TI TMS320F243

 SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
D High-Performance Static CMOS Technology
D Includes the TMS320C2xx Core CPU
D
D
D
D
D
− Object-Compatible With the TMS320C2xx
− Source-Code-Compatible With
TMS320C25
− Upwardly Compatible With TMS320C5xt
− 50-ns Instruction Cycle Time
Commercial and Industrial Temperature
Available
Memory
− 544 Words x 16 Bits of On-Chip
Data/Program Dual-Access RAM
(DARAM)
− 8K Words x 16 Bits of Flash EEPROM
− 224K Words x 16 Bits of Total Memory
Address Reach (F243 only)
External Memory Interface (F243 only)
Event-Manager Module
− Eight Compare/Pulse-Width Modulation
(PWM) Channels
− Two 16-Bit General-Purpose Timers With
Four Modes, Including Continuous
Up and Up / Down Counting
− Three 16-Bit Full Compare Units With
Deadband
− Three Capture Units (Two With
Quadrature Encoder-Pulse Interface
Capability)
Single 10-Bit Analog-to-Digital Converter
(ADC) Module With 8 Multiplexed Input
Channels
D Controller Area Network (CAN) Module
D 26 Individually Programmable, Multiplexed
General-Purpose I / O (GPIO) Pins
D Six Dedicated GPIO Pins (F243 only)
D Phase-Locked-Loop (PLL)-Based Clock
D
D
D
D
D
D
D
D
D
D
Module
Watchdog (WD) Timer Module
Serial Communications Interface (SCI)
Module
16-Bit Serial Peripheral Interface (SPI)
Module
Five External Interrupts (Power Drive
Protection, Reset, NMI, and Two Maskable
Interrupts)
Three Power-Down Modes for Low-Power
Operation
Scan-Based Emulation
Development Tools Available:
− Texas Instruments (TI) ANSI C Compiler,
Assembler/ Linker, and C-Source
Debugger
− Full Range of Emulation Products
− Self-Emulation (XDS510)
− Third-Party Digital Motor Control and
Fuzzy-Logic Development Support
144-Pin LQFP PGE Package (F243)
68-Pin PLCC FN Package (F241)
64-Pin QFP PG Package (F241)
description
The TMS320F243 and TMS320F241 devices are members of the 24x generation of digital signal processor
(DSP) controllers based on the TMS320C2000t platform of 16-bit fixed-point DSPs. The F243 is a superset
of the F241. These two devices share similar core and peripherals with some exceptions. For example, the F241
does not have an external memory interface. This new family is optimized for digital motor / motion control
applications. The DSP controllers combine the enhanced TMS320t DSP family architectural design of the
C2xx core CPU for low-cost, high-performance processing capabilities and several advanced peripherals
optimized for motor/ motion control applications. These peripherals include the event manager module, which
provides general-purpose timers and PWM registers to generate PWM outputs, and a single,10-bit
analog-to-digital converter (ADC), which can perform conversion within 1 µs.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TMS320C5x, XDS510, TMS320C2000, and TMS320 are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
Copyright  2006, Texas Instruments Incorporated
!" #!$% &"'
&! #" #" (" " ") !"
&& *+' &! #", &" ""%+ %!&"
", %% #""'
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1
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
Table of Contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Device Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
PGE Package, 144-Pin LQFP, F243 . . . . . . . . . . . . . . . . 5
FN Package, 68-Pin PLCC, F241 . . . . . . . . . . . . . . . . . . 6
PG Package, 64-Pin QFP, F241 . . . . . . . . . . . . . . . . . . . 7
Terminal Functions - F243 PGE Package . . . . . . . . . . . 8
Terminal Functions - F241 PG and FN Packages . . . 15
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 19
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 20
System-Level Functions . . . . . . . . . . . . . . . . . . . . . . . . . 20
Device Memory Maps . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Memory Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Peripheral Memory Map . . . . . . . . . . . . . . . . . . . . . . . . 23
Software-Controlled Wait-State Generator . . . . . . . . 24
Digital I/O and Shared Pin Functions . . . . . . . . . . . . . 25
Digital I/O Control Registers . . . . . . . . . . . . . . . . . . . . 28
Device Reset and Interrupts . . . . . . . . . . . . . . . . . . . . 28
Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Functional Block Diagram of the 24x DSP CPU . . . . . 40
24x Legend for the Internal Hardware . . . . . . . . . . . . 41
F243/F241 DSP Core CPU . . . . . . . . . . . . . . . . . . . . . . 42
Internal Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
External Memory Interface (F243 only) . . . . . . . . . . . 48
Wait-State Generation (F243 only) . . . . . . . . . . . . . . . 49
Event-Manager (EV2) Module . . . . . . . . . . . . . . . . . . 50
Analog-to-Digital Converter (ADC) Module . . . . . . . . 53
A/D Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Serial Peripheral Interface (SPI) Module . . . . . . . . . . 55
Serial Communications Interface (SCI) Module . . . . 57
Controller Area Network (CAN) Module . . . . . . . . . . 59
Watchdog (WD) Timer Module . . . . . . . . . . . . . . . . . . 62
Scan-Based Emulation . . . . . . . . . . . . . . . . . . . . . . . . . . 64
TMS320x24x Instruction Set . . . . . . . . . . . . . . . . . . . . . 64
Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Repeat Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . 65
Development Support . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
2
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Documentation Support . . . . . . . . . . . . . . . . . . . . . . . . . 74
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . 75
Recommended Operating Conditions . . . . . . . . . . . . . 75
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 76
Parameter Measurement Information . . . . . . . . . . . . . . 77
Signal Transition Levels . . . . . . . . . . . . . . . . . . . . . . . . 77
Timing Parameter Symbology . . . . . . . . . . . . . . . . . . . 78
General Notes on Timing Parameters . . . . . . . . . . . . 78
Clock Characteristics and Timings . . . . . . . . . . . . . . . . 79
Clock Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Ext Reference Crystal/Clock w/PLL Circuit Enabled 80
Low-Power Mode Timings . . . . . . . . . . . . . . . . . . . . . . 81
RS Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
XF, BIO, and MP/MC Timings . . . . . . . . . . . . . . . . . . . 84
Timing Event Manager Interface . . . . . . . . . . . . . . . . . . 85
PWM Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Capture and QEP Timings . . . . . . . . . . . . . . . . . . . . . . 86
Interrupt Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
General-Purpose Input/Output Timings . . . . . . . . . . . 88
SPI Master Mode Timing Parameters . . . . . . . . . . . . . 89
SPI Slave Mode Timing Parameters . . . . . . . . . . . . . . . 93
External Memory Interface Read Timings . . . . . . . . . . 97
External Memory Interface Write Timings . . . . . . . . . . 99
External Memory Interface Ready-on-Read . . . . . . . 101
External Memory Interface Ready-on-Write . . . . . . . 102
10-Bit Dual Analog-to-Digital Converter (ADC) . . . . . 103
ADC Operating Frequency . . . . . . . . . . . . . . . . . . . . 103
ADC Input Pin Circuit . . . . . . . . . . . . . . . . . . . . . . . . . 104
Internal ADC Module Timings . . . . . . . . . . . . . . . . . . 105
Flash EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Programming Operation . . . . . . . . . . . . . . . . . . . . . . . 106
Erase Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Flash-Write Operation . . . . . . . . . . . . . . . . . . . . . . . . 106
Register File Compilation . . . . . . . . . . . . . . . . . . . . . . . 107
Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
REVISION HISTORY
REVISION
DATE
PRODUCT STATUS
HIGHLIGHTS
“Terminal Functions - F243 PGE Package” table:
− updated TYPE column of RD
Updated Development Support section.
Updated Device and Development-Support Tool Nomenclature
section.
D
February 2006
Production Data
Figure 16, TMS320x24x DSP Device Nomenclature:
Removed “Q = −40°C to 125°C, Q 100 Fault Grading” from
TEMPERATURE RANGE.
Updated Documentation Support section.
Recommended Operating Conditions table:
VAI: changed MIN value from VSSA to VREFLO
VAI: changed MAX value from VCCA to VREFHI
Updated Mechanical Data section.
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SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
device features
Table 1 and Table 2 provide a comparison of the features of the F243 and F241. See the functional block
diagram for 24x peripherals and memory.
Table 1. Hardware Features of the TMS320F24x DSP Controllers
ON-CHIP MEMORY (WORDS)
RAM
TMS320F24x
DEVICES
DATA SPACE
CONFIGURABLE
DATA / PROG SPACE
(B1 RAM - 256 WORDS)
(B2 RAM - 32 WORDS)
(B0 RAM)
288
256
EXTERNAL
MEMORY
INTERFACE
√
TMS320F243
TMS320F241
−
POWER
SUPPLY
(V)
CYCLE
TIME
(ns)
5
50
Table 2. Device Specifications of the TMS320F24x DSP Controllers
ON-CHIP MEMORY (WORDS)
ROM
FLASH
EEPROM
PROG
PROG
TMS320F243
−
8K
TMS320F241
−
8K
TMS320F24x
DEVICES
4
ADC
CHANNELS
PERIPHERALS
GPIO
PACKAGE
TYPE
PIN COUNT
CAN
SPI
8
√
√
32
PGE
144-PQFP
8
√
√
26
FN 68-PLCC
PG 64-PQFP
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SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
109
111
110
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
1
108
VSSO
2
107
PS
3
106
VDDO
4
105
IS
5
104
6
103
7
102
8
101
9
100
10
99
11
98
12
97
13
96
14
95
15
94
A0
A1
PWM1/IOPA6
A2
PWM2/IOPA7
A3
PWM3/IOPB0
DNC
PWM4/IOPB1
A4
PWM5/IOPB2
A5
A6
PWM6/IOPB3
A7
PDPINT
A8
TCLKIN/IOPB7
A9
TDIR/IOPB6
A10
XINT1/IOPA2
A11
XINT2/ADCSOC/IOPD1
A12
NMI
A13
VCCP/WDDIS
A14
VDDO
A15
VSSO
16
93
17
92
TMS320F243
(144-Pin LQFP)
18
19
91
90
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
V SSO
D2
V DDO
V SSO
XTAL1/CLKIN
XTAL2
MP/MC
READY
EMU0
D3
EMU1/OFF
D4
XF/IOPC0
D5
V SS
D6
VDD
D7
BIO/IOPC1
SCITXD/IOPA0
D8
SCIRXD/IOPA1
D9
SPISIMO/IOPC2
D10
SPISOMI/IOPC3
D11
SPICLK/IOPC4
D12
SPISTE/IOPC5
D13
PMT
D14
VSSO
D15
VDDO
55
73
54
74
36
53
75
35
52
76
34
51
77
33
50
78
32
49
79
31
48
80
30
47
81
29
46
82
28
45
83
27
44
84
26
43
85
25
42
86
24
41
87
23
40
88
22
39
89
21
38
20
37
NC
NC
ADCIN04
ADCIN03
NC
ADCIN02
NC
ADCIN01
NC
ADCIN00
NC
DNC
NC
VSSO
VSSO
VSS
VDD
ENA_144
RS
IOPD2
IOPD3
TCK
IOPD4
TDI
IOPD5
TDO
IOPD6
TMS
IOPD7
TRST
VIS_CLK
VSS
D0
VDDO
D1
VSSO
143
144
ADCIN0
ADCIN05
ADCIN06
V REFLO
V REFHI
NC
ADCIN07
NC
VCCA
NC
VSSA
NC
NC
NC
V SSO
T1PWM/T1CMP/IOPB4
V SSO
T2PWM/T2CMP/IOPB5
V SS
VIS_OE
VDD
V SSO
CAP1/QEP0/IOPA3
STRB
CAP2/QEP1/IOPA4
BR
CAP3/IOPA5
RD
V SSO
CLKOUT/IOPD0
CANTX/IOPC6
R/W
CANRX/IOPC7
WE
V SSO
DS
V DDO
PGE PACKAGE†‡
(TOP VIEW)
† NC = No connection, DNC = Do not connect
‡ The PMT pin, number 68 in this package drawing, must be connected to ground.
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5
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
PDPINT
2
1
68
67
66
65
64
63
62
61
CANRX/IOPC7
10
60
PMT
CANTX/IOPC6
11
59
SPISTE/IOPC5
CLKOUT/IOPD0
12
58
SPICLK/IOPC4
CAP3/IOPA5
13
57
SPISOMI/IOPC3
CAP2/QEP1/IOPA4
14
56
SPISIMO/IOPC2
CAP1/QEP0/IOPA3
15
55
SCIRXD/IOPA1
VDD
16
54
SCITXD/IOPA0
VSS
17
53
BIO/IOPC1
T2CMP/T2PWM/IOPB5
18
52
VDD
T1CMP/T1PWM/IOPB4
19
51
VSS
VSSA
20
50
XF/IOPC0
VCCA
21
49
EMU1
ADCIN07
22
48
EMU0
VREFHI
23
47
XTAL2
VREFLO
24
46
XTAL1/CLKIN
ADCIN06
25
45
VDDO
ADCIN05
26
44
VSSO
ADCIN02
ADCIN01
ADCIN00
DNC
36
37
38
39
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• HOUSTON, TEXAS 77251−1443
41
42
43
V SSO
ADCIN03
35
V DDO
ADCIN04
34
TRST
VSS
33
TMS
32
TDO
31
TDI
30
TCK
29
RS
28
V SSO
27
NC
TMS320F241
(68-Pin PLCC)
† NC = No connection, DNC = Do not connect
‡ The PMT pin, number 60 in this package drawing, must be connected to ground.
6
V SSO
PWM6/IOPB3
3
V DDO
PWM5/IOPB2
4
V CCP /WDDIS
PWM4/IOPB1
5
NMI
PWM3/IOPB0
6
XINT2/ADCSOC/IOPD1
PWM2/IOPA7
7
XINT1/IOPA2
PWM1/IOPA6
8
TDIR/IOPB6
V DDO
9
TCLKIN/IOPB7
V SSO
FN PACKAGE†‡
(TOP VIEW)
40
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
VDDO
VSSO
PMT
SPISTE/IOPC5
SPICLK/IOPC4
SPISOMI/IOPC3
SPISIMO/IOPC2
SCIRXD/IOPA1
SCITXD/IOPA0
BIO/IOPC1
VDD
VSS
XF/IOPC0
EMU1
EMU0
XTAL2
XTAL1/CLKIN
VDDO
VSSO
PG PACKAGE†‡
(TOP VIEW)
51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
VCCP/WDDIS
NMI
XINT2/ADCSOC/IOPD1
XINT1/IOPA2
TDIR/IOPB6
TCLKIN/IOPB7
PDPINT
PWM6/IOPB3
PWM5/IOPB2
PWM4/IOPB1
PWM3/IOPB0
PWM2/IOPA7
PWM1/IOPA6
52
53
54
55
56
57
58
59
60
61
62
63
64
TMS320F241
(64-Pin QFP)
32
31
30
29
28
27
26
25
24
23
22
21
20
TRST
TMS
TDO
TDI
TCK
RS
VSSO
DNC
ADCIN00
ADCIN01
ADCIN02
ADCIN03
ADCIN04
VDDO
VSSO
CANRX/IOPC7
CANTX/IOPC6
CLKOUT/IOPD0
CAP3/IOPA5
CAP2/QEP1/IOPA4
CAP1/QEP0/IOPA3
VDD
VSS
T2CMP/T2PWM/IOPB5
T1CMP/T1PWM/IOPB4
VSSA
VCCA
ADCIN07
V REFHI
VREFLO
ADCIN06
ADCIN05
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
† NC = No connection, DNC = Do not connect
‡ The PMT pin, number 49 in this package drawing, must be connected to ground.
POST OFFICE BOX 1443
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SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
Terminal Functions - F243 PGE Package
NAME
144
LQFP
NO.
TYPE†
RESET
STATE‡
DESCRIPTION
ANALOG-TO-DIGITAL CONVERTER (ADC) INPUTS
ADCIN00
10
ADCIN01
8
ADCIN02
6
ADCIN03
4
ADCIN04
3
ADCIN05
144
ADCIN06
143
ADCIN07
139
I
I
Analog inputs to the ADC
VCCA
137
−
−
Analog supply voltage for ADC (5 V). It is highly recommended to
isolate VCCA from the digital supply voltage (and VSSA from digital
ground) to maintain the specified accuracy and improve the noise
immunity of the ADC.
VSSA
VREFHI
135
−
−
Analog ground reference for ADC
141
−
−
ADC analog high-voltage reference input
VREFLO
142
−
−
ADC analog low-voltage reference input
EVENT MANAGER
T1PWM/T1CMP/IOPB4
130
I/O/Z
I
Timer 1 compare output/general-purpose bidirectional digital I/O
(GPIO).
T2PWM/T2CMP/IOPB5
128
I/O/Z
I
Timer 2 compare output/GPIO
TDIR/IOPB6
85
I/O
I
Counting direction for general-purpose (GP) timer/GPIO. If TDIR=1,
upward counting is selected. If TDIR=0, downward counting is
selected.
TCLKIN/IOPB7
87
I/O
I
External clock input for GP timer/GPIO. Note that timer can also use
the internal device clock.
CAP1/QEP0/IOPA3
123
I/O
I
Capture input #1/quadrature encoder pulse input #0/GPIO
CAP2/QEP1/IOPA4
121
I/O
I
Capture input #2/quadrature encoder pulse input #1/GPIO
CAP3/IOPA5
119
I/O
I
Capture input #3/GPIO
PWM1/IOPA6
102
I/O/Z
I
Compare/PWM output pin #1 or GPIO
PWM2/IOPA7
100
I/O/Z
I
Compare/PWM output pin #2 or GPIO
PWM3/IOPB0
98
I/O/Z
I
Compare/PWM output pin #3 or GPIO
PWM4/IOPB1
96
I/O/Z
I
Compare/PWM output pin #4 or GPIO
PWM5/IOPB2
94
I/O/Z
I
Compare/PWM output pin #5 or GPIO
PWM6/IOPB3
91
I/O/Z
I
Compare/PWM output pin #6 or GPIO
I
Power drive protection interrupt input. This interrupt, when activated,
puts the PWM output pins in the high-impedance state should motor
drive/power converter abnormalities, such as overvoltage or
overcurrent, etc., arise. PDPINT is level-sensitive and can cause
multiple interrupts when held low.
PDPINT
89
I
† I = input, O = output, Z = high impedance
‡ The reset state indicates the state of the pin at reset. If the pin is an input, indicated by an I, its state is determined by user design. If the pin is
an output, its level at reset is indicated.
§ At reset, the device comes up with AVIS mode enabled. The data bus is in output mode while AVIS is enabled.
NOTE: Bold, italicized pin names indicate pin function after reset.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is 150 µA.)
8
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Terminal Functions - F243 PGE Package (Continued)
NAME
144
LQFP
NO.
TYPE†
RESET
STATE‡
DESCRIPTION
SERIAL PERIPHERAL INTERFACE (SPI) AND BIT I/O PINS
SPISIMO/IOPC2
60
I/O
I
SPI slave in, master out or GPIO
SPISOMI/IOPC3
62
I/O
I
SPI slave out, master in or GPIO
SPICLK/IOPC4
64
I/O
I
SPI clock or GPIO
66
I/O
I
SPI slave transmit enable (optional) or GPIO
SPISTE/IOPC5
SERIAL COMMUNICATIONS INTERFACE (SCI) AND BIT I/O PINS
SCITXD/IOPA0
56
SCIRXD/IOPA1
58
I/O
I
SCI asynchronous serial port transmit data or GPIO
I/O
I
SCI asynchronous serial port receive data or GPIO
CONTROLLER AREA NETWORK (CAN)
CANTX/IOPC6
115
I/O
I
CAN transmit data or GPIO
CANRX/IOPC7
113
I/O
I
CAN receive data or GPIO
INTERRUPT, EXTERNAL ACCESS, AND MISCELLANEOUS SIGNALS
RS
19
I/O
I
Device reset. RS causes the F243/241 to terminate execution and sets
PC = 0. When RS is brought to a high level, execution begins at location
zero of program memory. RS affects (or sets to zero) various registers
and status bits. When the watchdog timer overflows, it initiates a system
reset pulse that is reflected on the RS pin. This pulse is eight clock cycles
wide.
NMI§
79
I
I
Nonmaskable interrupt. When NMI is activated, the device is interrupted
regardless of the state of the INTM bit of the status register. NMI is
(falling) edge- and low-level-sensitive. To be recognized by the core, this
pin must be kept low for at least one clock cycle after the falling edge.
I
External user interrupt 1 or GPIO. Both XINT1 and XINT2 are edgesensitive. To be recognized by the core, these pins must be kept
high/low for at least one clock cycle after the edge. The edge polarity is
programmable.
I
External user interrupt 2. External “start-of-conversion” input for
ADC/GPIO. Both XINT1 and XINT2 are edge-sensitive. To be
recognized by the core, these pins must be kept high/low for at least one
clock cycle after the edge. The edge polarity is programmable.
I
Microprocessor/Microcomputer mode select. If this pin is low during
reset, the device is put in microcomputer mode and program execution
begins at 0000h of internal program memory (flash EEPROM). A high
value during reset puts the device in microprocessor mode and program
execution begins at 0000h of external program memory. (↓)
I
READY is pulled low to add wait states for external accesses. READY
indicates that an external device is prepared for a bus transaction to be
completed. If the device is not ready, it pulls the READY pin low. The
processor waits one cycle and checks READY again. Note that the
processor performs READY-detection if at least one software wait state
is programmed. To meet the external READY timings, the wait-state
generator control register (WSGR) should be programmed for at least
one wait state. (↑)
XINT1/IOPA2
XINT2/ADCSOC/IOPD1
MP/MC
READY
83
81
43
44
I/O
I/O
I
I
† I = input, O = output, Z = high impedance
‡ The reset state indicates the state of the pin at reset. If the pin is an input, indicated by an I, its state is determined by user design. If the pin is
an output, its level at reset is indicated.
§ At reset, the device comes up with AVIS mode enabled. The data bus is in output mode while AVIS is enabled.
NOTE: Bold, italicized pin names indicate pin function after reset.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is 150 µA.)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
9
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
Terminal Functions - F243 PGE Package (Continued)
NAME
144
LQFP
NO.
TYPE†
RESET
STATE‡
DESCRIPTION
INTERRUPT, EXTERNAL ACCESS, AND MISCELLANEOUS SIGNALS (CONTINUED)
IS
DS
PS
105
110
107
O/Z
1
I/O, data, and program space strobe select signals. IS, DS, and PS are always high
unless low-level asserted for access to the relevant external memory space or I/O.
They are placed in the high-impedance state during reset, power down, and when
EMU1/OFF is active low.
WE
112
O/Z
1
Write enable strobe. The falling edge of WE indicates that the device is driving the
external data bus (D15 −D0). WE is active on all external program, data, and I/O
writes. WE goes in the high-impedance state when EMU1/OFF is active low.
RD
118
O/Z
1
Read enable strobe. Read-select indicates an active, external read cycle. RD is
active on all external program, data, and I / O reads. RD goes into the
high-impedance state when EMU1/OFF is active low.
R/W
114
O/Z
1
Read/write signal. R/W indicates transfer direction during communication to an
external device. It is normally in read mode (high), unless low level is asserted for
performing a write operation. It is placed in the high-impedance state when
EMU1/OFF is active low and during power down.
1
External memory access strobe. STRB is always high unless asserted low to
indicate an external bus cycle. STRB is active for all off-chip accesses. It is placed
in the high-impedance state during power down, and when EMU1/OFF is active
low.
STRB
122
O/Z
BR
120
O/Z
1
Bus request, global memory strobe. BR is asserted during access of
external global data memory space. BR can be used to extend the data memory
address space by up to 32K words. BR goes in the high-impedance state during
reset, power down, and when EMU1/OFF is active low.
VIS_CLK
31
O
0
Visibility clock. Same as CLKOUT, but timing is aligned for external buses in
visibility mode.
ENA_144
18
I
I
Active high to enable external interface signals. If pulled low, the F243 behaves like
an F241—i.e., it has no external memory and generates an illegal address if any
of the three external spaces are accessed (IS, DS, PS asserted). This pin has an
internal pulldown. (↓)
VIS_OE
126
O
0
This pin is active (low) whenever the external databus is driving as an output during
visibility mode. Can be used by external decode logic to prevent data bus
contention while running in visibility mode.
O−1
External flag output (latched software-programmable signal). XF is a
general-purpose output pin. It is set/reset by the SETC XF/CLRC XF instruction.
This pin is configured as an external flag output by all device resets. It can be used
as a GPIO, if not used as XF.
I
Branch control input. BIO is polled by the BCND pma,BIO instruction. If BIO is low,
a branch is executed. If BIO is not used, it should be pulled high. This pin is
configured as a branch control input by all device resets. It can be used as a GPIO,
if not used as a branch control input.
XF/IOPC0
BIO/IOPC1
49
55
I/O
I/O
† I = input, O = output, Z = high impedance
‡ The reset state indicates the state of the pin at reset. If the pin is an input, indicated by an I, its state is determined by user design. If the pin is
an output, its level at reset is indicated.
§ At reset, the device comes up with AVIS mode enabled. The data bus is in output mode while AVIS is enabled.
NOTE: Bold, italicized pin names indicate pin function after reset.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is 150 µA.)
10
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
Terminal Functions - F243 PGE Package (Continued)
NAME
144
LQFP
NO.
TYPE†
RESET
STATE‡
DESCRIPTION
INTERRUPT, EXTERNAL ACCESS, AND MISCELLANEOUS SIGNALS (CONTINUED)
PMT
68
VCCP/WDDIS
77
I
I
I
Enables parallel module test (PMT). This pin must be connected to ground. (↓)
I
Flash programming voltage pin and watchdog disable. This is the 5-V supply used
for flash programming. Flash cannot be programmed if this pin is held at 0 V. This
pin also works as a hardware watchdog disable, when VCCP/WDDIS = +5 V and
bit 6 in WDCR is set to 1. Do not use a current-limiting resistor on this pin.
DEDICATED I/O SIGNALS
IOPD2
20
I/O
Dedicated GPIO − Port D bit 2 (↓)
IOPD3
21
I/O
Dedicated GPIO − Port D bit 3 (↓)
IOPD4
23
I/O
Dedicated GPIO − Port D bit 4 (↓)
I
IOPD5
25
I/O
IOPD6
27
I/O
Dedicated GPIO − Port D bit 5 (↓)
Dedicated GPIO − Port D bit 6 (↓)
IOPD7
29
I/O
Dedicated GPIO − Port D bit 7 (↓)
D0 (↓)
33
D1 (↓)
35
D2 (↓)
38
D3 (↓)
46
D4 (↓)
48
D5 (↓)
50
D6 (↓)
52
DATA AND ADDRESS BUS SIGNALS
D7 (↓)
D8
54
(↑)
57
D9 (↓)
59
D10 (↓)
61
D11 (↓)
63
D12 (↓)
65
D13 (↓)
67
D14 (↓)
69
D15 (↓)
71
I/O/Z
O§
Bit x of the 16-bit Data Bus
† I = input, O = output, Z = high impedance
‡ The reset state indicates the state of the pin at reset. If the pin is an input, indicated by an I, its state is determined by user design. If the pin is
an output, its level at reset is indicated.
§ At reset, the device comes up with AVIS mode enabled. The data bus is in output mode while AVIS is enabled.
NOTE: Bold, italicized pin names indicate pin function after reset.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is 150 µA.)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
11
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
Terminal Functions - F243 PGE Package (Continued)
NAME
144
LQFP
NO.
TYPE†
RESET
STATE‡
DESCRIPTION
DATA AND ADDRESS BUS SIGNALS (CONTINUED)
A0
104
A1
103
A2
101
A3
99
A4
95
A5
93
A6
92
A7
90
A8
88
A9
86
A10
84
A11
82
A12
80
A13
78
A14
76
A15
74
O
0
Bit x of the 16-bit Address Bus
CLOCK SIGNALS
XTAL1/CLKIN
41
I
I
PLL oscillator input pin. Crystal input to PLL/clock source input to PLL.
XTAL1/CLKIN is tied to one side of a reference crystal.
XTAL2
42
O
O
Crystal output. PLL oscillator output pin. XTAL2 is tied to one side of a reference
crystal. This pin goes in the high-impedance state when EMU1/OFF is active low.
CLKOUT/IOPD0
116
I/O
O
Clock output. This pin outputs either the CPU clock (CLKOUT) or the watchdog
clock (WDCLK). The selection is made by the CLKSRC bit
(bit 14) of the System Control and Status Register (SCSR). This pin can be used
as a GPIO if not used as a clock output pin.
TCK
22
I
I
JTAG test clock with internal pullup (↑)
TDI
24
I
I
JTAG test data input (TDI) with internal pullup. TDI is clocked into the selected
register (instruction or data) on a rising edge of TCK. (↑)
TDO
26
I/O
I
JTAG scan out, test data output (TDO). The contents of the selected register
(instruction or data) is shifted out of TDO on the falling edge of TCK. (↓)
TMS
28
I
I
JTAG test-mode select (TMS) with internal pullup. This serial control input is
clocked into the TAP controller on the rising edge of TCK. (↑)
TEST SIGNALS
† I = input, O = output, Z = high impedance
‡ The reset state indicates the state of the pin at reset. If the pin is an input, indicated by an I, its state is determined by user design. If the pin is
an output, its level at reset is indicated.
