC Ordering Information ICS9112yM-27-T Example: ICS XXXX y M - PPP - T Designation for tape and reel packaging Pattern Number (2 or 3 digit number for parts with ROM code patterns) Package Type M=SOIC Revision Designator (will not correlate with datasheet revision) Device Type (consists of 3 or 4 digit numbers) Prefix ICS, AV = Standard Device 8 PRODUCT PREVIEW documents contain information on new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.