MT9M112 1/4-Inch, 1.3 Megapixel CMOS Image Sensor System-on-Chip Features ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● DigitalClarity™ CMOS imaging technology VDD power disable switch for reduced standby current On-die phase lock loop (PLL) Programmable I/O slew rate 2 x 2 pixel binning Simple two-wire serial programming interface ITU-R BT.656 (YCbCr), 565RGB, 555RGB, or 444RGB formats (progressive scan) System-on-chip (SOC)—a completely integrated camera system Ultra low-power, low-cost, progressive scan CMOS image sensor 1.3-megapixel resolution (1,280H x 1,024V) 1/4-inch optical format 15 frames per second (fps) at full resolution Superior low-light performance On-die image flow processor performs sophisticated processing: color recovery and correction, sharpening, gamma, lens shading correction, and on-the-fly defect correction Mechanical shutter support Filtered image downscaling to arbitrary size with smooth, continuous zoom and pan Getting the Picture…in Style Mobile applications with small form factors are in demand, and not surprisingly, customers are expecting to find more features in their new slimmer, sleeker cell phones. They want to snap a photo at the family picnic or capture a good time with friends at a party. The 1/4-inch, 1.3-megapixel SOC image sensor opens the door to slim designs that take great pictures. Its specially engineered microlenses produce high-quality images and enable low-profile camera modules. Focused on Design The MT9M112 is a fully integrated system-on-chip (SOC) sensor, incorporating additional logic on the device that simplifies the camera module design, related manufacturing processes, system integration, power management, and component count. It incorporates sophisticated camera functions on-chip and is programmable through a simple two-wire serial interface. This yields more space and makes the sensor easier to design with. Additionally, this device enables mobile phone manufacturers to simply upgrade their existing 1/4-inch VGA cameras to 1/4inch megapixel cameras, occupying the same height and footprint. Enhanced Capabilities The device features 2 x 2 pixel binning, programmable input/output slew rate, mechanical shutter support, and continuous, smooth zoom and pan, as well as day and night mode configurations. It has threechannel gamma correction, lens shading correction, and color correction. The camera control sequencer automates the camera’s flash and video clip snapshots. The device also has an on-board PLL and supports pixel binning as an enhanced form of image size reduction. You Get a Complete Solution The MT9M112 is sure to improve your designs, as will working with Micron. In addition to high-quality products, you’ll also get the added advantages of doing business with a top-tier supplier: advanced technology, worldwide facilities, technical expertise, and sales support—a superior solution from an industry leader. Samples for this device are available now, and production will commence in December of 2005. For more information or to order the MT9M112, call your Micron Imaging representative or visit Micron’s Web site at www.micron.com/imaging. MT9M112 Specifications ● ● ● ● ● ● ● ● ● Pixel Size: 2.8µm x 2.8µm Active Imager Size: 3.6mm (H) x 2.9mm (V) 4.59mm Diagonal Active Pixels: 1,280H x 1,024V Color Filter Array: RGB Bayer pattern Shutter: Electronic rolling shutter (ERS) Automatic Functions: On-the-fly defect correction, exposure, white balance, black reference, flicker avoidance, and color saturation Max Data Rate/ Master Clock: 27 MPS/54 MHz Frame Rate: 15 fps @ full resolution, 30 fps in preview mode (640 x 512) ADC: ● ● Signal-to-Noise Ratio: 44dB (MAX) Supply Voltage: Digital I/O: 1.7V–3.1V Digital Core: 1.7V–1.9V (1.8V nominal) Analog: 2.5V_3.1V (2.8V nominal) ● Window Size: Arbitrary (including VGA, QVGA, CIF, QCIF) Power Consumption: 160mW at 1.8V, 15 fps SXGA 90mW at 1.8V, 30 fps VGA binning enabled Flash Support: Xenon and LED Operating Temp. Range: -30°C to +70°C Package: Die ● ● ● 10 bit, on-chip Responsivity: 68dB ● ● ● Dynamic Range: 1.0 V/lux-sec (550nm) Block Diagram Sensor Core SCLK SDATA ● ● ● ● ● RESET# ● CLK_IN ● STANDBY ● VDD_DIS 1,280H x 1,024V 1/4-inch optical format Auto black compensation Programmable analog gain Programmable exposure 10-bit ADC H/W context switch to/from preview Bayer RGB output SRAM Line Buffers Pixel Data Control Bus Timing and Control (Two-Wire Serial I/F Transactions) Image Data Control Bus GP1O-GP13 (Two-Wire Serial I/F Transactions) + Sensor Control (gains, shutter, etc.) Image Flow Processor Camera Control VDDPLL/PLLGND ● VDDQ/DGND ● VDD /DGND ● VAA /AGND ● VAAPIX Auto exposure Auto white balance Flicker detect/avoid Camera control (snapshots, flash, video, clip) www.micron.com Products are warranted only to meet Micron’s production data sheet specifications. Products and specifications are subject to change without notice. Micron, the Micron logo, and DigitalClarity are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. ©2005 Micron Technology, Inc. All rights reserved. 08/08/05 EN.L Control Bus (Two-Wire Serial I/F Trans.) Image Flow Processor Color Pipe ● ● ● ● Image Data ● ● ● Lens shading correction Color interpolation Filtered resize and zoom Defect correction Color correction Gamma correction Color conversion + formatting DOUT 0 – DOUT 7 PIXCLK FRAME_VALID LINE_VALID FLASH STROBE