§ At reset, the device comes up with AVIS mode enabled. The data bus is in output mode while AVIS is enabled.
NOTE: Bold, italicized pin names indicate pin function after reset.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is 150 µA.)
12
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
Terminal Functions - F243 PGE Package (Continued)
NAME
144
LQFP
NO.
TYPE†
RESET
STATE‡
DESCRIPTION
TEST SIGNALS (CONTINUED)
TRST
30
I
I
JTAG test reset with internal pulldown. TRST, when driven high, gives
the scan system control of the operations of the device. If this signal is
not connected or driven low, the device operates in its functional mode,
and the test reset signals are ignored. (↓)
EMU0
45
I/O
I
Emulator I/O pin 0 with internal pullup. When TRST is driven high, this
pin is used as an interrupt to or from the emulator system and is defined
as input/output through the JTAG scan. (↑)
EMU1/OFF
47
I/O
I
Emulator I/O pin 1 with internal pullup. When TRST is driven high, this
pin is used as an interrupt to or from the emulator system and is defined
as input/output through JTAG scan. (↑)
SUPPLY SIGNALS
14
15
36
37
40
70
VSSO
73
−
−
Digital logic and buffer ground reference
−
−
Digital logic and buffer supply voltage
−
−
Digital logic supply voltage
−
−
Digital logic ground reference
108
111
117
124
129
131
34
39
72
VDDO
75
106
109
17
VDD
53
125
16
32
VSS
51
127
† I = input, O = output, Z = high impedance
‡ The reset state indicates the state of the pin at reset. If the pin is an input, indicated by an I, its state is determined by user design. If the pin is
an output, its level at reset is indicated.
§ At reset, the device comes up with AVIS mode enabled. The data bus is in output mode while AVIS is enabled.
NOTE: Bold, italicized pin names indicate pin function after reset.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is 150 µA.)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
13
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
Terminal Functions - F243 PGE Package (Continued)
NAME
144
LQFP
NO.
TYPE†
RESET
STATE‡
DESCRIPTION
NO CONNECTS
12
DNC
97
−
−
Do not connect. Reserved for test.
−
−
No internal connection made to this pin
1
2
5
7
9
11
NC
13
132
133
134
136
138
140
† I = input, O = output, Z = high impedance
‡ The reset state indicates the state of the pin at reset. If the pin is an input, indicated by an I, its state is determined by user design. If the pin is
an output, its level at reset is indicated.
§ At reset, the device comes up with AVIS mode enabled. The data bus is in output mode while AVIS is enabled.
NOTE: Bold, italicized pin names indicate pin function after reset.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is 150 µA.)
14
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
Terminal Functions - F241 PG and FN Packages
64
QFP
NO.
68
PLCC
NO.
ADCIN00
24
32
ADCIN01
23
31
ADCIN02
22
30
ADCIN03
21
29
ADCIN04
20
28
ADCIN05
19
26
ADCIN06
18
25
ADCIN07
15
22
NAME
TYPE†
RESET
STATE‡
DESCRIPTION
ANALOG-TO-DIGITAL CONVERTER (ADC) INPUTS
I
I
Analog inputs to the ADC
VCCA
14
21
−
−
Analog supply voltage for ADC (5 V). It is highly recommended to isolate
VCCA from the digital supply voltage (and VSSA from digital ground) to
maintain the specified accuracy and improve the noise immunity of the
ADC.
VSSA
VREFHI
13
20
−
−
Analog ground reference for ADC
16
23
−
−
ADC analog high-voltage reference input
VREFLO
17
24
−
−
ADC analog low-voltage reference input
EVENT MANAGER
T1CMP/T1PWM/IOPB4
12
19
I/O/Z
Timer 1 compare output/general-purpose bidirectional digital I/O (GPIO).
T2CMP/T2PWM/IOPB5
11
18
I/O/Z
Timer 2 compare output/GPIO
TDIR/IOPB6
56
67
I/O
Counting direction for GP timer/GPIO. If TDIR=1, upward counting is
selected. If TDIR=0, downward counting is selected.
TCLKIN/IOPB7
57
68
I/O
External clock input for GP timer/GPIO. Note that timer can also use the
internal device clock.
CAP1/QEP0/IOPA3
8
15
I/O
Capture input #1/quadrature encoder pulse input #0/GPIO
CAP2/QEP1/IOPA4
7
14
I/O
CAP3/IOPA5
6
13
I/O
PWM1/IOPA6
64
7
I/O/Z
Compare/PWM output pin #1 or GPIO
PWM2/IOPA7
63
6
I/O/Z
Compare/PWM output pin #2 or GPIO
PWM3/IOPB0
62
5
I/O/Z
Compare/PWM output pin #3 or GPIO
PWM4/IOPB1
61
4
I/O/Z
Compare/PWM output pin #4 or GPIO
PWM5/IOPB2
60
3
I/O/Z
Compare/PWM output pin #5 or GPIO
PWM6/IOPB3
59
2
I/O/Z
Compare/PWM output pin #6 or GPIO
PDPINT
58
1
I
I
Capture input #2/quadrature encoder pulse input #1/GPIO
Capture input #3/GPIO
I
Power drive protection interrupt input. This interrupt, when activated, puts
the PWM output pins in the high-impedance state, should motor
drive/power converter abnormalities, such as overvoltage or overcurrent,
etc., arise. PDPINT is level-sensitive and can cause multiple interrupts
when held low.
† I = input, O = output, Z = high impedance
‡ The reset state indicates the state of the pin at reset. If the pin is an input, indicated by an I, its state is determined by user design. If the pin is
an output, its level at reset is indicated.
NOTE: Bold, italicized pin names indicate pin function after reset.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is 150 µA.)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
15
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
Terminal Functions - F241 PG and FN Packages (Continued)
NAME
64
QFP
NO.
68
PLCC
NO.
TYPE†
RESET
STATE‡
DESCRIPTION
SERIAL PERIPHERAL INTERFACE (SPI) AND BIT I/O PINS
SPISIMO/IOPC2
45
56
I/O
SPISOMI/IOPC3
46
57
I/O
SPICLK/IOPC4
47
58
I/O
SPISTE/IOPC5
48
59
I/O
SCITXD/IOPA0
43
54
I/O
SCIRXD/IOPA1
44
55
I/O
CANTX/IOPC6
4
11
I/O
CANRX/IOPC7
3
10
I/O
SPI slave in, master out or GPIO
SPI slave out, master in or GPIO
I
SPI clock or GPIO
SPI slave transmit enable (optional) or GPIO
SERIAL COMMUNICATIONS INTERFACE (SCI) AND BIT I/O PINS
SCI asynchronous serial port transmit data or GPIO
I
SCI asynchronous serial port receive data or GPIO
CONTROLLER AREA NETWORK (CAN)
CAN transmit data or GPIO
I
CAN receive data or GPIO
INTERRUPT, EXTERNAL ACCESS, AND MISCELLANEOUS SIGNALS
RS
27
35
I/O
I
Device reset. RS causes the F243/241 to terminate execution and sets
PC = 0. When RS is brought to a high level, execution begins at location
zero of program memory. RS affects (or sets to zero) various registers
and status bits. When the watchdog timer overflows, it initiates a system
reset pulse reflected on the RS pin. This pulse is eight clock cycles wide.
NMI
53
64
I
I
Nonmaskable interrupt. When NMI is activated, the device is interrupted
regardless of the state of the INTM bit of the status register. NMI is
(falling) edge- and low-level-sensitive. To be recognized by the core, this
pin must be kept low for at least one clock cycle after the falling edge.
XINT1/IOPA2
55
66
I/O
I
External user interrupt 1 or GPIO. Both XINT1 and XINT2 are edgesensitive. To be recognized by the core, these pins must be kept low/high
for at least one clock cycle after the edge. The edge polarity is
programmable.
I
External user interrupt 2. External “start-of-conversion” input for
ADC/GPIO. Both XINT1 and XINT2 are edge-sensitive. To be
recognized by the core, these pins must be kept low/high for at least one
clock cycle after the edge. The edge polarity is programmable.
O−1
External flag output (latched software-programmable signal). XF is a
general-purpose output pin. It is set/reset by the SETC XF/CLRC XF
instruction. This pin is configured as an external flag output by all device
resets. It can be used as a GPIO, if not used as XF.
XINT2/ADCSOC/IOPD1
XF/IOPC0
54
39
65
50
I/O
I/O
BIO/IOPC1
42
53
I/O
I
Branch control input. BIO is polled by the BCND pma,BIO instruction. If
BIO is low, a branch is executed. If BIO is not used, it should be pulled
high. This pin is configured as a branch control input by all device resets.
It can be used as a GPIO, if not used as a branch control input.
PMT
49
60
I
I
Enables parallel module test (PMT). This pin must be connected to
ground.
† I = input, O = output, Z = high impedance
‡ The reset state indicates the state of the pin at reset. If the pin is an input, indicated by an I, its state is determined by user design. If the pin is
an output, its level at reset is indicated.
NOTE: Bold, italicized pin names indicate pin function after reset.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is 150 µA.)
16
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
Terminal Functions - F241 PG and FN Packages (Continued)
NAME
64
QFP
NO.
68
PLCC
NO.
TYPE†
RESET
STATE‡
DESCRIPTION
CLOCK SIGNALS
XTAL1/CLKIN
35
46
I
I
PLL oscillator input pin. Crystal input to PLL/clock source input to PLL.
XTAL1/CLKIN is tied to one side of a reference crystal.
XTAL2
36
47
O
O
Crystal output. PLL oscillator output pin. XTAL2 is tied to one side of a
reference crystal. This pin goes in the high-impedance state when
EMU1/OFF is active low.
O
Clock output. This pin outputs either the CPU clock (CLKOUT) or the
watchdog clock (WDCLK). The selection is made by the CLKSRC bit (bit 14)
of the System Status and Control Register (SSCR). This pin can be used as
a GPIO if not used as a clock output pin.
CLKOUT/IOPD0
5
12
I/O
TEST SIGNALS
TCK
28
36
I
I
JTAG test clock with internal pullup (↑)
TDI
29
37
I
I
JTAG test data input (TDI) with internal pullup. TDI is clocked into the selected
register (instruction or data) on a rising edge of TCK. (↑)
TDO
30
38
I/O
I
JTAG scan out, test data output (TDO). The contents of the selected register
(instruction or data) is shifted out of TDO on the falling edge of TCK. (↓)
TMS
31
39
I
I
JTAG test-mode select (TMS) with internal pullup. This serial control input is
clocked into the TAP controller on the rising edge of TCK. (↑)
TRST
32
40
I
I
JTAG test reset with internal pulldown. TRST, when driven high, gives the
scan system control of the operations of the device. If this signal is not
connected or driven low, the device operates in its functional mode, and the
test reset signals are ignored. (↓)
EMU0
37
48
I/O
I
Emulator I/O pin 0 with internal pullup. When TRST is driven high, this pin is
used as an interrupt to or from the emulator system and is defined as
input/output through the JTAG scan. (↑)
EMU1
38
49
I/O
I
Emulator I/O pin 1 with internal pullup. When TRST is driven high, this pin is
used as an interrupt to or from the emulator system and is defined as
input/output through JTAG scan. (↑)
9
16
−
−
41
52
−
−
−
42
−
−
1
8
−
−
34
45
−
−
51
62
−
−
−
41
−
−
10
17
−
−
40
51
−
−
SUPPLY SIGNALS
VDD
VDDO
VSS
Digital logic supply voltage (5 V)
Digital logic and buffer supply voltage (5 V)
Digital logic ground reference
† I = input, O = output, Z = high impedance
‡ The reset state indicates the state of the pin at reset. If the pin is an input, indicated by an I, its state is determined by user design. If the pin is
an output, its level at reset is indicated.
NOTE: Bold, italicized pin names indicate pin function after reset.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is 150 µA.)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
17
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
Terminal Functions - F241 PG and FN Packages (Continued)
NAME
64
QFP
68
PLCC
TYPE†
RESET
STATE‡
DESCRIPTION
SUPPLY SIGNALS (CONTINUED)
−
43
−
−
2
9
−
−
26
34
−
−
33
44
−
−
50
61
−
−
NC
−
27
DNC
25
33
VSSO
Digital logic and buffer ground reference
NO CONNECT
No internal connection made to this pin
−
−
Do not connect. Reserved for test.
INTERFACE CONTROL SIGNALS
VCCP/WDDIS
52
63
I
I
Flash programming voltage supply pin. This is the 5-V supply used for
flash programming. Flash cannot be programmed if this pin is held at 0 V.
This pin also works as a hardware watchdog disable, when VCCP/WDDIS
= +5 V and bit 6 in WDCR is set to 1. Note that on ROM devices, only the
WDDIS function is valid. Do not use a current-limiting resistor on this pin.
† I = input, O = output, Z = high impedance
‡ The reset state indicates the state of the pin at reset. If the pin is an input, indicated by an I, its state is determined by user design. If the pin is
an output, its level at reset is indicated.
NOTE: Bold, italicized pin names indicate pin function after reset.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is 150 µA.)
18
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
functional block diagram of the 24x DSP controller
Data Bus
Á
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Flash
EEPROM
DARAM
B0
DARAM
B1/B2
Program Bus
Test/
Emulation
Á
Á
Á
Á
Memory†
Control
Interrupts
Initialization
7
C2xx
CPU
Instruction
Register
Program
Controller
ARAU
Input
Shifter
Multiplier
Status/
Control
Registers
ALU
TREG
Auxiliary
Registers
Accumulator
PREG
Memory
Mapped
Registers
Output
Shifter
Product
Shifter
Event
Manager
GeneralPurpose
Timers
Compare
Units
Capture/
Quadrature
Encoder
Pulse (QEP)
2
8
3
PDPINT
2
Interrupts
Resets
† F243 only
‡ 26 in F241
16
16
Peripheral Bus
Á
Á
Á
Á
Clock
Module
4
GeneralPurpose
I/O Pins
32‡
Single 10-Bit
Analogto-Digital
Converter
SerialPeripheral
Interface
8
POST OFFICE BOX 1443
4
SerialCommunications
Interface
2
• HOUSTON, TEXAS 77251−1443
Watchdog
Timer
CAN Module
2
19
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
architectural overview
The functional block diagram provides a high-level description of each component in the F243/F241 DSP
controllers. The TMS320x24x devices are composed of three main functional units: a C2xx DSP core, internal
memory, and peripherals. In addition to these three functional units, there are several system-level features of
the F243/F241 that are distributed. These system features include the memory map, device reset, interrupts,
digital input / output (I / O), clock generation, and low-power operation.
system-level functions
device memory maps
The F243/F241 devices implement three separate address spaces for program memory, data memory, and
I/O space. On the F243/F241, the first 96 (0−5Fh) data memory locations are either allocated for
memory-mapped registers or reserved. This memory-mapped register space contains various control and
status registers, including those for the CPU.
All the on-chip peripherals of the F243/F241 devices are mapped into data memory space. Access to these
registers is made by the CPU instructions addressing their data memory locations. Figure 1 shows the F243
memory map and Figure 2 shows the F241 memory map.
CAUTION:
Accessing “Reserved” memory locations may cause unpredictable device operation.
20
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
memory maps
ÍÍÍÍÍÍ
ÍÍÍÍÍÍ
ÍÍÍÍÍÍ
ÍÍÍÍÍ
ÍÍÍÍÍÍ
ÍÍÍÍÍ
ÍÍÍÍÍÍ
Hex
0000
003F
0040
Program
Interrupt
Vector Table
User Code in
Flash Memory
1FFF
2000
Hex
0000
005F
0060
007F
0080
00FF
0100
01FF
0200
02FF
0300
03FF
0400
Data
Memory-Mapped
Registers/Reserved
Addresses
I/O
Hex
0000
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
On-Chip
DARAM B2
Illegal
Reserved
On-Chip DARAM
(B0)‡ (CNF = 0)
Reserved (CNF = 1)
On-Chip
DARAM (B1)§
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
External
Reserved
04FF
0500
Illegal
External
6FFF
7000
73FF
7400
743F
7440
Peripheral MemoryMapped Registers
(System,WD, ADC,
SCI, SPI, CAN, I/O,
Interrupts)
Peripheral
Memory-Mapped
Registers
(Event Manager)
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
Illegal
7FFF
8000
ÂÂÂÂÂÂÂ
ÂÂÂÂÂÂÂ
ÂÂÂÂÂÂÂ
ÂÂÂÂÂÂÂ
ÂÂÂÂÂÂÂ
ÂÂÂÂÂÂÂ
ÂÂÂÂÂÂÂ
FEFF
FF00
Reserved
FF0E
FF0F
FDFF
FE00
FEFF
FF00
FFFF
Reserved†
(CNF = 1)
External (CNF = 0)
On-Chip DARAM
(B0)† (CNF = 1)
External (CNF = 0)
ÍÍÍ
ÍÍÍ
External
Flash Control
Mode Register
FF10
Reserved
FFFE
FFFF
FFFF
Wait-State Generator
Control Register
(On-Chip)
On-Chip FLASH memory, (8K) − if MP/MC = 0
External Program Memory
− if MP/MC = 1
† When CNF = 1, addresses FE00h−FEFFh and FF00h−FFFFh are mapped to the same physical block (B0) in program-memory space. For
example, a write to FE00h will have the same effect as a write to FF00h. For simplicity, addresses FE00h−FEFFh are referred to as reserved
when CNF = 1.
‡ When CNF = 0, addresses 0100h−01FFh and 0200h−02FFh are mapped to the same physical block (B0) in data-memory space. For example,
a write to 0100h will have the same effect as a write to 0200h. For simplicity, addresses 0100h−01FFh are referred to as reserved.
§ Addresses 0300h−03FFh and 0400h−04FFh are mapped to the same physical block (B1) in data-memory space. For example, a write to 0400h
has the same effect as a write to 0300h. For simplicity, addresses 0400h−04FFh are referred to as Reserved.
Figure 1. TMS320F243 Memory Map
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
21
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
memory maps (continued)
Hex
0000
003F
0040
1FFF
2000
ÍÍÍÍÍÍ
ÍÍÍÍÍÍ
ÍÍÍÍÍÍ
ÍÍÍÍÍÍ
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Program
Interrupt
Vector Table
User code in
Flash Memory
Illegal
FDFF
FE00
Reserved†
FEFF
FF00
FFFF
Hex
0000
On-Chip DARAM
B0† (CNF = 1)
Reserved (CNF = 0)
ÍÍÍ
ÍÍÍ
005F
0060
007F
0080
00FF
0100
01FF
0200
02FF
0300
03FF
0400
04FF
0500
Data
Memory-Mapped
Registers/Reserved
Addresses
Hex
0000
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
On-Chip
DARAM B2
Illegal
Reserved
On-Chip DARAM
(B0)‡ (CNF = 0)
Reserved (CNF = 1)
On-Chip
DARAM (B1)§
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
ÂÂÂÂÂÂ
Reserved
Illegal
6FFF
7000
73FF
7400
Peripheral MemoryMapped Registers
(System,WD, ADC,
SCI, SPI, CAN, I/O,
Interrupts)
Peripheral
Memory-Mapped
Registers
(Event Manager)
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743F
7440
Illegal
7FFF
8000
Illegal
FFFF
On-Chip FLASH memory, (8K) − if MP/MC = 0
External Program Memory
− if MP/MC = 1
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I/O
Illegal
FEFF
FF00
Reserved
FF0E
FF0F
Flash Control
Mode Register
FF10
Reserved
FFFF
† When CNF = 1, addresses FE00h−FEFFh and FF00h−FFFFh are mapped to the same physical block (B0) in program-memory space. For
example, a write to FE00h will have the same effect as a write to FF00h. For simplicity, addresses FE00h−FEFFh are referred to as reserved
when CNF = 1.
‡ When CNF = 0, addresses 0100h−01FFh and 0200h−02FFh are mapped to the same physical block (B0) in data-memory space. For example,
a write to 0100h will have the same effect as a write to 0200h. For simplicity, addresses 0100h−01FFh are referred to as reserved.
§ Addresses 0300h−03FFh and 0400h−04FFh are mapped to the same physical block (B1) in data-memory space. For example, a write to 0400h
has the same effect as a write to 0300h. For simplicity, addresses 0400h−04FFh are referred to as Reserved.
NOTE A: There is no external memory space for program, data, or I/O in the F241.
Figure 2. TMS320F241 Memory Map
22
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
peripheral memory map
The system and peripheral control register frame contains all the data, status, and control bits to operate the
system and peripheral modules on the device (excluding the event manager). The register frame is mapped
in the data memory space.
Reserved
0000
005F
0060
007F
0080
Memory-Mapped Registers
and Reserved Locations
02FF
0300
03FF
0400
04FF
0500
07FF
0800
6FFF
7000
73FF
7400
743F
7440
0005
Interrupt Flag Register (IFR)
0006
Emulation Registers
and Reserved
Reserved
Illegal
7000 −700F
System Configuration and
Control Registers
7010 −701F
Watchdog Timer Registers
7020 −702F
ADC
7030 −703F
SPI
7040 −704F
On-Chip DARAM B0
(CNF = 0)
or
Reserved (CNF = 1)
On-Chip DARAM B1
Reserved
0007−005F
SCI
7050 −705F
Illegal
Illegal
7060 −706F
Illegal
External-Interrupt Registers
7070 −707F
Illegal
7080 −708F
Peripheral Frame 1 (PF1)
Peripheral Frame 2 (PF2)
7FFF
8000
External{
FFFF
•
Global-Memory Allocation
Register (GREG)
Illegal
Illegal
•
0004
On-Chip DARAM B2
00FF
0100
01FF
0200
0000−0003
Interrupt Mask Register (IMR)
CAUTION:
Do not access reserved locations. Accessing
the reserved memory locations may cause
unpredictable device operation.
Accessing illegal addresses will assert an NMI.
Digital-I/O Control Registers
7090 −709F
Illegal
70A0 −70FF
CAN Control Registers
7100 −710E
Illegal
710F−71FF
CAN Mailboxes
7200−722F
Illegal
7230−73FF
General-Purpose
Timer Registers
7400 −7408
Compare, PWM, and
Deadband Registers
7411 −7419
Capture and QEP Registers
7420 −7429
Interrupt Mask and
Flag Registers
742C −7431
Illegal
7432 −743F
† External memory is available on the F243 only, and it is illegal in the F241.
Figure 3. Peripheral Memory Map for F243/F241
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
23
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
software-controlled wait-state generator
Due to the fast cycle time of the F243 devices, it is often necessary to operate with wait states to interface with
external logic or memory. For many systems, one wait state is adequate.
The software wait-state generator can be programmed to generate between 0 and 7 wait states for a given
space. Software wait states are configured through the wait-state generator register (WSGR). The WSGR
includes three 3-bit fields to configure wait states for the following external memory spaces: data space (DSWS),
program space (PSWS), and I/O space (ISWS). The wait-state generator enables wait states for a given
memory space based on the value of the corresponding three bits, regardless of the condition of the READY
signal. The READY signal can be used to generate additional wait states. All bits of the WSGR are set to 1 at
reset so that the device can operate from slow memory at reset. The WSGR register (shown in Table 3, Table 4
and Table 5) resides at I / O location FFFFh. This register should not be accessed in the F241.
Table 3. Wait-State Generator Control Register ( WSGR)
15
12
11
10
9
8
6
5
3
2
0
Reserved
BVIS
ISWS
DSWS
PSWS
0
R/W−11
R/W−111
R/W−111
R/W−111
LEGEND:
0 = Always read as zeros, R = Read Access, W= Write Access, − n = Value after reset
Table 4. Wait-State(s) Programming
PSWS, DSWS, ISWS BITS
WAIT STATES FOR PROGRAM, DATA, OR I / O
000
0
001
1
010
2
011
3
100
4
101
5
110
6
111
7
Table 5. Wait-State Generator Control Register ( WSGR)
24
BITS
NAME
DESCRIPTION
2 −0
PSWS
External program space wait states. PSWS determines that between 0 to 7 wait states are applied to all reads
and writes to off-chip program space address. The memory cycle can be further extended by using the READY
signal. The READY signal does not override the wait states generated by PSWS. These bits are set to 1 (active)
by reset (RS).
5 −3
DSWS
External data space wait states. DSWS determines that between 0 to 7 wait states are applied to all reads and
writes to off-chip data space. The memory cycle can be further extended by using the READY signal. The READY
signal does not override the wait states generated by DSWS. These bits are set to 1 (active) by reset (RS).
8 −6
ISWS
External input / output space wait state. ISWS determines that between 0 to 7 wait states are applied to all reads
and writes to off-chip I / O space. The memory cycle can be further extended by using the READY signal. The
READY signal does not override the wait states generated by ISWS. These bits are set to 1 (active) by reset (RS).
10 −9
BVIS
Bus visibility modes. Bits 10 and 9 allow selection of various bus visibility modes while running from internal
program and/or data memory. These modes provide a method of tracing internal bus activity. These bits are set
to 11b by reset (RS), causing internal program address and program data to be output on the external address
and data pins. See Table 6.
15 −11
−
Reserved
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
software-controlled wait-state generator (continued)
Table 6. Visibility Modes
BIT 10
BIT 9
VISIBILITY MODE
0
0
Bus visibility OFF (reduces power consumption and noise)
0
1
Bus visibility OFF (reduces power consumption and noise)
1
0
Data-address bus output to external address bus.
Data-data bus output to external data bus.
1
1
Program-address bus output to external address bus.
Program-data bus output to external data bus.
digital I/O and shared pin functions
The F243 has a total of 32 general-purpose, bidirectional, digital I/O (GPIO) pins that function as follows: six
pins are dedicated I/O pins (see Table 7) and 26 pins are shared between primary functions and I/O. The F241
has 26 I/O pins; all are shared with other functions. The digital I/O ports module provides a flexible method for
controlling both dedicated I/O and shared pin functions. All I/O and shared pin functions are controlled using
eight 16-bit registers. These registers are divided into two types:
D Output Control Registers — used to control the multiplexer selection that chooses between the primary
function of a pin or the general-purpose I/O function.
D Data and Control Registers — used to control the data and data direction of bidirectional I/O pins.
Table 7. Dedicated I/O Pins (F243 Only)
F243 PIN NUMBER
PIN NAME
20
IOPD2
21
IOPD3
23
IOPD4
25
IOPD5
27
IOPD6
29
IOPD7
description of shared I/O pins
The control structure for shared I/O pins is shown in Figure 4, where each pin has three bits that define its
operation:
D Mux control bit — this bit selects between the primary function (1) and I/O function (0) of the pin.
D I/O direction bit — if the I/O function is selected for the pin (mux control bit is set to 0), this bit determines
whether the pin is an input (0) or an output (1).
D I/O data bit — if the I/O function is selected for the pin (mux control bit is set to 0) and the direction selected
is an input, data is read from this bit; if the direction selected is an output, data is written to this bit.
The mux control bit, I/O direction bit, and I/O data bit are in the I/O control registers.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
25
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
description of shared I/O pins (continued)
IOP Data Bit
(Read/Write)
In
Primary
Function
Out
Note:
IOP DIR Bit
0 = Input
1 = Output
When the MUX control bit = 1, the primary
function is selected in all cases except
for the following pins:
1. XF/IOPC0 (0 = Primary Function)
2. BIO/IOPC1 (0 = Primary Function)
3. CLKOUT/IOPD0 (0 = Primary Function)
0
1
MUX Control Bit
0 = I/O Function
1 = Primary Function
Pullup
or
Pulldown
Primary
Function
or I/O Pin
Pin
Figure 4. Shared Pin Configuration
A summary of shared pin configurations and associated bits is shown in Table 8.
26
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
description of shared I/O pins (continued)
Table 8. Shared Pin Configurations
PIN NO.
144
PQFP
68
PLCC
F243
64
QFP
MUX CONTROL
REGISTER
(name.bit #)
PIN FUNCTION SELECTED
I/O PORT DATA AND DIRECTION†
(OCRx.n = 1)
(OCRx.n = 0)
REGISTER
DATA
BIT NO.‡
DIR
BIT NO.§
F241
56
54
43
OCRA.0
SCITXD
IOPA0
PADATDIR
0
8
58
55
44
OCRA.1
SCIRXD
IOPA1
PADATDIR
1
9
10
83
66
55
OCRA.2
XINT1
IOPA2
PADATDIR
2
123
15
8
OCRA.3
CAP1/QEP0
IOPA3
PADATDIR
3
11
121
14
7
OCRA.4
CAP2/QEP1
IOPA4
PADATDIR
4
12
119
13
6
OCRA.5
CAP3
IOPA5
PADATDIR
5
13
102
7
64
OCRA.6
PWM1
IOPA6
PADATDIR
6
14
100
6
63
OCRA.7
PWM2
IOPA7
PADATDIR
7
15
98
5
62
OCRA.8
PWM3
IOPB0
PBDATDIR
0
8
96
4
61
OCRA.9
PWM4
IOPB1
PBDATDIR
1
9
94
3
60
OCRA.10
PWM5
IOPB2
PBDATDIR
2
10
91
2
59
OCRA.11
PWM6
IOPB3
PBDATDIR
3
11
130
19
12
OCRA.12
T1PWM/T1CMP
IOPB4
PBDATDIR
4
12
128
18
11
OCRA.13
T2PWM/T2CMP
IOPB5
PBDATDIR
5
13
85
67
56
OCRA.14
TDIR
IOPB6
PBDATDIR
6
14
87
68
57
OCRA.15
TCLKIN
IOPB7
PBDATDIR
7
15
49
50
39
OCRB.0
IOPC0
XF
PCDATDIR
0
8
55
53
42
OCRB.1
IOPC1
BIO
PCDATDIR
1
9
60
56
45
OCRB.2
SPISIMO
IOPC2
PCDATDIR
2
10
62
57
46
OCRB.3
SPISOMI
IOPC3
PCDATDIR
3
11
64
58
47
OCRB.4
SPICLK
IOPC4
PCDATDIR
4
12
66
59
48
OCRB.5
SPISTE
IOPC5
PCDATDIR
5
13
115
11
4
OCRB.6
CANTX
IOPC6
PCDATDIR
6
14
113
10
3
OCRB.7
CANRX
IOPC7
PCDATDIR
7
15
116
12
5
OCRB.8
IOPD0
CLKOUT
PDDATDIR
0
8
81
65
54
OCRB.9
XINT2/ADCSOC
IOPD1
PDDATDIR
1
9
† Valid only if the I/O function is selected on the pin.
