PHILIPS SAA4978H

INTEGRATED CIRCUITS
DATA SHEET
SAA4978H
Picture Improved Combined
Network (PICNIC)
Product specification
Supersedes data of 1998 Oct 07
File under Integrated Circuits, IC02
1999 May 03
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
QUICK REFERENCE DATA
4
ORDERING INFORMATION
5
BLOCK DIAGRAM
6
PINNING INFORMATION
7
FUNCTIONAL DESCRIPTION
7.1
7.1.1
Analog input blocks
Gain elements for automatic gain control (9 dB
range)
Clamp circuit, clamping Y to digital level 32 and
UV to 0 (2’s complement)
Analog anti-aliasing prefilter
9-bit analog-to-digital conversion
Digital processing blocks
Overflow detection
Y delay
Transient noise suppression
Non-linear phase filter after ADC
4 MHz notch
Digital clamp correction for UV
4 : 4 : 4 downsampled to 4 : 2 : 2 or 4 : 1 : 1
Bus A format: interface formatting, timed with
enabling signal (see Table 1 and Fig.9)
Bus B format (see Table 1 and Fig.9)
Time base correction and sample rate
conversion
Noise reduction
Histogram
Subtitle detection
Black bar detection
Bus C format (see Table 1)
Bus D reformatter: the various input formats
are all converted to the internal 9 bits 4 : 2 : 2
(see Table 1)
Peaking
Non-linear phase filter before DAC
DCTI
Border blank
Analog output blocks
Triple 10-bit digital-to-analog conversion
Analog anti-aliasing post-filter
PLL
SNERT
PSP
Microcontroller
Board level testability
Power-on reset
7.1.2
7.1.3
7.1.4
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.2.6
7.2.7
7.2.8
7.2.9
7.2.10
7.2.11
7.2.12
7.2.13
7.2.14
7.2.15
7.2.16
7.2.17
7.2.18
7.2.19
7.2.20
7.3
7.3.1
7.3.2
7.3.3
7.3.4
7.3.5
7.3.6
7.3.7
7.3.8
1999 May 03
2
SAA4978H
8
CONTROL REGISTER DESCRIPTION
9
LIMITING VALUES
10
THERMAL CHARACTERISTICS
11
CHARACTERISTICS
12
APPLICATION
13
PACKAGE OUTLINE
14
SOLDERING
14.1
14.2
14.3
14.4
Introduction
Reflow soldering
Wave soldering
Repairing soldered joints
15
DEFINITIONS
16
LIFE SUPPORT APPLICATIONS
17
PURCHASE OF PHILIPS I2C COMPONENTS
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
1
SAA4978H
FEATURES
• Clamp
• Analog AGC
• Triple YUV 9-bit Analog-to-Digital Converter (ADC)
• Triple bypassable analog anti-alias filter
• 4 MHz notch filter
• 2D-peaking and coring
• Non-linear phase filter after ADC
• Non-linear phase filter before DAC
• 4 : 1 : 1 or 4 : 2 : 2 digital processing
• Coaxial Transceiver Interface (CTI)
• 4 : 1 : 1 or 4 : 2 : 2 selectable I/O interface
• Triple 10-bit Digital-to-Analog Converter (DAC)
• Asynchronous digital input
• Triple bypassable analog reconstruction filter
• Time base correction
• Embedded microcontroller (80C51 core)
• Histogram analysis
• Programmable signal positioner
• Histogram modification
• SNERT interface
• Subtitle detection
• I2C-bus user control interface
• Black bar detection
• Boundary Scan Test (BST).
• Line memory based noise reduction (spatial)
• Noise level measurement
2
• Clamp noise reduction
The SAA4978H is a monolithic integrated circuit suitable
either for 1fH or 2fH applications that contain a large variety
of picture improvement functions. It combines
analog-to-digital and digital-to-analog conversion for YUV
signals, digital processing, line-locked clock regeneration
and an 80C51 microcontroller core in one IC.
• Dynamic peaking
• Energy measurement
• Multi Picture-In-Picture (multi PIP) decimation
• Differential Pulse Code Modulation (DPCM) data
decompression for colour
3
GENERAL DESCRIPTION
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDDA
analog supply voltage
VDDD
digital supply voltage
3.0
3.3
3.6
V
IDDA
analog supply current
VDDA = 3.45 V
−
145
180
mA
IDDD
digital supply current
VDDD = 3.6 V
−
210
270
mA
fclk
clock frequency
−
16
−
MHz
S/N
signal-to-noise ratio
50
−
−
dB
4
3.15
default settings
3.3
3.45
V
ORDERING INFORMATION
TYPE
NUMBER
SAA4978H
1999 May 03
PACKAGE
NAME
QFP160
DESCRIPTION
plastic quad flat package; 160 leads (lead length 1.6 mm);
body 28 × 28 × 3.4 mm; high stand-off height
3
VERSION
SOT322-2
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62
Ref L
YB0
to
YB8
WEB
CLKAS
43 to 51 84 to 76 75 to 67 66 85
3-STATE
various
bias controls
BAND GAP
REFERENCES
21
53 to 61
UVB0
to
UVB8
SYNCHRONIZE
Ref H
DITHER
YIN
23
Y
DELAY
CLAMP
UIN
VIN
TRIPLE
AGC
9-BIT
TRIPLE
ANALOG
PREFILTER
MAJORITY
FOLLOWER
FILTER
NON-LINEAR
PHASE
FILTER
4 MHz
NOTCH
5
ADC
TRIPLE
9-BIT
DITHER
TIME BASE
CORRECTION/
SAMPLE
RATE
CONVERTER
MUX
REFORMATTER
25
5
UV
CLAMP
CORRECTION
26
FORMATTER
DOWNSAMPLER
4
VDDA1 to
VDDA4
11, 22, 24, 31
VSSA1 to
VSSA4
13, 16, 27, 32
10
11
bus A
SAA4978H
RED
MUX
BORDER
CLP
WEC
IEC
bus B
SKEWEN
SKEW
HA
BLANKING
WEA
B
UPSAMPLER
DOWNSAMPLER
DITHER
OVERFLOW
DETECTOR
CLP
A
MUX
C
PIXREP
HREF
BST/TEST
Philips Semiconductors
DIFFIN
64, 90,
134, 139
UVA0
to
UVA8
Picture Improved Combined Network
(PICNIC)
BGEXT
17
64, 87,
100, 135
YA0
to
YA8
WEA
BLOCK DIAGRAM
VSSD1 to
VSSD4
5
ok, full pagewidth
1999 May 03
VDDD1 to
VDDD4
D
PSP
E
F
G
36
37
38
39
40
41
18
19
29
30
158
157
10
MHB172
TEST TRST TMS
TDI
TDO TCK
HDFL VDFL
VA
HREFEXT
INT1
INT0
FBL
Product specification
Fig.1 Block diagram (continued in Fig.2).
SAA4978H
Standard bus width in data path is 9 bits; exceptions are marked.
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SUBTITLE
DETECTION
NOISE
ESTIMATION
BLACK BAR
DETECTION
112
114 to 122
124 to 132
91
to 99
RED
101 to 109
110
3-STATE
SPECTRAL
MEASUREMENT
UNDITHER
DITHER
DYNAMIC 10
PEAKING
MUX
A
DOWNSAMPLER
DITHER
MUX
UPSAMPLER
DITHER
YOUT
DPCM
CODER
4
TRIPLE
ANALOG
POST-FILTER
10
4
8
DAC
TRIPLE
10-BIT
BORDER
BLANK
REFORMATTER
FORMATTER
HISTOGRAM
MODIFICATION
12
5
5
NOISE
REDUCTION
NON-LINEAR 10
PHASE
FILTER
14
MUX
DCTI
DPCM DECODER
10
15
B
bus C
bus D
PIXREP
BLANKING
UOUT
VOUT
Philips Semiconductors
113
SPECTRAL
MEASUREMENT
YD0
to
YD8
UVD0
to
UVD8
Picture Improved Combined Network
(PICNIC)
book, full pagewidth
1999 May 03
UVC8
to
UVC0
YC8
to
WEC IEC YC0
5
BORDER
SPECIAL FUNCTION
REGISTERS
VARIOUS
REGISTERS
AUXILIARY
RAM
PROGRAM
ROM
SAA4978H
SKEWEN
C
CL16
D
CL16
CL16
WATCHDOG
FREQUENCY
GUARD
HREF
CL16
SKEW
CL32
DATA8
P1.1
INT1 INT0 P1.4
bone
80C51 MICROCONTROLLER CORE
EA PSEN
P1.5
P3.5 P3.4 P1.2 P1.3 P1.7 P1.6 RST
PLL
E
F
CRYSTAL
OSCILLATOR
OR
G
1
2
140 149
to
to
147 156 136 137 138 160 159 8
9
5
4
6
7
42, 63, 86,
111, 133, 3
52, 123, 148
88
89
28
34
35
OSCI
OSCO
MHB173
SNDA SNCL
T0
WDRST
VSSO1
to
VSSO6
VDDO1
to
VDDO3
Standard bus width in data path is 9 bits; exceptions are marked.
Fig.2 Block diagram (continued from Fig.1).
