TI SN74CB3Q3384APW

SN74CB3Q3384A
10-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS114D – DECEMBER 2002 – REVISED JUNE 2005
•
FEATURES
•
•
•
•
•
•
•
(1)
High-Bandwidth Data Path (up to 500 MHz (1))
5-V Tolerant I/Os With Device Powered Up or
Powered Down
Low and Flat ON-State Resistance
(ron) Characteristics Over Operating Range
(ron = 3 Ω Typ)
Rail-to-Rail Switching on Data I/O Ports
– 0- to 5-V Switching With 3.3-V VCC
– 0- to 3.3-V Switching With 2.5-V VCC
Bidirectional Data Flow With Near-Zero
Propagation Delay
Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
(Cio(OFF) = 4 pF Typ)
Fast Switching Frequency (fOE = 20 MHz Max)
•
•
•
•
•
•
•
•
For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI application
report, CBT-C, CB3T, and CB3Q Signal-Switch Families,
literature number SCDA008.
Data and Control Inputs Provide Undershoot
Clamp Diodes
Low Power Consumption (ICC = 1 mA Typ)
VCC Operating Range From 2.3 V to 3.6 V
Data I/Os Support 0- to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
Supports Both Digital and Analog
Applications: PCI Interface, Differential Signal
Interface, Memory Interleaving, Bus Isolation,
Low-Distortion Signal Gating
DBQ, DGV, OR PW PACKAGE
(TOP VIEW)
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
1B5
1A5
GND
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
VCC
2B5
2A5
2A4
2B4
2B3
2A3
2A2
2B2
2B1
2A1
2OE
DESCRIPTION/ORDERING INFORMATION
ORDERING INFORMATION
PACKAGE (1)
TA
QSOP – DBQ
–40°C to 85°C
TSSOP – PW
TVSOP – DGV
(1)
ORDERABLE PART NUMBER
Tape and reel
SN74CB3Q3384ADBQR
Tube
SN74CB3Q3384APW
Tape and reel
SN74CB3Q3384APWR
Tape and reel
SN74CB3Q3384ADGVR
TOP-SIDE MARKING
CB3Q3384A
BU384A
BU384A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2005, Texas Instruments Incorporated
SN74CB3Q3384A
10-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS114D – DECEMBER 2002 – REVISED JUNE 2005
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The SN74CB3Q3384A is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of
the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows
for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device
also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus.
Specifically designed to support high-bandwidth applications, the SN74CB3Q3384A provides an optimized
interface solution ideally suited for broadband communications, networking, and data-intensive computing
systems.
The SN74CB3Q3384A is organized as two 5-bit bus switches with separate output-enable (1OE, 2OE) inputs. It
can be used as two 5-bit bus switches or as one 10-bit bus switch. When OE is low, the associated 5-bit bus
switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE
is high, the associated 5-bit bus switch is OFF, and a high-impedance state exists between the A and B ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging
current backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
(EACH 5-BIT BUS SWITCH)
INPUT
OE
INPUT/OUTPUT
A
FUNCTION
L
B
A port = B port
H
Z
Disconnect
LOGIC DIAGRAM (POSITIVE LOGIC)
3
1A1
2
1B1
SW
11
1A5
10
1B5
SW
1
1OE
14
2A1
15
23
22
2A5
2OE
2
2B1
SW
SW
13
2B5
SN74CB3Q3384A
10-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS114D – DECEMBER 2002 – REVISED JUNE 2005
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A
B
VCC
Charge
Pump
EN(1)
(1) EN is the internal enable signal applied to the switch.
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
4.6
V
VIN
Control input voltage range (2) (3)
–0.5
7
V
VI/O
Switch I/O voltage range (2) (3) (4)
–0.5
7
V
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
II/O
ON-state switch current (5)
±64
mA
IO
Continuous current through VCC or GND
±100
mA
θJA
Package thermal impedance (6)
Tstg
Storage temperature range
DBQ package
61
DGV package
86
PW package
(1)
(2)
(3)
(4)
(5)
(6)
UNIT
°C/W
88
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground, unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
VI and VO are used to denote specific conditions for VI/O.
II and IO are used to denote specific conditions for II/O.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
VCC
Supply voltage
VIH
High-level control input voltage
VIL
Low-level control input voltage
VI/O
Data input/output voltage
TA
Operating free-air temperature
(1)
MIN
MAX
UNIT
2.3
3.6
VCC = 2.3 V to 2.7 V
1.7
5.5
V
VCC = 2.7 V to 3.6 V
2
5.5
VCC = 2.3 V to 2.7 V
0
0.7
VCC = 2.7 V to 3.6 V
0
0.8
0
5.5
V
–40
85
°C
V
V
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
SN74CB3Q3384A
10-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS114D – DECEMBER 2002 – REVISED JUNE 2005
Electrical Characteristics (1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
MIN TYP (2)
TEST CONDITIONS
VCC = 3.6 V,
II = –18 mA
VCC = 3.6 V,
VIN = 0 to 5.5 V
IOZ (3)
VCC = 3.6 V,
VO = 0 to 5.5 V,
VI = 0,
Switch OFF,
VIN = VCC or GND
Ioff
VCC = 0,
VO = 0 to 5.5 V,
VI = 0
ICC
VCC = 3.6 V,
II/O = 0,
Switch ON or OFF,
VIN = VCC or GND
Control inputs
VCC = 3.6 V,
One input at 3 V,
Other inputs at VCC or GND
ICCD (5)
Per control
input
VCC = 3.6 V,
A and B ports open,
Cin
Control inputs
VCC = 3.3 V,
VIN = 5.5 V, 3.3 V, or 0
Cio(OFF)
VCC = 3.3 V,
Switch OFF,
VIN = VCC or GND,
Cio(ON)
VCC = 3.3 V,
IIN
Control inputs
∆ICC
(4)
ron (6)
VCC = 3 V
(1)
(2)
(3)
(4)
(5)
(6)
UNIT
–1.8
V
±1
µA
±1
µA
1
µA
2
mA
30
µA
1
0.15
0.25
mA/
MHz
2.5
3.5
pF
VI/O = 5.5 V, 3.3 V, or 0
3.5
5
pF
Switch ON,
VIN = VCC or GND,
VI/O = 5.5 V, 3.3 V, or 0
8
10
pF
VI = 0,
IO = 30 mA
3
8
VI = 1.7 V,
IO = –15 mA
3.5
9
VI = 0,
IO = 30 mA
3
6
VI = 2.4 V,
IO = –15 mA
3.5
8
Control input switching at 50% duty cycle
VCC = 2.3 V,
TYP at VCC = 2.5 V
MAX
Ω
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
This parameter specifies the dynamic power-supply current associated with the operating frequency of a single control input (see
Figure 2).