‡ If the GPIO pin is configured as an output, these bits can be written to. If the pin is configured as an input, these bits are read from.
§ If the DIR bit is 0, the GPIO pin functions as an input. For a value of 1, the pin is configured as an output.
NOTE: GPIO pins IOPD2 to IOPD7 are dedicated I/O pins in F243. These pins are not available in the F241.
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digital I/O control registers
Table 9 lists the registers available in the digital I/O module. As with other F243/F241 peripherals, the registers
are memory-mapped to the data space.
Table 9. Addresses of Digital I/O Control Registers
ADDRESS
REGISTER
NAME
7090h
OCRA
I/O mux control register A
7092h
OCRB
I/O mux control register B
7098h
PADATDIR
I/O port A data and direction register
709Ah
PBDATDIR
I/O port B data and direction register
709Ch
PCDATDIR
I/O port C data and direction register
709Eh
PDDATDIR
I/O port D data and direction register
device reset and interrupts
The TMS320x24x software-programmable interrupt structure supports flexible on-chip and external interrupt
configurations to meet real-time interrupt-driven application requirements. The F243/F241 recognizes three types
of interrupt sources:
D Reset (hardware- or software-initiated) is unarbitrated by the CPU and takes immediate priority over any
other executing functions. All maskable interrupts are disabled until the reset service routine enables them.
The F243/F241 devices have two sources of reset: an external reset pin and a watchdog timer timeout
(reset).
D Hardware-generated interrupts are requested by external pins or by on-chip peripherals. There are two
types:
−
External interrupts are generated by one of four external pins corresponding to the interrupts XINT1,
XINT2, PDPINT, and NMI. The first three can be masked both by dedicated enable bits and by the CPU’s
interrupt mask register (IMR), which can mask each maskable interrupt line at the DSP core. NMI, which
is not maskable, takes priority over peripheral interrupts and software-generated interrupts. It can be
locked out only by an already executing NMI or a reset.
−
Peripheral interrupts are initiated internally by these on-chip peripheral modules: the event manager,
SPI, SCI, WD, CAN, and ADC. They can be masked both by enable bits for each event in each peripheral
and by the CPU’s IMR, which can mask each maskable interrupt line at the DSP core.
D Software-generated interrupts for the F243/F241 devices include:
28
−
The INTR instruction. This instruction allows initialization of any F243/F241 interrupt with software. Its
operand indicates the interrupt vector location to which the CPU branches. This instruction globally
disables maskable interrupts (sets the INTM bit to 1).
−
The NMI instruction. This instruction forces a branch to interrupt vector location 24h, the same location
used for the nonmaskable hardware interrupt NMI. NMI can be initiated by driving the NMI pin low or by
executing an NMI instruction. This instruction globally disables maskable interrupts.
−
The TRAP instruction. This instruction forces the CPU to branch to interrupt vector location 22h. The
TRAP instruction does not disable maskable interrupts (INTM is not set to 1); therefore, when the CPU
branches to the interrupt service routine, that routine can be interrupted by the maskable hardware
interrupts.
−
An emulator trap. This interrupt can be generated with either an INTR instruction or a TRAP instruction.
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reset
The reset operation ensures an orderly startup sequence for the device. There are two possible causes of a
reset, as shown in Figure 5.
Reset
Signal
Watchdog Timer Reset
System Reset
External Reset (RS) Pin Active
Figure 5. Reset Signals
The two possible reset signals are generated as follows:
D Watchdog timer reset. A watchdog-timer-generated reset occurs if the watchdog timer overflows or an
improper value is written to either the watchdog key register or the watchdog control register. (Note that
when the device is powered on, the watchdog timer is automatically active.) The watchdog timer reset is
reflected on the external RS pin also.
D Reset pin active. To generate an external reset pulse on the RS pin, a low-level pulse duration of at least
one CPUCLK cycle is necessary to ensure that the device recognizes the reset signal.
Once watchdog reset is activated, the external RS pin is driven (active) low for a minimum of eight CPUCLK
cycles. This allows the TMS320x24x device to reset external system components.
The occurrence of a reset condition causes the TMS320x24x to terminate program execution and affects
various registers and status bits. During a reset, RAM contents remain unchanged, and all control bits that are
affected by a reset are initialized to their reset state.
hardware-generated interrupts
The 24x CPU supports one nonmaskable interrupt (NMI) and six maskable prioritized interrupt requests. The
24x devices have many peripherals, and each peripheral is capable of generating one or more interrupts in
response to many events. The 24x CPU does not have sufficient interrupt requests to handle all these peripheral
interrupt requests; therefore, a centralized interrupt controller is provided to arbitrate the interrupt requests from
all the different sources. Throughout this section, refer to Figure 6 .
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hardware-generated interrupts (continued)
PDPINT
ADCINT
XINT1
XINT2
SPIINT
RXINT
TXINT
CANMBINT
CANERINT
CMP1INT
CMP2INT
CMP3INT
TPINT1
TCINT1
TUFINT1
TOFINT1
IMR
IRQ
Pulse
Gen
Unit
IFR
Level 1
IRQ GEN
INT1
INT2
Level 2
IRQ GEN
CPU
TPINT2
TCINT2
TUFINT2
TOFINT2
Level 3
IRQ GEN
CAPINT1
CAPINT2
CAPINT3
Level 4
IRQ GEN
SPIINT
RXINT
TXINT
CANMBINT
CANERINT
Level 5
IRQ GEN
ADCINT
XINT1
XINT2
Level 6
IRQ GEN
INT3
INT4
INT5
INT6
IACK
PIVR & logic
PIRQR#
PIACK#
Data Addr
Bus Bus
Figure 6. Peripheral Interrupt Expansion Block Diagram
interrupt hierarchy
The number of interrupt requests available is expanded by having two levels of hierarchy in the interrupt request
system. There are two levels of hierarchy in both the interrupt request/acknowledge hardware and in the
interrupt service routine software.
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interrupt request structure
1. At the lower level of the hierarchy, the peripheral interrupt requests (PIRQs) from several peripherals to the
interrupt controller are ORed together to generate a request to the CPU. There is an interrupt flag bit and
an interrupt enable bit located in the peripheral for each event that can cause a peripheral interrupt request.
There is also one PIRQ for each event. If an interrupt-causing event occurs in a peripheral, and the
corresponding interrupt enable bit is set, the interrupt request from the peripheral to the interrupt controller
is asserted. This interrupt request simply reflects the status of the peripheral’s interrupt flag gated with the
interrupt enable bit. When the interrupt flag is cleared, the interrupt request is cleared. Some peripherals
have the capability to make either a high-priority or a low-priority interrupt request. If a peripheral has this
capability, the value of its interrupt priority bit is transmitted to the interrupt controller. The interrupt request
continues to be asserted until it is either automatically cleared by an interrupt acknowledge or cleared by
software.
2. At the upper level of the hierarchy, the ORed PIRQs generate interrupt (INT) requests to the CPU. The
request to the 24x CPU is a low-going pulse of 2 CPU clock cycles. The Peripheral Interrupt Expansion (PIE)
controller generates an INT pulse when any of the PIRQs controlling that INT go active. If any of the PIRQs
capable of asserting that CPU interrupt request are still active in the cycle following an interrupt
acknowledge for that INT, another INT pulse is generated (an interrupt acknowledge clears the
highest-priority pending PIRQ). Which CPU interrupt requests get asserted by which peripheral interrupt
requests, and the relative priority of each peripheral interrupt request, is defined in the interrupt controller
and is not part of any of the peripherals. This is shown in Table 10.
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interrupt request structure (continued)
Table 10. F243/F241 Interrupt Source Priority and Vectors
OVERALL
PRIORITY
CPU
INTERRUPT
AND
VECTOR
ADDRESS
Reset
1
Reserved
PERIPHERAL
INTERRUPT
VECTOR
(PIV)
MASKABLE?
SOURCE
PERIPHERAL
MODULE
DESCRIPTION
RSN
0000h
N/A
N
RS pin,
Watchdog
Reset from pin, watchdog
timeout
2
−
0026h
N/A
N
CPU
NMI
3
NMI
0024h
N/A
N
Nonmaskable
Interrupt
PDPINT
4
0.0
0020h
Y
EV
ADCINT
5
0.1
0004h
Y
ADC
XINT1
6
0.2
0001h
Y
External
Interrupt Logic
External interrupt pins in
high priority
XINT2
7
0.3
0011h
Y
External
Interrupt Logic
External interrupt pins in
high priority
SPIINT
8
0.4
0005h
RXINT
9
0.5
0006h
Y
SCI
SCI receiver interrupt in
high-priority mode
TXINT
10
0.6
0007h
Y
SCI
SCI transmitter interrupt in
high-priority mode
CANMBINT
11
0.7
0040h
CANERINT
12
0.8
0041h
CMP1INT
13
0.9
0021h
Y
EV
Compare 1 interrupt
CMP2INT
14
0.10
0022h
Y
EV
Compare 2 interrupt
CMP3INT
15
0.11
0023h
Y
EV
Compare 3 interrupt
TPINT1
16
0.12
0027h
Y
EV
Timer 1 period interrupt
TCINT1
17
0.13
0028h
Y
EV
Timer 1 PWM interrupt
TUFINT1
18
0.14
0029h
Y
EV
Timer 1 underflow
interrupt
TOFINT1
19
0.15
002Ah
Y
EV
Timer 1 overflow interrupt
TPINT2
20
1.0
002Bh
Y
EV
Timer 2 period interrupt
TCINT2
21
1.1
002Ch
Y
EV
Timer 2 PWM interrupt
TUFINT2
22
1.2
002Dh
Y
EV
Timer 2 underflow
interrupt
TOFINT2
23
1.3
002Eh
Y
EV
Timer 2 overflow interrupt
CAPINT1
24
1.4
0033h
Y
EV
Capture 1 interrupt
CAPINT2
25
1.5
0034h
Y
EV
Capture 2 interrupt
CAPINT3
26
1.6
0035h
Y
EV
Capture 3 interrupt
INTERRUPT
NAME
32
INT1
0002h
INT2
0004h
INT3
0006h
INT4
0008h
BIT
POSITION IN
PIRQRx AND
PIACKRx
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Emulator Trap
Nonmaskable interrupt
Power device protection
interrupt pin
ADC interrupt in
high-priority mode
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
interrupt request structure (continued)
Table 10. F243/F241 Interrupt Source Priority and Vectors (Continued)
INTERRUPT
NAME
OVERALL
PRIORITY
CPU
INTERRUPT
AND
VECTOR
ADDRESS
BIT
POSITION IN
PIRQRx AND
PIACKRx
PERIPHERAL
INTERRUPT
VECTOR
(PIV)
MASKABLE?
SOURCE
PERIPHERAL
MODULE
DESCRIPTION
SPIINT
27
1.7
0005h
Y
SPI
SPI interrupt (low-priority)
RXINT
28
1.8
0006h
Y
SCI
SCI receiver interrupt
(low-priority mode)
TXINT
29
1.9
0007h
Y
SCI
SCI transmitter interrupt
(low-priority mode)
CANMBINT
30
1.10
0040h
Y
CAN
CAN mailbox interrupt
(low-priority mode)
CANERINT
31
1.11
0041h
Y
CAN
CAN error interrupt
(low-priority mode)
ADCINT
32
1.12
0004h
Y
ADC
ADC interrupt
(low-priority)
XINT1
33
1.13
0001h
Y
External
Interrupt Logic
External interrupt pins
(low-priority mode)
XINT2
34
1.14
0011h
Y
External
Interrupt Logic
External interrupt pins
(low-priority mode)
000Eh
N/A
Y
CPU
Analysis interrupt
Reserved
INT5
000Ah
INT6
000Ch
TRAP
N/A
0022h
N/A
N/A
CPU
TRAP instruction
Phantom
Interrupt
Vector
N/A
N/A
0000h
N/A
CPU
Phantom interrupt vector
interrupt acknowledge
When the CPU asserts its interrupt acknowledge, it simultaneously puts a value on the memory interface
program address bus, which corresponds to the CPU interrupt being acknowledged (it does this because it is
fetching the CPU interrupt vector from program memory, each INT has a vector stored in a dedicated program
memory address). This value is shown in Table 10, column 3, CPU Interrupt and Vector Address. The PIE
controller uses the CPU interrupt acknowledge to generate its internal signals to clear the current interrupt
requests.
interrupt vectors
When the CPU receives an interrupt request (INT), it does not know which peripheral event caused the request
(PIRQ). To enable the CPU to distinguish between all of these events, a unique interrupt vector is generated
in response to an active interrupt request getting acknowledged. This vector PIV is loaded into the Peripheral
Interrupt Vector Register (PIVR) in the PIE controller and can then be read by the CPU to generate a branch
to the respective Interrupt Service Routine (ISR).
In effect, there are two vector tables: a CPU vector table and a user-specified peripheral vector table. The CPU’s
vector table, which starts at 0000h, is used to get to the General Interrupt Service Routine (GISR) in response
to a CPU interrupt request (INT). A user-specified peripheral vector table is employed to get to the
Event-Specific Interrupt Service Routine (SISR), corresponding to the event which caused the peripheral
interrupt request (PIRQ). The code in the GISR should read the Peripheral Interrupt Vector Register (PIVR) after
saving any necessary context, and use this value PIV to generate a branch to the SISR.
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interrupt vectors (continued)
The peripheral interrupt vectors (PIVs) are stored in a table in the peripheral interrupt expansion controller. They
can either be hard-coded (potentially ROM), or register locations (RAM), which are programmed by the reset
service routine. The PIVs are all implemented as hard-coded values on the F243/F241 devices, according to
Table 10, column 5.
phantom interrupt vector
The phantom interrupt vector is an interrupt system integrity feature. If the CPU’s interrupt acknowledge is
asserted, but there is no associated peripheral interrupt request asserted, the phantom vector is used so that
this fault is handled in a controlled manner. One way the phantom interrupt vector could be required is if the CPU
executes a software interrupt instruction with an argument corresponding to a peripheral interrupt (usually
INT1−INT6). The other way would be if a peripheral made an interrupt request, but its interrupt request flag was
cleared by software before the CPU acknowledged the request. In this case, there may be no peripheral
interrupt request asserted to the interrupt controller, so the controller would not know which peripheral interrupt
vector to load into the PIVR. In these situations, the phantom interrupt vector is loaded into the PIVR in lieu of
a peripheral interrupt vector.
software hierarchy
There are two levels of interrupt service routine hierarchy: the General Interrupt Service Routine (GISR), and
the Event-Specific Interrupt Service Routine (SISR). There is one GISR for each maskable prioritized request
(INT) to the CPU. This can perform necessary context saves before it fetches the PIV from the PIVR. This PIV
value is used to generate a branch to the SISR. There is one SISR for every interrupt request from a peripheral
to the interrupt controller. The SISR performs the actions required in response to the peripheral interrupt
request.
nonmaskable interrupts
The PIE controller does not support expansion of nonmaskable interrupts. This is because an ISR must read
the peripheral interrupt vector from the PIVR before interrupts are re-enabled. All interrupts are automatically
disabled when any of the INT1 − INT6 interrupts are serviced. If the PIVR is not read before interrupts are
re-enabled, another interrupt would be acknowledged and a new peripheral interrupt vector would be loaded
into the PIVR, causing permanent loss of the original peripheral interrupt vector. Since, by their very nature,
nonmaskable interrupts cannot be masked, they cannot be included in the interrupt expansion controller
because they could cause the loss of peripheral interrupt vectors.
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interrupt operation sequence
1. An interrupt-generating event occurs in a peripheral. The interrupt flag (IF) bit corresponding to that event
is set in a register in the peripheral. If the appropriate interrupt enable (IE) bit is set, the peripheral generates
an interrupt request to the PIE controller by asserting its PIRQ. If the interrupt is not enabled in the peripheral
register, the IF remains set until cleared by software. If the interrupt is enabled at a later time, and the
interrupt flag is still set, the PIRQ will immediately be asserted. The interrupt flag (IF) in the peripheral
register should be cleared by software only. If the IF bit is not cleared after the respective interrupt service,
future interrupts will not be recognized.
2. If no unacknowledged CPU interrupt request of the same priority level has previously been sent, the
peripheral interrupt request, PIRQ, causes the PIE controller to generate a CPU interrupt request pulse.
This pulse is active low for 2 CPU clock cycles.
3. The interrupt request to the CPU sets the corresponding flag in the CPU’s interrupt flag register, IFR. If the
CPU interrupt has been enabled (by setting the appropriate bit in the CPU’s Interrupt Mask Register, IMR),
the CPU stops what it is doing. It then masks all other maskable interrupts by setting the INTM bit, saves
some context, clears the respective IFR bit, and starts executing the General Interrupt Service Routine
(GISR) for that interrupt priority level. The CPU generates an interrupt acknowledge automatically, which
is accompanied by a value on the Program Address Bus (PAB) that corresponds to the interrupt priority level
being responded to. These values are shown in Table 10, column 3.
4. The PIE controller decodes the PAB value and generates an internal peripheral interrupt acknowledge to
load the PIV into the PIVR. The appropriate peripheral interrupt vector (or the phantom interrupt vector),
is referenced from the table stored in the PIE controller.
5. When the GISR has completed any necessary context saves, it reads the PIVR and uses the interrupt vector
as a target (or to generate a target) for a branch to the Event-Specific Interrupt Service Routine (SISR) for
the interrupt event which occurred in the peripheral. Interrupts must not be re-enabled until the PIVR has
been read; otherwise, its contents can get overwritten by a subsequent interrupt.
NOTE: If an interrupt occurs during the execution of a CLRC INTM instruction, the device always completes CLRC INTM as well as the next
instruction before the pending interrupt is processed. This ensures that a return instruction that directly follows CLRC INTM will be
executed before an interrupt is processed. The return instruction will pop the previous return address off the top of the stack before the
new return address is pushed onto the stack. To allow the CPU to complete the return, interrupts are also blocked after a RET instruction
until at least one instruction at the return address is executed. Interrupts may be blocked for more than one instruction if the instruction
at the return address requires additional blocking for pipeline protection. If you want an ISR to occur within the current ISR rather than
after the current ISR, place the CLRC INTM instruction more than one instruction before the return (RET) instruction.
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external interrupts
The F243/F241 devices have four external interrupts. These interrupts include:
D XINT1. The XINT1 control register (at 7070h) provides control and status for this interrupt. XINT1 can be used
as a high-priority (Level 1) or low-priority (Level 6) maskable interrupt or as a general-purpose I/O pin. XINT1
can also be programmed to trigger an interrupt on either the rising or the falling edge.
D XINT2. The XINT2 control register (at 7071h) provides control and status for this interrupt. XINT2 can be used
as a high-priority (Level 1) or low-priority (Level 6) maskable interrupt or a general-purpose I/O pin. XINT2 can
also be programmed to trigger an interrupt on either the rising or the falling edge.
D NMI. This is a nonmaskable external interrupt.
D PDPINT. This interrupt is provided for safe operation of power converters and motor drives controlled by
the F243/F241. This maskable interrupt can put the timers and PWM output pins in high-impedance states
and inform the CPU in case of motor drive abnormalities such as overvoltage, overcurrent, and excessive
temperature rise. PDPINT is a Level 1 interrupt.
Table 11 is a summary of the external interrupt capability of the F243/F241.
Table 11. External Interrupt Types and Functions
EXTERNAL
INTERRUPT
CONTROL
REGISTER
NAME
CONTROL
REGISTER
ADDRESS
MASKABLE?
XINT1
XINT1CR
7070h
Yes
(Level 1 or 6)
XINT2
XINT2CR
7071h
Yes
(Level 1 or 6)
NMI
—
—
No
742Ch
Yes
(Level 1)
PDPINT
36
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clock generation
The F243/F241 devices have an on-chip, (x4) PLL-based clock module. This module provides all the necessary
clocking signals for the device, as well as control for low-power mode entry. The only external component
necessary for this module is a fundamental crystal. The “times 4” (x4) option for the F243/F241 PLL is fixed and
cannot be changed.
The PLL-based clock module provides two modes of operation:
D Crystal-operation
This mode allows the use of a 5-MHz external reference crystal to provide the time base to the device.
D External clock source operation
This mode allows the internal oscillator to be bypassed. The device clocks are generated from an external
clock source input on the XTAL1/CLKIN pin. In this case, an external oscillator clock is connected to the
XTAL1/CLKIN pin.
The clock module includes two external pins:
1. XTAL1/CLKIN
clock source/crystal input
2. XTAL2
output to crystal
XTAL1/CLKIN
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
XTAL
OSC
XTAL2
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
x4
PLL
CPUCLK
Figure 7. PLL Clock Module Block Diagram
low-power modes
The 24x has an IDLE instruction. When executed, the IDLE instruction stops the clocks to all circuits in the CPU,
but the clock output from the CPU continues to run. With this instruction, the CPU clocks can be shut down to
save power while the peripherals (clocked with CLKOUT) continue to run. The CPU exits the IDLE state if it is
reset, or, if it receives an interrupt request.
clock domains
All 24x-based devices have two clock domains:
1. CPU clock domain − consists of the clock for most of the CPU logic
2. System clock domain − consists of the peripheral clock (which is derived from CLKOUT of the CPU) and
the clock for the interrupt logic in the CPU.
When the CPU goes into IDLE mode, the CPU clock domain is stopped while the system clock domain continues
to run. This mode is also known as IDLE1 mode. The 24x CPU also contains support for a second IDLE mode,
IDLE2. By asserting IDLE2 to the 24x CPU, both the CPU clock domain and the system clock domain are
stopped, allowing further power savings. A third low-power mode, HALT mode, the deepest, is possible if the
oscillator and WDCLK are also shut down when in IDLE2 mode.
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low-power modes (continued)
Two control bits, LPM(1) and LPM(0), specify which of the three possible low-power modes is entered when
the IDLE instruction is executed (see Table 12). These bits are located in the System Control and Status
Register (SCSR) described in the TMS320C241/C242/C243 DSP Controllers CPU, System, Instruction Set,
and Peripherals Reference Guide (literature number SPRU276).
Table 12. Low-Power Modes Summary
LOW-POWER MODE
LPMx BITS
SCSR[12:13]
CPU
CLOCK
DOMAIN
SYSTEM
CLOCK
DOMAIN
WDCLK
STATUS
PLL
STATUS
OSC
STATUS
EXIT
CONDITION
CPU running normally
XX
On
On
On
On
On
—
IDLE1 − (LPM0)
00
Off
On
On
On
On
Peripheral Interrupt,
External Interrupt,
Reset
IDLE2 − (LPM1)
01
Off
Off
On
On
On
Wakeup Interrupts,
External Interrupt,
Reset
HALT − (LPM2)
{PLL/OSC power down}
1X
Off
Off
Off
Off
Off
Reset Only
wakeup from low-power modes
reset
A reset (from any source) causes the device to exit any of the IDLE modes. If the device is halted, the reset will
first start the oscillator, and there can be a delay while the oscillator powers up before clocks are generated to
initiate the CPU reset sequence.
external interrupts
The external interrupts, XINTx, can cause the device to exit any of the low-power modes, except HALT. If the
device is in IDLE2 mode, the synchronous logic connected to the external interrupt pins is bypassed with
combinatorial logic which recognizes the interrupt on the pin, starts the clocks, and then allows the clocked logic
to generate an interrupt request to the PIE controller. Note that in Table 12, external interrupts include PDPINT.
wakeup interrupts
Certain peripherals (for example, the CAN wakeup interrupt which can assert the CAN error interrupt request
even when there are no clocks running) can have the capability to start the device clocks and then generate
an interrupt in response to certain external events, for example, activity on a communication line.
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peripheral interrupts
All peripheral interrupts, if enabled locally and globally, can cause the device to exit IDLE1 mode.
Wake-Up Signal
to CPU†
Peripheral
Interrupts
NMI
XINT1
XINT2
External-Interrupt Logic
Reset
Signal
External Reset (RS pin)
Watchdog Timer Module
M
U
X
Reset Logic
(Wake-Up Signal)
† The CPU can exit HALT mode (LPM2) with a RESET only.
Figure 8. Waking Up the Device From Power Down
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functional block diagram of the 24x DSP CPU
Program Bus
IS
DS
PS
NPAR
16
PC
PAR
MSTACK
MUX
W/R
WE
NMI
RS
MP/MC
XINT[1−2]
Data Bus
Control
X1
CLKOUT
CLKIN/X2
Program Bus
MUX
R/W
STRB
READY
BR
XF
Stack 8 × 16
2
FLASH EEPROM/
ROM
MUX
A15−A0
16
Program Control
(PCTRL)
16
16
16
16
16
MUX
D15−D0
16
16
Data Bus
16
Data Bus
16
16
9
3
AR0(16)
DP(9)
AR1(16)
16
7
LSB
from
IR
16
16
AR2(16)
ARP(3)
16
MUX
MUX
AR3(16)
3
16
16
9
AR4(16)
3
AR5(16)
ARB(3)
TREG0(16)
AR6(16)
Multiplier
AR7(16)
3
ISCALE (0−16)
PREG(32)
16
32
PSCALE (−6,ā 0,ā 1,ā 4)
32
32
16
MUX
ARAU(16)
MUX
32
CALU(32)
16
32
Memory Map
Register
32
MUX
MUX
Data/Prog
DARAM
B0 (256 × 16)
Data
DARAM
B2 (32 × 16)
IFR (16)
GREG (16)
C ACCH(16)
ACCL(16)
32
B1 (256 × 16)
MUX
OSCALE (0−7)
Program Bus
IMR (16)
16
16
16
16
NOTES: A. Symbol descriptions appear in Table 13 and Table 14.
B. For clarity, the data and program buses are shown as single buses although they include address and data bits.
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24x legend for the internal hardware
Table 13. Legend for the 24x Internal Hardware
SYMBOL
NAME
DESCRIPTION
ACC
Accumulator
32-bit register that stores the results and provides input for subsequent CALU operations. Also includes shift
and rotate capabilities
ARAU
Auxiliary Register
Arithmetic Unit
An unsigned, 16-bit arithmetic unit used to calculate indirect addresses using the auxiliary registers as inputs
and outputs
AUX
REGS
Auxiliary Registers
0 −7
These 16-bit registers are used as pointers to anywhere within the data space address range. They are
operated upon by the ARAU and are selected by the auxiliary register pointer (ARP). AR0 can also be used
as an index value for AR updates of more than one and as a compare value to AR.
BR
Bus Request
Signal
BR is asserted during access of the external global data memory space. READY is asserted to the device
when the global data memory is available for the bus transaction. BR can be used to extend the data memory
address space by up to 32K words.
C
Carry
Register carry output from CALU. C is fed back into the CALU for extended arithmetic operation. The C bit
resides in status register 1 (ST1), and can be tested in conditional instructions. C is also used in accumulator
shifts and rotates.
CALU
Central Arithmetic
Logic Unit
32-bit-wide main arithmetic logic unit for the TMS320C2xx core. The CALU executes 32-bit operations in a
single machine cycle. CALU operates on data coming from ISCALE or PSCALE with data from ACC, and
provides status results to PCTRL.
DARAM
Dual-Access RAM
If the on-chip RAM configuration control bit (CNF) is set to 0, the reconfigurable data dual-access RAM
(DARAM) block B0 is mapped to data space; otherwise, B0 is mapped to program space. Blocks B1 and B2
are mapped to data memory space only, at addresses 0300−03FF and 0060−007F, respectively. Blocks 0
and 1 contain 256 words, while block 2 contains 32 words.
DP
Data Memory
Page Pointer
The 9-bit DP register is concatenated with the seven least significant bits (LSBs) of an instruction word to
form a direct memory address of 16 bits. DP can be modified by the LST and LDP instructions.
GREG
Global Memory
Allocation
Register
GREG specifies the size of the global data memory space. This register is not useful in the F241, since it
has no external memory interface.
IMR
Interrupt Mask
Register
IMR individually masks or enables the seven interrupts.
IFR
Interrupt Flag
Register
The 7-bit IFR indicates that the TMS320C2xx has latched an interrupt from one of the seven maskable
interrupts.
INT#
Interrupt Traps
A total of 32 interrupts by way of hardware and/or software are available.
ISCALE
Input Data-Scaling
Shifter
16- to 32-bit barrel left-shifter. ISCALE shifts incoming 16-bit data 0 to16 positions left, relative to the 32-bit
output within the fetch cycle; therefore, no cycle overhead is required for input scaling operations.