CLK16 CLK32 HA
Product specification
RSTR
SCL
RST
RSTW
SDA
SAA4978H
P2.7 P0.7 EA
ALE
to
to
T1
PSEN
P2.0 P0.0
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
6
SAA4978H
PINNING INFORMATION
SYMBOL
PIN
DESCRIPTION
SNDA
1
SNERT data input/output
SNCL
2
SNERT clock output
VSSO6
3
digital microcontroller I/O ground 6; internally connected to all other VSSO pins
SCL
4
I2C-bus serial clock input (P1.6)
SDA
5
I2C-bus serial data input/output (P1.7)
RST
6
microcontroller reset input
WDRST
7
watchdog reset output
RSTW
8
reset write signal output/SNERT reset (only PALplus) Port 1.2
RSTR
9
reset read signal output/SNERT reset (SAA4991WP or SAA4992H) Port 1.3
FBL
10
fast blanking input to PSP and Port 1.4
VDDA1
11
analog back-end supply voltage 1
YOUT
12
Y analog output
VSSA1
13
analog back-end ground 1
UOUT
14
U analog output
VOUT
15
V analog output
VSSA2
16
analog input ground 2; internally connected to substrate
BGEXT
17
band gap external/reference currents input
HDFL
18
horizontal synchronization signal output, deflection part
VDFL
19
vertical synchronization signal output, deflection part
AGND
20
analog ground
DIFFIN
21
differential Y input
VDDA2
22
analog input supply voltage 2
YIN
23
Y analog input
VDDA3
24
analog input supply voltage 3
UIN
25
U analog input
VIN
26
V analog input
VSSA3
27
analog input ground 3; internally connected to substrate
HA
28
horizontal synchronization input, acquisition part
VA
29
vertical synchronization input, acquisition part
HREFEXT
30
horizontal reference external output
VDDA4
31
analog PLL supply voltage 4
VSSA4
32
analog PLL ground 4; internally connected to substrate
VSSX
33
oscillator ground
OSCI
34
oscillator input
OSCO
35
oscillator output
TEST
36
test input/external 32 MHz clock input
TRST
37
BST reset input
TMS
38
BST test mode select input
TDI
39
BST test data input
TDO
40
BST test data output
1999 May 03
6
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SYMBOL
SAA4978H
PIN
DESCRIPTION
TCK
41
BST test clock input
VSSO1
42
digital bus A/B ground 1; internally connected to all other VSSO pins
UVA0
43
bus A output UVL
UVA1
44
bus A output UV0
UVA2
45
bus A output UV1
UVA3
46
bus A output UV2
UVA4
47
bus A output UV3
UVA5
48
bus A output UV4
UVA6
49
bus A output UV5
UVA7
50
bus A output UV6
UVA8
51
bus A output UV7
VDDO1
52
digital I/O bus A/B supply voltage 1; internally connected to all other VDDO pins
YA0
53
bus A output YL
YA1
54
bus A output Y0
YA2
55
bus A output Y1
YA3
56
bus A output Y2
YA4
57
bus A output Y3
YA5
58
bus A output Y4
YA6
59
bus A output Y5
YA7
60
bus A output Y6
YA8
61
bus A output Y7
WEA
62
write enable bus A output
VSSO2
63
digital bus A/B ground 2; internally connected to all other VSSO pins
VDDD1
64
digital core supply voltage 1; internally connected to all other VDDD pins
VSSD1
65
digital core ground 1; internally connected to all other VSSD pins
WEB
66
write enable bus B input
YB8
67
bus B input Y7
YB7
68
bus B input Y6
YB6
69
bus B input Y5
YB5
70
bus B input Y4
YB4
71
bus B input Y3
YB3
72
bus B input Y2
YB2
73
bus B input Y1
YB1
74
bus B input Y0
YB0
75
bus B input YL
UVB8
76
bus B input UV7
UVB7
77
bus B input UV6
UVB6
78
bus B input UV5
UVB5
79
bus B input UV4
UVB4
80
bus B input UV3
UVB3
81
bus B input UV2
1999 May 03
7
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SYMBOL
SAA4978H
PIN
DESCRIPTION
UVB2
82
bus B input UV1
UVB1
83
bus B input UV0
UVB0
84
bus B input UVL
CLKAS
85
asynchronous clock input
VSSO3
86
digital I/O bus B/clock ground 3; internally connected to all other VSSO pins
VDDD2
87
digital core supply voltage 2; internally connected to all other VDDD pins
CLK16
88
16 MHz clock output
CLK32
89
32 MHz clock output
VSSD2
90
digital core ground 2; internally connected to all other VSSD pins
UVD0
91
bus D input UVL
UVD1
92
bus D input UV0
UVD2
93
bus D input UV1
UVD3
94
bus D input UV2
UVD4
95
bus D input UV3
UVD5
96
bus D input UV4
UVD6
97
bus D input UV5
UVD7
98
bus D input UV6
UVD8
99
bus D input UV7
VDDD3
100
digital core supply voltage 3; internally connected to all other VDDD pins
YD0
101
bus D input YL
YD1
102
bus D input Y0
YD2
103
bus D input Y1
YD3
104
bus D input Y2
YD4
105
bus D input Y3
YD5
106
bus D input Y4
YD6
107
bus D input Y5
YD7
108
bus D input Y6
YD8
109
bus D input Y7
RED
110
read enable bus D output
VSSO4
111
digital I/O bus C/D ground 4; internally connected to all other VSSO pins
IEC
112
input enable bus C output
WEC
113
write enable bus C output
YC8
114
bus C output Y7
YC7
115
bus C output Y6
YC6
116
bus C output Y5
YC5
117
bus C output Y4
YC4
118
bus C output Y3
YC3
119
bus C output Y2
YC2
120
bus C output Y1
YC1
121
bus C output Y0
YC0
122
bus C output YL
1999 May 03
8
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SYMBOL
SAA4978H
PIN
DESCRIPTION
VDDO2
123
digital I/O supply voltage 2 to bus C/D; internally connected to all other VDDO pins
UVC8
124
bus C output UV7
UVC7
125
bus C output UV6
UVC6
126
bus C output UV5
UVC5
127
bus C output UV4
UVC4
128
bus C output UV3
UVC3
129
bus C output UV2
UVC2
130
bus C output UV1
UVC1
131
bus C output UV0
UVC0
132
bus C output UVL
VSSO5
133
digital I/O ground 5 to bus D and microcontroller; internally connected to all other
VSSO pins
VSSD3
134
digital core ground 3; internally connected to all other VSSD pins
VDDD4
135
digital core supply voltage 4; internally connected to all other VDDD pins
EA
136
external access output (active LOW)
PSEN
137
program store enable output (active LOW)
ALE
138
address latch enable output
VSSD4
139
digital core ground 4; internally connected to all other VSSD pins
P2.7
140
Port 2 data input/output signal 7
P2.6
141
Port 2 data input/output signal 6
P2.5
142
Port 2 data input/output signal 5
P2.4
143
Port 2 data input/output signal 4
P2.3
144
Port 2 data input/output signal 3
P2.2
145
Port 2 data input/output signal 2
P2.1
146
Port 2 data input/output signal 1
P2.0
147
Port 2 data input/output signal 0
VDDO3
148
microcontroller I/O pad supply voltage 3
P0.7
149
Port 0 data input/output signal 7
P0.6
150
Port 0 data input/output signal 6
P0.5
151
Port 0 data input/output signal 5
P0.4
152
Port 0 data input/output signal 4
P0.3
153
Port 0 data input/output signal 3
P0.2
154
Port 0 data input/output signal 2
P0.1
155
Port 0 data input/output signal 1
P0.0
156
Port 0 data input/output signal 0
INT0
157
interrupt 0, I/O Port 3.2 (active LOW)
INT1
158
interrupt 1, I/O Port 3.3 (active LOW)
T0
159
timer 0 I/O Port 3.4
T1
160
timer 1 I/O Port 3.5
1999 May 03
9
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
handbook, halfpage
121
160
SAA4978H
120
1
SAA4978H
80
81
41
40
MHB174
Fig.3 Pin configuration.
7
According to this specification, a lift of 6 dB up to a drop of
3 dB may be necessary with respect to the nominal values.
The gain setting within the required minimum 9 dB range
is performed digitally via the internal microcontroller.
For this purpose a gain setting digital-to-analog converter
is incorporated. The smallest step in the gain setting
should be hardly visible on the picture, this can be met with
smaller steps of 0.4%/step.
FUNCTIONAL DESCRIPTION
The SAA4978H consists of the following main functional
blocks:
• Analog preprocessing and analog-to-digital conversion
• Digital processing at 1fH level
• Digital processing at 2fH level
• Digital-to-analog conversion
Luminance and chrominance gain settings can be
separately controlled. The reason for this split is that
U and V may have already been gain adjusted by an
Automatic Chrominance Control (ACC), whereas
luminance is to be adjusted by the SAA4978H AGC.
However, for RGB originated sources, Y, U and V should
be adjusted with the same AGC gain.
• Line-locked clock generation
• Crystal oscillator
• Control interfacing I2C-bus and SNERT
• Register I/O
• Programmable Signal Positioner (PSP)
• 80C51 microcontroller core
• Board level testability provisions.
7.1.2
7.1
A clamp circuit is applied to each input channel, to map the
colourless black level in each video line (on the sync back
porch) to level 32 at 9 bits for Y and to the centre level of
the converters for U and V. During the clamp period, an
internally generated clamp pulse is used to switch-on the
clamp action.
7.1.1
Analog input blocks
GAIN ELEMENTS FOR AUTOMATIC GAIN CONTROL
(9 dB RANGE)
A variable amplifier is used to map the possible YUV input
range to the analog-to-digital converter range e.g. as
defined for SCART signals.
1999 May 03
10
CLAMP CIRCUIT, CLAMPING Y TO DIGITAL LEVEL 32
AND UV TO 0 (TWOS COMPLEMENT)
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
A voltage controlled current source construction, which
references to voltage reference points in the ladders of the
analog-to-digital converters, provides a current on the
input of the YUV signals in order to bring the signals to the
correct DC value. This current is proportional to the DC
error, but is limited to ±150 µA. It is essential that the clamp
current becomes zero with a zero error and that the
asymmetry between positive and negative clamp currents
is limited to within 10%. When the clamping action is off,
the residual clamp current should be very low, so that the
clamp level will not drift away within a video line.
The clamp level in the Y channel has a minimum value of
600 mV to ensure undisturbed clamping for maximum
Y input signals with top sync levels up to 600 mV. In order
to improve common mode rejection it is recommended to
connect the same source impedance as used in the YIN
input at the DIFFIN input to ground.
7.1.3
7.2.2
The Y samples can be shifted onto 4 positions with
respect to the UV samples. This shift is meant to account
for a possible difference in delay prior to the SAA4978H,
e.g. from a prefilter in front of an analog-to-digital
converter. The zero delay setting is suitable for the
nominal case of aligned input data according to the
interface format standard. One setting provides one
sampleless delay in Y, the other two settings provide more
delay in the Y path.
7.2.3
ANALOG ANTI-ALIASING PREFILTER
7.2.4
7.2.1
9-BIT ANALOG-TO-DIGITAL CONVERSION
7.2.5
4 MHZ NOTCH
The 4 MHz notch provides a zero on 1⁄4 of the sample
frequency. With fs = 16 MHz the notch is thus at 4 MHz.
The 3 dB notch width is 2 MHz. The filter coefficients are
1⁄ × [−1; 0; 5; 0; 5; 0; −1]. This filter gives a relative gain of
8
0.75 dB at 1.7 and 6.3 MHz.
