TI TPPM0301DR

TPPM0301
400-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS315 – SEPTEMBER 2000
D
D
D
D
D
D
Automatic Input Voltage Source Selection
Glitch-Free Regulated Output
5-V Input Voltage Source Detector With
Hysteresis
400-mA Load Current Capability With 5-V or
3.3-V Input Source
Low rDS(on) Auxiliary Switch
Thermally Enhanced Packaging Concept
for Efficient Heat Management
D PACKAGE
(TOP VIEW)
5VAUX
5VCC
3.3VOUT
3.3VAUX
1
8
2
7
3
6
4
5
GND
GND
GND
GND
description
The TPPM0301 is a low-dropout regulator with auxiliary power management that provides a constant 3.3-V
supply at the output capable of driving a 400-mA load.
The TPPM0301 provides a regulated power output for systems that have multiple input sources and require a
constant voltage source with a low-dropout voltage. This is a single output, multiple input intelligent power
source selection device with a low-dropout regulator for either 5VCC or 5VAUX inputs, and a low- resistance
bypass switch for the 3.3VAUX input.
Transitions may occur from one input supply to another without generating a glitch, outside of the specification
range, on the 3.3-V output. The device has an incorporated reverse blocking scheme to prevent excess leakage
from the input terminals in the event that the output voltage is greater than the input voltage.
The input voltage is prioritized in the following order: 5VCC, 5VAUX, and 3.3VAUX.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
TPPM0301
400-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS315 – SEPTEMBER 2000
functional block diagram
Linear Regulator
With LDO
5VCC
3.3VOUT
5-V
Detection
Current
Sensor
Over
Temperature
Gate Drive
and Control
5VAUX
5VAUX
Detection
Linear Regulator
With LDO
GND
Current
Sensor
Gate Drive
and Control
Low ON
Resistance
Switch
3.3VAUX
3VAUX
Detection
Current
Sensor
Gate Drive
5-V Detection
and Control
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
3.3VAUX
4
I
3.3-V auxiliary input
3.3VOUT
3
O
3.3-V output with a typical capacitance load of 4.7 µF
5VAUX
1
I
5-V auxiliary input
5VCC
2
I
5-V main input
GND
5, 6, 7, 8
I
Ground
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TPPM0301
400-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS315 – SEPTEMBER 2000
Table 1. Input Selection
INPUT VOLTAGE STATUS
(V)
3.3VAUX
INPUT SELECTED
OUTPUT
(V)
OUTPUT
(I)
5VCC/5VAUX/3.3VAUX
3.3VOUT
5VCC
5VAUX
0
0
0
None
0
IL (mA)
0
0
0
3.3
3.3VAUX
3.3
375
0
5
0
5VAUX
3.3
400
0
5
3.3
5VAUX
3.3
400
5
0
0
5VCC
3.3
400
5
0
3.3
5VCC
3.3
400
5
5
0
5VCC
3.3
400
5
5
3.3
5VCC
3.3
400
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, 5-V main input, V(5VCC) (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Auxiliary voltage, 5-V input, V(5VAUX) (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Auxiliary voltage, 3.3-V input, V(3.3VAUX) (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 V
3.3-V output current limit, I(LIMIT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 A
Continuous power dissipation, PD (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W
Electrostatic discharge susceptibility, human body model, V(HBMESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
Operating ambient temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 150°C
Operating junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 5°C to 120°C
Lead temperature (soldering, 10 second), T(LEAD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. Absolute negative voltage on these terminal should not be below –0.5 V.
3. RθJA must be less than 55°C/W, typically achieved with two square inches of copper printed circuit board area connected to the GND
terminals for heat dissipation or equivalent.
recommended operating conditions
MIN
TYP
MAX
UNIT
5-V main input, V(5VCC)
4.5
5.5
V
5-V auxiliary input, V(5VAUX)
4.5
5.5
V
3.3-V auxiliary input, V(3.3VAUX)
3
Load capacitance, CL
4.23
4.7
3.6
V
5.17
µF
Load current, IL
0
400
mA
Ambient temperature, TA
0
70
°C
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
TPPM0301
400-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS315 – SEPTEMBER 2000
electrical characteristics over recommended operating free-air temperature range, TA = 0°C to
70°C, CL = 4.7 µF (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V(5VCC)/
V(5VAUX)
5-V inputs
I(Q)
Quiescent supplyy current
IL
I(LIMIT)
T(TSD)†
Output load current
Thys†
V(3.3VOUT)
Thermal hysteresis
CL
Load capacitance
Ilkg(REV)
Reverse leakage output current
MIN
TYP
MAX
4.5
5
5.5
2.5
5
mA
250
500
µA
1
1.5
From 5VCC or 5VAUX terminals, IL = 0 to
400 mA
From 3.3VAUX terminal, IL = 0 A
0.4
Output current limit
3.3VOUT = 0 V
Thermal shutdown
3 3VOUT output shorted to 0 V
3.3VOUT
3.3-V output
IL = 400 mA
Minimal ESR to insure stability of regulated
output
150
180
15
3.135
3.3
3.465
V
A
°C
V
µF
4.7
Tested for input that is grounded.
3.3VAUX, 5VAUX or 5VCC = GND,
3.3VOUT = 3.3 V
UNIT
50
µA
† Design targets only. Not tested in production.