MPY
Multiplier
16 × 16-bit multiplier to a 32-bit product. MPY executes multiplication in a single cycle. MPY operates either
signed or unsigned 2s-complement arithmetic multiply.
MSTACK
Micro Stack
MSTACK provides temporary storage for the address of the next instruction to be fetched when program
address-generation logic is used to generate sequential addresses in data space.
MUX
Multiplexer
Multiplexes buses to a common input
NPAR
Next Program
Address Register
NPAR holds the program address to be driven out on the PAB on the next cycle.
OSCALE
Output
Data-Scaling
Shifter
16- to 32-bit barrel left-shifter. OSCALE shifts the 32-bit accumulator output 0 to 7 bits left for quantization
management and outputs either the 16-bit high- or low-half of the shifted 32-bit data to the data-write data
bus (DWEB).
PAR
Program Address
Register
PAR holds the address currently being driven on PAB for as many cycles as it takes to complete all memory
operations scheduled for the current bus cycle.
PC
Program Counter
PC increments the value from NPAR to provide sequential addresses for instruction-fetching and sequential
data-transfer operations.
PCTRL
Program
Controller
PCTRL decodes instruction, manages the pipeline, stores status, and decodes conditional operations.
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24x legend for the internal hardware (continued)
Table 13. Legend for the 24x Internal Hardware (Continued)
SYMBOL
NAME
DESCRIPTION
PREG
Product Register
32-bit register holds results of 16 × 16 multiply
PSCALE
Product-Scaling
Shifter
0-, 1-, or 4-bit left shift, or 6-bit right shift of multiplier product. The left-shift options are used to manage the
additional sign bits resulting from the 2s-complement multiply. The right-shift option is used to scale down
the number to manage overflow of product accumulation in the CALU. PSCALE resides in the path from the
32-bit product shifter and from either the CALU or the data-write data bus (DWEB), and requires no cycle
overhead.
STACK
Stack
STACK is a block of memory used for storing return addresses for subroutines and interrupt-service
routines, or for storing data. The C24x stack is 16-bit wide and eight-level deep.
TREG
Temporary
Register
16-bit register holds one of the operands for the multiply operations. TREG holds the dynamic shift count
for the LACT, ADDT, and SUBT instructions. TREG holds the dynamic bit position for the BITT instruction.
F243/F241 DSP core CPU
The TMS320x24x devices use an advanced Harvard-type architecture that maximizes processing power by
maintaining two separate memory bus structures — program and data — for full-speed execution. This multiple
bus structure allows data and instructions to be read simultaneously. Instructions support data transfers
between program memory and data memory. This architecture permits coefficients that are stored in program
memory to be read in RAM, thereby eliminating the need for a separate coefficient ROM. This, coupled with a
four-deep pipeline, allows the F243/F241 devices to execute most instructions in a single cycle.
status and control registers
Two status registers, ST0 and ST1, contain the status of various conditions and modes. These registers can
be stored into data memory and loaded from data memory, thus allowing the status of the machine to be saved
and restored for subroutines.
The load status register (LST) instruction is used to write to ST0 and ST1. The store status register (SST)
instruction is used to read from ST0 and ST1 — except for the INTM bit, which is not affected by the LST
instruction. The individual bits of these registers can be set or cleared when using the SETC and CLRC
instructions. Figure 9 shows the organization of status registers ST0 and ST1, indicating all status bits contained
in each. Several bits in the status registers are reserved and are read as logic 1s. Table 14 lists status register
field definitions.
15
ST0
13
ARP
15
ST1
13
ARB
12
11
10
9
OV
OVM
1
INTM
8
0
DP
12
11
10
9
8
7
6
5
4
3
2
CNF
TC
SXM
C
1
1
1
1
XF
1
1
1
0
PM
Figure 9. Status and Control Register Organization
Table 14. Status Register Field Definitions
FIELD
FUNCTION
ARB
Auxiliary register pointer buffer. When the ARP is loaded into ST0, the old ARP value is copied to the ARB except during an LST
instruction. When the ARB is loaded by way of an LST #1 instruction, the same value is also copied to the ARP.
ARP
Auxiliary register (AR) pointer. ARP selects the AR to be used in indirect addressing. When the ARP is loaded, the old ARP value
is copied to the ARB register. ARP can be modified by memory-reference instructions when using indirect addressing, and by the
LARP, MAR, and LST instructions. The ARP is also loaded with the same value as ARB when an LST #1 instruction is executed.
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status and control registers (continued)
Table 14. Status Register Field Definitions (Continued)
FIELD
FUNCTION
C
Carry bit. C is set to 1 if the result of an addition generates a carry, or reset to 0 if the result of a subtraction generates a borrow.
Otherwise, C is reset after an addition or set after a subtraction, except if the instruction is ADD or SUB with a 16-bit shift. In these
cases, the ADD can only set and the SUB only reset the carry bit, but cannot affect it otherwise. The single-bit shift and rotate
instructions also affect C, as well as the SETC, CLRC, and LST #1 instructions. Branch instructions have been provided to branch
on the status of C. C is set to 1 on a reset.
CNF
On-chip RAM configuration control bit. If CNF is set to 0, the reconfigurable data dual-access RAM blocks are mapped to data
space; otherwise, they are mapped to program space. The CNF can be modified by the SETC CNF, CLRC CNF, and LST #1
instructions. RS sets the CNF to 0.
DP
Data memory page pointer. The 9-bit DP register is concatenated with the seven LSBs of an instruction word to form a direct
memory address of 16 bits. DP can be modified by the LST and LDP instructions.
INTM
Interrupt mode bit. When INTM is set to 0, all unmasked interrupts are enabled. When set to 1, all maskable interrupts are disabled.
INTM is set and reset by the SETC INTM and CLRC INTM instructions. RS also sets INTM. INTM has no effect on the unmaskable
RS and NMI interrupts. Note that INTM is unaffected by the LST instruction. This bit is set to 1 by reset. It is also set to 1 when
a maskable interrupt trap is taken.
OV
Overflow flag bit. As a latched overflow signal, OV is set to 1 when overflow occurs in the arithmetic logic unit (ALU). Once an
overflow occurs, the OV remains set until a reset, BCND/D on OV/NOV, or LST instructions clear OV.
OVM
Overflow mode bit. When OVM is set to 0, overflowed results overflow normally in the accumulator. When set to 1, the accumulator
is set to either its most positive or negative value upon encountering an overflow. The SETC and CLRC instructions set and reset
this bit, respectively. LST can also be used to modify the OVM.
PM
Product shift mode. If these two bits are 00, the multiplier’s 32-bit product is loaded into the ALU with no shift. If PM = 01, the PREG
output is left-shifted one place and loaded into the ALU, with the LSB zero-filled. If PM = 10, PREG output is left-shifted by four
bits and loaded into the ALU, with the LSBs zero-filled. PM = 11 produces a right shift of six bits, sign-extended. Note that the PREG
contents remain unchanged. The shift takes place when transferring the contents of the PREG to the ALU. PM is loaded by the
SPM and LST #1 instructions. PM is cleared by RS.
SXM
Sign-extension mode bit. SXM = 1 produces sign extension on data as it is passed into the accumulator through the scaling shifter.
SXM = 0 suppresses sign extension. SXM does not affect the definitions of certain instructions; for example, the ADDS instruction
suppresses sign extension regardless of SXM. SXM is set by the SETC SXM and reset by the CLRC SXM instructions, and can
be loaded by the LST #1 instruction. SXM is set to 1 by reset.
TC
Test/control flag bit. TC is affected by the BIT, BITT, CMPR, LST #1, and NORM instructions. TC is set to a 1 if a bit tested by BIT
or BITT is a 1, if a compare condition tested by CMPR exists between AR (ARP) and AR0, if the exclusive-OR function of the two
most significant bits (MSBs) of the accumulator is true when tested by a NORM instruction. The conditional branch, call, and return
instructions can execute based on the condition of TC.
XF
XF pin status bit. XF indicates the state of the XF pin, a general-purpose output pin. XF is set by the SETC XF and reset by the
CLRC XF instructions. XF is set to 1 by reset.
central processing unit
The TMS320x24x central processing unit (CPU) contains a 16-bit scaling shifter, a 16 x 16-bit parallel multiplier,
a 32-bit central arithmetic logic unit (CALU), a 32-bit accumulator, and additional shifters at the outputs of both
the accumulator and the multiplier. This section describes the CPU components and their functions. The
functional block diagram shows the components of the CPU.
input scaling shifter
The TMS320x24x provides a scaling shifter with a 16-bit input connected to the data bus and a 32-bit output
connected to the CALU. This shifter operates as part of the path of data coming from program or data space
to the CALU and requires no cycle overhead. It is used to align the 16-bit data coming from memory to the 32-bit
CALU. This is necessary for scaling arithmetic as well as aligning masks for logical operations.
The scaling shifter produces a left shift of 0 to 16 on the input data. The LSBs of the output are filled with zeros;
the MSBs can either be filled with zeros or sign-extended, depending upon the value of the SXM bit
(sign-extension mode) of status register ST1. The shift count is specified by a constant embedded in the
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input scaling shifter (continued)
instruction word or by a value in TREG. The shift count in the instruction allows for specific scaling or alignment
operations specific to that point in the code. The TREG base shift allows the scaling factor to be adaptable to
the system’s performance.
multiplier
The TMS320x24x devices use a 16 x 16-bit hardware multiplier that is capable of computing a signed or an
unsigned 32-bit product in a single machine cycle. All multiply instructions, except the MPYU (multiply unsigned)
instruction, perform a signed multiply operation. That is, two numbers being multiplied are treated as
2s-complement numbers, and the result is a 32-bit 2s-complement number. There are two registers associated
with the multiplier, as follow:
D 16-bit temporary register (TREG) that holds one of the operands for the multiplier
D 32-bit product register (PREG) that holds the product
Four product shift modes (PM) are available at the PREG output (PSCALE). These shift modes are useful for
performing multiply/accumulate operations, performing fractional arithmetic, or justifying fractional products.
The PM field of status register ST1 specifies the PM shift mode, as shown in Table 15.
Table 15. PSCALE Product Shift Modes
PM
SHIFT
00
No shift
DESCRIPTION
01
Left 1
Removes the extra sign bit generated in a 2s-complement multiply to produce a Q31 product
10
Left 4
Removes the extra 4 sign bits generated in a 16x13 2s-complement multiply to a produce a Q31 product when
using the multiply by a 13-bit constant
11
Right 6
Scales the product to allow up to 128 product accumulation without the possibility of accumulator overflow
Product feed to CALU or data bus with no shift
The product can be shifted one bit to compensate for the extra sign bit gained in multiplying two 16-bit
2s-complement numbers (MPY instruction). A four-bit shift is used in conjunction with the MPY instruction with
a short immediate value (13 bits or less) to eliminate the four extra sign bits gained in multiplying a 16-bit number
by a 13-bit number. Finally, the output of PREG can be right-shifted 6 bits to enable the execution of up to
128 consecutive multiply/accumulates without the possibility of overflow.
The LT (load TREG) instruction normally loads TREG to provide one operand (from the data bus), and the MPY
(multiply) instruction provides the second operand (also from the data bus). A multiplication also can be
performed with a 13-bit immediate operand when using the MPY instruction. Then a product is obtained every
two cycles. When the code is executing multiple multiplies and product sums, the CPU supports the pipelining
of the TREG load operations with CALU operations using the previous product. The pipeline operations that
run in parallel with loading the TREG include: load ACC with PREG (LTP); add PREG to ACC (LTA); add PREG
to ACC and shift TREG input data (DMOV) to next address in data memory (LTD); and subtract PREG from ACC
(LTS).
Two multiply/accumulate instructions (MAC and MACD) fully utilize the computational bandwidth of the
multiplier, allowing both operands to be processed simultaneously. The data for these operations can be
transferred to the multiplier each cycle by way of the program and data buses. This facilitates single-cycle
multiply/accumulates when used with the repeat (RPT) instruction. In these instructions, the coefficient
addresses are generated by program address generation (PAGEN) logic, while the data addresses are
generated by data address generation (DAGEN) logic. This allows the repeated instruction to access the values
from the coefficient table sequentially and step through the data in any of the indirect addressing modes.
The MACD instruction, when repeated, supports filter constructs (weighted running averages) so that as the
sum-of-products is executed, the sample data is shifted in memory to make room for the next sample and to
throw away the oldest sample.
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multiplier (continued)
The MPYU instruction performs an unsigned multiplication, which greatly facilitates extended-precision
arithmetic operations. The unsigned contents of TREG are multiplied by the unsigned contents of the addressed
data memory location, with the result placed in PREG. This process allows the operands of greater than 16 bits
to be broken down into 16-bit words and processed separately to generate products of greater than 32 bits. The
SQRA (square / add) and SQRS (square / subtract) instructions pass the same value to both inputs of the
multiplier for squaring a data memory value.
After the multiplication of two 16-bit numbers, the 32-bit product is loaded into the 32-bit product register
(PREG). The product from PREG can be transferred to the CALU or to data memory by way of the SPH (store
product high) and SPL (store product low) instructions. Note: the transfer of PREG to either the CALU or data
bus passes through the PSCALE shifter, and therefore is affected by the product shift mode defined by PM. This
is important when saving PREG in an interrupt-service-routine context save as the PSCALE shift effects cannot
be modeled in the restore operation. PREG can be cleared by executing the MPY #0 instruction. The product
register can be restored by loading the saved low half into TREG and executing a MPY #1 instruction. The high
half, then, is loaded using the LPH instruction.
central arithmetic logic unit
The TMS320x24x central arithmetic logic unit (CALU) implements a wide range of arithmetic and logical
functions, the majority of which execute in a single clock cycle. This ALU is referred to as central to differentiate
it from a second ALU used for indirect-address generation called the auxiliary register arithmetic unit (ARAU).
Once an operation is performed in the CALU, the result is transferred to the accumulator (ACC) where additional
operations, such as shifting, can occur. Data that is input to the CALU can be scaled by ISCALE when coming
from one of the data buses (DRDB or PRDB) or scaled by PSCALE when coming from the multiplier.
The CALU is a general-purpose arithmetic/logic unit that operates on 16-bit words taken from data memory or
derived from immediate instructions. In addition to the usual arithmetic instructions, the CALU can perform
Boolean operations, facilitating the bit manipulation ability required for a high-speed controller. One input to the
CALU is always provided from the accumulator, and the other input can be provided from the product register
(PREG) of the multiplier or the output of the scaling shifter (that has been read from data memory or from the
ACC). After the CALU has performed the arithmetic or logical operation, the result is stored in the accumulator.
The TMS320x24x devices support floating-point operations for applications requiring a large dynamic range.
The NORM (normalization) instruction is used to normalize fixed-point numbers contained in the accumulator
by performing left shifts. The four bits of the TREG define a variable shift through the scaling shifter for the
LACT/ADDT/SUBT (load/add to /subtract from accumulator with shift specified by TREG) instructions. These
instructions are useful in floating-point arithmetic where a number needs to be denormalized — that is,
floating-point to fixed-point conversion. They are also useful in execution of an automatic gain control (AGC)
going into a filter. The BITT (bit test) instruction provides testing of a single bit of a word in data memory based
on the value contained in the four LSBs of TREG.
The CALU overflow saturation mode can be enabled/disabled by setting/resetting the OVM bit of ST0. When
the CALU is in the overflow saturation mode and an overflow occurs, the overflow flag is set and the accumulator
is loaded with either the most positive or the most negative value representable in the accumulator, depending
on the direction of the overflow. The value of the accumulator at saturation is 07FFFFFFFh (positive) or
080000000h (negative). If the OVM (overflow mode) status register bit is reset and an overflow occurs, the
overflowed results are loaded into the accumulator with modification. (Note that logical operations cannot result
in overflow.)
The CALU can execute a variety of branch instructions that depend on the status of the CALU and the
accumulator. These instructions can be executed conditionally based on any meaningful combination of these
status bits. For overflow management, these conditions include the OV (branch on overflow) and EQ (branch
on accumulator equal to zero). In addition, the BACC (branch to address in accumulator) instruction provides
the ability to branch to an address specified by the accumulator (computed goto). Bit test instructions (BIT and
BITT), which do not affect the accumulator, allow the testing of a specified bit of a word in data memory.
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central arithmetic logic unit (continued)
The CALU also has an associated carry bit that is set or reset depending on various operations within the device.
The carry bit allows more efficient computation of extended-precision products and additions or subtractions.
It also is useful in overflow management. The carry bit is affected by most arithmetic instructions as well as the
single-bit shift and rotate instructions. It is not affected by loading the accumulator, logical operations, or other
such non-arithmetic or control instructions.
The ADDC (add to accumulator with carry) and SUBB (subtract from accumulator with borrow) instructions use
the previous value of carry in their addition/subtraction operation.
The one exception to the operation of the carry bit is in the use of ADD with a shift count of 16 (add to high
accumulator) and SUB with a shift count of 16 (subtract from high accumulator) instructions. This case of the
ADD instruction can set the carry bit only if a carry is generated, and this case of the SUB instruction can reset
the carry bit only if a borrow is generated; otherwise, neither instruction affects it.
Two conditional operands, C and NC, are provided for branching, calling, returning, and conditionally executing,
based upon the status of the carry bit. The SETC, CLRC, and LST #1 instructions also can be used to load the
carry bit. The carry bit is set to one on a hardware reset.
accumulator
The 32-bit accumulator is the registered output of the CALU. It can be split into two 16-bit segments for storage
in data memory. Shifters at the output of the accumulator provide a left shift of 0 to 7 places. This shift is
performed while the data is being transferred to the data bus for storage. The contents of the accumulator
remain unchanged. When the post-scaling shifter is used on the high word of the accumulator (bits 16−31), the
MSBs are lost and the LSBs are filled with bits shifted in from the low word (bits 0−15). When the post-scaling
shifter is used on the low word, the LSBs are zero-filled.
The SFL and SFR (in-place one-bit shift to the left / right) instructions and the ROL and ROR (rotate to the
left/right) instructions implement shifting or rotating of the contents of the accumulator through the carry bit. The
SXM bit affects the definition of the SFR (shift accumulator right) instruction. When SXM = 1, SFR performs an
arithmetic right shift, maintaining the sign of the accumulator data. When SXM = 0, SFR performs a logical shift,
shifting out the LSBs and shifting in a zero for the MSB. The SFL (shift accumulator left) instruction is not affected
by the SXM bit and behaves the same in both cases, shifting out the MSB and shifting in a zero. Repeat (RPT)
instructions can be used with the shift and rotate instructions for multiple-bit shifts.
auxiliary registers and auxiliary-register arithmetic unit (ARAU)
The x243/x241 provides a register file containing eight auxiliary registers (AR0 −AR7). The auxiliary registers
are used for indirect addressing of the data memory or for temporary data storage. Indirect auxiliary-register
addressing allows placement of the data memory address of an instruction operand into one of the auxiliary
registers. These registers are referenced with a 3-bit auxiliary register pointer (ARP) that is loaded with a value
from 0 through 7, designating AR0 through AR7, respectively. The auxiliary registers and the ARP can be loaded
from data memory, the ACC, the product register, or by an immediate operand defined in the instruction. The
contents of these registers also can be stored in data memory or used as inputs to the CALU.
The auxiliary register file (AR0−AR7) is connected to the ARAU. The ARAU can autoindex the current auxiliary
register while the data memory location is being addressed. Indexing either by ±1 or by the contents of the AR0
register can be performed. As a result, accessing tables of information does not require the CALU for address
manipulation; therefore, the CALU is free for other operations in parallel.
internal memory
The TMS320x24x devices are configured with the following memory modules:
D Dual-access random-access memory (DARAM)
D Flash
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internal memory (continued)
dual-access RAM (DARAM)
There are 544 words × 16 bits of DARAM on the x243/x241 device. The x243/x241 DARAM allows writes to
and reads from the RAM in the same cycle. The DARAM is configured in three blocks: block 0 (B0), block 1 (B1),
and block 2 (B2). Block 1 contains 256 words and Block 2 contains 32 words, and both blocks are located only
in data memory space. Block 0 contains 256 words, and can be configured to reside in either data or program
memory space. The SETC CNF (configure B0 as data memory) and CLRC CNF (configure B0 as program
memory) instructions allow dynamic configuration of the memory maps through software.
When using on-chip RAM, or high-speed external memory, the x243/x241 runs at full speed with no wait states.
The ability of the DARAM to allow two accesses to be performed in one cycle, coupled with the parallel nature
of the x243/x241 architecture, enables the device to perform three concurrent memory accesses in any given
machine cycle. Externally, the READY line can be used to interface the x243/x241 to slower, less expensive
external memory. Downloading programs from slow off-chip memory to on-chip RAM can speed processing
while cutting system costs.
flash EEPROM
Flash EEPROM provides an attractive alternative to masked program ROM. Like ROM, flash is nonvolatile.
However, it has the advantage of “in-target” reprogrammability. The F243/F241 incorporates one 8K × 16-bit
flash EEPROM module in program space. Flash devices offer a cost-effective reprogrammable solution for
volume production.
Unlike most discrete flash memory, the F243/F241 flash does not require a dedicated state machine, because
the algorithms for programming and erasing the flash are executed by the DSP core. This enables several
advantages, including: reduced chip size and sophisticated, adaptive algorithms. For production programming,
the IEEE Standard 1149.1† (JTAG) scan port provides easy access to the on-chip RAM for downloading the
algorithms and flash code. Other key features of the flash include zero-wait-state access rate and single 5-V
power supply. Before programming, the flash EEPROM module generates the necessary voltages internally,
making it unnecessary to provide the programming or erase voltages externally.
An erased bit in the flash is read as a logic 1, and a programmed bit is read as a logic 0. The flash requires a
block-erase of the entire 8K module; however, any combination of bits can be programmed. The following four
algorithms are required for flash operations: clear, erase, flash-write, and program. For an explanation of these
algorithms and a complete description of the flash EEPROM, see the TMS320F20x/F24x DSP Embedded Flash
Memory Technical Reference (literature number SPRU282).
illegal access detect
Any access to an illegal address asserts an NMI. This feature is useful to provide a graceful return back to the
user code, should an illegal address be accessed inadvertently.
flash serial loader/utilities
The on-chip flash is shipped with a serial bootloader code programmed at the following addresses:
0000−00FFh. All other flash memory locations are in an erased state. The serial bootloader can be used to load
flash-programming algorithms or code to any destination RAM through the on-chip serial communications
interface (SCI). Refer to the TMS320F240 Serial Bootloader application note (located at ftp://www.ti.com/) to
understand on-chip flash programming using the serial bootloader code. (Choose /pub/tms320bbs/c24xfiles
at the main ftp directory to locate the f240boot.pdf file.) The latest TMS320F243/241 flash utilities should be
available at http://www.ti.com which is the external TI web site.
† IEEE Standard 1149.1−1990, IEEE Standard Test Access Port.
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peripherals
The integrated peripherals of the TMS320x24x are described in the following subsections:
D
D
D
D
D
D
D
External memory interface (F243 only)
Event-manager (EV2) module
Analog-to-digital converter (ADC) module
Serial peripheral interface (SPI) module
Serial communications interface (SCI) module
Controller area network (CAN) module
Watchdog (WD) timer module
external memory interface (F243 only)
The TMS320F243 can address up to 64K × 16 words of memory (or registers) in each of the program, data,
and I/ O spaces. On-chip memory, when enabled, occupies some of this off-chip range. In data space, the high
32K words can be mapped dynamically either locally or globally using the global memory allocation register
(GREG) as described in the TMS320C241/C242/C243 DSP Controllers CPU, System, Instruction Set, and
Peripherals Reference Guide (literature number SPRU276). Access to a data-memory location, that is mapped
as global, asserts the BR pin low.
The CPU of the TMS320F243 schedules a program fetch, data read, and data write on the same machine cycle.
This is because from on-chip memory, the CPU can execute all three of these operations in the same cycle.
However, the external interface multiplexes the internal buses to one address and one data bus. The external
interface sequences these operations to complete first the data write, then the data read, and finally the program
read.
The F243 supports a wide range of system interfacing requirements. Program, data, and I/O address spaces
provide interface to memory and I/O, thereby maximizing system throughput. The full 16-bit address and data
bus, along with the PS, DS, and IS space-select signals, allow addressing of 64K 16-bit words in program, data,
and I/O space. Since on-chip peripheral registers occupy positions of data-memory space, the externally
addressable data-memory space is 32K 16-bit words.
I/O design is simplified by having I/O treated the same way as memory. I/O devices are accessed in the I/O
address space using the processor’s external address and data buses in the same manner as memory-mapped
devices.
The F243 external parallel interface provides various control signals to facilitate interfacing to the device. The
R / W output signal is provided to indicate whether the current cycle is a read or a write. The STRB output signal
provides a timing reference for all external cycles. For convenience, the device also provides the RD and the
WE output signals, which indicate a read and a write cycle, respectively, along with timing information for those
cycles. The availability of these signals minimizes external gating necessary for interfacing external devices to
the F243.
The bus request (BR) signal is used in conjunction with other F243 interface signals to arbitrate external global
memory accesses. Global memory is external data memory space in which the BR signal is asserted at the
beginning of the access. When an external global memory device receives the bus request, it responds by
asserting the READY signal after the global memory access is arbitrated and the global access is completed.
The TMS320F243 supports zero-wait-state reads on the external interface. However, to avoid bus conflicts,
writes take two cycles. This allows the TMS320F243 to buffer the transition of the data bus from input to output
(or output to input) by a half cycle. In most systems, TMS320F243 ratio of reads to writes is significantly large
to minimize the overhead of the extra cycle on writes.
48
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external memory interface (F243 only) (continued)
Wait states can be generated when accessing slower external resources. The wait states operate on
machine-cycle boundaries and are initiated either by using the READY pin or using the software wait-state
generator. READY pin can be used to generate any number of wait states. When using the READY pin to
communicate with slower devices, the F243 processor waits until the slower device completes its function and
signals the processor by way of the READY line. Once a ready indication is provided back to the F243 from
the external device, execution continues. For external wait states using the READY pin, the on-chip wait-state
generator must be programmed to generate at least one wait state.
wait-state generation (F243 only)
Wait-state generation is incorporated in the F243 without any external hardware for interfacing the F243 with
slower off-chip memory and I/O devices. Adding wait states lengthens the time the CPU waits for external
memory or an external I/O port to respond when the CPU reads from or writes to that external memory or I/O
port. Specifically, the CPU waits one extra cycle (one CLKOUT cycle) for every wait state. The wait states
operate on CLKOUT cycle boundaries.
To avoid bus conflicts, writes from the F243 always take at least two CLKOUT cycles. The F243 offers two
options for generating wait states:
D READY Signal. With the READY signal, you can externally generate any number of wait states. The READY
pin has no effect on accesses to internal memory.
D On-Chip Wait-State Generator. With this generator, you can generate zero to seven wait states.
generating wait states with the READY signal
When the READY signal is low, the F243 waits one CLKOUT cycle and then checks READY again. The F243
will not continue executing until the READY signal is driven high; therefore, if the READY signal is not used, it
should be pulled high.
The READY pin can be used to generate any number of wait states. However, when the F243 operates at full
speed, it may not respond fast enough to provide a READY-based wait state for the first cycle. For extended
wait states using external READY logic, the on-chip wait-state generator should be programmed to generate
at least one wait state.
generating wait states with the F243 on-chip software wait-state generator
The software wait-state generator can be programmed to generate zero to seven wait states for a given off-chip
memory space (program, data, or I/O), regardless of the state of the READY signal. These zero to seven wait
states are controlled by the wait-state generator register (WSGR) (I/O FFFFh). For more detailed information
on the WSGR and associated bit functions, refer to the TMS320C241/C242/C243 DSP Controllers CPU,
System, Instruction Set, and Peripherals Reference Guide (literature number SPRU276).
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event-manager (EV2) module
The event-manager module includes general-purpose (GP) timers, full compare/PWM units, capture units, and
quadrature-encoder pulse (QEP) circuits. Figure 10 shows the functions of the event manager.
24x DSP Core
Data Bus
ADDR Bus
Reset INT2,3,4 Clock
16
16
16
16
EV Control Registers
and Control Logic
ADC Start of
Conversion
Output
Logic
GP Timer 1
Compare
T1CMP/
T1PWM
TDIR
16
TCLKIN
GP Timer 1
Prescaler
CLKOUT
16
T1CON[4,5]
16
Full-Compare
Units
3
SVPWM
State
Machine
T1CON[8,9,10]
PWM1
3
3
Deadband
Units
Output
Logic
PWM6
16
16
T2CMP/
T2PWM
Output
Logic
GP Timer 2
Compare
TCLKIN
GP Timer 2
Prescaler
16
CLKOUT
T2CON[8,9,10]
T2CON[4,5]
TDIR
16
DIR
Clock
QEP
Circuit
MUX
CAPCON[14,13]
2
2
16
2
Capture Units
CAP3
16
Figure 10. Event-Manager Block Diagram
50
CAP1/QEP0
CAP2/QEP1
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general-purpose (GP) timers
There are two GP timers on the TMS320x24x. The GP timer x (for x = 1 or 2) includes:
D
D
D
D
D
D
D
A 16-bit timer, up-/down-counter, TxCNT, for reads or writes
A 16-bit timer-compare register, TxCMPR (double-buffered with shadow register), for reads or writes
A 16-bit timer-period register, TxPR (double-buffered with shadow register), for reads or writes
A 16-bit timer-control register,TxCON, for reads or writes
Selectable internal or external input clocks
A programmable prescaler for internal or external clock inputs
Control and interrupt logic, for four maskable interrupts: underflow, overflow, timer compare, and period
interrupts
D A selectable direction input pin (TDIR) (to count up or down when directional up- / down-count mode is
selected)
The GP timers can be operated independently or synchronized with each other. The compare register
associated with each GP timer can be used for compare function and PWM-waveform generation. There are
three continuous modes of operations for each GP timer in up- or up / down-counting operations. Internal or
external input clocks with programmable prescaler is used for each GP timer. GP timers also provide the time
base for the other event-manager submodules: GP timer 1 for all the compares and PWM circuits, GP timer 2/1
for the capture units and the quadrature-pulse counting operations.