Digital processing blocks
The notch can be bypassed without changing the group
delay.
OVERFLOW DETECTION
A histogram of the three overflow levels is made every field
and can be read in a 2-byte accuracy. An input selector
defines which ADC is monitored.
7.2.6
DIGITAL CLAMP CORRECTION FOR UV
During 32 samples within the active clamping the clamp
error is measured and accumulated to determine a
low-pass filtered value of the clamp error. A vertical
recursive filter is then used to further reduce this error
value. This value can be read by the microcontroller or be
used directly to correct the clamp error. It is also possible
for the microcontroller to give a fixed correction value.
In the event of U or V selection the underflow information
is also added to the first histogram level, in this way the
data can be handled as out-of-range information.
The histogram content provides information for the AGC to
make an accurate estimate of the decrease in gain, in the
event of overflow for luminance or out-of-range detection
for U and V.
1999 May 03
NON-LINEAR PHASE FILTER AFTER ADC
The non-linear phase filter adjusts for possible group delay
differences in the luminance channel. The filter coefficients
are [−L × (1 − u); 1 + L; −L × u]; where L determines the
strength of the filter and u determines the asymmetry.
The effect of the asymmetry is that for higher frequencies
the delay is decreased for u ≤ 0.5. Settings are provided
for L = 0, 1⁄16, 2⁄16 and 3⁄16 and u = 0, 1⁄4 and 1⁄2.
Three identical multi-step type analog-to-digital converters
are used to convert the Y, U and V inputs with a 16 MHz
data rate. The ADCs have a 2-bit overflow detection, and
an underflow detection for U and V, to be used for AGC
control. The 2 bits are coded for one in-range level and
three overflow levels; 1 dB, 1 to 2 dB and 2 to 3 dB.
7.2
TRANSIENT NOISE SUPPRESSION
A circuit is added in the luminance channel to suppress the
typical multi-step trip level noise. This majority follower
filter compares the neighbouring pixels to a +1 or −1 LSB
difference. If the majority of these differences is +1 then 1
is added to the actual pixel. If the majority of these
differences is −1 then 1 is subtracted from the actual pixel.
The number of pixels included in the filter is selectable;
1 (bypass), 3, 5, 7 or 9.
A 3rd-order linear phase filter is applied to each of the
Y, U and V channels. It provides a notch on fclk (16 MHz
at Y, U and V) to strongly prevent aliasing to low
frequencies, which would be the most disturbing.
The bandwidth of the filters is designed for −3 dB at
5.6 MHz. The filters can be bypassed if external filtering
with other characteristics is desired. In the bypass mode
the gain accuracy of the front-end part is 4% instead of 8%
for the filter-on mode.
7.1.4
Y DELAY
11
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
7.2.7
SAA4978H
It is possible, in bus B reformatter, to invert the UV data so
that the SAA4978H can handle any polarity convention of
the UV data.
4 : 4 : 4 DOWNSAMPLED TO 4 : 2 : 2 OR 4 : 1 : 1
4 : 4 : 4 data is downsampled to 4 : 2 : 2, by first filtering
with a [1; 0; −7; 0; 38; 64; 38; 0; −7; 0; 1] filter, before being
subsampled by a factor of 2. The U and V samples from
the 4 : 2 : 2 data are filtered again by a [−1; 0; 9; 16; 9; 0;
−1] filter, before being subsampled a second time by a
factor of 2. Bypassing this function keeps the data in the
4 : 2 : 2 format.
7.2.8
In the event of an asynchronous input the clock has to be
provided externally to pin CLKAS.
When applying an external PALplus decoder with 30 ms
processing delay, the vertical field start can be set via
software in a PSP register. For “CCIR 656” standard data
format input, inversion of the MSB of the (synchronized)
bus B UV input can be selected. Synchronization signals
included in this format will be ignored.
BUS A FORMAT: INTERFACE FORMATTING, TIMED
WITH ENABLING SIGNAL (see Table 1 and Fig.9)
The chosen 4 : 1 : 1 or 4 : 2 : 2 formatted output data is
presented to bus A (YUV_A bus), consistent with the WEA
data enable signal. After the rising edge of WEA the first,
respectively second, data word contains the first phase of
the 4 : 1 : 1 or 4 : 2 : 2 format, depending on the qualifier
respectively prequalifier mode of WEA. If the data has to
be formatted to 8 bits, a choice can be made between
rounding and dithered rounding. Dithered rounding may be
applied in the sense that every odd output sample has had
an addition of 0.25 LSB (relative to 8 bits) before
truncation and every even output sample has had an
addition of 0.75 LSB before truncation. In this way, on
average, correct rounding is realized (no DC shift).
Especially for low frequency signals, the resolution is
increased by a factor of 2 by the high frequency
modulation. The phase of dithering can be switched 180°
from line-to-line, field-to-field or frame-to-frame, in order to
decrease the visibility of the dithering pattern.
7.2.10
CONVERSION
The Time Base Correction (TBC) and Sample Rate
Conversion (SRC) block provides a dynamically controlled
delay with an accuracy of up to 1⁄64 of a pixel and a range
of −0.5 to +0.5 lines (plus processing delay).
The time base correction block has an input for skew data.
This skew data can be the phase error measured by a
HPLL, which is located in the PLL block of the SAA4978H.
The skew is used as a shift of the complete active video
part of a line. Added with a static (user controlled) shift, up
to 1⁄2 video line (32 µs) can be shifted in both directions,
related to a nominal 1⁄2 line delay.
For sample rate conversion, the delay is also varied along
the line with the subpixel accuracy. With a zero-order
variation of the delay, a linear compress or expand
function can be obtained. The range for the compression
factor is 0 to 2, meaning infinite zoom up to a compression
with a factor of 2. With a 2nd-order variation of the delay
added to the control, the compression factor can be
modulated with a parabolic shape, thus giving a panoramic
view option to display e.g. 4 : 3 video on a 16 : 9 screen or
vice versa.
The not connected output pins of bus A, including WEA
(depending on the application), can be set to 3-state to
allow short-circuiting of these pins at board production.
Short-circuiting at not connected outputs can not be tested
by Boundary Scan Test (BST). For outputs in 3-state mode
it is not allowed to apply voltages higher than
VDDO + 0.3 V.
7.2.9
The static shift may also be used to make the delay of the
SAA4978H plus periphery equal to an integer number of
lines. This is useful for 1fH applications, in which the
horizontal sync signal is not delayed with the video data.
This will then make the function of time base correction
obsolete for 1fH applications.
BUS B FORMAT (see Table 1 and Fig.9)
Bus B can accommodate the following formats; 4 : 1 : 1
serial, 4 : 2 : 2 parallel, 4 : 2 : 2 double clock UYVY, all
synchronous and asynchronous. All external formats are
selectable with prequalifier or qualifier WEB. All of the
various input formats are converted to the internal 9 bits
4 : 2 : 2. For the 8-bit inputs, the LSB of the input bus
should be connected externally to a fixed logic level. In the
event of a 4 : 1 : 1 input, the U and V channels are
reformatted and upsampled by generating the extra
samples with a 1⁄16 × [−1; 9; 9; −1] filter. The other U and V
samples remain equal to the original 4 : 1 : 1 sample
values.
1999 May 03
TIME BASE CORRECTION AND SAMPLE RATE
Another main task for the sample rate converter is to
resynchronize external data at a non-system clock sample
rate, for instance, MPEG decoder signals at 13.5 MHz.
A requirement for these signals is that they are line and
frame locked to the SAA4978H.
12
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
7.2.11
SAA4978H
The histogram acquisition uses 32 baskets on the grey
scale from (ultra) black to (ultra) white. Pixels that are
found around the centre of a basket increase a counter for
that basket with the value 8, pixels that come around the
edge between two baskets increase the counters in both
baskets, such as 3 in the left one and 5 in the right one.
By this method, the quantization distortion is overcome
from having a discrete set of baskets.
NOISE REDUCTION
The noise reduction part consists of clamp noise reduction
and spatial noise reduction for low frequency noise. Within
this ensemble a two dimensional band split is used,
enabling also the functions of 2D low passing, adding the
multi Picture-In-Picture (multi PIP) function and 2D
peaking.
The clamp noise reduction is realized with an adaptive
temporal recursive filter. This filter will correct the DC level
of each line when it is varying from field-to-field in the
segments with the least likely movement. This clamp noise
filtering is intended to correct for clamp errors in a
complete chain, which cannot be removed with traditional
clamping on the back porch of the video. Clamp noise is
only reduced for luminance.
Between acquisition of the histogram and correction of the
transfer curves, the microcontroller included in the
SAA4978H processes the counter values from the
32 baskets. The outcome of the microcontrollers algorithm
defines a differential transfer curve for the luminance. This
means that only differences from a 1 : 1 transfer curve are
coded. This is done in 32 LUT points, with a linear
interpolation for all input values in between the LUT points.
The spatial noise reduction is targeted for reduction of the
mid frequency noise spectrum, where adaptive filtering
combines pixels around the centre pixel and pixels from
the lines above in a recursive way. This spatial noise
reduction is only realized for luminance.
When changes are made to the luminance level of pixels,
the saturation has to be restored by using the same
relative gain for the U and V channels.
The histogram data also provides the information of the
minimum and maximum levels of Y, U and V, by which the
microcontroller can affect an AGC gain before the video
analog-to-digital conversion.
The 2D low-pass filter is a [1; 2; 1] filter in both the
horizontal and vertical direction. 2D high-pass is realized
by taking the centre tap and subtracting the 2D low-pass
output from it. Also added in the 2D high-pass is the
vertical low-passed data, which is subtracted from the
centre tap and multiplied by a user selectable gain
(0 to 7⁄8). The 2D high-pass data is multiplied by a user
selectable gain of 0 and 2⁄4 to 8⁄4 and cored before adding
it to the 2D low-pass branch for the 2D peaking function.
The HF signal bypasses both the LF temporal and the
spatial noise reduction, therefore sharpness in the high
frequencies is not reduced by the noise reduction parts.
The factor 0 on the HF signal yields a pure 2D low-passed
signal at the output. Multi PIP with pure subsampling of this
signal yields a much better result than without the low-pass
operation.