5-V detect
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V(TO_LO)
Threshold voltage, low
5VAUX or 5VCC ↓
3.85
4.05
4.25
V
V(TO_HI)
Threshold voltage, high
5VAUX or 5VCC ↑
4.1
4.3
4.5
V
MIN
TYP
MAX
auxiliary switch
PARAMETER
TEST CONDITIONS
R(SWITCH)
Auxiliary switch resistance
5VAUX = 5VCC = 0 V,
3.3VAUX = 3.3 V, IL = 150 mA
∆VO(∆VI)
∆VO(∆IO)
Line regulation voltage
5VAUX or 5VCC = 4.5 V to 5.5 V
Load regulation voltage
20 mA < IL < 400 mA
VI – VO
Dropout voltage
IL < 400 mA
0.4
2
UNIT
Ω
mV
40
mV
1
V
thermal characteristics
PARAMETER
MIN
TYP
MAX
UNIT
RθJC
Thermal impedance, junction-to-case
38
°C/W
RθJA
Thermal impedance, junction-to-ambient
97
°C/W
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TPPM0301
400-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS315 – SEPTEMBER 2000
THERMAL INFORMATION
To ensure reliable operation of the device, the junction temperature of the output device must be within the safe
operating area (SOA). This is achieved by having a means to dissipate the heat generated from the junction
of the output structure. There are two components that contribute to thermal resistance. They consist of two
paths in series. The first is the junction to case thermal resistance, RθJC; the second is the case to ambient
thermal resistance, RθCA. The overall junction to ambient thermal resistance, RθJA, is determined by:
RθJA = RθJC + RθCA
The ability to efficiently dissipate the heat from the junction is a function of the package style and board layout
incorporated in the application. The operating junction temperature is determined by the operating ambient
temperature, TA, and the junction power dissipation, PJ.
The junction temperature, TJ, is equal to the following thermal equation:
TJ = TA + PJ (RθJC) + PJ (RθCA)
TJ = TA + PJ (RθJA)
This particular application uses the enhanced 8-pin SO package with an integral fused lead frame (terminals
5 to 8). By incorporating a dedicated heat spreading copper plane of at least two square inches on a double-side
printed-circuit board (PCB), a thermal resistance of junction to ambient, RθJA, of 50°C/W can be obtained.
Alternatively, if no dedicated copper plane is incorporated for this device and the PCB has a multilayer
construction, the ground terminals (5 to 8) could be electrically connected to the ground plane of the board. This
will provide a means for heat spreading through the copper plane associated within the PCB (GND layer). This
concept could provide a thermal resistance from junction to ambient, RθJA, of 70°C/W if implemented correctly.
Hence, maximum power dissipation allowable for an operating ambient temperature of 70°C, and a maximum
junction temperature of 150°C is determined as:
PJ = (TJ – TA) / RθJA
PJ = (150 – 70) / 50 = 1.6 W
Using two square inches of dedicated copper plane on double-sided PCB,
PJ = (150 – 70) / 70 = 1.14 W
Using a multilayer board and utilizing the ground plane for heat spreading, worst case maximum power
dissipation is determined by:
PD = (5.5 – 3) × 0.4 = 1 W
Normal operating maximum power dissipation is (see Figure 1):
PD = (5 – 3.3) × 0.4 = 0.68 W
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
TPPM0301
400-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS315 – SEPTEMBER 2000
THERMAL INFORMATION
Power Dissipation Derate Curve Using
Two Square Inches of Copper Heat
Spreader on a Double-Sided PCB
Power Dissipation Derate Curve Using
Multilayer Board With The Ground
Plane for Heat Spreader
Power – W
2.5
1.78
1
0.68
25
80
100
116
103
Ambient Temperature – °C
150
NOTE: These curves are to be used for guideline purposes only. For a particular application, a more specific thermal characterization is required.
Figure 1. Power Dissipation Derating Curves
APPLICATION INFORMATION
1
4.7 µF
GND
5VCC
GND
8
0.1 µF
2
4.7 µF
5VAUX
0.1 µF
7
TPPM0301
3
3.3VOUT
GND
3.3VAUX
GND
6
4.7 µF
4
4.7 µF
5
0.1 µF
Figure 2. Typical Application Schematic
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TPPM0301
400-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS315 – SEPTEMBER 2000
MECHANICAL DATA
D (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0.050 (1,27)
0.020 (0,51)
0.014 (0,35)
14
0.010 (0,25) M
8
0.008 (0,20) NOM
0.244 (6,20)
0.228 (5,80)
0.157 (4,00)
0.150 (3,81)
Gage Plane
0.010 (0,25)
1
7
0°– 8°
A
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.069 (1,75) MAX
0.010 (0,25)
0.004 (0,10)
PINS **
0.004 (0,10)
8
14
16
A MAX
0.197
(5,00)
0.344
(8,75)
0.394
(10,00)
A MIN
0.189
(4,80)
0.337
(8,55)
0.386
(9,80)
DIM
4040047 / D 10/96
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
Falls within JEDEC MS-012
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• DALLAS, TEXAS 75265
7
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPPM0301DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPPM0301DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
TPPM0301DR
17-May-2007
Package Pins
D
8
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
FMX
330
0
6.4
5.2
2.1
8
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TPPM0301DR
D
8
FMX
342.9
336.6
20.6
Pack Materials-Page 2
W
Pin1
(mm) Quadrant
12
PKGORN
T1TR-MS
P
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