Double-buffering of the period and compare registers allows programmable change of the timer (PWM) period
and the compare/PWM pulse width as needed.
full-compare units
There are three full-compare units on TMS320x24x. These compare units use GP timer1 as the time base and
generate six outputs for compare and PWM-waveform generation using programmable deadband circuit. The
state of each of the six outputs is configured independently. The compare registers of the compare units are
double-buffered, allowing programmable change of the compare/PWM pulse widths as needed.
programmable deadband generator
The deadband generator circuit includes three 8-bit counters and an 8-bit compare register. Desired deadband
values (from 0 to 24 µs) can be programmed into the compare register for the outputs of the three compare units.
The deadband generation can be enabled/disabled for each compare unit output individually. The
deadband-generator circuit produces two outputs (with or without deadband zone) for each compare unit output
signal. The output states of the deadband generator are configurable and changeable as needed by way of the
double-buffered ACTR register.
PWM waveform generation
Up to 8 PWM waveforms (outputs) can be generated simultaneously by TMS320x24x: three independent pairs
(six outputs) by the three full-compare units with programmable deadbands, and two independent PWMs by
the GP-timer compares.
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PWM characteristics
Characteristics of the PWMs are as follows:
D
D
D
D
D
D
D
16-bit registers
Programmable deadband for the PWM output pairs, from 0 to 24 µs
Minimum deadband width of 50 ns
Change of the PWM carrier frequency for PWM frequency wobbling as needed
Change of the PWM pulse widths within and after each PWM period as needed
External-maskable power and drive-protection interrupts
Pulse-pattern-generator circuit, for programmable generation of asymmetric, symmetric, and four-space
vector PWM waveforms
D Minimized CPU overhead using auto-reload of the compare and period registers
capture unit
The capture unit provides a logging function for different events or transitions. The values of the GP timer 2
counter are captured and stored in the two-level FIFO stacks when selected transitions are detected on capture
input pins, CAPx for x = 1, 2, or 3. The capture unit of the TMS320x24x consists of three capture circuits.
D Capture units include the following features:
−
One 16-bit capture control register, CAPCON (R/W)
−
One 16-bit capture FIFO status register, CAPFIFO
−
Selection of GP timer 2 as the time base
−
Three 16-bit 2-level-deep FIFO stacks, one for each capture unit
−
Three capture input pins CAP1, CAP2, and CAP3, one input pin per each capture unit. [All inputs are
synchronized with the device (CPU) clock. In order for a transition to be captured, the input must hold at
its current level to meet two rising edges of the device clock. The input pins CAP1 and CAP2 can also be
used as QEP inputs to the QEP circuit.]
−
User-specified transition (rising edge, falling edge, or both edges) detection
−
Three maskable interrupt flags, one for each capture unit
quadrature-encoder pulse (QEP) circuit
Two capture inputs (CAP1 and CAP2) can be used to interface the on-chip QEP circuit with a quadrature
encoder pulse. Full synchronization of these inputs is performed on-chip. Direction or leading-quadrature pulse
sequence is detected, and GP timer 2 is incremented or decremented by the rising and falling edges of the two
input signals (four times the frequency of either input pulse).
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analog-to-digital converter (ADC) module
A simplified functional block diagram of the ADC module is shown in Figure 11. The ADC module consists of
a 10-bit ADC with a built-in sample-and-hold (S/ H) circuit. A total of 8 analog input channels is available on the
F243/F241. Eight analog inputs are provided by way of an 8-to-1 analog multiplexer. Maximum total conversion
time for each ADC unit is 1 µs. Reference voltage for the ADC module is 0−5 V and is supplied externally.
Functions of the ADC module include:
D The ADC unit can perform single or continuous S / H and conversion operations. When in continuous
conversion mode, the ADC generates two results every 1700 ns (with a 20-MHz clock and a prescale factor
of 1). These two results can be two separate analog inputs.
D Two 2-level-deep FIFO result registers
D Conversion can be started by software, an external signal transition on a device pin (ADCSOC), or by
certain event manager events.
D The ADC control register is double-buffered (with a shadow register) and can be written to at any time. A
new conversion can start either immediately or when the previous conversion process is completed.
D In single-conversion mode, at the end of each conversion, an interrupt flag is set and the peripheral interrupt
request (PIRQ) is generated if it is unmasked/enabled.
D The result of previous conversions stored in data registers will be lost when a third result is stored in the
2-level-deep data FIFO.
A/D overview
The “pseudo” dual ADC is based around a 10-bit string/capacitor converter with the switched capacitor string
providing an inherent S/ H function. (Note: There is only one converter with only one inherent S/H circuit.) This
peripheral behaves as though there are two analog converters, ADC #1 and ADC #2, but in fact, it uses only
one converter. This feature makes the A/D software compatible with the C240’s A/D and also allows two values
(e.g., voltage and current) to be converted almost simultaneoulsy with one conversion request. VCCA and VSSA
pins must be connected to 5 V and analog ground, respectively. Standard isolation techniques must be used
while applying power to the ADC module.
The ADC module, shown in Figure 11, has the following features:
D Up to 8 analog inputs, ADCIN00−ADCIN07. The results from converting the inputs ADCIN00−ADCIN07 are
placed in one of the ADCFIFO results registers (see Table 16). The digital value of the input analog voltage
is derived by:
Digital Value + 1023
D
D
D
D
D
D
D
D
Input Analog Voltage * V REFLO
V REFHI * V REFLO
Almost simultaneous measurement of two analog inputs, 1700 ns apart
Single conversion and continuous conversion modes
Conversion can be started by software, an internal event, and/or an external event.
VREFHI and VREFLO (high- and low-voltage) reference inputs
Two-level-deep digital result registers that contain the digital vaules of completed conversions
Two programmable ADC module control registers (see Table 16)
Programmable clock prescaler
Interrupt or polled operation
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A/D overview (continued)
Data Reg. 1
2-Level-Deep
FIFO
(ADCFIFO1)
ADCSOC
Analog
Switch
ADCIN00
Control
Registers
Control
Logic
Data Reg. 2
2-Level-Deep
FIFO
(ADCFIFO2)
Analog
Switch
ADCIN01
Program
Clock
Prescaler
Start
Analog
Switch
ADCIN02
ADC
CLK
EOC
Timing
and
Control
Logic
OUT[9:0]
Successive
Approximation
Register
ADC
MACRO
VRT
5-Bit
Resistor
String
Analog
Switch
ADCIN07
5-Bit
Capacitor
Array
Comparator
VRB
AIN
VREFHI
VCCA
VSSA
VREFLO
Figure 11. F243/F241 Pseudo Dual Analog-to-Digital Converter (ADC) Module
Table 16. Addresses of ADC Registers
54
ADDRESS OFFSET
NAME
DESCRIPTION
7032h
ADCTRL1
ADC Control Register 1
7034h
ADCTRL2
ADC Control Register 2
7036h
ADCFIFO1
ADC 2-Level-Deep Data Register FIFO for
Pseudo ADC #1
7038h
ADCFIFO2
ADC 2-Level-Deep Data Register FIFO for
Pseudo ADC #2
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shadowed bits
Many of the control register bits are described as “shadowed”. This means that changing the value of one of
these bits does not take effect until the current conversion is complete.
serial peripheral interface (SPI) module
The F243/F241 devices include the four-pin serial peripheral interface (SPI) module. The SPI is a high-speed
synchronous serial I/O port that allows a serial bit stream of programmed length (one to sixteen bits) to be shifted
into and out of the device at a programmable bit-transfer rate. Normally, the SPI is used for communications
between the DSP controller and external peripherals or another processor. Typical applications include external
I/O or peripheral expansion through devices such as shift registers, display drivers, and ADCs. Multidevice
communications are supported by the master/slave operation of the SPI.
The SPI module features include the following:
D Four external pins:
−
SPISOMI: SPI slave-output/master-input pin
−
SPISIMO: SPI slave-input/master-output pin
−
SPISTE: SPI slave transmit-enable pin
−
SPICLK: SPI serial-clock pin
NOTE: All these four pins can be used as GPIO, if the SPI module is not used.
D
D
D
D
Two operational modes: master and slave
Baud rate: 125 different programmable rates / 5 Mbps at 20-MHz CPUCLK
Data word length: one to sixteen data bits
Four clocking schemes controlled by clock polarity and clock phase bits include:
−
Falling edge without phase delay: SPICLK active high. SPI transmits data on the falling edge of the
SPICLK signal and receives data on the rising edge of the SPICLK signal.
−
Falling edge with phase delay: SPICLK active high. SPI transmits data one half-cycle ahead of the
falling edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal.
−
Rising edge without phase delay: SPICLK inactive low. SPI transmits data on the rising edge of the
SPICLK signal and receives data on the falling edge of the SPICLK signal.
−
Rising edge with phase delay: SPICLK inactive low. SPI transmits data one half-cycle ahead of the
falling edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal.
D Simultaneous receive and transmit operation (transmit function can be disabled in software)
D Transmitter and receiver operations are accomplished through either interrupt-driven or polled algorithms.
D Eight SPI module control registers: Located in control register frame beginning at address 7040h.
NOTE: All registers in this module are 16-bit registers that are connected to the 16-bit peripheral bus. When a register is accessed, the register
data is in the lower byte (7 −0), and the upper byte (15 −8) is read as zeros. Writing to the upper byte has no effect.
Figure 12 is a block diagram of the SPI in slave mode.
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serial peripheral interface (SPI) module (continued)
SPIRXBUF.15−0
Overrun
INT ENA
Receiver
Overrun
SPIRXBUF
Buffer Register
SPI Priority
SPISTS.7
SPIPRI.6
SPICTL.4
SPITXBUF.15−0
0
16
SPITXBUF
Buffer Register
SPI INT
ENA
SPI INT FLAG
1
High INT Priority
Low INT Priority
SPISTS.6
SPICTL.0
16
SPI Interrupt
to CPU
M
M
S
SPIDAT
Data Register
S
SW1
External
Connections
SPISIMO
M
SPIDAT.15−0
M
S
S
SW2
SPISOMI
Talk
SPICTL.1
S
SPISTE}
State Control
Master/Slave†
SPICCR.3−0
SPI CHAR
3
2
1
SPICTL.2
S
0
SW3
M
SPI Bit Rate
CLKOUT
S
SPIBRR.6 − 0
6
5
4
3
2
Clock
Polarity
Clock
Phase
SPICCR.6
SPICTL.3
SPICLK
M
1
0
† The diagram is shown in slave mode.
‡ The SPISTE pin is shown enabled, meaning the data can be transmitted or received in this mode. Note that switches SW1, SW2, and SW3 are
closed in this configuration. The “switches” are assumed to close when their “control signal” is high.
Figure 12. Four-Pin Serial Peripheral Interface Module Block Diagram
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serial communications interface (SCI) module
The F243/F241 devices include a serial communications interface (SCI) module. The SCI module supports
digital communications between the CPU and other asynchronous peripherals that use the standard
non-return-to-zero (NRZ) format. The SCI receiver and transmitter are double-buffered, and each has its own
separate enable and interrupt bits. Both can be operated independently or simultaneously in the full-duplex
mode. To ensure data integrity, the SCI checks received data for break detection, parity, overrun, and framing
errors. The bit rate is programmable to over 65 000 different speeds through a 16-bit baud-select register.
Features of the SCI module include:
D Two external pins
−
SCITXD: SCI transmit-output pin
−
SCIRXD: SCI receive-input pin
NOTE: Both pins can be used as GPIO if not used for SCI.
D Baud rate programmable to 64K different rates
−
Up to 1250 Kbps at 20-MHz CPUCLK
D Data word format
D
D
D
D
D
−
One start bit
−
Data word length programmable from one to eight bits
−
Optional even/odd/no parity bit
−
One or two stop bits
Four error-detection flags: parity, overrun, framing, and break detection
Two wake-up multiprocessor modes: idle-line and address bit
Half- or full-duplex operation
Double-buffered receive and transmit functions
Transmitter and receiver operations can be accomplished through interrupt-driven or polled algorithms with
status flags.
−
Transmitter: TXRDY flag (transmitter-buffer register is ready to receive another character) and
TX EMPTY flag (transmitter-shift register is empty)
−
Receiver: RXRDY flag (receiver-buffer register is ready to receive another character), BRKDT flag
(break condition occurred), and RX ERROR (monitoring four interrupt conditions)
D Separate enable bits for transmitter and receiver interrupts (except BRKDT)
D NRZ (non-return-to-zero) format
D Ten SCI module control registers located in the control register frame beginning at address 7050h
NOTE: All registers in this module are 8-bit registers that are connected to the 16-bit peripheral bus. When a register is accessed, the register
data is in the lower byte (7 −0), and the upper byte (15 −8) is read as zeros. Writing to the upper byte has no effect.
Figure 13 shows the SCI module block diagram.
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serial communications interface (SCI) module (continued)
TXWAKE
Frame Format and Mode
SCICTL1.3
Parity
Even/Odd Enable
SCICCR.6 SCICCR.5
1
SCITXBUF.7−0
Transmitter-Data
Buffer Register
SCI TX Interrupt
TXRDY
TX INT ENA
SCICTL2.7
TX EMPTY
8
TXINT
SCICTL2.0
External
Connections
SCICTL2.6
WUT
TXENA
TXSHF
Register
SCITXD
SCITXD
SCICTL1.1
SCIHBAUD. 15 −8
SCI Priority Level
1
Baud Rate
MSbyte
Register
Level 2 Int.
0
Level 1 Int.
SCI TX
Priority
CLOCK
SCILBAUD. 7 −0
SCIPRI.6
Baud Rate
LSbyte
Register
Level 2 Int.
1
0
Level 1 Int.
SCI RX
Priority
SCIPRI.5
RXENA
RX ERR INT ENA
SCICTL1.6
RX Error
SCIRXST.7
SCIRXST.4 −2
RX Error
FE OE PE
SCIRXD
SCICTL1.0
8
Receiver-Data
Buffer
Register
SCIRXBUF.7−0
SCI RX Interrupt
RXRDY
SCIRXST.6
BRKDT
SCIRXST.5
RX/BK INT ENA
SCICTL2.1
RXINT
RXWAKE
SCIRXST.1
SCIRXD
RXSHF
Register
Figure 13. Serial Communications Interface (SCI) Module Block Diagram
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controller area network (CAN) module
The CAN peripheral supports the following features:
D Full implementation of CAN protocol, version 2.0B
−
Standard and extended identifiers
−
Data and remote frames
D Six mailboxes for objects of 0- to 8-bytes data length
D
D
D
D
D
D
D
−
Two receive mailboxes (MBOX0,1), two transmit mailboxes (MBOX4,5)
−
Two configurable transmit/receive mailboxes (MBOX2,3)
Local acceptance mask registers (LAMn) for mailboxes 0 and 1 and mailboxes 2 and 3
Programmable bit rate
Programmable interrupt scheme
Programmable wake up on bus activity
Automatic reply to a remote request
Automatic re-transmission in case of error or loss of arbitration
Bus failure diagnostic
−
Bus on/off
−
Error passive/active
−
Bus error warning
−
Bus stuck dominant
−
Frame error report
−
Readable error counter
D Self-Test Mode
−
The CAN peripheral operates in a loop back mode
−
Receives its own transmitted message and generates its own acknowledge signal
D Two-Pin Communication
−
The CAN module uses two pins for communication, CANTX and CANRX
−
These two pins are connected to a CAN transceiver chip, which in turn is connected to a CAN bus
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controller area network (CAN) module (continued)
Table 17. Register Addresses†
Address
Name
Description
7100h
MDER
7101h
TCR
Transmission Control Register (bits 15 to 0)
7102h
RCR
Receive Control Register (bits 15 to 0)
7103h
MCR
Master Control Register (bits 13 to 6, 1, 0)
7104h
BCR2
Bit Configuration Register 2 (bits 7 to 0)
7105h
BCR1
Bit Configuration Register 1 (bits 10 to 0)
7106h
ESR
Error Status Register (bits 8 to 0)
7107h
GSR
Global Status Register (bits 5 to 0)
7108h
CEC
Transmit and Receive Error Counters (bits 15 to 0)
7109h
CAN_IFR
Interrupt Flag Register (bits 13 to 8, 6 to 0)
710Ah
CAN_IMR
Interrupt Mask Register (bits 15, 13 to 0)
Mailbox Direction/Enable Register (bits 7 to 0)
710Bh
LAM0_H
Local Acceptance Mask for MBOX0 and 1 (bits 31, 28 to 16)
710Ch
LAM0_L
Local Acceptance Mask for MBOX0 and 1 (bits 15 to 0)
710Dh
LAM1_H
Local Acceptance Mask for MBOX2 and 3 (bits 31, 28 to 16)
710Eh
LAM1_L
Local Acceptance Mask for MBOX2 and 3 (bits 15 to 0)
710Fh
Reserved
Accesses assert the CAADDRx signal from the CAN peripheral (which will assert an Illegal Address error)
† All unimplemented register bits are read as zero, writes have no effect. Register bits are initialized to zero, unless otherwise stated in the definition.
CAN interrupt logic
There are two interrupt requests from the CAN module to the Peripheral Interrupt Expansion (PIE) controller:
the Mailbox Interrupt and the Error Interrupt. Both interrupts can assert either a high-priority request or a
low-priority request to the CPU. The following events can initiate an interrupt:
D Transmission Interrupt
A message was transmitted or received successfully —asserts the Mailbox Interrupt.
D Abort Acknowledge Interrupt
D
D
D
D
D
D
60
A send transmission was aborted —asserts the Error Interrupt.
Write Denied Interrupt
The CPU tried to write to a mailbox but was not allowed to —asserts the Error Interrupt.
Wakeup Interrupt
After wakeup, this interrupt is generated —asserts the Error Interrupt, even when clocks are not running.
Receive Message Lost Interrupt
An old message was overwritten by a new one —asserts the Error Interrupt.
Bus-Off Interrupt
The CAN module enters the bus-off state —asserts the Error Interrupt.
Error Passive Interrupt
The CAN module enters the error passive mode —asserts the Error Interrupt.
Warning Level Interrupt
One or both of the error counters is greater than or equal to 96 —asserts the Error Interrupt.
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CAN configuration mode
Normal Mode
(CCR = 0)
(CCE = 0)
Configuration Mode
Requested
(CCR = 1)
(CCE = 0)
Wait for Configuration
Mode
(CCR = 1)
(CCE = 0)
CCE = 0
Configuration Mode
Active
(CCR = 1)
(CCE = 1)
Changing of Bit Timing
Parameters Enabled
Normal Mode
Requested
(CCR = 0)
(CCE = 1)
Wait for Normal Mode
(CCR = 0)
(CCE = 1)
CCE = 1
Figure 14. CAN Initialization
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61
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
CAN configuration mode (continued)
The CAN module must be initialized before activation. This is only possible if the module is in configuration
mode. The configuration mode is set by programming the CCR bit of the MCR register with “1”. Only if the status
bit CCE (GSR.4) confirms the request by getting “1”, the initialization can be performed. Afterwards, the bit
configuration registers can be written. The module is activated again by programming the control bit CCR with
zero. After a hardware reset, the configuration mode is active.
watchdog (WD) timer module
The F243/F241 devices include a watchdog (WD) timer module. The WD function of this module monitors
software and hardware operation by generating a system reset if it is not periodically serviced by software by
having the correct key written. The WD timer operates independently of the CPU and is always enabled. It does
not need any CPU initialization to function. When a system reset occurs, the WD timer defaults to the fastest
WD timer rate available (6.55 ms for a 39062.5-Hz WDCLK signal). As soon as reset is released internally, the
CPU starts executing code, and the WD timer begins incrementing. This means that, to avoid a premature reset,
WD setup should occur early in the power-up sequence. See Figure 15 for a block diagram of the WD module.
The WD module features include the following:
D WD Timer
− Seven different WD overflow rates ranging from 6.55 ms to 419.43 ms
− A WD-reset key (WDKEY) register that clears the WD counter when a correct value is written, and
generates a system reset if an incorrect value is written to the register
− WD check bits that initiate a system reset if an incorrect value is written to the WD control register
(WDCR)
D Automatic activation of the WD timer, once system reset is released
− Three WD control registers located in control register frame beginning at address 7020h.
NOTE: All registers in this module are 8-bit registers. When a register is accessed, the register data is in the lower byte, the upper byte is read
as zeros. Writing to the upper byte has no effect.
Figure 15 shows the WD block diagram. Table 18 shows the different WD overflow (timeout) selections.
62
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watchdog (WD) timer module (continued)
WDCLK
System
Reset
6-Bit
FreeRunning
Counter
/64
/32
/16
/8
/4
/2
CLR
000
001
010
011
WDPS
WDCR.2 −0
2 1 0
100
101
110
WDCR.6
111
WDDIS
WDCNTR.7 −0
8-Bit Watchdog
Counter
CLR
One-Cycle
Delay
WDFLAG
WDCR.7
WDKEY.7 −0
System
Reset
Request
Bad Key
Watchdog
Reset Key
Register
55 + AA
Detector
Good Key
Reset Flag
PS/257
WDCHK2−0
WDCR.5 −3†
Bad WDCR Key
3
3
System Reset
1 0 1
(Constant
Value)
† Writing to bits WDCR.5 −3 with anything but the correct pattern (101) generates a system reset.
Figure 15. Block Diagram of the WD Module
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SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
watchdog (WD) timer module (continued)
Table 18. WD Overflow (Timeout) Selections
39.0625-kHz WDCLK†
WD PRESCALE SELECT BITS
WDCLK DIVIDER
FREQUENCY (Hz)
MINIMUM
OVERFLOW (ms)
WDPS2
WDPS1
WDPS0
0
0
X‡
1
152.59
6.55
0
1
0
2
76.29
13.11
0
1
1
4
38.15
26.21
1
0
0
8
19.07
52.43
1
0
1
16
9.54
104.86
1
1
0
32
4.77
209.72
1
1
1
64
2.38
419.43
† Generated by 5-MHz clock
‡ X = Don’t care
scan-based emulation
TMS320x2xx devices incorporate scan-based emulation logic for code-development and
hardware-development support. Scan-based emulation allows the emulator to control the processor in the
system without the use of intrusive cables to the full pinout of the device. The scan-based emulator
communicates with the x2xx by way of the IEEE 1149.1-compatible (JTAG) interface. The F243 and F241
DSPs, like the TMS320F206, TMS320C203, and TMS320LC203, do not include boundary scan. The scan
chain of these devices is useful for emulation function only.
TMS320x24x instruction set
The x24x microprocessor implements a comprehensive instruction set that supports both numeric-intensive
signal-processing operations and general-purpose applications, such as multiprocessing and high-speed
control. Source code for the TMS320C1xt (C1xt) and TMS320C2xt (C2xt) generation DSPs is upwardly
compatible with the x243/x241 devices.
For maximum throughput, the next instruction is prefetched while the current one is being executed. Because
the same data lines are used to communicate to external data, program, or I/O space, the number of cycles an
instruction requires to execute varies, depending upon whether the next data operand fetch is from internal or
external memory. Highest throughput is achieved by maintaining data memory on chip and using either internal
or fast external program memory.
addressing modes
The TMS320x24x instruction set provides four basic memory-addressing modes: direct, indirect, immediate,
and register.
In direct addressing, the instruction word contains the lower seven bits of the data memory address. This field
is concatenated with the nine bits of the data memory page pointer (DP) to form the 16-bit data memory address.
Therefore, in the direct-addressing mode, data memory is paged effectively with a total of 512 pages, each page
containing 128 words.
Indirect addressing accesses data memory through the auxiliary registers. In this addressing mode, the address
of the instruction operand is contained in the currently selected auxiliary register. Eight auxiliary registers
(AR0−AR7) provide flexible and powerful indirect addressing. To select a specific auxiliary register, the auxiliary
register pointer (ARP) is loaded with a value from 0 to 7 for AR0 through AR7, respectively.
TMS320C1x, C1x, TMS320C2x, and C2x are trademarks of Texas Instruments.
64
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addressing modes (continued)
There are seven types of indirect addressing: autoincrement or autodecrement, postindexing by adding or
subtracting the contents of AR0, single-indirect addressing with no increment or decrement, and bit-reversed
addressing [used in Fast Fourier Transforms (FFTs)] with increment or decrement. All operations are performed
on the current auxiliary register in the same cycle as the original instruction, following which the current auxiliary
register and ARP can be modified.
In immediate addressing, the actual operand data is provided in a portion of the instruction word or words. There
are two types of immediate addressing: long and short. In short-immediate addressing, the data is contained
in a portion of the bits in a single-word instruction. In long-immediate addressing, the data is contained in the
second word of a two-word instruction. The immediate-addressing mode is useful for data that does not need
to be stored or used more than once during the course of program execution (for example, initialization values
or constants).
The register-addressing mode uses operands in CPU registers either explicitly, such as with a direct reference
to a specific register, or implicitly, with instructions that intrinsically reference certain registers. In either case,
operand reference is simplified because 16-bit values can be used without specifying a full 16-bit operand
address or immediate value.
repeat feature
The repeat function can be used with instructions (as defined in Table 20) such as multiply/accumulates (MAC
and MACD), block moves (BLDD and BLPD), I/O transfers (IN/OUT ), and table read/writes (TBLR/TBLW).
These instructions, although normally multicycle, are pipelined when the repeat feature is used, and they
effectively become single-cycle instructions. For example, the table-read instruction can take three or more
cycles to execute, but when the instruction is repeated, a table location can be read every cycle.
The repeat counter (RPTC) is loaded with the addressed data memory location if direct or indirect addressing
is used, and with an 8-bit immediate value if short-immediate addressing is used. The internal RPTC register
is loaded by the RPT instruction. This results in a maximum of N + 1 executions of a given instruction. RPTC
is cleared by reset. Once a repeat instruction (RPT ) is decoded, all interrupts, including NMI (but excluding
reset), are masked until the completion of the repeat loop.
instruction set summary
This section summarizes the operation codes (opcodes) of the instruction set for the x24x digital signal
processors. This instruction set is a superset of the C1x and C2x instruction sets. The instructions are arranged
according to function and are alphabetized by mnemonic within each category. The symbols in Table 19 are
used in the instruction set summary table (Table 20). T he TI C2xx assembler accepts C2x instructions.
The number of words that an instruction occupies in program memory is specified in column 3 of Table 21.
Several instructions specify two values separated by a slash mark ( / ) for the number of words. In these cases,
different forms of the instruction occupy a different number of words. For example, the ADD instruction occupies
one word when the operand is a short-immediate value or two words if the operand is a long-immediate value.
The number of cycles that an instruction requires to execute is also in column 3 of Table 21. All instructions are
assumed to be executed from internal program memory (RAM) and internal data dual-access memory. The
cycle timings are for single-instruction execution, not for repeat mode.
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SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
instruction set summary (continued)
Table 19. TMS320x24x Opcode Symbols
SYMBOL
DESCRIPTION
A
Address
ACC
Accumulator
ACCB
Accumulator buffer
ARx
Auxiliary register value (0 −7)
BITx
4-bit field that specifies which bit to test for the BIT instruction
BMAR
Block-move address register
DBMR
Dynamic bit-manipulation register
I
Addressing-mode bit
II...II
Immediate operand value
INTM
Interrupt-mode flag bit
INTR#
Interrupt vector number
K
Constant
PREG
Product register
PROG
Program memory
RPTC
Repeat counter
SHF, SHFT
3/4-bit shift value
TC
Test-control bit
Two bits used by the conditional execution instructions to represent the conditions TC, NTC, and BIO.
T P Meaning
TP
66
00
01
10
11
BIO low
TC = 1
TC = 0
None of the above conditions
TREGn
Temporary register n (n = 0, 1, or 2)
ZLVC
4-bit field representing the following conditions:
Z:
ACC = 0
L:
ACC < 0
V:
Overflow
C:
Carry
A conditional instruction contains two of these 4-bit fields. The 4-LSB field of the instruction is a 4-bit mask field. A 1 in the
corresponding mask bit indicates that the condition is being tested. The second 4-bit field (bits 4 −7) indicates the state of
the conditions designated by the mask bits as being tested. For example, to test for ACC ≥ 0, the Z and L fields are set while
the V and C fields are not set. The next 4-bit field contains the state of the conditions to test. The Z field is set to indicate
testing of the condition ACC = 0, and the L field is reset to indicate testing of the condition ACC ≥ 0. The conditions possible
with these 8 bits are shown in the BCND and CC instructions. To determine if the conditions are met, the 4-LSB bit mask
is ANDed with the conditions. If any bits are set, the conditions are met.
