7820 Microprocessor-compatible 8-Bit ADC TABLE 1. PIN DESCRIPTION PIN SYMBOL DESCRIPTION 1 VIN Analog Input Range: VREF(-) to VREF(+). 2 DB0 Data Output. Three State Output, bit 0 (LSB) 3 DB1 Data Output. Three State Output, bit 1 4 DB2 Data Output. Three State Output, bit 2 5 DB3 Data Output. Three State Output, bit 3 6 WR/RDY 7 Mode 8 RD READ Input. RD must be low to access data from the part. 9 INT INTERUPT Output. INT going low indicates that the conversion is complete INT returns high on rising the edge of RD or CS. 10 GND Ground 11 VREF- Lower limit of reference span. Range: GND < VREF(-) < VREF(+) 12 VREF+ Upper limit of reference span. Range: GND < VREF(-) < VREF(+) < VDD 13 CS Chip Select Input. CS, the decoded device address, must be low for RD or WR to be recognized by the converter. 14 DB4 Data Output. Three State Output, bit 4 15 DB5 Data Output. Three State Output, bit 5 16 DB6 Data Output. Three State Output, bit 6 17 DB7 Data Output. Three State Output, bit 7 (MSB) 18 OFL Overflow Output. If the analog input is higher than (VREF(+) - 1/2LSB), OFL will be low at the end of conversion. It is a non three state output which can be used to cascade 2 or more devices to increase resolution. 19 NC No Connection. 20 VDD Power supply voltage, +5V WRITE control input/READY status output. Mode Selection Input. It determines whether the device operates in the WR-RD or RD mode. It is internally tied to GND through a 50 µ A current source. Memory TABLE 2. 7820 ABSOLUTE MAXIMUM RATINGS1 PARAMETER MIN MAX UNIT VDD to GND -0 7.0 V Digital Input Voltage to GND (Pins 6-80, 13) -0.3 VDD +0.3 V Digital Output Voltage to GND (Pins 2-5, 9, 14-18) 0.3 VDD +0.3 V VREF (+) to GND 0 VDD +0.3 V VREF (-) to GND VSS -0.3 VREF (+) V 09.09.03 Rev 3 All data sheets are subject to change without notice 2 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC TABLE 2. 7820 ABSOLUTE MAXIMUM RATINGS1 PARAMETER MIN MAX UNIT VIN to GND -0.3 VDD +0.3 V Operating Temperature -55 125 °C Storage Temperature Range -65 150 °C Power Dissipation to 75°C -- 450 mW Derates above +75°C -- 6 mW/°C 1. CAUTION: ESD (electrostatic discharge) sensitive device. The digital control inputs are diode protected; however, permanent damage may occur on unconnected devices subject to high energy electrostatic fields. Unused devices must be stored in conductive foam or shunts. The protective foam should be discharged to the destination socket before devices are inserted. PARAMETER TEST CONDITIONS SUBGROUPS MIN TYP MAX UNIT Memory TABLE 3. 7820 DC ELECTRICAL CHARACTERISTICS (VDD = +5V; VREF(+) = +5V; VREF(-) = GND = 0V, UNLESS OTHERWISE SPECIFIED) (RD MODE (PIN 7 = 0V)) (TA = -55 TO 125 °C UNLESS OTHERWISE SPECIFIED) Accuracy Resolution -- 8 -- -- Bits Total Unadjusted Error1 -- -- -- ±1.0 LSB Minimum Resolution for which No Missing Codes are Guaranteed -- -- -- 8 Bits Reference Input Input Resisitance -- 1, 2, 3 1.0 -- 4.0 kΩ VREF (+) Input Voltage Range -- 1, 2, 3 VREF(-) -- VDD V VREF (-) Input Voltage Range -- 1, 2, 3 GND -- VREF(+) V Input Voltage Range -- 1, 2, 3 VREF(-) -- VREF(+) V Input Leakage Current -- 1, 2, 3 -- -- ±3 µA Input Capacitance2 -- 1, 2, 3 -- 45 -- pF VINH -- 1, 2, 3 2.4 -- -- V VINH -- 1, 2, 3 -- -- 0.8 V IINH(CS, RD) -- 1, 2, 3 -- -- 1 µA IINH(WR) -- 1, 2, 3 -- -- 3 µA IINL(WR) -- 1, 2, 3 -- -- -1 µA Input Capacitance2 -- 1, 2, 3 -- 5 8 pF Analog Input Logic Inputs CS, WR, RD 09.09.03 Rev 3 All data sheets are subject to change without notice 3 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC TABLE 3. 