7.2.12
Another main part of the histogram is the display-bars
block. This block can insert up to 32 horizontal bars in the
YUV data path. Size, spacing, luminance, colour and
length are fully programmable. This can be used to
construct a visual display of the histogram or transfer
curve.
7.2.13
Subtitle detection searches in a large area of the video
field for patterns that are characteristic for subtitles.
The expectation is to encounter in a video line a
considerable number of crossings through both a dark
grey and a light grey threshold and in its vicinity also
crossings in the other direction. This part is realized with
valid crossing (event) counting on each line in the target
area. This event value is stored for 128 lines in the subtitle
RAM, which is located at the top of the auxiliary RAM.
The subtitle logic has higher priority to access the subtitle
RAM than the microcontroller.
HISTOGRAM
Histogram modification consists of acquiring the histogram
of the luminance levels and correcting the luminance
transfer curve in order to provide more perceptual contrast
in the picture.
The internal microcontroller can filter out this data. In a
number of adjacent lines, there must be a similar high
count value for the number of events. If this condition holds
then the detection of subtitles on that vertical position is
more definite.
For economy, a subsampling is realized on the video with
a factor of 4 before the histogram is produced. From
line-to-line, a two pixel offset is used on the subsample
pattern.
1999 May 03
SUBTITLE DETECTION
13
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
This information can be used in combination with other
information on how to display the video source on the
screen. Such decisions are made entirely by the internal
microcontroller.
7.2.14
7.2.16
FORMATS ARE ALL CONVERTED TO THE INTERNAL
9 BITS 4 : 2 : 2 (see Table 1)
Bus D can handle 4 : 1 : 1 external 8 or 9 bits, 4 : 2 : 2
external 8 or 9 bits, 4 : 2 : 2 internal 9 bits and DPCM
4 : 2 : 2.
BLACK BAR DETECTION
Black bar detection searches in the upper and in the lower
part of the screen to respectively the last black line and the
first black line. To avoid disturbances of Logos in the video,
measurements can be performed in only the horizontal
centre part of the lines.
7.2.15
Bus D is selectable in 1fH and 2fH mode. In 1fH mode the
internal input can also be used.
For dithered 8-bit luminance signals an undither block is
provided that restores the 9th bit for low frequency and low
noise. This is needed before the peaking circuit to prevent
amplification of the 1⁄2fs dither modulation.
BUS C FORMAT (see Table 1)
The U and V samples from the 4 : 2 : 2 data are filtered
again by a [−1; 0; 9; 16; 9; 0; −1] filter, before being
subsampled by a factor of 2. Bypassing this function keeps
the data in the 4 : 2 : 2 format.
In the event of 8-bit inputs, the LSB of the input bus should
be externally connected to a fixed logic level.
In the event of a 4 : 1 : 1 input, the U and V channels are
reformatted and upsampled by generating the extra
samples with a 1⁄16 × [−1; 9; 9; −1] filter. The other U and V
samples remain equal to the original 4 : 1 : 1 sample
values.
Should it be required to format the data to 8 bits, a choice
can be made between rounding and dithered rounding.
Dithered rounding may be applied in the sense that every
odd output sample has had an addition of 0.25 LSB
(relative to 8 bits) before truncation and every even output
sample has had an addition of 0.75 LSB before truncation.
In this way, normally, correct rounding is realized (no DC
shift). Especially for low frequency signals, the resolution
is increased by a factor of 2 by the high frequency
modulation. The phase of dithering is switched 180° from
line-to-line, field-to-field or frame-to-frame in order to
decrease the visibility of the dithering pattern.
7.2.17
PEAKING
Peaking in the SAA4978H can be used in two ways:
1. The first way is to give the luminance a linear boost of
the higher frequency ranges, which makes no
distinction between small and large details or edges.
2. The second way is to use the peaking dynamically, in
order to boost smaller details and provide less gain on
large details and edges. The effect is detail
enhancement without the creation of unnaturally large
overshoots and undershoots on large details and
edges.
This block also performs the subsampling for multi PIP,
with subsampling factors of 1, 2, 3 and 4.
Another output format at bus C is Differential Pulse Code
Modulation (DPCM) 4 : 2 : 2. This data compression
method is applied on the U and V channels, and gives a
50% data reduction. In this way it is possible to convert a
4 : 2 : 2 picture to 2fH using a single 12-bit wide field
memory. This format is especially useful for graphics
conversion with high amplitude and high saturation input
signals. The not connected output pins of bus C including
WEC and IEC (depending on the application) can be set to
3-state to allow short-circuiting of these pins at board
production. Short-circuiting at not connected outputs can
not be tested by BST. For outputs in 3-state mode it is not
allowed to apply voltages higher than VDDO + 0.3 V.
1999 May 03
BUS D REFORMATTER: THE VARIOUS INPUT
Basically, the three peaking filters (1 high-pass and
2 band-pass) filter the incoming luminance signal.
The high-pass filter is made with [−1; 2; −1] coefficients,
giving a maximum throughput at 1⁄2fs (equals 8 MHz).
The first band-pass filter has [−1; 0; 2; 0; −1] coefficients,
giving a maximum throughput at 1⁄4fs (equals 4 MHz).
The second band-pass filter has a cascade of
[−1; 0; 0; 2; 0; 0; −1] and [1; 2; 1] coefficients, giving a
maximum throughput at 2.38 MHz.
With a separate gain control on each of the peaking filters
[possible gain settings of (0, 1⁄16, 2⁄16, 3⁄16, 4⁄16, 5⁄16, 6⁄16
and 8⁄16)], a desired frequency characteristic can be
obtained with steps of maximum 2 dB gain difference at
the centre frequencies.
14
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
The sum of the filter outputs is fed through a coring circuit
with a user definable transfer curve between
−7 and +7 LSB at a 12-bit level. The definition of the coring
LUT is realized with two control registers. Herein, for each
of the points in the transfer curve, the user can define an
output between 0 and the input value. For the LUT
points +7 (and −7), a choice can be made from
(−4) +4 to (−7) +7. By setting control bit CORING to LOW,
the coring transfer curve is switched to a coarse coring
which is only dependent on the threshold (see Fig.13).
7.2.19
The Digital Colour Transient Improvement (DCTI) is
intended for U and V signals originating from a 4 : 1 : 1
source. Horizontal transients are detected and enhanced
without overshoots by differentiating, making absolute and
again differentiating the U and V signals separately. This
signal is used as a pointer to make a time modulation.
This results in a 4 : 4 : 4 U and V bandwidth. To prevent
third harmonic distortion, typical for this processing, a so
called ‘over the hill protection’ prevents peak signals from
becoming distorted. It is possible to control gain, width,
connect U and V and over the hill range via the
microcontroller.
The so formed peaking signal can be added to the original
luminance signal, the sum of which then becomes the 9-bit
output signal (black-to-white), with an additional DA shift
fitting within 10 bits.
At the output of the DCTI a post-filter is situated to make a
correction for the simple upsampling in DCTI which is a
linear interpolation [1; 2; 1]. The post-filter coefficients are
[−1; 2; 6; 2; −1], convolution of both filters gives
[−1; 0; 9; 16; 9; 0; −1]. This post-filter should only be used
when the DCTI is off, and the source material is 4 : 2 : 2
bandwidth.
For dynamic use of the peaking circuit, an additional gain
is provided on the peaking signal. This gain is made
dependent on the energy in the peaking signal.
To overcome an unwanted coring on structured small
signals, the output of the low-pass filter is also used to
monitor if the high frequency contents are large enough to
refrain from coring. Therefore the coring is set off if the HF
energy level rises above a user definable threshold.
7.2.20
Spectral measurements are performed with the
spectr_meas subpart, by calculating the sum of the
absolute values from a chosen one of the three (high-pass
and band-pass) filter outputs over a vertical window in a
video field. With this window it is possible to disable
subtitles. The maximum value of the chosen filter output
within a windowed video field is also monitored. For the
generally lower HF contents of the video signal, a
weighting by a factor 4 can be switched in, while
measuring on the High-Pass Filter (HPF).
7.2.18
BORDER BLANK
The border and blanking processing is operating at a
4 : 4 : 4 level, just before the analog-to-digital conversion.
Here it is possible to generate a blanking window and
within this window a border window. The blanking window
is used to blank the non-visible part of the output to the
clamp level. The border window is the visible part of the
video that contains no video, such as the sides in
compression mode, this part can be programmed to
display any luminance or colour level in an 8-bit accuracy;
pixel repetition is also possible here. In case of multi PIP
this block can generate separation borders in the
horizontal and vertical direction.
NON-LINEAR PHASE FILTER BEFORE DAC
This non-linear phase filter adjusts for possible group
delay differences in the Y, U and V output channels, and
for sinus x/x bandwidth loss of the ADCs. The filter
coefficients are [−L × (1 − u); 1 + L; −L × u]; where
L determines the strength of the filter and u determines the
asymmetry. The effect of the asymmetry is that for higher
frequencies the delay is decreased for u ≤ 0.5. Settings
are provided for L = 0, 1⁄8, 2⁄8, 3⁄8 and u = 0, 1⁄4, 1⁄2.
1999 May 03
DCTI
15
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
7.3
7.3.1
SAA4978H
7.3.6
Analog output blocks
The SAA4978H contains an embedded 80C51
microcontroller core including a 1 kbyte RAM and a
32 kbyte ROM. It also includes an I2C-bus user control
interface. For development reasons an external ROM can
be accessed with 64 kbyte maximum size. An external
emulator can be connected.
TRIPLE 10-BIT DIGITAL-TO-ANALOG CONVERSION
Three identical DACs are used to convert Y, U and V with
a 32 or 16 MHz data rate.
7.3.2
ANALOG ANTI-ALIASING POST-FILTER
A 3rd-order linear phase filter is applied to each of the Y,
U and V channels. It provides a notch on fclk (32 MHz at Y,
U and V) to strongly prevent aliasing to low frequencies,
which would be most disturbing. The filters can be
bypassed if external filtering with other characteristics is
desired. Bandwidth and gain accuracy are given in
Chapter 11.
7.3.3
The main difference to most existing 80C51 derivatives is:
• 768 byte auxiliary RAM from which 128 bytes can be
accessed as subtitle RAM
• Interrupt vector address for the I2C-bus is 33H
• On-chip ROM code protection
• SNERT at 1 or 2 Mbaud with additional Sample
Frequency Registers (SFRs) instead of UART
PLL
• Host interface containing all control registers access
e.g. via MOVX instruction.