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instruction set summary (continued)
Table 20. TMS320x24x Instruction Set Summary
x24x
MNEMONIC
ABS
ADD
OPCODE
WORDS/
CYCLES
MSB
Absolute value of accumulator
1/1
1011
1110
0000
0000
Add to accumulator with shift
1/1
0010
SHFT
IADD
RESS
Add to high accumulator
1/1
0110
0001
IADD
RESS
Add to accumulator short immediate
1/1
1011
1000
KKKK
KKKK
DESCRIPTION
LSB
Add to accumulator long immediate with shift
2/2
1011
1111
1001
SHFT
ADDC
Add to accumulator with carry
1/1
0110
0000
IADD
RESS
ADDS
Add to low accumulator with sign extension suppressed
1/1
0110
0010
IADD
RESS
ADDT
Add to accumulator with shift specified by T register
1/1
0110
0011
IADD
RESS
ADRK
Add to auxiliary register short immediate
1/1
0111
1000
KKKK
KKKK
AND with accumulator
1/1
0110
1110
IADD
RESS
AND
APAC
AND immediate with accumulator with shift
2/2
AND immediate with accumulator with shift of 16
2/2
Add P register to accumulator
1/1
B
Branch unconditionally
2/4
BACC
Branch to address specified by accumulator
1/4
BANZ
Branch on auxiliary register not zero
2/4/2
Branch if TC bit ≠ 0
2/4/2
Branch if TC bit = 0
2/4/2
Branch on carry
2/4/2
Branch if accumulator ≥ 0
2/4/2
Branch if accumulator > 0
2/4/2
Branch on I/O status low
2/4/3
Branch if accumulator ≤ 0
2/4/2
Branch if accumulator < 0
2/4/2
Branch on no carry
2/4/2
BCND
1011
1111
1011 SHFT
16-Bit Constant
1011
1110
1000
16-Bit Constant
1011
0111
1011
• HOUSTON, TEXAS 77251−1443
1110
0010
0000
1110
0001
0000
0000
Branch Address
1110
0010
0000
0000
Branch Address
1110
0011
0001
0001
Branch Address
1110
0011
1000
Branch Address
1110
0011
0000
0100
Branch Address
1110
0000
0000
0000
Branch Address
1110
0011
1100
Branch Address
0011
0100
1100
1100
0100
Branch Address
0011
0000
0001
Branch Address
1110
POST OFFICE BOX 1443
0100
1011 IADD RESS
Branch Address
1110
2/4/2
0000
1001 IADD RESS
Branch Address
0111
1110
Branch if no overflow
1110
0001
0011
0000
0010
Branch Address
67
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
instruction set summary (continued)
Table 20. TMS320x24x Instruction Set Summary (Continued)
x24x
MNEMONIC
WORDS/
CYCLES
DESCRIPTION
OPCODE
MSB
1110
Branch if accumulator ≠ 0
2/4/2
Branch on overflow
2/4/2
0000
1000
0011
0010
0010
Branch Address
1110
Branch if accumulator = 0
0011
Branch Address
1110
BCND
LSB
2/4/2
0011
1000
1000
Branch Address
BIT
Test bit
1/1
0100
BITx
IADD
RESS
BITT
Test bit specified by TREG
1/1
0110
1111
IADD
RESS
1000
IADD
RESS
Block move from data memory to data memory source immediate
2/3
Block move from data memory to data memory destination immediate
2/3
1010
BLDD†
Branch Address
1010
Block move from program memory to data memory
2/3
CALA
Call subroutine indirect
1/4
CALL
Call subroutine
CLRC
0101
IADD
RESS
1011
1110
0011
0000
0111
1010
IADD
RESS
2/4
Conditional call subroutine
RESS
Branch Address
Routine Address
1110
CC
IADD
Branch Address
1010
BLPD
1001
2/4/2
10TP
ZLVC
ZLVC
Routine Address
Configure block as data memory
1/1
1011
1110
0100
0100
Enable interrupt
1/1
1011
1110
0100
0000
Reset carry bit
1/1
1011
1110
0100
1110
Reset overflow mode
1/1
1011
1110
0100
0010
Reset sign-extension mode
1/1
1011
1110
0100
0110
Reset test / control flag
1/1
1011
1110
0100
1010
Reset external flag
1/1
1011
1110
0100
1100
CMPL
Complement accumulator
1/1
1011
1110
0000
0001
CMPR
Compare auxiliary register with auxiliary register AR0
1/1
1011
1111
0100
01CM
DMOV
Data move in data memory
1/1
0111
0111
IADD
RESS
IDLE
Idle until interrupt
1/1
1011
1110
0010
0010
1010
1111
IADD
RESS
IN
Input data from port
2/2
16BIT
I/O
PORT
ADRS
INTR
Software-interrupt
1/4
1011
1110
011K
KKKK
Load accumulator with shift
1/1
0001
SHFT
IADD
RESS
1111
1000
SHFT
Load accumulator long immediate with shift
2/2
1011
LACC
Zero low accumulator and load high accumulator
1/1
0110
† In x24x devices, the BLDD instruction does not work with memory-mapped registers IMR, IFR, and GREG.
68
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16-Bit Constant
1010
IADD
RESS
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
instruction set summary (continued)
Table 20. TMS320x24x Instruction Set Summary (Continued)
x24x
MNEMONIC
LACL
LACT
OPCODE
WORDS/
CYCLES
MSB
Load accumulator immediate short
1/1
1011
1001
KKKK
Zero accumulator
1/1
1011
1001
0000
0000
Zero low accumulator and load high accumulator
1/1
0110
1010
IADD
RESS
Zero low accumulator and load low accumulator with no sign extension
1/1
0110
1001
IADD
RESS
Load accumulator with shift specified by T register
1/1
0110
1011
IADD
RESS
Load auxiliary register
1/2
0000
0ARx
IADD
RESS
Load auxiliary register short immediate
1/2
1011
0ARx
KKKK
KKKK
1011
1111
0000
1ARx
DESCRIPTION
LAR
LSB
KKKK
Load auxiliary register long immediate
2/2
Load data-memory page pointer
1/2
0000
1101
IADD
RESS
Load data-memory page pointer immediate
1/2
1011
110P
AGEP
OINT
Load high-P register
1/1
0111
0101
IADD
RESS
Load status register ST0
1/2
0000
1110
IADD
RESS
Load status register ST1
1/2
0000
1111
IADD
RESS
LT
Load TREG
1/1
0111
0011
IADD
RESS
LTA
Load TREG and accumulate previous product
1/1
0111
0000
IADD
RESS
LTD
Load TREG, accumulate previous product, and move data
1/1
0111
0010
IADD
RESS
LTP
Load TREG and store P register in accumulator
1/1
0111
0001
IADD
RESS
LTS
Load TREG and subtract previous product
1/1
0111
0100
IADD
RESS
0010
IADD
RESS
MAC
Multiply and accumulate
2/3
MACD
Multiply and accumulate with data move
2/3
Load auxiliary register pointer
1/1
1000
Modify auxiliary register
1/1
Multiply (with TREG, store product in P register)
1/1
Multiply immediate
MPYA
MPYS
LDP
LPH
LST
16-Bit Constant
1010
16-Bit Constant
1010
0011
IADD
RESS
16-Bit Constant
1011
1000
1ARx
1000
1011
IADD
RESS
0101
0100
IADD
RESS
1/1
110C
KKKK
KKKK
KKKK
Multiply and accumulate previous product
1/1
0101
0000
IADD
RESS
Multiply and subtract previous product
1/1
0101
0001
IADD
RESS
MPYU
Multiply unsigned
1/1
0101
0101
IADD
RESS
NEG
Negate accumulator
1/1
1011
1110
0000
0010
NMI
Nonmaskable interrupt
1/4
1011
1110
0101
0010
NOP
No operation
1/1
1000
1011
0000
0000
NORM
Normalize contents of accumulator
1/1
1010
0000
IADD
RESS
OR with accumulator
1/1
0110
1101
IADD
RESS
1011
1111
1100
SHFT
MAR
MPY
OR
OR immediate with accumulator with shift
2/2
16-Bit Constant
1011
1110
1000
0010
OR immediate with accumulator with shift of 16
2/2
OUT
Output data to port
2/3
0000
16BIT
1100
I/O
IADD
PORT
RESS
ADRS
PAC
Load accumulator with P register
1/1
1011
1110
0000
0011
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16-Bit Constant
69
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
instruction set summary (continued)
Table 20. TMS320x24x Instruction Set Summary (Continued)
x24x
MNEMONIC
WORDS/
CYCLES
DESCRIPTION
OPCODE
MSB
LSB
POP
Pop top of stack to low accumulator
1/1
1011
1110
0011
0010
POPD
Pop top of stack to data memory
1/1
1000
1010
IADD
RESS
PSHD
Push data-memory value onto stack
1/1
0111
0110
IADD
RESS
PUSH
Push low accumulator onto stack
1/1
1011
1110
0011
1100
RET
Return from subroutine
1/4
1110
1111
0000
0000
RETC
Conditional return from subroutine
1/4/2
1110
11TP
ZLVC
ZLVC
ROL
Rotate accumulator left
1/1
1011
1110
0000
1100
ROR
Rotate accumulator right
1/1
1011
1110
0000
1101
Repeat instruction as specified by data-memory value
1/1
0000
1011
IADD
RESS
RPT
Repeat instruction as specified by immediate value
1/1
1011
1011
KKKK
KKKK
SACH
Store high accumulator with shift
1/1
1001
1SHF
IADD
RESS
SACL
Store low accumulator with shift
1/1
1001
0SHF
IADD
RESS
SAR
Store auxiliary register
1/1
1000
0ARx
IADD
RESS
SBRK
Subtract from auxiliary register short immediate
1/1
0111
1100
KKKK
KKKK
Set carry bit
1/1
1011
1110
0100
1111
Configure block as program memory
1/1
1011
1110
0100
0101
Disable interrupt
1/1
1011
1110
0100
0001
Set overflow mode
1/1
1011
1110
0100
0011
Set test / control flag
1/1
1011
1110
0100
1011
Set external flag XF
1/1
1011
1110
0100
1101
SETC
Set sign-extension mode
1/1
1011
1110
0100
0111
SFL
Shift accumulator left
1/1
1011
1110
0000
1001
SFR
Shift accumulator right
1/1
1011
1110
0000
1010
SPAC
Subtract P register from accumulator
1/1
1011
1110
0000
0101
SPH
Store high-P register
1/1
1000
1101
IADD
RESS
SPL
Store low-P register
1/1
1000
1100
IADD
RESS
SPM
Set P register output shift mode
1/1
1011
1111
IADD
RESS
SQRA
Square and accumulate
1/1
0101
0010
IADD
RESS
SQRS
Square and subtract previous product from accumulator
1/1
0101
0011
IADD
RESS
Store status register ST0
1/1
1000
1110
IADD
RESS
Store status register ST1
1/1
1000
1111
IADD
RESS
1010
1110
IADD
RESS
SST
SPLK
Store long immediate to data memory
2/2
Subtract from accumulator long immediate with shift
2/2
Subtract from accumulator with shift
1/1
0011
SHFT
Subtract from high accumulator
1/1
0110
Subtract from accumulator short immediate
1/1
1011
16-Bit Constant
1011
SUB
70
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1111
1010
SHFT
16-Bit Constant
IADD
RESS
0101
IADD
RESS
1010
KKKK
KKKK
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instruction set summary (continued)
Table 20. TMS320x24x Instruction Set Summary (Continued)
x24x
MNEMONIC
WORDS/
CYCLES
DESCRIPTION
OPCODE
MSB
LSB
SUBB
Subtract from accumulator with borrow
1/1
0110
0100
IADD
RESS
SUBC
Conditional subtract
1/1
0000
1010
IADD
RESS
SUBS
Subtract from low accumulator with sign extension suppressed
1/1
0110
0110
IADD
RESS
SUBT
Subtract from accumulator with shift specified by TREG
1/1
0110
0111
IADD
RESS
TBLR
Table read
1/3
1010
0110
IADD
RESS
TBLW
Table write
1/3
1010
0111
IADD
RESS
TRAP
Software interrupt
1/4
1011
1110
0101
0001
Exclusive-OR with accumulator
1/1
0110
1100
IADD
RESS
1111
1101
SHFT
Exclusive-OR immediate with accumulator with shift
2/2
Exclusive-OR immediate with accumulator with shift of 16
2/2
Zero low accumulator and load high accumulator with rounding
1/1
1011
XOR
16-Bit Constant
1011
ZALR
1110
1000
0011
16-Bit Constant
0110
1000
IADD
RESS
development support
Texas Instruments offers an extensive line of development tools for the x24x generation of DSPs, including tools
to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules.
The following products support development of x24x-based applications:
Software Development Tools:
Assembler/linker
Simulator
Optimizing ANSI C compiler
Application algorithms
C/Assembly debugger and code profiler
Hardware Development Tools:
Emulator XDS510t (supports x24x multiprocessor system debug)
See Table 21 and Table 22 for complete listings of development support tools for the x24x. For information on
pricing and availability, contact the nearest TI field sales office or authorized distributor.
To receive copies of TMS320 DSP literature, contact the Literature Response Center at 800/477−8924 or
contact the Product Information Center at the following web site:
http://www−k.ext.ti.com/sc/technical_support/product_information_centers.htm.
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development support (continued)
Table 21. Development Support Tools
DEVELOPMENT TOOL
PLATFORM
PART NUMBER
Software − Code Generation Tools
Assembler/Linker
C Compiler/Assembler/Linker
C Compiler/Assembler/Linker
PC, OS/2, Windows 3.x/Windows 95
TMDS3242850-02
PC, OS/2, Windows 3.x/Windows 95
TMDS3242855-02
Open Windows, HP9000, SPARC
TMDS3242555-08
Software − Simulation
C2xx Simulator
SPARC, Open Windows
TMDX324x551-09
Software − Emulation Debug Tools
Code Composer 4.10, Code Generation 7.0
TI C Source Debugger − WS
PC, Windows 3.x, OS/2
TMDS324012xx
SPARC, SunOS
TMDX324062xx
Hardware − Emulation Debug Tools
XDS510XL Board (ISA card), w/JTAG cable
XDS510PP Pod (Parallel Port) w/JTAG cable
XDS510WS Box w/JTAG cable
PC
TMDS00510
PC
TMDS00510PP
SPARC
TMDS00510WS
Table 22. TMS320x24x-Specific Development Tools
DEVELOPMENT TOOL
PLATFORM
PART NUMBER
Hardware − Evaluation/Starter Kits
TMS320LF2407 EVM
PC, Windows 95, Windows 98
TMDX3P701016
TMS320F240 EVM
PC, Windows 3.x
TMDX326P124X
TMS320F243 EVM
PC, Windows 95
TMDS3P604030
device and development-support tool nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP
devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS
(e.g., TMS320F243). Texas Instruments recommends two of three possible prefix designators for its support
tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from
engineering prototypes (TMX / TMDX) through fully qualified production devices/tools (TMS / TMDS).
Device development evolutionary flow:
TMX
Experimental device that is not necessarily representative of the final device’s electrical
specifications
TMP
Final silicon die that conforms to the device’s electrical specifications but has not completed
quality and reliability verification
TMS
Fully-qualified production device
PC and OS/2 are trademarks of International Business Machines Corp.
Windows is a registered trademark of Microsoft Corporation.
SPARC is a trademark of SPARC International, Inc.
SunOS is a trademark of Sun Microsystems, Inc.
XDS510XL, XDS510PP, and XDS510WS are trademarks of Texas Instruments.
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device and development-support tool nomenclature (continued)
Support tool development evolutionary flow:
TMDX
Development support product that has not yet completed Texas Instruments internal qualification
testing
TMDS
Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability
of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, FN, PG, and PGE) and temperature range (for example, L). Figure 16 provides a legend for
reading the complete device name for any TMS320x2xx family member.
TMS 320
F
243
PGE (L)
PREFIX
TMX = experimental device
TMP = prototype device
TMS = qualified device
TEMPERATURE RANGE (DEFAULT: 0°C TO 70°C)
L = 0°C to 70°C
A = −40°C to 85°C
S = −40°C to 125°C
PACKAGE TYPE†
FN = 68-pin PLCC
PG = 64-pin plastic QFP
PGE = 144-pin plastic LQFP
DEVICE FAMILY
320 = TMS320t DSP Family
DEVICE
24x DSP
TECHNOLOGY
C = CMOS
E = CMOS EPROM
F = Flash EEPROM
LC = Low-voltage CMOS (3.3 V)
VC = Low-voltage CMOS (3 V)
240
241
242
243‡
† PLCC = Plastic J-Leaded Chip Carrier
QFP = Quad Flatpack
LQFP = Low-Profile Quad Flatpack
‡ The package dimensions of the 243 device correspond to the LQFP package. This device was stated to be in QFP packaging
in previous data sheets. The package dimensions have not changed; only the package designation has changed.
Figure 16. TMS320x24x DSP Device Nomenclature
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documentation support
Extensive documentation supports all of the TMS320t DSP family generations of devices from product
announcement through applications development. The types of documentation available include: data sheets,
such as this document, with design specifications; complete user’s guides for all devices and development
support tools; and hardware and software applications.
A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal
processing research and education. The TMS320t DSP newsletter, Details on Signal Processing, is published
quarterly and distributed to update TMS320t DSP customers on product information.
Updated information on the TMS320t DSP controllers can be found at the Texas Instruments web site on the
Worldwide Web at: http://www.ti.com.
To send comments regarding the F243/F241 datasheet (SPRS064), use the [email protected] email
address, which is a repository for feedback. For questions and support, contact the Product Information Center
listed at the http://www−k.ext.ti.com/sc/technical_support/product−information−centers.htm site.
Silicon enhancements and errata pertaining to peripherals (such as CAN) are posted on the TI web site and
are updated as and when required.
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absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VDD‡ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Input clamp current IIK (VI < 0 or VI > VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA
Output clamp current IOK (VO < 0 or VO > VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA
Operating free-air temperature range, TA: L version(F243/F241) . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
A version(F243/F241) . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
S version(F241) . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ All voltage values are with respect to VSS.
recommended operating conditions§
VDD
VSS
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
IOH
High-level output current, VOH = 2.4 V
All outputs
IOL
Low-level output current, VOL = 0.7 V
All outputs
TA
MIN
NOM
MAX
4.5
5
5.5
Supply ground
Operating free-air temperature
0
UNIT
V
V
XTAL1/CLKIN
3
VDD + 0.3
All other inputs
2
VDD + 0.3
XTAL1/CLKIN
−0.3
0.7
All other inputs
−0.3
0.7
V
V
8
mA
8
mA
L version
0
70
A version
−40
85
S version
−40
125
°C
C
TFP
Flash programming on flash devices, temperature
−40
85
°C
§ Thermal resistance values, ΘJA (junction-to-ambient) and ΘJC (junction-to-case) for the F243/F241 can be found on the mechanical package
pages.
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electrical characteristics over recommended operating free-air temperature and voltage range
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
IOH = MAX = 8 mA
VOL
Low-level output voltage
IOL = MAX = 8 mA
II
IOZ
IDD†
Ci
Input current
MIN
TYP
MAX
2.4
V
0.7
Pins with pulldown
VIN = VDD
VIN = 0 V
Pins with pullup
VIN = VDD
VIN = 0 V
65
150
−5
All other input-only pins
−5
Output current, high-impedance
state (off-state)
VO = VDD or 0 V
−5
Supply current, operating mode
tc(CO) = 50 ns
350
5
−5
−350
UNIT
5
−150
1
243
120
241
90
Supply current, Idle 1 low-power
mode
LPM0 tc(CO) = 50 ns
55
Supply current, Idle 2 low-power
mode
LPM1 tc(CO) = 50 ns
30
Supply current, PLL/OSC
power-down mode
LPM2
−65
V
µA
A
µA
A
5
µA
5
µA
mA
mA
Input capacitance
5
mA
15
pF
Co
Output capacitance
15
pF
† In operating mode, the CPU is running a dummy code in B0 program memory. In all IDLE modes, the CPU is idle in B0 program memory.
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PARAMETER MEASUREMENT INFORMATION
IOL
Tester Pin
Electronics
Output
Under
Test
50 Ω
VLOAD
CT
IOH
Where:
IOL
IOH
VLOAD
CT
=
=
=
=
2 mA (all outputs)
300 µA (all outputs)
1.5 V
110-pF typical load-circuit capacitance
Figure 17. Test Load Circuit
signal transition levels
The data in this section is shown for the 5-V version. Note that some of the signals use different reference
voltages, see the recommended operating conditions table. TTL-output levels are driven to a minimum
logic-high level of 2.4 V and to a maximum logic-low level of 0.7 V.
Figure 18 shows the TTL-level outputs.
2.4 V (VOH)
80%
20%
0.7 V (VOL)
Figure 18. TTL-Level Outputs
TTL-output transition times are specified as follows:
D For a high-to-low transition, the level at which the output is said to be no longer high is below 80% of the
total voltage range and lower and the level at which the output is said to be low is 20% of the total voltage
range and lower.
D For a low-to-high transition, the level at which the output is said to be no longer low is 20% of the total voltage
range and higher and the level at which the output is said to be high is 80% of the total voltage range and
higher.
Figure 19 shows the TTL-level inputs.
2.0 V (VIH)
90%
10%
0.7 V (VIL)
Figure 19. TTL-Level Inputs
TTL-compatible input transition times are specified as follows:
D For a high-to-low transition on an input signal, the level at which the input is said to be no longer high is 90%
of the total voltage range and lower and the level at which the input is said to be low is 10% of the total voltage
range and lower.
D For a low-to-high transition on an input signal, the level at which the input is said to be no longer low is 10%
of the total voltage range and higher and the level at which the input is said to be high is 90% of the total
voltage range and higher.
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PARAMETER MEASUREMENT INFORMATION
timing parameter symbology
Timing parameter symbols used are created in accordance with JEDEC Standard 100. To shorten the symbols,
some of the pin names and other related terminology have been abbreviated as follows:
A
A[15:0]
MS
Memory strobe pins IS, DS, or PS
Cl
XTAL1/CLKIN
R
READY
CO
CLKOUT
RD
Read cycle or RD
D
D[15:0]
RS
RESET pin RS
INT
NMI, XINT1, XINT2
W
Write cycle or WE
Lowercase subscripts and their meanings:
Letters and symbols and their meanings:
a
access time
H
High
c
cycle time (period)
L
Low
d
delay time
V
Valid
f
fall time
X
Unknown, changing, or don’t care level
h
hold time
Z
High impedance
r
rise time
su
setup time
t
transition time
v
valid time
w
pulse duration (width)
general notes on timing parameters
All output signals from the F243/F241 devices (including CLKOUT) are derived from an internal clock such that
all output transitions for a given half-cycle occur with a minimum of skewing relative to each other.
The signal combinations shown in the following timing diagrams may not necessarily represent actual cycles.
For actual cycle examples, refer to the appropriate cycle description section of this data sheet.
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CLOCK CHARACTERISTICS AND TIMINGS
clock options
PARAMETER
PLL multiply-by-4
The F243/F241 devices include an on-chip PLL which is hardwired for multiply-by-4 operation. This requires
the use of a 5-MHz clock input frequency for 20-MHz device operation. This input clock can be provided from
either an external reference crystal or oscillator.
external reference crystal clock option
The internal oscillator is enabled by connecting a crystal across XTAL1/CLKIN and XTAL2 pins as shown in
Figure 20a. The crystal should be in fundamental operation and parallel resonant, with an effective series
resistance of 30 Ω and a power dissipation of 1 mW; it should be specified at a load capacitance of 20 pF.
external reference oscillator clock option
The internal oscillator is disabled by connecting a TTL-level clock signal to XTAL1/CLKIN and leaving the XTAL2
input pin unconnected as shown in Figure 20b.
XTAL1/CLKIN
C1
(see Note A)
XTAL2
Crystal
XTAL1/CLKIN
C2
(see Note A)
XTAL2
External
Clock Signal
(toggling 0 −5 V)
NC
NOTE A: For the values of C1 and C2, see the crystal manufacturer’s specification.
(a)
(b)
Figure 20. Recommended Crystal / Clock Connection
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external reference crystal/clock with PLL circuit enabled
The internal oscillator is enabled by connecting a crystal across XTAL1/CLKIN and XTAL2 pins as shown in
Figure 20a. The crystal should be in fundamental operation and parallel resonant, with an effective series
resistance of 30 Ω and a power dissipation of 1 mW; it should be specified at a load capacitance of 20 pF.
timings with the PLL circuit enabled
PARAMETER
fx
Input clock frequency
C1, C2
Load capacitance
MIN
TYP
MAX
UNIT
Oscillator
1
5
MHz
CLKIN
1
5
MHz
10
pF
switching characteristics over recommended operating conditions [H = 0.5 tc(CO)] (see Figure 21)
PARAMETER
CLOCK MODE
tc(CO)
Cycle time, CLKOUT
tf(CO)
tr(CO)
Fall time, CLKOUT
tw(COL)
tw(COH)
Pulse duration, CLKOUT low
tp
MIN
TYP
MAX
50
ns
4
Rise time, CLKOUT
ns
4
Pulse duration, CLKOUT high
Transition time, PLL synchronized after PLL enabled
UNIT
ns
H −3
H
H +3
ns
H −3
H
H +3
ns
2500tc(Cl)
ns
before PLL lock,
CLKIN multiply by 4
timing requirements (see Figure 21)
EXTERNAL REFERENCE
CRYSTAL
MIN
5 MHz
200
MAX
UNIT
tc(Cl)
Cycle time, XTAL1/CLKIN
tf(Cl)
tr(Cl)
Fall time, XTAL1/CLKIN
tw(CIL)
tw(CIH)
Pulse duration, XTAL1/CLKIN low as a percentage of tc(Cl)
40
Pulse duration, XTAL1/CLKIN high as a percentage of tc(Cl)
40
60
%
Rise time, XTAL1/CLKIN
ns
5
ns
5
ns
60
%
tc(CI)
tw(CIH)
tf(Cl)
tr(Cl)
tw(CIL)
XTAL1/CLKIN
tw(COH)
tc(CO)
tw(COL)
tr(CO)
tf(CO)
CLKOUT
Figure 21. CLKIN-to-CLKOUT Timing for PLL Oscillator Mode, Multiply-by-4 Option with 5-MHz Clock
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low-power mode timings
switching characteristics over recommended operating conditions [H = 0.5tc(CO)]
(see Figure 22 and Figure 23)
PARAMETER
LOW-POWER MODES
td(WAKE-A)
Delay time, CLKOUT switching to
IDLE1/IDLE2
program execution resume
td(IDLE-COH)
Delay time, Idle instruction
executed to CLKOUT high
td(WAKE-OSC)
Delay time, wakeup interrupt
asserted to oscillator running
td(IDLE-OSC)
Delay time, Idle instruction
executed to oscillator power off
td(EX)
Delay time, reset vector executed
after RS high
MIN
LPM0
LPM1
HALT
{PLL/OSC power down}
TYP
4 + 6 tc(CO)
LPM2
MAX
UNIT
15 × tc(CO)
ns
4tc(CO)
ns
OSC start-up
and PLL lock
time
ms
4tc(CO)
µs
36H
ns
td(WAKE−A)
A0−A15
CLKOUT
WAKE INT
Figure 22. Entry and Exit Timing − LPM0 and LPM1
td(EX)
A0−A15
td(IDLE−OSC)
td(IDLE−COH)
td(WAKE−OSC)
CLKOUT
ÁÁ
ÁÁ
RESET
Figure 23. HALT Mode − LPM2
NOTE: WAKE INT can be any valid interrupt or RESET
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RS timings
switching characteristics over recommended operating conditions for a reset [H = 0.5tc(CO)]
(see Figure 24)
PARAMETER
tw(RSL1)
MIN
Pulse duration, RS low†
td(EX)
Delay time, reset vector executed after RS high
† The parameter tw(RSL1) refers to the time RS is an output.
XTAL1/
CLKIN
td(EX)
tw(RSL1)
RS
CLKOUT
A0−A15
Figure 24. Watchdog Reset Pulse
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MAX
UNIT
8tc(CO)
ns
36H
ns
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
timing requirements for a reset [H = 0.5tc(CO)] (see Figure 25)
MIN
tw(RSL)
Pulse duration, RS low†
td(EX)
Delay time, reset vector executed after RS high
† The parameter tw(RSL) refers to the time RS is an input
MAX
UNIT
8H
ns
36H
ns
XTAL1/
CLKIN
td(EX)
tw(RSL) + x†
RS
CLKOUT
A0−A15
Case A. External reset after power-on
XTAL1/
CLKIN
td(EX)
tw(RSL) + x†
RS
CLKOUT
A0−A15
GPIO
Pins‡
Hi-Z Inputs
Defined by User Code
Case B. Power-on reset
† The value of x depends on the reset condition as follows: PLL enabled: Assuming CLKIN is stable, x=PLL lock-up time. If the internal oscillator
is used, x=oscillator lock-up time + PLL lock-up time. In case of resets after power on reset, x=0 (i.e., tw(RSL)=8H ns only).
‡ (All GPIO pins except CLKOUT and XF pins.) GPIO pins are undefined until XTAL1/CLKIN is valid. This behavior is important to consider while
using PWM pins for power-electronic circuits.