7820 DC ELECTRICAL CHARACTERISTICS (VDD = +5V; VREF(+) = +5V; VREF(-) = GND = 0V, UNLESS OTHERWISE SPECIFIED) (RD MODE (PIN 7 = 0V)) (TA = -55 TO 125 °C UNLESS OTHERWISE SPECIFIED) PARAMETER TEST CONDITIONS SUBGROUPS MIN TYP MAX UNIT VINH -- 1, 2, 3 3.5 -- -- V IINH -- 1, 2, 3 -- -- 200 µA -- 1, 2, 3 -- -- -1 µA -- 1, 2, 3 -- 5 8 pF VOH ISOURCE = 360 µ A 1, 2, 3 4 -- -- V VOL ISINK = 1.6 mA 1, 2, 3 -- -- 0.4 V Floating State Leakage 1, 2, 3 -- -- ±3 µA -- 1, 2, 3 -- 5 8 pF VOL ISINK = 2.6mA 1, 2, 3 -- -- 0.4 V IOUT Floating State Leakage 1, 2, 3 -- -- ±3 V Output Capacitance2 -- 4, 5, 6 -- 5 8 pF Slew Rate, Tracking2 -- 1, 2, 3 -- 0.2 0.1 V/µ s VDD ±5% for specified performance 1, 2, 3 -- -- 5 V IDD CS = RD = OV 1, 2, 3 -- -- 20 mA -- 1, 2, 3 -- 40 -- mW VDD = 5V ±5% 1, 2, 3 -- ±1/16 ±1/4 LSB Mode IINL Input Capacitance2 Logic Outputs DB0-DB7, OFL, INT IOUT(DB0-DB7) Memory Output Capacitance2 RDY Power Supply Power Dissipation Power Supply Sensitivity 1. Total unadjusted error includes offset, full scale and linearity error. 2. Guarenteed by design. 09.09.03 Rev 3 All data sheets are subject to change without notice 4 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC TABLE 4. 7820 AC ELECTRICAL CHARACTERISTICS1 (VDD = +5V; VREF(+) = +5V; VREF(-) = GND = 0V, UNLESS OTHERWISE SPECIFIED) (RD MODE (PIN 7 = 0V)) (TA = -55 TO 125 °C UNLESS OTHERWISE SPECIFIED) PARAMETER SYMBOL MIN MAX UNIT CS to RD/WR Setup Time 9, 10, 11 tCSS 0 -- ns CS to RD/WR Hold Time 9, 10, 11 tCSH 0 -- ns CS to Delay Time (Pull-up Resistor = 5kΩ 9, 10, 11 tRDY -- 100 ns Conversion Time (RD Mode) 9, 10, 11 tCRD -- 2.5 µs Data Access Time (RD Mode) 9, 10, 11 tACCD -- tCRD + 50 ns RD to INT Delay (RD Mode) 9, 10, 11 tINTH -- 225 ns Data Hold Time 9, 10, 11 tDH -- 100 ns Delay Time Between Conversions 9, 10, 11 tp 600 -- ns Write Pulse Width 9, 10, 11 tWR 600 -- ns -- 50 µs Delay Time Between WR and RD Pulses 9, 10, 11 tRD 700 -- ns Data Access Time (WR-RD Mode) 9, 10, 11 tACC1 -- 250 ns RD to INT Delay 9, 10, 11 tR1 -- 225 ns WR to INT Delay 9, 10, 11 tINTL -- 1700 ns Data Access Time (WR-RD Mode) 9, 10, 11 tACC2 -- 110 ns WR to INT Delay (Stand-Alone Operation) 9, 10, 11 tIHWR -- 150 ns Data Access Time After INT (Stand-Alone Operation 9, 10, 11 tID -- 75 ns Memory SUBGROUPS 1. Sample tested at 25°C to ensure compliance. Only on process design change. 09.09.03 Rev 3 All data sheets are subject to change without notice 5 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC FIGURE 1. LOAD CIRCUITS FOR DATA ACCESS TIME TEST Memory FIGURE 2. LOAD CIRCUITS FOR DATA HOLD TIME RESET 09.09.03 Rev 3 All data sheets are subject to change without notice 6 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC FIGURE 3. LOAD CIRCUIT FOR ACCESS TIME Memory FIGURE 4. LOAD CIRCUIT FOR OUTPUT FLOAT DELAY 09.09.03 Rev 3 All data sheets are subject to change without notice 7 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC FIGURE 5. ACCURACY VS. TWR Memory FIGURE 6. ACCURACY VS. TRD 09.09.03 Rev 3 All data sheets are subject to change without notice 8 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC FIGURE 7. ACCURACY VS. TSP Memory FIGURE 8. ACCURACY VS. TREF [VREF = VREF(+) - VREF(-)] 09.09.03 Rev 3 All data sheets are