The PLL consists of a ring oscillator, Discrete Time
Oscillator (DTO) and digital control loop. The PLL
characteristic is controlled by means of the
microcontroller.
7.3.4
7.3.7
The digital outputs UVAL, UVA0, UVA1, UVA2, UVA3,
YAL, UVCL, UVC0, UVC1, UVC2, UVC3, YCL, WEA,
WEC and IEC can be set in 3-state mode if not connected
in the application. This means that these outputs with
index 0 to 3 are set in 3-state if 4 : 1 : 1 is chosen, and the
outputs with index L are set in 3-state if 8 bits output is
chosen.
The read or write operation must be set by the
microcontroller. When writing to the bus, 2 bytes are
loaded by the microcontroller; one for the address, the
other for the data. When reading from the bus, 1 byte is
loaded by the microcontroller for the address, the received
byte is the data from the addressed SNERT location.
7.3.8
The SNERT interface replaces the standard UART
interface. In contrast to the 80C51 UART interface there
are additional control registers, other I/O pads and no byte
separation time between address and data. After
power-on reset the 1 Mbaud mode is active. Switching
baud rate during transmission should be avoided.
POWER-ON RESET
All digital blocks except PLL are reset by a HIGH level at
the reset pin. Only the watchdog counter is reset by the
falling edge of the reset pulse. The PLL needs no reset.
The frequency guard generates a single reset pulse with a
duration of 0.875 ms when the actual frequency enters the
desired range of 14 to 18 MHz. If the frequency leaves this
range then no reset pulse is generated.
PSP
For dynamically changing data such as timing signals, the
programmable signal positioner generates them on the
basis of parameters sent by the microcontroller. For the
reset function of the microcontroller, a watchdog timer is
also built-in that creates a reset pulse unless it is triggered
by a change in the Bone signal within a preset time
(1.05 s).
1999 May 03
BOARD LEVEL TESTABILITY
Boundary scan test is implemented, according to
“IEEE standard 1149.1”. The boundary scan affects all
digital pins and will cover all connections from the
SAA4978H to other ICs that are also equipped with BST.
The connectivity of the analog YUV input/output pins can
also be tested with the use of BST.
SNERT
A SNERT interface is built-in to transform the parallel data
from the microcontroller into 1 or 2 Mbaud switchable
SNERT data. This interface is also capable of reading data
from the SNERT bus should it be required to access read
registers.
7.3.5
MICROCONTROLLER
16
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NAME
ADDRESS
HEX
READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
DESCRIPTION
Clamp registers (clamp position in steps of one pixel, only first quarter of line available)
CLAMP_START
300
write
X X X X X X X X clamp start position
CLAMP_STOP
301
write
X X X X X X X X clamp stop position
AGC_GAIN_Y
302
write
X X X X X X X X X set Y gain (−3 to +6 dB)
AGC_GAIN_U
303
write
X X X X X X X X X set U gain (−3 to +6 dB)
AGC_GAIN_V
304
write
X X X X X X X X X set V gain (−3 to +6 dB)
YUV_SELECT
305
write
OVERFLOW_11_HIGH
300
read
E
X X X X X X X X read HIGH byte level 11
OVERFLOW_11_LOW
301
read
E
X X X X X X X X read LOW byte level 11
OVERFLOW_10_HIGH
302
read
E
X X X X X X X X read HIGH byte level 10
OVERFLOW_10_LOW
303
read
E
X X X X X X X X read LOW byte level 10
OVERFLOW_01_HIGH
304
read
E
X X X X X X X X read HIGH byte level 01;
underflow/overflow
OVERFLOW_01_LOW
305
read
E
X X X X X X X X read LOW byte level 01;
underflow/overflow
306
write
AGC
Overflow detection control
X X select ADC (Y, U, V, V)
Philips Semiconductors
CONTROL REGISTER DESCRIPTION
Picture Improved Combined Network
(PICNIC)
1999 May 03
8
17
Digital front-end
DFRONTEND_CONTROLS1
X X X X X X X X
U_CLAMP_COR_FVAL
X X X U clamp correction value
(twos complement) used in external
correction mode
V_CLAMP_COR_FVAL
X X X
307
write
UV clamp correction mode (internal,
external, keep, keep)
X X X X X X X
UV_TAU
Y_DELAY
X X select UV clamp time constant
(4, 9, 19 and 39 lines)
X X
select Y delay (−1, 0, 1, 2)
Product specification
DFRONTEND_CONTROLS2
X X
SAA4978H
UV_COR_MODE
V clamp correction value
(twos complement) used in external
correction mode
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READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
MFF_WIDTH
DFRONTEND_CONTROLS3
X X X
308
write
select MFF width
(0, 3, 5, 7, 9, 9, 9 and 9 samples)
X X X X X
X X input λ settings (0, 1⁄16, 2⁄16, 3⁄16)
NLP_L_AD
NLP_U_AD
input µ settings (0, 1⁄4, 1⁄2, 1⁄2)
X X
NOTCH
ACT_VIDEO_WINDOW_H_START
DESCRIPTION
X
select notch (off, on)
309
write
X X X X X X X X
ACT_VIDEO_WINDOW_H_LENGTH 30A
write
X X X X X X X X
ACT_VIDEO_WINDOW_V_START
write
write
CLAMP_U_ERROR
306
read
0 X X X X X X X clamp offset in U (twos complement;
gain 16) used in internal correction
mode
CLAMP_V_ERROR
307
read
0 X X X X X X X clamp offset in V (twos complement;
gain 16) used in internal correction
mode
30D
write
X X X X X X X X
18
30B
ACT_VIDEO_WINDOW_V_LENGTH 30C
X X X X X X X X X
S
X X X X X X X X X not double buffered for PSP (WEA)
Philips Semiconductors
ADDRESS
HEX
Picture Improved Combined Network
(PICNIC)
1999 May 03
NAME
Bus A output control
BUS_A_CONTROL1
Y_BUS_A_8BIT_ROUND
X X Y bus A (9-bit rounded, 9-bit rounded,
8-bit dithered, 8-bit truncated)
Y_BUS_A_DITHER
X X X
SEL_422_OUT
X
UV_CORING
select 4 : 2 : 2 output format (4 : 1 : 1,
4 : 2 : 2)
X X
30E
write
select UV coring mode
(off, 0.5, 1.0, 1.5 LSB)
X X X X X X X
UV_BUS_A_DITHER
X X UV bus A (9-bit rounded,
9-bit rounded, 8-bit dithered,
8-bit rounded)
X X X
dithering mode on UV bus A (F1L1,
F1L2, F1L1, F1L2, F2L1, F2L2, F4L1,
F4L2)
SAA4978H
UV_BUS_A_8BIT_ROUND
Product specification
BUS_A_CONTROL2
dithering mode on Y bus A (F1L1,
F1L2, F1L1,F1L2, F2L1, F2L2, F4L1,
F4L2)
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READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
FORCE_BUS_A_TRI
X
WE_A_QUALIFIER
DESCRIPTION
force bus A output to 3-state including
WEA (off, on)
X
WEA definition (prequalifier, qualifier)
Bus B input control
BUS_B_CONTROL
30F
write
X X X X X X X
SEL_INPUT_FORMAT
X X select input format (4 : 2 : 2 external,
4 : 1 : 1 external, 4 : 2 : 2 internal,
4 : 2 : 2 internal)
SEL_DOUBLE_CLOCK
X
SEL_ASYNCHRONOUS
X
UV_INV
X
WE_B_QUALIFIER
X
19
INV656
select double input data rate (single,
double clock)
select asynchronous input clock
(synchronous, asynchronous clock)
invert U and V data (not inverted,
inverted)
WEB definition (prequalifier, qualifier)
X
invert MSB of bus B input (related to
656 based input)
Philips Semiconductors
ADDRESS
HEX
Picture Improved Combined Network
(PICNIC)
1999 May 03
NAME
TBC/SRC control
write
S
X X X X X X X X X control of compression/expansion at
line centre (twos complement:
−256 to +255)
C2
311
write
S
X X X X X X X X control of compression/expansion at
line edges (twos complement:
−128 to +127)
H_SHIFT_HIGH
312
write
S
X X X X X X X X horizontal shift (bits 15 to 8)
H_SHIFT_LOW
313
write
S
X X X X X X X X horizontal shift (bits 7 to 0)
H_DATAPATH_DELAY
314
write
S
X X X X X X X X horizontal data path delay (bits 7 to 0)
H_DATAPATH_DELAY_SKEW
315
write
S
X X X X X X X
H_DATAPATH_DELAY_MSB
SKEW_MULT
X X X X X horizontal data path delay
(bits 12 to 8)
X X
skew multiply factor (off, 1, undefined,
−1)
Product specification
310
SAA4978H
C0
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LIMERIC_THR_UP
316
write
LIMERIC_WANTED_VALUE
317
write
S
X X X X X X X X sensitivity of noise estimator
LIMERIC_TASTE_AND_COMP
318
write
S
X X X X X X X X
DESCRIPTION
Noise estimator
X X X X X X X X threshold to define the weight factor of
considered pixels
TASTE_VALUE
X X X X taste value
COMPENSATION_VALUE
LIMERIC_LB_DETAIL
X X X X
compensation value
(twos complement)
319
write
S
X X X X X X X X bottom limit of detail counter
LIMERIC_UB_DETAIL
31A
write
S
X X X X X X X X top limit of detail counter
LIMERIC_YP_AND_OVLPL
31B
write
S
X X X X X X X X
OVERLAP_VALUE
X X X X overlap level for noise estimator
(0 to 15)
PREFILTER_SCALING
X X
20
SOB_NEGLECT
X
INPUT8BIT
X
luminance prefilter scaling
(1, 1⁄2, 1⁄4, off)
Philips Semiconductors
READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
Picture Improved Combined Network
(PICNIC)
1999 May 03
ADDRESS
HEX
NAME
neglects the Sum Over a Block value
of those blocks that contain values
towards black and white;
(use, neglect) = (measure except
around black and white level, measure
everywhere
number of bits at input of NE block
(9, 8)
read
E
0 0 0 0 X X X X noise estimator value