Figure 25. Reset Timing
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XF, BIO, and MP/MC timings
switching characteristics over recommended operating conditions (see Figure 26)
PARAMETER
td(XF)
Delay time, CLKOUT high to XF high/low
MIN
MAX
−3
7
MIN
MAX
UNIT
ns
timing requirements (see Figure 26)
tsu(BIO)CO
Setup time, BIO or MP/MC low before CLKOUT low
th(BIO)CO
Hold time, BIO or MP/MC low after CLKOUT low
ns
19
ns
CLKOUT
td(XF)
XF
tsu(BIO)CO
BIO,
MP/MC
Figure 26. XF and BIO Timing
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UNIT
0
th(BIO)CO
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
TIMING EVENT MANAGER INTERFACE
PWM timings
PWM refers to PWM outputs on PWM1, PWM2, PWM3, PWM4, PWM5, PWM6, T1PWM, and T2PWM.
switching characteristics over recommended operating conditions for PWM timing
[H = 0.5tc(CO)] (see Figure 27)
PARAMETER
tw(PWM)†
MIN
MAX
2H+5
Pulse duration, PWM output high/low
td(PWM)CO
Delay time, CLKOUT low to PWM output switching
† PWM outputs may be 100%, 0%, or increments of tc(CO) with respect to the PWM period.
UNIT
ns
15
ns
timing requirements‡ [H = 0.5tc(CO)] (see Figure 28)
MIN
tw(TMRDIR)
Pulse duration, TMRDIR low/high
tw(TMRCLK)
Pulse duration, TMRCLK low as a percentage of TMRCLK cycle time
twh(TMRCLK)
Pulse duration, TMRCLK high as a percentage of TMRCLK cycle time
MAX
4H+5
tc(TMRCLK)
Cycle time, TMRCLK
‡ Parameter TMRDIR is equal to the pin TDIR, and parameter TMRCLK is equal to the pin TCLKIN.
ns
40
60
40
60
4 × tc(CO)
UNIT
%
%
ns
CLKOUT
td(PWM)CO
tw(PWM)
PWMx
Figure 27. PWM Output Timing
CLKOUT
tw(TMRDIR)
TMRDIR
Figure 28. Capture/TMRDIR Timing
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SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
capture and QEP timings
CAP refers to CAP1/QEP0/IOPA3, CAP2/QEP1/IOPA4, and CAP3/IOPA5.
timing requirements [H = 0.5tc(CO)] (see Figure 29)
MIN
tw(CAP)
4H +15
Pulse duration, CAP input low/high
CLKOUT
tw(CAP)
CAPx
Figure 29. Capture Input and QEP Timing
86
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
MAX
UNIT
ns
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
interrupt timings
INT refers to NMI, XINT1, and XINT2/IO. PDP refers to PDPINT.
switching characteristics over recommended operating conditions (see Figure 30)
PARAMETER
MIN
thz(PWM)PDP
Delay time, PDPINT low to PWM to high-impedance state
td(INT)
Delay time, INT low/high to interrupt-vector fetch
MAX
12
10tc(CO)
UNIT
ns
ns
timing requirements [H = 0.5tc(CO)] (see Figure 30)
MIN
MAX
UNIT
tw(INT)
Pulse duration, INT input low/high
2H+15
ns
tw(PDP)
Pulse duration, PDPINT input low
4H+5
ns
CLKOUT
tw(PDP)
PDPINT
thz(PWM)PDP
PWM
tw(INT)
XINT1/XINT2/NMI
td(INT)
ADDRESS
Interrupt Vector
Figure 30. PDPINT and External Interrupt Timings
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
87
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
general-purpose input/output timings
switching characteristics over recommended operating conditions (see Figure 31)
PARAMETER
MIN
MAX
UNIT
td(GPO)CO
tr(GPO)
Delay time, CLKOUT low to GPIO low/high
All GPIOs
9
ns
Rise time, GPIO switching low to high
All GPIOs
8
ns
tf(GPO)
Fall time, GPIO switching high to low
All GPIOs
6
ns
timing requirements [H = 0.5tc(CO)] (see Figure 32)
MIN
tw(GPI)
2H+15
Pulse duration, GPI high/low
CLKOUT
td(GPO)CO
GPIO
tr(GPO)
tf(GPO)
Figure 31. General-Purpose Output Timing
CLKOUT
tw(GPI)
GPIO
Figure 32. General-Purpose Input Timing
88
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
MAX
UNIT
ns
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
0.5tc(SPC)M −10
0.5tc(SPC)M −10
Pulse duration, SPICLK low
(clock polarity = 1)
Pulse duration, SPICLK low
(clock polarity = 0)
Pulse duration, SPICLK high
(clock polarity = 1)
Delay time, SPICLK high to
SPISIMO valid (clock polarity = 0)
Delay time, SPICLK low to
SPISIMO valid (clock polarity = 1)
Valid time, SPISIMO data valid after
SPICLK low (clock polarity =0)
Valid time, SPISIMO data valid after
SPICLK high (clock polarity =1)
Setup time, SPISOMI before
SPICLK low (clock polarity = 0)
Setup time, SPISOMI before
SPICLK high (clock polarity = 1)
Valid time, SPISOMI data valid after
SPICLK low (clock polarity = 0)
Valid time, SPISOMI data valid after
SPICLK high (clock polarity = 1)
tw(SPCL)M
tw(SPCL)M
tw(SPCH)M
td(SPCH-SIMO)M
td(SPCL-SIMO)M
tv(SPCL-SIMO)M
tv(SPCH-SIMO)M
tsu(SOMI-SPCL)M
tsu(SOMI-SPCH)M
tv(SPCL-SOMI)M
tv(SPCH-SOMI)M
0.25tc(SPC)M −10
0.25tc(SPC)M −10
0
0
0.5tc(SPC)M −10
0.5tc(SPC)M −10
− 10
− 10
0.5tc(SPC)M −10
0.5tc(SPC)M −10
Pulse duration, SPICLK high
(clock polarity = 0)
tw(SPCH)M
4tc(CO)
Cycle time, SPICLK
tc(SPC)M
MIN
10
10
0.5tc(SPC)M
0.5tc(SPC)M
0.5tc(SPC)M
0.5tc(SPC)M
128tc(CO)
MAX
SPI WHEN (SPIBRR + 1) IS EVEN
OR SPIBRR = 0 OR 2
† The MASTER / SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is cleared.
‡ tc = system clock cycle time = 1/CLKOUT = tc(CO)
§ The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
9§
8§
5§
4§
3§
2§
1
NO.
5tc(CO)
MIN
0.5tc(SPC)M −0.5tc (CO)−10
0.5tc(SPC)M −0.5tc(CO) −10
0
0
0.5tc(SPC)M + 0.5tc(CO) −10
0.5tc(SPC)M + 0.5tc(CO) −10
− 10
− 10
0.5tc(SPC)M + 0.5tc (CO)−10
0.5tc(SPC)M + 0.5tc (CO)−10
0.5tc(SPC)M −0.5tc(CO) −10
127tc(CO)
MAX
10
10
0.5tc(SPC)M + 0.5tc(CO)
0.5tc(SPC)M + 0.5tc(CO)
0.5tc(SPC)M − 0.5tc(CO)
0.5tc(SPC)M −0.5tc(CO)
SPI WHEN (SPIBRR + 1)
IS ODD AND SPIBRR > 3
0.5tc(SPC)M −0.5tc(CO) −10
SPI master mode external timing parameters (clock phase = 0)†‡ (see Figure 33)
SPI master mode timing information is listed in the following tables.
SPI MASTER MODE TIMING PARAMETERS
ns
ns
ns
ns
ns
ns
ns
UNIT
-
-
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
89
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
PARAMETER MEASUREMENT INFORMATION
1
SPICLK
(clock polarity = 0)
2
3
SPICLK
(clock polarity = 1)
4
5
SPISIMO
Master Out Data Is Valid
8
9
SPISOMI
Master In Data
Must Be Valid
SPISTE†
† The SPISTE signal must be active before the SPI communication stream starts; the SPISTE signal must remain active
until the SPI communication stream is complete.
Figure 33. SPI Master Mode External Timing (Clock Phase = 0)
90
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
0.5tc(SPC)M −10
0.5tc(SPC)M −10
Pulse duration, SPICLK low
(clock polarity = 1)
Pulse duration, SPICLK low
(clock polarity = 0)
Pulse duration, SPICLK high
(clock polarity = 1)
tw(SPCH)M
tw(SPCL)M
tw(SPCL)M
tw(SPCH)M
0.5tc(SPC)M −10
Setup time, SPISIMO data
valid before SPICLK low
(clock polarity = 1)
Valid time, SPISIMO data
valid after SPICLK high
(clock polarity =0)
Valid time, SPISIMO data
valid after SPICLK low
(clock polarity =1)
Setup time, SPISOMI before
SPICLK high
(clock polarity = 0)
Setup time, SPISOMI before
SPICLK low
(clock polarity = 1)
Valid time, SPISOMI data
valid after SPICLK high
(clock polarity = 0)
Valid time, SPISOMI data
valid after SPICLK low
(clock polarity = 1)
tsu(SIMO-SPCL)M
tv(SPCH-SIMO)M
tv(SPCL-SIMO)M
tsu(SOMI-SPCH)M
tsu(SOMI-SPCL)M
tv(SPCH-SOMI)M
tv(SPCL-SOMI)M
0.25tc(SPC)M −10
0.25tc(SPC)M −10
0
0
0.5tc(SPC)M −10
0.5tc(SPC)M −10
Setup time, SPISIMO data
valid before SPICLK high
(clock polarity = 0)
tsu(SIMO-SPCH)M
0.5tc(SPC)M −10
0.5tc(SPC)M −10
0.5tc(SPC)M −10
Pulse duration, SPICLK high
(clock polarity = 0)
4tc(CO)
Cycle time, SPICLK
tc(SPC)M
MIN
0.5tc(SPC)M
0.5tc(SPC)M
0.5tc(SPC)M
0.5tc(SPC)M
128tc(CO)
MAX
SPI WHEN (SPIBRR + 1) IS EVEN
OR SPIBRR = 0 OR 2
† The MASTER / SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is set.
‡ tc = system clock cycle time = 1/CLKOUT = tc(CO)
§ The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
11§
10§
7§
6§
3§
2§
1
NO.
MIN
5tc(CO)
0.5tc(SPC)M −10
0.5tc(SPC)M −10
0
0
0.5tc(SPC)M −10
0.5tc(SPC)M −10
0.5tc(SPC)M −10
0.5tc(SPC)M − 10
0.5tc(SPC)M + 0.5tc(CO) −10
0.5tc(SPC)M + 0.5tc(CO) −10
0.5tc(SPC)M −0.5tc (CO)−10
127tc(CO)
MAX
0.5tc(SPC)M + 0.5tc(CO)
0.5tc(SPC)M + 0.5tc(CO)
0.5tc(SPC)M − 0.5tc(CO)
0.5tc(SPC)M − 0.5tc(CO)
SPI WHEN (SPIBRR + 1)
IS ODD AND SPIBRR > 3
0.5tc(SPC)M −0.5tc (CO)−10
SPI master mode external timing parameters (clock phase = 1)†‡ (see Figure 34)
ns
ns
ns
ns
ns
ns
ns
UNIT
-
-
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
91
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
PARAMETER MEASUREMENT INFORMATION
1
SPICLK
(Clock Polarity = 0)
2
3
SPICLK
(Clock Polarity = 1)
6
7
SPISIMO
Data Valid
Master Out Data Is Valid
10
11
Master In Data
Must Be Valid
SPISOMI
SPISTE†
† The SPISTE signal must be active before the SPI communication stream starts; the SPISTE signal must remain active until
the SPI communication stream is complete.
Figure 34. SPI Master Mode External Timing (Clock Phase = 1)
92
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
SPI SLAVE MODE TIMING PARAMETERS
Slave mode timing information is listed in the following tables.
SPI slave mode external timing parameters (clock phase = 0)†‡ (see Figure 35)
NO.
12
13§
14§
15§
MIN
Cycle time, SPICLK
tw(SPCL)S
tw(SPCL)S
Pulse duration, SPICLK low (clock polarity = 1)
Pulse duration, SPICLK low (clock polarity = 0)
0.5tc(SPC)S −10
0.5tc(SPC)S −10
tw(SPCH)S
Pulse duration, SPICLK high (clock polarity = 1)
0.5tc(SPC)S −10
td(SPCH-SOMI)S
Delay time, SPICLK high to SPISOMI valid
(clock polarity = 0)
0.375tc(SPC)S −10
td(SPCL-SOMI)S
Delay time, SPICLK low to SPISOMI valid (clock polarity = 1)
0.375tc(SPC)S −10
tv(SPCL-SOMI)S
Valid time, SPISOMI data valid after SPICLK low
(clock polarity =0)
0.75tc(SPC)S
tv(SPCH-SOMI)S
Valid time, SPISOMI data valid after SPICLK high
(clock polarity =1)
0.75tc(SPC)S
16§
19§
4tc(CO)‡
0.5tc(SPC)S −10
tc(SPC)S
tw(SPCH)S
tsu(SIMO-SPCL)S
tsu(SIMO-SPCH)S
Pulse duration, SPICLK high (clock polarity = 0)
UNIT
ns
0.5tc(SPC)S
0.5tc(SPC)S
ns
0.5tc(SPC)S
0.5tc(SPC)S
ns
ns
ns
Setup time, SPISIMO before SPICLK low (clock polarity = 0)
0
Setup time, SPISIMO before SPICLK high (clock polarity = 1)
0
tv(SPCL-SIMO)S
Valid time, SPISIMO data valid after SPICLK low
(clock polarity = 0)
0.5tc(SPC)S
tv(SPCH-SIMO)S
Valid time, SPISIMO data valid after SPICLK high
(clock polarity = 1)
0.5tc(SPC)S
20§
MAX
ns
ns
† The MASTER / SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is cleared.
‡ tc = system clock cycle time = 1/CLKOUT = tc(CO)
§ The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
93
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
PARAMETER MEASUREMENT INFORMATION
12
SPICLK
(Clock Polarity = 0)
13
14
SPICLK
(Clock Polarity = 1)
15
16
SPISOMI
SPISOMI Data Is Valid
19
20
SPISIMO
SPISIMO Data
Must Be Valid
SPISTE†
† The SPISTE signal must be active before the SPI communication stream starts; the SPISTE signal must remain active until
the SPI communication stream is complete.
Figure 35. SPI Slave Mode External Timing (Clock Phase = 0)
94
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
SPI slave mode external timing parameters (clock phase = 1)†‡ (see Figure 36)
NO.
12
13§
14§
17§
MIN
tc(SPC)S
tw(SPCH)S
Cycle time, SPICLK
tw(SPCL)S
tw(SPCL)S
Pulse duration, SPICLK low (clock polarity = 1)
tw(SPCH)S
tsu(SOMI-SPCH)S
Pulse duration, SPICLK high (clock polarity = 1)
tsu(SOMI-SPCL)S
Setup time, SPISOMI before SPICLK low (clock polarity = 1)
tv(SPCH-SOMI)S
Valid time, SPISOMI data valid after SPICLK high
(clock polarity =0)
0.75tc(SPC)S
tv(SPCL-SOMI)S
Valid time, SPISOMI data valid after SPICLK low
(clock polarity =1)
0.75tc(SPC)S
18§
21§
tsu(SIMO-SPCH)S
tsu(SIMO-SPCL)S
Pulse duration, SPICLK high (clock polarity = 0)
Pulse duration, SPICLK low (clock polarity = 0)
Setup time, SPISOMI before SPICLK high (clock polarity = 0)
UNIT
8tc(CO)
0.5tc(SPC)S −10
0.5tc(SPC)S −10
0.5tc(SPC)S
0.5tc(SPC)S
ns
0.5tc(SPC)S −10
0.5tc(SPC)S −10
0.5tc(SPC)S
0.5tc(SPC)S
ns
0.125tc(SPC)S
0.125tc(SPC)S
ns
ns
ns
Setup time, SPISIMO before SPICLK high (clock polarity = 0)
0
Setup time, SPISIMO before SPICLK low (clock polarity = 1)
0
tv(SPCH-SIMO)S
Valid time, SPISIMO data valid after SPICLK high
(clock polarity = 0)
0.5tc(SPC)S
tv(SPCL-SIMO)S
Valid time, SPISIMO data valid after SPICLK low
(clock polarity = 1)
0.5tc(SPC)S
22§
MAX
ns
ns
† The MASTER / SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is set.
‡ tc = system clock cycle time = 1/CLKOUT = tc(CO)
§ The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
95
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
PARAMETER MEASUREMENT INFORMATION
12
SPICLK
(Clock Polarity = 0)
13
14
SPICLK
(Clock Polarity = 1)
17
18
SPISOMI
SPISOMI Data Is Valid
Data Valid
21
22
SPISIMO
SPISIMO Data
Must Be Valid
SPISTE†
† The SPISTE signal must be active before the SPI communication stream starts; the SPISTE signal must remain active until
the SPI communication stream is complete.
Figure 36. SPI Slave Mode External Timing (Clock Phase = 1)
96
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
external memory interface read timings
switching characteristics over recommended operating conditions for an external memory
interface read (see Figure 37)
PARAMETER
MIN
MAX
UNIT
td(COL−CNTL)
Delay time, CLKOUT low to control valid
3
ns
td(COL−CNTH)
Delay time, CLKOUT low to control inactive
3
ns
td(COL−A)RD
Delay time, CLKOUT low to address valid
5
ns
td(COH−RDL)
Delay time, CLKOUT high to RD strobe active
4
ns
td(COL−RDH)
Delay time, CLKOUT low to RD strobe inactive high
0
ns
td(COL−SL)
Delay time, CLKOUT low to STRB strobe active low
3
ns
td(COL−SH)
Delay time, CLKOUT low to STRB strobe inactive high
3
ns
th(A)COL
Hold time, address valid after CLKOUT low
−4
ns
tsu(A)RD
Setup time, address valid before RD strobe active low
22
ns
th(A)RD
Hold time, address valid after RD strobe inactive high
−1
ns
−4
timing requirements [H = 0.5tc(CO)] (see Figure 37)
MIN
ta(A)
Access time, read data from address valid
tsu(D)RD
Setup time, read data before RD strobe inactive high
th(D)RD
Hold time, read data after RD strobe inactive high
th(AIV-D)
Hold time, read data after address invalid
POST OFFICE BOX 1443
MAX
2H−20
• HOUSTON, TEXAS 77251−1443
UNIT
ns
12
ns
0
ns
−3
ns
97
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
external memory interface read timings (continued)
CLKOUT
td(COL−CNTL)
td(COL−CNTH)
PS, DS, IS, BR
td(COL−A)RD
td(COL−A)RD
th(A)COL
th(A)COL
A[0:15]
td(COH−RDL)
td(COL−RDH)
ta(A)
td(COH−RDL)
td(COL−RDH)
th(A)RD
RD
th(AIV−D)
tsu(A)RD
ta(A)
tsu(D)RD
th(D)RD
tsu(D)RD
th(D)RD
D[0:15]
td(COL−SL)
td(COL−SH)
STRB
Figure 37. Memory Interface Read/Read Timings
98
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
external memory interface write timings
switching characteristics over recommended operating conditions for an external memory
interface write [H = 0.5tc(CO)] (see Figure 38)
PARAMETER
td(COH−CNTL)
Delay time, CLKOUT high to control valid
td(COH−CNTH)
Delay time, CLKOUT high to control inactive
MIN
MAX
UNIT
9
ns
9
ns
11
ns
Delay time, CLKOUT high to R/W low
6
ns
td(COH−RWH)
Delay time, CLKOUT high to R/W high
6
ns
td(COL−WL)
Delay time, CLKOUT low to WE strobe active low
−4
0
ns
td(COL−WH)
Delay time, CLKOUT low to WE strobe inactive high
−4
0
ns
ten(D)COL
Enable time, data bus driven from CLKOUT low
td(COL−SL)
Delay time, CLKOUT low to STRB active low
td(COL−SH)
Delay time, CLKOUT low to STRB inactive high
td(COH−A)W
Delay time, CLKOUT high to address valid
td(COH−RWL)
th(A)COHW
7
ns
3
ns
3
ns
Hold time, address valid after CLKOUT high
H−1
ns
tsu(A)W
Setup time, address valid before WE strobe active low
H−9
ns
tsu(D)W
Setup time, write data before WE strobe inactive high
2H−1
ns
ns
ns
th(D)W
Hold time, write data after WE strobe inactive high
3
tdis(W-D)
Disable time, data bus high impedance from WE high
4
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
99
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
external memory interface write timings (continued)
CLKOUT
td(COH−CNTL)
td(COH−CNTH)
td(COH−CNTL)
PS, DS, IS, BR
td(COH−A)W
th(A)COHW
A[0:15]
td(COH−RWL)
td(COH−RWH)
tsu(A)W
R/W
td(COL−WL)
td(COL−WH)
td(COL−WH)
td(COL−WL)
WE
tdis(W-D)
ten(D)COL
ten(D)COL
tsu(D)W
th(D)W
tsu(D)W
th(D)W
D[0:15]
td(COL−SL)
td(COL−SL)
td(COL−SH)
td(COL−SH)
STRB
ENA_144
VIS_CLK
2H
2H
VIS_OE
NOTE A: ENA_144 when low along with BVIS bits (10,9 set to 10 or 11) in register WSGR - IO@FFFFh, VIS_CLK and VIS_OE will be visible at
pins 31 (F243) and 126 (F243) respectively. VIS_CLK and VIS_OE indicate internal memory write cycles (program/data). During
VIS_OE cycles, the external bus will be driven. VIS_CLK is essentially CLKOUT, to be used along with VIS_OE for trace capabilities.
Figure 38. Address Visibility Mode
100
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
external memory interface ready-on-read timings
switching characteristics over recommended operating conditions for an external memory
interface ready-on-read (see Figure 39)
PARAMETER
td(COL−A)RD
MIN
MAX
5
Delay time, CLKOUT low to address valid
UNIT
ns
timing requirements for an external memory interface ready-on-read (see Figure 39)
MIN
th(RDY)COH
Hold time, READY after CLKOUT high
−5
tsu(D)RD
Setup time, read data before RD strobe inactive high
12
tv(RDY)ARD
Valid time, READY after address valid on read
tsu(RDY)COH
Setup time, READY before CLKOUT high
MAX
ns
ns
4
17
UNIT
ns
ns
CLKOUT
Wait Cycle
PS, DS, IS, BR
td(COL−A)RD
A[0:15]
RD
tsu(D)RD
D[0:15]
STRB
tv(RDY)ARD
th(RDY)COH
READY
tsu(RDY)COH
Figure 39. Ready-on-Read Timings
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
101
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
external memory interface ready-on-write timings
switching characteristics over recommended operating conditions for an external memory
interface ready-on-write (see Figure 40)
PARAMETER
td(COH−A)W
MIN
MAX
11
Delay time, CLKOUT high to address valid
UNIT
ns
timing requirements for an external memory interface ready-on-write [H = 0.5tc(CO)]
(see Figure 40)
MIN
th(RDY)COH
Hold time, READY after CLKOUT high
tsu(D)W
Setup time, write data before WE strobe inactive high
tv(RDY)AW
Valid time, READY after address valid on write
tsu(RDY)COH
Setup time, READY before CLKOUT high
Wait Cycle
PS, DS, IS, BR
td(COH−A)W
A[0:15]
WE
tsu(D)W
D[0:15]
STRB
tv(RDY)AW
tsu(RDY)COH
th(RDY)COH
READY
Figure 40. Ready-on-Write Timings
POST OFFICE BOX 1443
2H−1
17
CLKOUT
102
MAX
−5
• HOUSTON, TEXAS 77251−1443
UNIT
ns
2H
ns
4
ns
ns
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
10-bit dual analog-to-digital converter (ADC)
The 10-bit ADC has a separate power bus for its analog circuitry. These pins are referred to as VCCA and VSSA.
The power bus isolation is to enhance ADC performance by preventing digital switching noise of the logic
circuitry that can be present on VSS and VCC from coupling into the ADC analog stage. All ADC specifications
are given with respect to VSSA unless otherwise noted.
Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-bit (1024 values)
Monotonic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Assured
Output conversion mode . . . . . . . . . . . . . . . . . . . . . . . 000h to 3FFh (000h for VI ≤ VSSA; 3FFh for VI ≥ VCCA)
Conversion time (including sample time) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 µs
recommended operating conditions
MIN
VCCA
VSSA
Analog supply voltage
VREFHI
VREFLO
Analog supply reference source†
Analog ground reference source†
NOM
MAX
5
5.5
4.5
Analog ground
0
VREFLO
VSSA
VAI
Analog input voltage, ADCIN00−ADCIN07
VREFLO
† VREFHI and VREFLO must be stable, within ±1/2 LSB of the required resolution, during the entire conversion time.
UNIT
V
V
VCCA
V
VREFHI
VREFHI
V
V
ADC operating frequency
MIN
ADC operating frequency
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
MAX
UNIT
20
MHz
103
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
operating characteristics over recommended operating condition ranges†
PARAMETER
DESCRIPTION
MIN
Converting
ICCA
MAX
10
VCCA = 5.5 V
Non-converting
2
VCCA = VREFHI = 5.5 V
PLL or OSC power
down
1
Analog supply current
UNIT
Non-sampling
10
Sampling
30
mA
µA
Cai
Analog input capacitance
Typical capacitive load on
analog input pin
EDNL
Differential nonlinearity error
Difference between the actual step width and the ideal
value
±2
LSB‡
EINL
Integral nonlinearity error
Maximum deviation from the best straight line through
the ADC transfer characteristics, excluding the
quantization error
±2
LSB‡
td(PU)
Delay time, power-up to ADC valid
Time to stabilize analog stage after power-up
10
µs
ZAI
Analog input source impedance
Analog input source impedance for conversions to
remain within specifications
10
Ω
pF
† Absolute resolution = 4.89 mV. At VREFHI = 5 V and VREFLO = 0 V, this is one LSB. As VREFHI decreases, VREFLO increases, or both, the LSB size
decreases. Therefore, the absolute accuracy and differential/integral linearity errors in terms of LSBs increase.
‡ LSB denotes “Least Significant Bits”. For example, an error of 2 LSB corresponds to (2 * 4.89) = 9.78 mV.
ADC input pin circuit
One of the most common A/D application errors is inappropriate source impedance. In practice, minimum
source impedance should be used to limit the error as well as to minimize the required sampling time; however,
the source impedance must be smaller than ZAI. A typical ADC input pin circuit is shown in Figure 41.
Requiv
R1
VAI
VIN
R1 = 10 Ω Typical
Figure 41. Typical ADC Input Pin Circuit
104
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
(to ADCINx Input)
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
internal ADC module timings (see Figure 42)
MIN
tc(AD)
tw(SHC)
Cycle time, ADC prescaled clock
tw(SH)
tw(C)
Pulse duration, sample and hold time
td(SOC-SH)
td(EOC-FIFO)
Pulse duration, total sample/hold and conversion time†
Pulse duration, total conversion time
Delay time, start of conversion‡ to beginning of sample and hold
Delay time, end of conversion to data loaded into result FIFO
MAX
UNIT
50
ns
900
ns
3tc(AD)
10tc(AD)
ns
3tc(CO)
2tc(CO)
ns
ns
ns
td(ADCINT)
Delay time, ADC flag to ADC interrupt
2tc(CO)
ns
† The total sample/hold and conversion time is determined by the summation of td(SOC-SH), tw(SH), tw(C), and td(EOC-FIFO).
‡ Start of conversion is signaled by the ADCIMSTART bit (ADCTRL1.13) or the ADCSOC bit (ADCTRL1.0) set in software, the external start signal
active (ADCSOC), or internal EVSOC signal active.
tc(AD)
Bit Converted
9
8
7
6
5
4
3
2
1
0
ADC Clock
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Analog Input
tw(C)
EOC/Convert
tw(SH)
Internal Start/
Sample Hold
td(SOC−SH)
Start of Convert
td(EOC−FIFO)
tw(SHC)
td(ADCINT)
XFR to FIFO
Figure 42. Analog-to-Digital Internal Module Timing
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
105
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
flash EEPROM
switching characteristics over recommended operating conditions
F243/F241
PARAMETER
MIN
Program-erase endurance
Program pulses per word†
TYP
MAX
1
10
150
1
20
1000
10K
Erase pulses per array†
UNIT
Cycles
Pulses
Pulses
†
Flash-write pulses per array
1
20
6000 Pulses
† These parameters are used in the flash programming algorithms. For a detailed description of the algorithms, see the TMS320F20x/TMS320F24x
DSP Embedded Flash Memory Technical Reference (literature number SPRU282).
timing requirements
F243/F241
MIN
MAX
UNIT
td(BUSY)
Delay time, after mode deselect to stabilization†
10
µs
†
td(RD-VERIFY)
Delay time, verify read mode select to stabilization
10
µs
† These parameters are used in the flash programming algorithms. For a detailed description of the algorithms, see the TMS320F20x/TMS320F24x
DSP Embedded Flash Memory Technical Reference (literature number SPRU282).
programming operation
F243/F241
PARAMETER
MIN
NOM
MAX
UNIT
tw(PGM)
Pulse duration, programming algorithm†
95
100
105
µs
td(PGM-MODE)
Delay time, program mode select to stabilization†
10
µs
† These parameters are used in the flash programming algorithms. For a detailed description of the algorithms, see the TMS320F20x/TMS320F24x
DSP Embedded Flash Memory Technical Reference (literature number SPRU282).
erase operation
F243/F241
PARAMETER
MIN
NOM
MAX
UNIT
tw(ERASE)
Pulse duration, erase algorithm†
6.65
7
7.35
ms
td(ERASE-MODE)
Delay time, erase mode select to stabilization†
10
µs
† These parameters are used in the flash programming algorithms. For a detailed description of the algorithms, see the TMS320F20x/TMS320F24x
DSP Embedded Flash Memory Technical Reference (literature number SPRU282).
flash-write operation
F243/F241
PARAMETER
MIN
NOM
MAX
UNIT
tw(FLW)
Pulse duration, flash-write algorithm†
13.3
14
14.7
ms
td(FLW-MODE)
Delay time, flash-write mode select to stabilization†
10
µs
† These parameters are used in the flash programming algorithms. For a detailed description of the algorithms, see the TMS320F20x/TMS320F24x
DSP Embedded Flash Memory Technical Reference (literature number SPRU282).