subject to change without notice 9 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC FIGURE 9. SIGNAL-NOISE RATIO VS. INPUT FREQUENCY Memory FIGURE 10. TINTL INTERNAL TIME DELAY VS. TEMPERATURE 09.09.03 Rev 3 All data sheets are subject to change without notice 10 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC FIGURE 11. OUTPUT CURRENT VS. TEMPERATURE Memory FIGURE 12. OPERATING SEQUENCE (WR-RD MODE) 09.09.03 Rev 3 All data sheets are subject to change without notice 11 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC FIGURE 13. RD MODE Memory FIGURE 14. WR-RD MODE (TRD>TINTL) 09.09.03 Rev 3 All data sheets are subject to change without notice 12 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC FIGURE 15. WR-RD MODE (TRD<TINTL) Memory FIGURE 16. WR-RD MODE STAND-ALONE OPERATION (CS=RD=0) 09.09.03 Rev 3 All data sheets are subject to change without notice 13 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC FIGURE 17. POWER SUPPLY AS REFERENCE FIGURE 18. INPUT NOT REFERENCED TO GND Memory 09.09.03 Rev 3 All data sheets are subject to change without notice 14 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC FIGURE 19. EQUIVALENT INPUT CIRCUIT Memory FIGURE 20. RC NETWORK MODEL 09.09.03 Rev 3 All data sheets are subject to change without notice 15 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC Memory 20 PIN RAD-PAK® DUAL IN LINE PACKAGE DIMENSION SYMBOL MIN NOM MAX A -- 0.202 0.230 b 0.014 0.018 0.026 b2 0.045 0.050 0.065 c 0.008 0.010 0.018 D -- 1.000 1.060 E 0.220 0.295 0.310 eA 0.300 BSC eA/2 0.150 BSC e 0.100 BSC L 0.135 0.145 0.155 Q 0.015 0.045 0.070 S1 0.005 0.025 -- S2 0.005 -- -- N 20 Note: All dimensions in inches 09.09.03 Rev 3 All data sheets are subject to change without notice 16 ©2003 Maxwell Technologies All rights reserved. Microprocessor-compatible 8-Bit ADC 7820 Important Notice: These data sheets are created using the chip manufacturer’s published specifications. Maxwell Technologies verifies functionality by testing key parameters either by 100% testing, sample testing or characterization. The specifications presented within these data sheets represent the latest and most accurate information available to date. However, these specifications are subject to change without notice and Maxwell Technologies assumes no responsibility for the use of this information. Maxwell Technologies’ products are not authorized for use as critical components in life support devices or systems without express written approval from Maxwell Technologies. Any claim against Maxwell Technologies must be made within 90 days from the date of shipment from Maxwell Technologies. Maxwell Technologies’ liability shall be limited to replacement of defective parts. Memory 09.09.03 Rev 3 All data sheets are subject to change without notice 17 ©2003 Maxwell Technologies All rights reserved. 7820 Microprocessor-compatible 8-Bit ADC Product Ordering Options Model Number 7820 RP D X Option Details Feature Monolithic S = Maxwell Class S B = Maxwell Class B I = Industrial (testing @ -55°C, +25°C, +125°C) E = Engineering (testing @ +25°C) Package D = Dual In-line Package (DIP) Radiation Feature RP = RAD-PAK® package Base Product Nomenclature Microprocessor-Compatible 8-Bit ADC 09.09.03 Rev 3 All data sheets are subject to change without notice Memory Screening Flow 18 ©2003 Maxwell Technologies All rights reserved.