NEST_FILT
309
read
E
X X X X X X X X filtered noise estimator value
DETAIL_CNT_H
30A
read
E
X X X X X X X X number of details detected in field
(HIGH byte)
DETAIL_CNT_L
30B
read
E
X X X X X X X X number of details detected in field
(LOW byte)
Product specification
308
SAA4978H
NEST
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READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
DESCRIPTION
Clamp noise reduction (CLINIC) control
CLINIC_CONTROL
31C
write
S
X X X X X X
K_SCALE
X X X select K scale
(4, 2, 1, 1⁄2, 1⁄4, 1⁄8, 1⁄16, 1⁄32)
K_ONE
X
CLINIC_OFF
select K is 1 versus adaptive
(adaptive, K = 1)
X
DITHER
CLINIC function off (on, off)
X
dither on (off, on)
CLINIC_MAX_DIFF
31D
write
S
X X X X X X X X maximum difference allowed between
actual and stored segment value
(bits 9 to 2)
CLINIC_THRESHOLD
31E
write
S
X X X X X X X X threshold to define motion in
segments (bits 9 to 2)
CLINIC_DIF_AND_THR_LSB
31F
write
S
X X X X
MAX_DIFF_LSB
21
X X maximum difference allowed between
actual and stored segment value
(bits 1 and 0)
THRESHOLD_LSB
X X
threshold to define motion in
segments (bits 1 and 0)
30C
read
E
X X X X X X X X number of events per field with motion
above threshold
TOT_COR_H
30D
read
E
X X X X X X X X accumulated absolute clamp
correction in field (bits 18 to 11)
TOT_COR_M
30E
read
E
X X X X X X X X accumulated absolute clamp
correction in field (bits 10 to 3)
TOT_COR_L
30F
read
E
0 0 0 0 0 X X X accumulated absolute clamp
correction in field (bits 2 to 0)
S
X X X X X X X X
Line memory and noise reduction (LIMERIC) control
write
N_DIST
X X select n_dist (2, 4, 8, 9)
PC_DIST
PE_DIST
X X
X X
select pc_dist (1, 2, 3, 4)
select pe_dist (5, 6, 7, 8)
SAA4978H
320
Product specification
NBR_EVENTS
LIMERIC_CONTROL
Philips Semiconductors
ADDRESS
HEX
Picture Improved Combined Network
(PICNIC)
1999 May 03
NAME
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READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
WEAVE
X
SEL_N_THR
DESCRIPTION
weave on (off, on)
X
select threshold from estimator versus
threshold from microcontroller
(estimator, microcontroller)
Band split peaking and coring
PEAKING_CONTROL1
321
write
S
X X X X
2D_PEAK_COEF
X X X 2D peaking coefficient
(0, 2⁄4, 3⁄4, 4⁄4, 5⁄4, 6⁄4, 7⁄4, 8⁄4)
CORE_THR
V_GAINSTR
X X X
X X X X
322
write
S
coring threshold (0, 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15 LSB)
X X X vertical peaking
(0, 1⁄8, 2⁄8, 3⁄8, 4⁄8, 5⁄8, 6⁄8, 7⁄8)
Noise reduction energy measurement
22
VHF_ENERGY_SUM_H
310
read
E
X X X X X X X X mean vertical energy measured in one
field (bits 15 to 8)
VHF_ENERGY_SUM_L
311
read
E
X X X X X X X X mean vertical energy measured in one
field (bits 7 to 0)
VHF_ENERGY_MAX
312
read
E
X X X X X X X X maximum vertical peak energy
measured in one field
BBD_FIRST_VIDEOLINE1
313
read
E
X X X X X X X X
1⁄
BBD_LAST_VIDEOLINE1
314
read
E
X X X X X X X X
1⁄
BBD_FIRST_VIDEOLINE2
315
read
E
X X X X X X X X
1⁄
BBD_LAST_VIDEOLINE2
316
read
E
X X X X X X X X
1⁄
BBD_WINDOW_H_START
323
write
S
X X X X X X X X
BBD_WINDOW_H_STOP
324
write
S
X X X X X X X X
BBD_WINDOW_V_START
325
write
S
X X X X X X X X X
BBD_WINDOW_V_STOP
326
write
S
X X X X X X X X X
Philips Semiconductors
ADDRESS
HEX
Picture Improved Combined Network
(PICNIC)
1999 May 03
NAME
Black bar position and control
2 number of first line after black bar
having video
2 number of last line before black bar
having video
2(number + 1) of first line after black
bar having video
Product specification
SAA4978H
2(number + 1) of last line before
black bar having video
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BBD_LOGO_LENGTH
327
write
S
X X X X X X X X number of non-black samples
permitted in a black bar line
BBD_SLICE_LEVEL1
328
write
S
X X X X X X X X
1⁄
BBD_SLICE_LEVEL2
329
write
S
X X X X X X X X
1⁄
BLACK_OFFSET
32A
write
S
X X X X X X X X definition of DC shift in Y
(twos complement)
LUT_DATA
32B
write
THRESHOLD_HIS
32C
write
S
X X X X X X X X if Yn − Yn − 1 > threshold then Yn is
added to the histogram
SPLIT_POSITION
32D
write
S
X X X X X X X X position of split point in steps of
4 pixels (left side unprocessed)
HISTOGRAM_CONTROL1
32E
write
DESCRIPTION
2 threshold to detect black
(detector 1)
2 threshold to detect black
(detector 2)
Histogram control
X X X X X X X X transfer of 32 bytes that define the
Y transfer LUT from microcontroller to
histogram (twos complement). The
first write after a field reset resets the
write pointer; subsequent write
operations increment the write pointer.
23
X X X X X X X not double buffered
HISTO_GAIN
X X X X histogram gain (0 to 15)
NOISE_RED
X
FILTER_1_ON
noise reduction on
X
FILTER_2_ON
1 : 2 : 1 filter on (off, on)
X
RESERVED WRITE ADDRESS
32F
write
YUV_IN_CONTROL
330
write
S
1 : 0 : 2 : 0 : 1 filter on (off, on)
X X X
X X
ROUND
UV_POS
X
UV_GAIN
X X
331
write
S
select UV ratio 128 versus 64
(64, 128)
follow if dy > 0 versus follow dy
(follow dy, follow if dy > 0)
UV gain (0, 1⁄2, 1, 2)
X X X X X X X X start of horizontal histogram window
SAA4978H
X
Product specification
X rounding versus truncating
(truncated, rounded)
RATIO_LIMIT
HGM_WINDOW_H_START
Philips Semiconductors
READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
Picture Improved Combined Network
(PICNIC)
1999 May 03
ADDRESS
HEX
NAME
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HGM_WINDOW_H_STOP
332
write
S
HGM_WINDOW_V_START
333
write
S
X X X X X X X X X start of vertical histogram window
HGM_WINDOW_V_STOP
334
write
S
X X X X X X X X X stop of vertical histogram window
HISTOGRAM_DATA
317
read
Y_MIN
318
read
E
X X X X X X X X minimum Y value in previous field
Y_MAX
319
read
E
X X X X X X X X maximum Y value in previous field
U_MIN
31A
read
E
X X X X X X X X minimum U value in previous field
U_MAX
31B
read
E
X X X X X X X X maximum U value in previous field
V_MIN
31C
read
E
X X X X X X X X minimum V value in previous field
V_MAX
31D
read
E
X X X X X X X X maximum V value in previous field
MAX_HISTO_VALUE
31E
read
E
X X X X X X X X maximum value in histogram of
previous field
SMART_BLACK
31F
read
E
X X X X X X X X black level indication (filtered Y_MIN)
THRESHOLD_HIGH
335
write
X X X X X X X X maximum level required for valid event
THRESHOLD_LOW
336
write
X X X X X X X X minimum level required for valid event
HIGH_TIME
337
write
X X X X X X X X minimum time above HIGH threshold
required for valid event
LOW_TIME
338
write
X X X X X X X X minimum time below LOW threshold
required for valid event
SUBTITLE_CONTROLS
339
write
DESCRIPTION
X X X X X X X X stop of horizontal histogram window
Histogram outputs
X X X X X X X X Histogram read command. The first
read after a field reset resets the read
pointer; subsequent read operations
increment the read pointer.
Philips Semiconductors
READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
Picture Improved Combined Network
(PICNIC)
1999 May 03
ADDRESS
HEX
NAME
24
Subtitle control
X X X
RESET_EVENTS
X reset events (cumulative, reset)
RESET_PEAK
SUBT_WINDOW_H_START
X
33A
write
X X X X X X X X
select event versus between
thresholds mode (within thresholds,
events)
select ‘every field’ versus ‘bleed’
(bleed, every field)
Product specification
X
SAA4978H
EVENT_MODE
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SUBT_WINDOW_H_STOP
33B
write
X X X X X X X X
SUBT_WINDOW_V_START
33C
write
X X X X X X X X X
SUBT_WINDOW_V_STOP
33D
write
X X X X X X X X X
EVENTS
280 to 2FF
read
DESCRIPTION
X X X X X X X X Events read command. Number of
transitions in the 128 lines of the
subtitle window.
read
321
read
BAR_ARRAY
33E
write
BAR_ARRAY_Y
33F
write
S
X X X X X X X X display bar luminance level
BAR_ARRAY_U
340
write
S
X X X X X X X X display bar U level (twos complement)
BAR_ARRAY_V
341
write
S
X X X X X X X X display bar V level (twos complement)
BAR_ARRAY_H_START
342
write
S
X X X X X X X X horizontal start position of the display
bars (see also
BAR_ARRAY_RESOLUTION)
BAR_ARRAY_V_START
343
write
S
X X X X X X X X vertical start position of the display
bars
BAR_ARRAY_WIDTH
344
write
S
X X X X X X X X the width of each bar in number of
lines (see also
BAR_ARRAY_RESOLUTION)
BAR_ARRAY_SPACE
345
write
S
X X X X X X X X the number of lines between two bars
(see also
BAR_ARRAY_RESOLUTION)
BAR_ARRAY_CONTROL
346
write
S
E
X X X X X X X X
1⁄
2 peak value of Y within the event
window
Bars control
25
BAR_ARRAY_ON
X X X X X X X X Bar array write command. The first
write after a field reset resets the write
pointer; subsequent write operations
increment the write pointer (see also
BAR_ARRAY_RESOLUTION).