106
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
register file compilation
Table 23 is a collection of all the programmable registers of the TMS320x24x (provided for a quick reference).
Table 23. Register File Compilation
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
DATA MEMORY SPACE
CPU STATUS REGISTERS
ARP
DP(7)
DP(6)
DP(5)
ARB
1
OV
OVM
1
INTM
DP(8)
DP(4)
DP(3)
DP(2)
DP(1)
DP(0)
CNF
TC
SXM
C
1
XF
1
1
ST0
ST1
1
1
PM
—
—
—
—
—
—
—
—
—
—
INT6 MASK
INT5 MASK
INT4 MASK
INT3 MASK
INT2 MASK
INT1 MASK
—
—
—
—
—
—
—
—
GLOBAL MEMORY AND CPU INTERRUPT REGISTERS
00004h
00005h
00006h
IMR
GREG
Global Data Memory Configuration Bits (7−0)
—
—
—
—
—
—
—
—
—
—
INT6 FLAG
INT5 FLAG
INT4 FLAG
INT3 FLAG
INT2 FLAG
INT1 FLAG
IRQ0.15
IRQ0.14
IRQ0.13
IRQ0.12
IRQ0.11
IRQ0.10
IRQ0.9
IRQ0.8
IRQ0.7
IRQ0.6
IRQ0.5
IRQ0.4
IRQ0.3
IRQ0.2
IRQ0.1
IRQ0.0
IRQ1.15
IRQ1.14
IRQ1.13
IRQ1.12
IRQ1.11
IRQ1.10
IRQ1.9
IRQ1.8
IRQ1.7
IRQ1.6
IRQ1.5
IRQ1.4
IRQ1.3
IRQ1.2
IRQ1.1
IRQ1.0
IFR
SYSTEM REGISTERS
07010h
07011h
07012h
to
07013h
07014h
07015h
IAK0.15
IAK0.14
IAK0.13
IAK0.12
IAK0.11
IAK0.10
IAK0.9
IAK0.8
IAK0.7
IAK0.6
IAK0.5
IAK0.4
IAK0.3
IAK0.2
IAK0.1
IAK0.0
IAK1.15
IAK1.14
IAK1.13
IAK1.12
IAK1.11
IAK1.10
IAK1.9
IAK1.8
IAK1.7
IAK1.6
IAK1.5
IAK1.4
IAK1.3
IAK1.2
IAK1.1
IAK1.0
—
CLKSRC
LPM1
LPM0
—
—
—
—
—
—
—
—
—
—
—
ILLADR
0701Fh
PIACKR1
SCSR
Illegal
DIN15
DIN14
DIN13
DIN12
DIN11
DIN10
DIN9
DIN8
DIN7
DIN6
DIN5
DIN4
DIN3
DIN2
DIN1
DIN0
V15
V14
V13
V12
V11
V10
V9
V8
V7
V6
V5
V4
V3
V2
V1
V0
0701Dh
0701Eh
PIACKR0
Illegal
07019h
to
0701Bh
0701Ch
PIRQR1
Illegal
07016h
to
07017h
07018h
PIRQR0
DINR
Illegal
PIVR
Illegal
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
107
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
register file compilation (continued)
Table 23. Register File Compilation (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
D3
D2
D1
D0
WDCNTR
D3
D2
D1
D0
WDKEY
WDCHK0
WDPS2
WDPS1
WDPS0
WDCR
ADCINTEN
ADCINTFLAG
WD CONTROL REGISTERS
07020h
to
07022h
07023h
Illegal
D7
D6
D5
D4
07024h
07025h
Illegal
D7
D6
D5
D4
07026h
to
07028h
07029h
Illegal
WDFLAG
WDDIS
WDCHK2
WDCHK1
0702Ah
to
07031h
Illegal
A-to-D MODULE CONTROL REGISTERS
07032h
SUSPENDSOFT
SUSPENDFREE
ADCEOC
ADCIMSTART
ADC2EN
ADC2CHSEL
ADCTRL1
ADCSOC
Illegal
—
07034h
IM
EVSOCP
EXTSOCP
—
ADCFIFO2
INTPRI
ADCEVSOC
ADCFIFO1
07035h
ADCEXTSOC
—
ADCTRL2
ADCPSCALE
Illegal
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
07037h
07038h
ADCCONRUN
ADC1CHSEL
07033h
07036h
ADC1EN
ADCFIFO1
Illegal
07039h
to
0703Fh
ADCFIFO2
Illegal
SERIAL PERIPHERAL INTERFACE (SPI) CONFIGURATION CONTROL REGISTERS
07040h
SPI SW
RESET
CLOCK
POLARITY
—
—
SPI
CHAR3
SPI
CHAR2
SPI
CHAR1
SPI
CHAR0
SPICCR
07041h
—
—
—
OVERRUN
INT ENA
CLOCK
PHASE
MASTER/
SLAVE
TALK
SPI INT
ENA
SPICTL
07042h
RECEIVER
OVERRUN
FLAG
SPI INT
FLAG
TX BUF
FULL FLAG
—
—
—
—
—
SPISTS
—
SPI BIT
RATE 6
SPI BIT
RATE 5
SPI BIT
RATE 4
SPI BIT
RATE 3
SPI BIT
RATE 2
SPI BIT
RATE 1
SPI BIT
RATE 0
SPIBRR
ERXB15
ERXB14
ERXB13
ERXB12
ERXB11
ERXB10
ERXB9
ERXB8
ERXB7
ERXB6
ERXB5
ERXB4
ERXB3
ERXB2
ERXB1
ERXB0
07043h
07044h
Illegal
07045h
07046h
108
Illegal
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPIRXEMU
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
register file compilation (continued)
Table 23. Register File Compilation (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
SERIAL PERIPHERAL INTERFACE (SPI) CONFIGURATION CONTROL REGISTERS (CONTINUED)
07047h
07048h
07049h
RXB15
RXB14
RXB13
RXB12
RXB11
RXB10
RXB9
RXB8
RXB7
RXB6
RXB5
RXB4
RXB3
RXB2
RXB1
RXB0
TXB15
TXB14
TXB13
TXB12
TXB11
TXB10
TXB9
TXB8
TXB7
TXB6
TXB5
TXB4
TXB3
TXB2
TXB1
TXB0
SDAT15
SDAT14
SDAT13
SDAT12
SDAT11
SDAT10
SDAT9
SDAT8
SDAT7
SDAT6
SDAT5
SDAT4
SDAT3
SDAT2
SDAT1
SDAT0
—
—
—
SPIPRI
SPIRXBUF
SPITXBUF
SPIDAT
0704Ah
Illegal
0704Eh
0704Fh
—
SPI
PRIORITY
SPI
SUSP SOFT
SPI
SUSP FREE
07050h
STOP
BITS
EVEN/ODD
PARITY
PARITY
ENABLE
LOOP BACK
ENA
ADDR/IDLE
MODE
SCI
CHAR2
SCI
CHAR1
SCI
CHAR0
SCICCR
07051h
—
RX ERR
INT ENA
SW RESET
—
TXWAKE
SLEEP
TXENA
RXENA
SCICTL1
07052h
BAUD15
(MSB)
BAUD14
BAUD13
BAUD12
BAUD11
BAUD10
BAUD9
BAUD8
SCIHBAUD
07053h
BAUD7
BAUD6
BAUD5
BAUD4
BAUD3
BAUD2
BAUD1
BAUD0
(LSB)
SCILBAUD
07054h
TXRDY
TX EMPTY
—
—
—
—
RX/BK
INT ENA
TX
INT ENA
SCICTL2
07055h
RX ERROR
RXRDY
BRKDT
FE
OE
PE
RXWAKE
—
SCIRXST
07056h
ERXDT7
ERXDT6
ERXDT5
ERXDT4
ERXDT3
ERXDT2
ERXDT1
ERXDT0
SCIRXEMU
07057h
RXDT7
RXDT6
RXDT5
RXDT4
RXDT3
RXDT2
RXDT1
RXDT0
SCIRXBUF
TXDT2
TXDT1
TXDT0
SCITXBUF
—
—
—
—
SERIAL COMMUNICATIONS INTERFACE (SCI) CONFIGURATION CONTROL REGISTERS
07058h
07059h
Illegal
TXDT7
TXDT6
TXDT5
TXDT4
0705Ah
to
0705Eh
0705Fh
TXDT3
Illegal
—
SCITX
PRIORITY
SCIRX
PRIORITY
SCI
SOFT
07060h
to
0706Fh
SCI
FREE
SCIPRI
Illegal
EXTERNAL INTERRUPT CONTROL REGISTERS
XINT1
FLAG
—
—
—
—
—
—
—
—
—
—
—
—
XINT1
POLARITY
XINT1
PRIORITY
XINT1
ENA
XINT2
FLAG
—
—
—
—
—
—
—
—
—
—
—
—
XINT2
POLARITY
XINT2
PRIORITY
XINT2
ENA
07070h
07071h
07072h
to
0708Fh
XINT1CR
XINT2CR
Illegal
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
109
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
register file compilation (continued)
Table 23. Register File Compilation (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
DIGITAL I/O CONTROL REGISTERS
07090h
CRA.15
CRA.14
CRA.13
CRA.12
CRA.11
CRA.10
CRA.9
CRA.8
CRA.7
CRA.6
CRA.5
CRA.4
CRA.3
CRA.2
CRA.1
CRA.0
—
—
—
—
—
—
CRB.9
CRB.8
CRB.7
CRB.6
CRB.5
CRB.4
CRB.3
CRB.2
CRB.1
CRB.0
07091h
07092h
Illegal
07093h
to
07097h
07098h
A7DIR
A6DIR
A5DIR
A4DIR
A3DIR
A2DIR
A1DIR
A0DIR
IOPA7
IOPA6
IOPA5
IOPA4
IOPA3
IOPA2
IOPA1
IOPA0
B7DIR
B6DIR
B5DIR
B4DIR
B3DIR
B2DIR
B1DIR
B0DIR
IOPB7
IOPB6
IOPB5
IOPB4
IOPB3
IOPB2
IOPB1
IOPB0
C7DIR
C6DIR
C5DIR
C4DIR
C3DIR
C2DIR
C1DIR
C0DIR
IOPC7
IOPC6
IOPC5
IOPC4
IOPC3
IOPC2
IOPC1
IOPC0
D7DIR
D6DIR
D5DIR
D4DIR
D3DIR
D2DIR
D1DIR
D0DIR
IOPD7
IOPD6
IOPD5
IOPD4
IOPD3
IOPD2
IOPD1
IOPD0
PBDATDIR
Illegal
0709Dh
0709Eh
PADATDIR
Illegal
0709Bh
0709Ch
OCRB
Illegal
07099h
0709Ah
OCRA
PCDATDIR
Illegal
0709Fh
Illegal
070A0h
to
070FFh
Illegal
PDDATDIR
CONTROLLER AREA NETWORK (CAN) CONFIGURATION CONTROL REGISTERS
07100h
07101h
07102h
07103h
07104h
07105h
07106h
07107h
07108h
110
—
—
—
—
—
—
—
—
MD3
MD2
ME5
ME4
ME3
ME2
ME1
ME0
TA5
TA4
TA3
TA2
AA5
AA4
AA3
AA2
TRS5
TRS4
TRS3
TRS2
TRR5
TRR4
TRR3
TRR2
RFP3
RFP2
RFP1
RFP0
RML3
RML2
RML1
RML0
RMP3
RMP2
RMP1
RMP0
OPC3
OPC2
OPC1
OPC0
—
—
SUSP
CCR
PDR
DBO
WUBA
CDR
ABO
STM
—
—
—
—
MBNR1
MBNR0
—
—
—
—
—
—
—
—
BRP7
BRP6
BRP5
BRP4
BRP3
BRP2
BRP1
BRP0
—
—
—
—
—
SBG
SJW1
SJW0
SAM
TSEG1−3
TSEG1−2
TSEG1−1
TSEG1−0
TSEG2−2
TSEG2−1
TSEG2−0
—
—
—
—
—
—
—
FER
BEF
SA1
CRCE
SER
ACKE
BO
EP
EW
—
—
—
—
—
—
—
—
—
—
SMA
CCE
PDA
—
RM
TM
TEC7
TEC6
TEC5
TEC4
TEC3
TEC2
TEC1
TEC0
REC7
REC6
REC5
REC4
REC3
REC2
REC1
REC0
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
MDER
TCR
RCR
MCR
BCR2
BCR1
ESR
GSR
CEC
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
register file compilation (continued)
Table 23. Register File Compilation (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
CONTROLLER AREA NETWORK (CAN) CONFIGURATION CONTROL REGISTERS (CONTINUED)
07109h
0710Ah
0710Bh
0710Ch
0710Dh
0710Eh
—
—
MIF5
MIF4
MIF3
MIF2
MIF1
MIF0
—
RMLIF
AAIF
WDIF
WUIF
BOIF
EPIF
WLIF
MIL
—
MIM5
MIM4
MIM3
MIM2
MIM1
MIM0
EIL
RMLIM
AAIM
WDIM
WUIM
BOIM
EPIM
WLIM
LAMI
—
—
LAM0−28
LAM0−27
LAM0−26
LAM0−25
LAM0−24
LAM0−23
LAM0−22
LAM0−21
LAM0−20
LAM0−19
LAM0−18
LAM0−17
LAM0−16
LAM0−15
LAM0−14
LAM0−13
LAM0−12
LAM0−11
LAM0−10
LAM0−9
LAM0−8
LAM0−7
LAM0−6
LAM0−5
LAM0−4
LAM0−3
LAM0−2
LAM0−1
LAM0−0
LAMI
—
—
LAM1−28
LAM1−27
LAM1−26
LAM1−25
LAM1−24
LAM1−23
LAM1−22
LAM1−21
LAM1−20
LAM1−19
LAM1−18
LAM1−17
LAM1−16
LAM1−15
LAM1−14
LAM1−13
LAM1−12
LAM1−11
LAM1−10
LAM1−9
LAM1−8
LAM1−7
LAM1−6
LAM1−5
LAM1−4
LAM1−3
LAM1−2
LAM1−1
LAM1−0
0710Fh
to
071FFh
CAN_IFR
CAN_IMR
LAM0_H
LAM0_L
LAM1_H
LAM1_L
Illegal
Message Object #0
07200h
07201h
07202h
IDL−15
IDL−14
IDL−13
IDL−12
IDL−11
IDL−10
IDL−9
IDL−8
IDL−7
IDL−6
IDL−5
IDL−4
IDL−3
IDL−2
IDL−1
IDL−0
IDE
AME
AAM
IDH−28
IDH−27
IDH−26
IDH−25
IDH−24
IDH−23
IDH−22
IDH−21
IDH−20
IDH−19
IDH−18
IDH−17
IDH−16
—
—
—
—
—
—
—
—
—
—
—
RTR
DLC3
DLC2
DLC1
DLC0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
IDL−15
IDL−14
IDL−13
IDL−12
IDL−11
IDL−10
IDL−9
IDL−8
IDL−7
IDL−6
IDL−5
IDL−4
IDL−3
IDL−2
IDL−1
IDL−0
07203h
07204h
07205h
07206h
07207h
MSGID0L
MSGID0H
MSGCTRL0
Reserved
MBX0A
MBX0B
MBX0C
MBX0D
Message Object #1
07208h
07209h
0720Ah
IDE
AME
AAM
IDH−28
IDH−27
IDH−26
IDH−25
IDH−24
IDH−23
IDH−22
IDH−21
IDH−20
IDH−19
IDH−18
IDH−17
IDH−16
—
—
—
—
—
—
—
—
—
—
—
RTR
DLC3
DLC2
DLC1
DLC0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0720Bh
0720Ch
0720Dh
MSGID1L
MSGID1H
MSGCTRL1
Reserved
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
MBX1A
MBX1B
111
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
register file compilation (continued)
Table 23. Register File Compilation (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
CONTROLLER AREA NETWORK (CAN) CONFIGURATION CONTROL REGISTERS (CONTINUED)
0720Eh
0720Fh
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
IDL−15
IDL−14
IDL−13
IDL−12
IDL−11
IDL−10
IDL−9
IDL−8
IDL−7
IDL−6
IDL−5
IDL−4
IDL−3
IDL−2
IDL−1
IDL−0
MBX1C
MBX1D
Message Object #2
07210h
07211h
07212h
IDE
AME
AAM
IDH−28
IDH−27
IDH−26
IDH−25
IDH−24
IDH−23
IDH−22
IDH−21
IDH−20
IDH−19
IDH−18
IDH−17
IDH−16
—
—
—
—
—
—
—
—
—
—
—
RTR
DLC3
DLC2
DLC1
DLC0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
07213h
07214h
07215h
07216h
07217h
MSGID2L
MSGID2H
MSGCTRL2
Reserved
MBX2A
MBX2B
MBX2C
MBX2D
Message Object #3
07218h
07219h
0721Ah
IDL−15
IDL−14
IDL−13
IDL−12
IDL−11
IDL−10
IDL−9
IDL−8
IDL−7
IDL−6
IDL−5
IDL−4
IDL−3
IDL−2
IDL−1
IDL−0
IDE
AME
AAM
IDH−28
IDH−27
IDH−26
IDH−25
IDH−24
IDH−23
IDH−22
IDH−21
IDH−20
IDH−19
IDH−18
IDH−17
IDH−16
—
—
—
—
—
—
—
—
—
—
—
RTR
DLC3
DLC2
DLC1
DLC0
0721Bh
0721Ch
0721Dh
0721Eh
0721Fh
MSGID3L
MSGID3H
MSGCTRL3
Reserved
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
IDL−15
IDL−14
IDL−13
IDL−12
IDL−11
IDL−10
IDL−9
IDL−8
IDL−7
IDL−6
IDL−5
IDL−4
IDL−3
IDL−2
IDL−1
IDL−0
MBX3A
MBX3B
MBX3C
MBX3D
Message Object #4
07220h
07221h
112
IDE
AME
AAM
IDH−28
IDH−27
IDH−26
IDH−25
IDH−24
IDH−23
IDH−22
IDH−21
IDH−20
IDH−19
IDH−18
IDH−17
IDH−16
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
MSGID4L
MSGID4H
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
register file compilation (continued)
Table 23. Register File Compilation (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
CONTROLLER AREA NETWORK (CAN) CONFIGURATION CONTROL REGISTERS (CONTINUED)
07222h
—
—
—
—
—
—
—
—
—
—
—
RTR
DLC3
DLC2
DLC1
DLC0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
IDL−15
IDL−14
IDL−13
IDL−12
IDL−11
IDL−10
IDL−9
IDL−8
IDL−7
IDL−6
IDL−5
IDL−4
IDL−3
IDL−2
IDL−1
IDL−0
07223h
07224h
07225h
07226h
07227h
MSGCTRL4
Reserved
MBX4A
MBX4B
MBX4C
MBX4D
Message Object #5
07228h
07229h
0722Ah
IDE
AME
AAM
IDH−28
IDH−27
IDH−26
IDH−25
IDH−24
IDH−23
IDH−22
IDH−21
IDH−20
IDH−19
IDH−18
IDH−17
IDH−16
—
—
—
—
—
—
—
—
—
—
—
RTR
DLC3
DLC2
DLC1
DLC0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0722Bh
0722Ch
0722Dh
0722Eh
0722Fh
MSGID5L
MSGID5H
MSGCTRL5
Reserved
07230h
to
073FFh
MBX5A
MBX5B
MBX5C
MBX5D
Illegal
GENERAL-PURPOSE (GP) TIMER CONFIGURATION CONTROL REGISTERS
07400h
07401h
07402h
07403h
07404h
07405h
—
T2STAT
T1TOADC(0)
TCOMPOE
T1STAT
—
T2TOADC
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
—
T1TOADC(1)
T2PIN
GPTCON
T1PIN
FREE
SOFT
—
TMODE1
TMODE0
TPS2
TPS1
TPS0
TSWT1
TENABLE
TCLKS1
TCLKS0
TCLD1
TCLD0
TECMPR
SELT1PR
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
T1CNT
T1CMPR
T1PR
T1CON
T2CNT
113
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
register file compilation (continued)
Table 23. Register File Compilation (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
GENERAL-PURPOSE (GP) TIMER CONFIGURATION CONTROL REGISTERS (CONTINUED)
07406h
07407h
07408h
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
FREE
SOFT
—
TMODE1
TMODE0
TPS2
TPS1
TPS0
TSWT1
TENABLE
TCLKS1
TCLKS0
TCLD1
TCLD0
TECMPR
SELT1PR
07409h
to
07410h
T2CMPR
T2PR
T2CON
Illegal
FULL AND SIMPLE COMPARE UNIT REGISTERS
07411h
CENABLE
CLD1
CLD0
SVENABLE
ACTRLD1
ACTRLD0
FCOMPOE
—
—
—
—
—
—
—
—
—
07412h
07413h
Illegal
SVRDIR
D2
D1
D0
CMP6ACT1
CMP6ACT0
CMP5ACT1
CMP5ACT0
CMP4ACT1
CMP4ACT0
CMP3ACT1
CMP3ACT0
CMP2ACT1
CMP2ACT0
CMP1ACT1
CMP1ACT0
—
—
—
—
DBT3
DBT2
DBT1
DBT0
EDBT3
EDBT2
EDBT1
DBTPS2
DBTPS1
DBTPS0
—
—
07414h
07415h
07418h
07419h
ACTR
Illegal
07416h
07417h
COMCON
DBTCON
Illegal
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
CAP3TSEL
CAP12TSEL
0741Ah
to
0741Fh
CMPR1
CMPR2
CMPR3
Illegal
CAPTURE UNIT REGISTERS
CAPRES
07420h
CAPQEPN
CAP3EN
CAP1EDGE
CAP2EDGE
—
CAP3FIFO
07421h
07422h
07423h
07424h
07425h
07426h
114
—
CAP3TOADC
CAP3EDGE
—
CAP2FIFO
CAP1FIFO
CAPCON
Illegal
—
—
—
—
—
—
—
—
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Illegal
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
CAPFIFO
CAP1FIFO
CAP2FIFO
CAP3FIFO
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
register file compilation (continued)
Table 23. Register File Compilation (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
CAPTURE UNIT REGISTERS (CONTINUED)
07427h
07428h
07429h
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0742Ah
to
0742Bh
CAP1FBOT
CAP2FBOT
CAP3FBOT
Illegal
EVENT MANAGER (EV) INTERRUPT CONTROL REGISTERS
0742Ch
0742Dh
0742Eh
0742Fh
07430h
07431h
—
—
—
—
—
T1OFINT
ENA
T1UFINT
ENA
T1CINT
ENA
T1PINT
ENA
—
—
—
CMP3INT
ENA
CMP2INT
ENA
CMP1INT
ENA
PDPINT
ENA
—
—
—
—
—
—
—
—
T2UFINT
ENA
T2CINT
ENA
T2PINT
ENA
—
—
—
—
T2OFINT
ENA
—
—
—
—
—
—
—
—
CAP2INT
ENA
CAP1INT
ENA
—
—
—
—
—
CAP3INT
ENA
—
—
—
—
—
T1OFINT
FLAG
T1UFINT
FLAG
T1CINT
FLAG
T1PINT
FLAG
—
—
—
CMP3INT
FLAG
CMP2INT
FLAG
CMP1INT
FLAG
PDPINT
FLAG
—
—
—
—
—
—
—
—
T2UFINT
FLAG
T2CINT
FLAG
T2PINT
FLAG
—
—
—
—
T2OFINT
FLAG
—
—
—
—
—
—
—
—
—
CAP3INT
FLAG
CAP2INT
FLAG
CAP1INT
FLAG
—
—
—
—
07432h
to
0743Fh
EVIMRA
EVIMRB
EVIMRC
EVIFRA
EVIFRB
EVIFRC
Illegal
I/O MEMORY SPACE
FLASH CONTROL MODE REGISTER
FF0Fh
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BVIS.1
BVIS.0
ISWS.2
ISWS.1
ISWS.0
DSWS.2
DSWS.1
DSWS.0
PSWS.2
PSWS.1
PSWS.0
FCMR
WAIT-STATE GENERATOR CONTROL REGISTER
0FFFFh
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
WSGR
115
SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006
MECHANICAL DATA
Table 24, Table 25, and Table 26 show the thermal data.
The mechanical package diagram(s) that follow the tables reflect the most current released mechanical data
available for the designated device(s).
Table 24. Typical Thermal Resistance Characteristics for PGE Package
PARAMETER
DESCRIPTION
°C / W
ΘJA
Junction-to-ambient
35
ΘJC
Junction-to-case
8.5
Table 25. Typical Thermal Resistance Characteristics for FN Package
PARAMETER
DESCRIPTION
°C / W
ΘJA
Junction-to-ambient
48
ΘJC
Junction-to-case
11
Table 26. Typical Thermal Resistance Characteristics for PG Package
116
PARAMETER
DESCRIPTION
°C / W
ΘJA
Junction-to-ambient
35
ΘJC
Junction-to-case
11
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
PACKAGE OPTION ADDENDUM
www.ti.com
5-Mar-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TMS320F241FN
NRND
PLCC
FN
68
18
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168HR
TMS320F241FNA
NRND
PLCC
FN
68
18
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168HR
TMS320F241FNS
NRND
PLCC
FN
68
18
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168HR
TMS320F241PG
NRND
QFP
PG
64
66
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72HR
TMS320F241PGA
NRND
QFP
PG
64
66
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72HR
TMS320F241PGS
NRND
QFP
PG
64
66
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72HR
TMS320F243PGE
NRND
LQFP
PGE
144
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TMS320F243PGEA
NRND
LQFP
PGE
144
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TMS320F243PGES
NRND
LQFP
PGE
144
TBD
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPLC004A – OCTOBER 1994
FN (S-PQCC-J**)
PLASTIC J-LEADED CHIP CARRIER
20 PIN SHOWN
Seating Plane
0.004 (0,10)
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
D
D1
0.020 (0,51) MIN
3
1
19
0.032 (0,81)
0.026 (0,66)
4
E
18
D2 / E2
E1
D2 / E2
8
14
0.021 (0,53)
0.013 (0,33)
0.007 (0,18) M
0.050 (1,27)
9
13
0.008 (0,20) NOM
D/E
D2 / E2
D1 / E1
NO. OF
PINS
**
MIN
MAX
MIN
MAX
MIN
MAX
20
0.385 (9,78)
0.395 (10,03)
0.350 (8,89)
0.356 (9,04)
0.141 (3,58)
0.169 (4,29)
28
0.485 (12,32)
0.495 (12,57)
0.450 (11,43)
0.456 (11,58)
0.191 (4,85)
0.219 (5,56)
44
0.685 (17,40)
0.695 (17,65)
0.650 (16,51)
0.656 (16,66)
0.291 (7,39)
0.319 (8,10)
52
0.785 (19,94)
0.795 (20,19)
0.750 (19,05)
0.756 (19,20)
0.341 (8,66)
0.369 (9,37)
68
0.985 (25,02)
0.995 (25,27)
0.950 (24,13)
0.958 (24,33)
0.441 (11,20)
0.469 (11,91)
84
1.185 (30,10)
1.195 (30,35)
1.150 (29,21)
1.158 (29,41)
0.541 (13,74)
0.569 (14,45)
4040005 / B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL DATA
MQFP008 – JULY 1998
PG (R-PQFP-G64)
PLASTIC QUAD FLATPACK
0,45
0,25
1,00
51
0,20 M
33
52
32
12,00 TYP
64
14,20
13,80
18,00
17,20
20
1
19
0,15 NOM
18,00 TYP
20,20
19,80
24,00
23,20
Gage Plane
0,25
0,10 MIN
2,70 TYP
0°– 10°
1,10
0,70
Seating Plane
3,10 MAX
0,10
4040101 / B 03/95
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Contact field sales office to determine if a tighter coplanarity requirement is available for this package.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL DATA
MTQF017A – OCTOBER 1994 – REVISED DECEMBER 1996
PGE (S-PQFP-G144)
PLASTIC QUAD FLATPACK
108
73
109
72
0,27
0,17
0,08 M
0,50
144
0,13 NOM
37
1
36
Gage Plane
17,50 TYP
20,20 SQ
19,80
22,20
SQ
21,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040147 / C 10/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
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