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
(1)
(2)
4
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
FROM
(INPUT)
TO
(OUTPUT)
fOE (1)
OE
A or B
10
20
tpd (2)
A or B
B or A
0.09
0.15
ns
ten
OE
A or B
1.5
7.2
1.5
6
ns
tdis
OE
A or B
1.5
6.6
1.5
6.6
ns
PARAMETER
MIN
MAX
MIN
UNIT
MAX
Maximum switching frequency for control input (VO > VCC, VI = 5 V, RL ≥ 1 MΩ, CL = 0)
The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
MHz
SN74CB3Q3384A
10-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS114D – DECEMBER 2002 – REVISED JUNE 2005
TYPICAL ron
vs
VI
ron - ON-State Resistance - 16
VCC = 3.3 V
TA = 25°C
IO = -15 mA
14
12
10
8
6
4
2
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VI - V
Figure 1. Typical ron vs VI
TYPICAL ICC
vs
OE SWITCHING FREQUENCY
12
VCC = 3.3 V
TA = 25°C
A and B Ports Open
10
ICC − mA
8
6
4
One OE Switching
2
0
0
2
4
6
8
10
12
14
16
18
20
OE Switching Frequency − MHz
Figure 2. Typical ICC vs OE Switching Frequency
5
SN74CB3Q3384A
10-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS114D – DECEMBER 2002 – REVISED JUNE 2005
PARAMETER MEASUREMENT INFORMATION
VCC
Input Generator
VIN
50 Ω
50 Ω
VG1
TEST CIRCUIT
DUT
2 × VCC
Input Generator
S1
RL
VO
VI
50 Ω
50 Ω
VG2
CL
(see Note A)
RL
TEST
VCC
S1
RL
VI
CL
tpd(s)
2.5 V ± 0.2 V
3.3 V ± 0.3 V
Open
Open
500 Ω
500 Ω
VCC or GND
VCC or GND
30 pF
50 pF
tPLZ/tPZL
2.5 V ± 0.2 V
3.3 V ± 0.3 V
2 × VCC
2 × VCC
500 Ω
500 Ω
GND
GND
30 pF
50 pF
0.15 V
0.3 V
tPHZ/tPZH
2.5 V ± 0.2 V
3.3 V ± 0.3 V
GND
GND
500 Ω
500 Ω
VCC
VCC
30 pF
50 pF
0.15 V
0.3 V
V∆
VCC
Output
Control
(VIN)
VCC/2
VCC
VCC/2
VCC/2
0V
tPLH
VOH
Output
VCC/2
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (tpd(s))
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLZ
VCC
VCC/2
VOL + V∆
VOL
tPZH
tPHL
VCC/2
0V
tPZL
Output
Control
(VIN)
Open
GND
Output
Waveform 2
S1 at GND
(see Note B)
tPHZ
VOH
VCC/2
VOH − V∆
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance
of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Test Circuit and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74CB3Q3384ADBQRE4
ACTIVE
SSOP/
QSOP
DBQ
24
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
74CB3Q3384ADBQRG4
ACTIVE
SSOP/
QSOP
DBQ
24
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
74CB3Q3384ADGVRE4
ACTIVE
TVSOP
DGV
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CB3Q3384ADGVRG4
ACTIVE
TVSOP
DGV
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3Q3384ADBQR
ACTIVE
SSOP/
QSOP
DBQ
24
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74CB3Q3384ADGVR
ACTIVE
TVSOP
DGV
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3Q3384APW
ACTIVE
TSSOP
PW
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3Q3384APWE4
ACTIVE
TSSOP
PW
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3Q3384APWG4
ACTIVE
TSSOP
PW
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3Q3384APWR
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3Q3384APWRE4
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3Q3384APWRG4
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.5
9.0
2.1
8.0
16.0
Q1
SN74CB3Q3384ADBQR
SSOP/
QSOP
DBQ
24
2500
330.0
16.4
SN74CB3Q3384ADGVR
TVSOP
DGV
24
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
SN74CB3Q3384APWR
TSSOP
PW
24
2000
330.0
16.4
6.95
8.3
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74CB3Q3384ADBQR
SSOP/QSOP
DBQ
24
2500
346.0
346.0
33.0
SN74CB3Q3384ADGVR
TVSOP
DGV
24
2000
346.0
346.0
29.0
SN74CB3Q3384APWR
TSSOP
PW
24
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
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