X X X
X select bar array on (off, on)
Product specification
320
PEAK_Y
SAA4978H
RESERVED READ ADDRESS
Philips Semiconductors
READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
Picture Improved Combined Network
(PICNIC)
1999 May 03
ADDRESS
HEX
NAME
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READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
BAR_ARRAY_RESOLUTION
X
BAR_ARRAY_TRANS
DESCRIPTION
select bar array resolution
(BAR_ARRAY_H_START × 4,
BAR_ARRAY_WIDTH × 2,
BAR_ARRAY_SPACE × 2,
BAR_ARRAY × 4,
BAR_ARRAY_H_START × 2,
BAR_ARRAY_WIDTH × 1,
BAR_ARRAY_SPACE × 1,
BAR_ARRAY × 2)
X
select mashing versus superimpose
(superimpose, mashing)
Bus C output control
BUS_C_CONTROL1
347
write
S
X X X X X X X X
SEL422OUT
X select 4 : 2 : 2 output (4 : 1 : 1,
4 : 2 : 2) overridden by DPCM
UV_BUS_C_8BIT_ROUND
X X
26
UV bus C (9-bit rounded,
9-bit rounded, 8-bit dithered,
8-bit truncated)
MPIP
BUS_C_CONTROL2
multi-PIP mode (off, 2 × 2, 3 × 3,
4 × 4); see also memory write control
X X
UV_BUS_C_DITHER
X X X
348
write
S
dither line and field phase (f1l1, f1l2,
f1l1, f1l2, f2l1, f2l2, f4l1, f4l2)
X X X X X X X
DPCM
X DPCM output (4 : 1 : 1/4 : 2 : 2,
DPCM) overrides SEL422OUT
FORCE_BUS_C_TRI
X
Y_BUS_C_8BIT_ROUND
X X
Y bus C (9-bit rounded, 9-bit rounded,
8-bit dithered, 8-bit truncated)
dither line and field phase (f1l1, f1l2,
f1l1, f1l2, f2l1, f2l2, f4l1, f4l2)
Product specification
X X X
force bus C to 3-state including WEC
and IEC (off, on)
SAA4978H
Y_BUS_C_DITHER
Philips Semiconductors
ADDRESS
HEX
Picture Improved Combined Network
(PICNIC)
1999 May 03
NAME
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WE_WINDOW_H_START
349
write
X X X X X X X X start of horizontal write enable window
WE_WINDOW_H_STOP
34A
write
X X X X X X X X stop of horizontal write enable window
ACQ_EN_WINDOW_V_START
34B
write
X X X X X X X X X start of vertical write and input enable
window
ACQ_EN_WINDOW_V_STOP
34C
write
X X X X X X X X X stop of vertical write and input enable
window
IE_WINDOW_H_START
34D
write
X X X X X X X X start of horizontal input enable window
IE_WINDOW_H_STOP
34E
write
X X X X X X X X stop of horizontal input enable window
WE_IE_SHIFT
34F
write
DESCRIPTION
Field memory control
X X X X
WE_C_SHIFT
X X fine shift of WEC (0, 1, 2, 3 pixels)
IE_C_SHIFT
X X
fine shift of IEC (0, 1, 2, 3 pixels)
27
CHOP_CYCLE
350
write
X X chop cycle of WEC and IEC
(1, 1⁄2, 1⁄3, 1⁄4)
RE_WINDOW_H_START
351
write
X X X X X X X X define start of horizontal read enable
window
RE_WINDOW_H_STOP
352
write
X X X X X X X X define stop of horizontal read enable
window
RE_WINDOW_V_START
353
write
X X X X X X X X X define start of vertical read enable
window
RE_WINDOW_V_STOP
354
write
X X X X X X X X X define stop of vertical read enable
window
355
write
Philips Semiconductors
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DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
Picture Improved Combined Network
(PICNIC)
1999 May 03
ADDRESS
HEX
NAME
Bus D input control
BUS_D_CONTROL
S
X
SEL_INPUT_FORMAT
X X
X X select input format (4 : 2 : 2 external,
4 : 1 : 1 external, 4 : 2 : 2 internal,
DPCM external)
356
write
X X X X X X X X
BE_WINDOW_H_STOP
357
write
X X X X X X X X
BE_WINDOW_V_START
358
write
X X X X X X X X X
BE_WINDOW_V_STOP
359
write
X X X X X X X X X
select undither active (off, on)
Product specification
X
BE_WINDOW_H_START
SAA4978H
UNDITHER
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READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
35A
write
DESCRIPTION
CTI control
DBACKEND_CONTROLS1
X X X X X X
CTI_SEPARATE
X
CTI_PROTECTION
X
CTI_GAIN
select hill protection (off, on)
CTI gain (0, 1⁄8, 2⁄8, 3⁄8, 4⁄8, 5⁄8, 6⁄8, 7⁄8)
X X X
CTI_FILTER_ON
DBACKEND_CONTROLS2
X
35B
write
post-filter on (off, on)
X X X X X X X X
X X limit CTI range (0, ±4, ±8, ±12)
CTI_LIMIT
CTI_SUPERHILL
X
CTI_DDX_SEL
select super hill protection (off, on)
X
CTI_SUPERHILL
28
NLP_DA
separate U and V processing (linked,
separate)
select first differentiating filter
(−1 0 0 1, −1 −2 −1 1 2 1)
X X X X
35C
write
hill detection threshold (0, 1, 2, 3, 4, 5,
6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
X X X X
Philips Semiconductors
ADDRESS
HEX
Picture Improved Combined Network
(PICNIC)
1999 May 03
NAME
X X output λ settings (0, 1⁄8, 2⁄8, 3⁄8)
NLP_L_DA
NLP_U_DA
output µ settings (0, 1⁄4, 1⁄2, 1⁄2)
X X
Dynamic peaking and coring
PEAKING_CONTROL2
35D
write
S
X X X X X X X X
X X X α value
(0, 1⁄16, 2⁄16, 3⁄16, 4⁄16, 5⁄16, 6⁄16, 8⁄16)
ALPHA
BETA
DELTA
LUTREGA
β value
(0, 1⁄16, 2⁄16, 3⁄16, 4⁄16, 5⁄16, 6⁄16, 8⁄16)
X X X
δ value (0, 1⁄4, 1⁄2, 1)
X X
35E
write
S
X X X X X X X X programmable coring replacement
values for luminance levels 1 to 4
LEVEL2
X X
LEVEL3
X X
LEVEL4
LUTREGB
X X X
35F
write
S
level 2 (0, 1, 2, 3)
level 3 (0, 1, 2, 3)
level 4 (0, 1, 2, 3, 4, 5, 6, 7)
X X X X X X X X programmable coring replacement
values for luminance levels 5 to 7
Product specification
X level 1 (0, 1)
SAA4978H
LEVEL1
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READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
LEVEL5
DESCRIPTION
X X X level 5 (0, 1, 2, 3, 4, 5, 6, 7)
LEVEL6
X X X
LEVEL7
level 6 (0, 1, 2, 3, 4, 5, 6, 7)
X X
level 7 (4, 5, 6, 7)
COR_THR
360
write
S
X X X X X X X X local energy above coring-threshold
switches off coring
PEAKING_CONTROL3
361
write
S
X X X X X X X X
X X X τ value
(0, 1⁄16, 2⁄16, 3⁄16, 4⁄16, 5⁄16, 6⁄16, 8⁄16)
TAU
NEGGAIN
X X
CORING
X
ENERGY_SEL
ENERGY_SELECT_V_START
X X
362
write
negative gain value (0, 1⁄4, 1⁄2, 1)
coring (coarse, fine) in accordance
with LUTREGA and LUTREGB;
see Fig.13
energy select (high × 4, mid, low, high)
X X X X X X X X X start of vertical energy select window
29
ENERGY_SELECT_V_STOP
363
write
RESERVED READ ADDRESS
322
read
E
X X X X X X X X X stop of vertical energy select window
X X X X X X X X
RESERVED READ ADDRESS
323
read
E
X X X X X X X X
ENERGY_MAX
324
read
E
X X X X X X X X maximum peak energy measured in
one field
Philips Semiconductors
ADDRESS
HEX
Picture Improved Combined Network
(PICNIC)
1999 May 03
NAME
Blanking control (definition of blanking window)
BLANKING_WINDOW_H_START
364
write
X X X X X X X X
BLANKING_WINDOW_H_STOP
365
write
X X X X X X X X
BLANKING_WINDOW_V_START
366
write
X X X X X X X X X
BLANKING_WINDOW_V_STOP
367
write
X X X X X X X X X
BORDER_SIDE_H_START
368
write
X X X X X X X X start of right border
BORDER_SIDE_H_STOP
369
write
X X X X X X X X end of left border
BORDER_SIDE_V_START
36A
write
X X X X X X X X X start of lower border
BORDER_SIDE_V_STOP
36B
write
X X X X X X X X X stop of upper border
BORDER_BAR_H_START
36C
write
Border control
36D
write
X X X X X X X X width of horizontal bars
BORDER_BAR_V_START
36E
write
X X X X X X X X X start of first vertical bar
Product specification
BORDER_BAR_H_WIDTH
SAA4978H
X X X X X X X X start of first horizontal bar
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BORDER_BAR_V_WIDTH
36F
write
BORDER_REPEAT_H
370
write
BORDER_REPEAT_V
371
write
BORDER_Y
372
write
X X X X X X X X Y value of sides and bars
BORDER_U
373
write
X X X X X X X X U value of sides and bars
(twos complement)
BORDER_V
374
write
X X X X X X X X V value of sides and bars
(twos complement)
375
write
DESCRIPTION
X X X X X X X X X width of vertical bars
X X X X X X X X horizontal repeat value
X X X X X X X X X vertical repeat value
PLL
PLL_CK_AND_CD
V
PLL_CK
V
PLL_CD
V
PLL_IDTO_PLUS_VARIOUS
376
write
PLL_IDTO(18-16)
X X X X X X X X
X X X X X K factor control (0 to 31)
X X X
damping control (0 to 7)
X X X
V
30
PLL_OFF
X
PLL_OPEN
V
DO_SNAP
X X X
X X X increment offset for DTO bits 18 to 16
(twos complement; bit 18 is the sign
bit)
X
X
Philips Semiconductors
READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
Picture Improved Combined Network
(PICNIC)
1999 May 03
ADDRESS
HEX
NAME
PLL off; keep output frequency
(off, on)
PLL open loop mode (closed, open)
do snapshot
PLL_IDTO(15-8)
377
write
V
X X X X X X X X increment offset for DTO bits 15 to 8
PLL_IDTO(7-0)
378
write
V
X X X X X X X X increment offset for DTO bits 7 to 0;
transfers all bits (18 to 0)
PLL_SKEW_DELAY
379
write
PLL_PE_MAX(15-8)
325
read
V
X X X X X X X X maximum phase offset during field
HIGH byte
PLL_PE_MAX(7-0)
326
read
V
X X X X X X X X maximum phase offset during field
LOW byte; transfers all bits (15 to 0)
PLL_PE_MIN(15-8)
327
read
V
X X X X X X X X minimum phase offset during field
HIGH byte
X X X skew transferred:
512 × (1 + PLL_SKEW_DELAY)
clocks after HREF;
PLL_SKEW_DELAY (0 to 7)
Product specification
SAA4978H
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PLL_PE_MIN(7-0)
328
read
V
X X X X X X X X minimum phase offset during field
LOW byte; transfers all bits (15 to 0)
PLL_PE_SUM(15-8)
329
read
V
X X X X X X X X accumulated phase offset during field
HIGH byte
PLL_PE_SUM(7-0)
32A
read
V
X X X X X X X X accumulated phase offset during field
LOW byte; transfers all bits (15 to 0)
PLL_PE_SABS(15-8)
32B
read
V
X X X X X X X X accumulated absolute phase offset
during field HIGH byte
PLL_PE_SABS(7-0)
32C
read
V
X X X X X X X X accumulated absolute phase offset
during field LOW byte; transfers all
bits (15 to 0)
PLL_INC_OFFSET(19-16)
32D
read
V
0 0 0 0 X X X X increment offset bits 19 to 16
(twos complement; bit 19 is the sign
bit)
PLL_INC_OFFSET(15-8)
32E
read
V
X X X X X X X X increment offset bit HIGH byte
PLL_INC_OFFSET(7-0)
32F
read
V
X X X X X X X X increment offset bit LOW byte;
transfers all bits (19 to 0)
PLL_CKA_VALUE
330
read
V
0 0 0 X X X X X actual K value
PLL_ADAPT_STATUS
331
read
V
0 0 0 0 0 0 0 X PLL adaptive status (locked,
unlocked)
RESERVED READ ADDRESS
332
read
HA_VALUE
333
read
X X X X X X X X available after VA or
COPY_VALUE_STROBE
VA_VALUE
334
read
X X X X X X X X as HA_VALUE; bit 8 in register
VARIOUS_BITS
HD_VALUE
335
read
X X X X X X X X available after VD or
COPY_VALUE_STROBE
VD_VALUE
336
read
X X X X X X X X as HD_VALUE; bit 8 in register
VARIOUS_BITS
PIP_RISING_EDGE_POS
337
read
X X X X X X X X
PIP_FALLING_EDGE_POS
338
read
X X X X X X X X
INTR_0_SOURCE
339
read
0 0 0 0 0 0 X X interrupt read; register reset after
read
DESCRIPTION
Philips Semiconductors
READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
Picture Improved Combined Network
(PICNIC)
1999 May 03
ADDRESS
HEX
NAME
31
Read registers PSP
Product specification
SAA4978H
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DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
VA_INTR_ACTIVE
X VA interrupt active (not active, active)
WE_INTR_ACTIVE
VARIOUS_BITS
DESCRIPTION
X
33A
read
WE interrupt active (not active, active)
0 0 0 0 0 0 X X
VA_VALUE_MSB
X MSB of VA
VD_VALUE_MSB
X
MSB of VD
Various PSP control
32
VA_SYNC_WINDOW_START
37A
write
X X X X X X X X X start of vertical VA_SYNC enable
window
VA_SYNC_WINDOW_STOP
37B
write
X X X X X X X X X stop of vertical VA_SYNC enable
window
VA_INC_HOR_POS
37C
write
X X X X X X X X horizontal position of VA_COUNTER
clock
HREF_EXT_START
37D
write
X X X X X X X X start HREFEXT pulse
HREF_EXT_STOP
37E
write
X X X X X X X X stop HREFEXT pulse
INTR_AND_SYNC_ENABLE
37F
write
X X X
X X X
INTR_VA_ENABLE
Philips Semiconductors
ADDRESS
HEX
Picture Improved Combined Network
(PICNIC)
1999 May 03
NAME
X VA interrupt enable (disabled,
enabled)
INTR_WE_ENABLE
X
INTR_VD_ENABLE
X
HD_CNTR_RST_BY_HDREF
X
DIVIDE_VD_INC
X
SEL_HA_CLAMP
X
WE interrupt enable (disabled,
enabled)
VD interrupt enable (disabled,
enabled)
HD counter reset from HD_REF
(no reset, reset by HD_REF)
divide VD_INC by 2 (100 Hz,
progressive scan mode)
select clamp-counter reset
(HA_REF, HA)
write
X X X X X X X X X delay in number of lines delay at
pin 157 caused by VA
HD_START
381
write
X X X X X X X X start HD pulse
HD_STOP
382
write
X X X X X X X X stop HD pulse
VD_HOR_POS
383
write
X X X X X X X X horizontal phase of VD
H_EXT_POS
384
write
X X X X X X X X HD counter length
Product specification
380
SAA4978H
INTR_VA_DELAY
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INTR_VD_DELAY
385
write
X X X X X X X X X value of COUNTER_VD that initiates
interrupt 1
PLL_OFF_START
386
write
X X X X X X X X X vertical start of PLL_OFF window
PLL_OFF_STOP
387
write
X X X X X X X X X vertical stop of PLL_OFF window
DISPLAY_CONTROL
388
write
DESCRIPTION
X X X X X X X X
RE_SHIFT
X X RE pixel shift (0, 1, 2, 3)
ENABLE_RESET_BLANK
X
PIXEL_REPETITION
enable blank reset (disabled, enabled)
X
ENABLE_BORDER_V_BAR
enable pixel repetition (disabled,
enabled)
X
ENABLE_BORDER_V_SIDE
enable vertical bars (disabled,
enabled)
X
ENABLE_BORDER_H_BAR
enable vertical sides (disabled,
enabled)
X
33
ENABLE_BORDER_H_SIDE
enable horizontal bars (disabled,
enabled)
X
enable horizontal sides (disabled,
enabled)
write
ACQ_WINDOWS_RESET
38A
write
TRIGGER to reset acquisition
windows
COPY_VALUE_STROBE
38B
write
TRIGGER to copy register values
TRIGGER_FLYBACK
38C
write
TRIGGER to set VD output
TRIGGER_SCAN
38D
write
TRIGGER to reset VD output
COUNTER_VD_RESET
38E
write
TRIGGER to reset VD counter
INTR_1_RESET
38F
write
TRIGGER to reset interrupt 1
DISPLAY_WINDOWS_RESET
390
write
TRIGGER to reset display windows
SEL_1FH
391
write
X select back-end clock at 16 MHz for
1fH processing (32 MHz, 16 MHz)
BUS_B_VREF
392
write
NRPXDIV4
393
write
X X X X X X X X X vertical start field reference for bus B
S
X X X X X X X X
1⁄
4 of horizontal length of video data in
data path
Product specification
389
SAA4978H
RESERVED WRITE ADDRESS
Philips Semiconductors
READ/
DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
Picture Improved Combined Network
(PICNIC)
1999 May 03
ADDRESS
HEX
NAME
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DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
394
write
DESCRIPTION
Testing
RESET_CONTROL
X
FIELD_RESET
X
TEST_Y_IN_D
33B
read
X X X X X X X X test receive register at bus D; Y input
TEST_UV_IN_D
33C
read
X X X X X X X X test receive register at bus D; UV input
395
write
X X X X X X X X test register for analog functions;
normal application mode: 49H
Analog blocks
ANASWITCH
CLAMP_ACTIVE
X clamp active
STDIFF_CONV
X
STDIFF_CONV_AGC
X
STDIFF_CONV_AGC_FILTER
single to differential converter and
AGC
X
34
FRONTEND_TO_OUTPUT
single to differential converter, AGC
and filter
X
ATT_OUT
front-end to output
X
ATT_RECONSTRUCT_OUT
attenuator to output
X
FRONTEND_TO_BACKEND
RESERVED WRITE ADDRESS
attenuator and reconstruction filter to
output
X
396
write
RESERVED WRITE ADDRESS
397
write
TM_AD_DA
398
write
front-end to back-end
X X X X
X
X X X test mode AD, DA blocks
TM_ADDA2
X ADC and DAC test
TM_ADDA1
TM_AD2DA
single to differential converter
Philips Semiconductors
ADDRESS
HEX
Picture Improved Combined Network
(PICNIC)
1999 May 03
NAME
X
X
ADC and DAC test
direct bypass from ADC to DAC
Product specification
SAA4978H
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DOUBLE
8 7 6 5 4 3 2 1 0
WRITE BUFFERED(1)
DESCRIPTION
SNERT control (these registers are implemented as special function register, they have a HEX address outside the normal control register
range)
SNCON
98
read/
write
X 0 0 0 0 0 X X SNERT control register (reset on bit 1
of register $E8: power-on reset)
TRM
read
X SNERT transmit busy flag
REC
read/
write
MB2
read/
write
X
X
SNERT receive busy flag
SNERT baud rate (1 MHz, 2 MHz)
SNADD
99
write
X X X X X X X X address of SNERT message to be
transmitted
SNWDA
9A
write
X X X X X X X X data of SNERT message to be
transmitted
SNRDA
9B
read
X X X X X X X X data from SNERT bus after a
completed reception
35
Note
Philips Semiconductors
ADDRESS
HEX
Picture Improved Combined Network
(PICNIC)
1999 May 03
NAME
1. Blank means not double buffered; E means double buffered and data available at end of active video; S means double buffered and data clocked in
at start of active video; V means double buffered and data valid at start of VA.
Product specification
SAA4978H
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
9 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VDDA
analog supply voltage
−0.5
+6
V
VDDD; VDDO
digital supply voltage
−0.5
+6
V
∆VDDA − DDD
supply voltage difference between analog and
digital supply voltages
−0.5
+0.5
V
∆VDDA − DDO
supply voltage difference between analog and
output supply voltages
−0.5
+0.5
V
VI
input voltage for all digital input and digital I/O pins −0.5
+5.5
V
Vi
analog input voltage
−0.3
VDDA + 0.3
V
Tstg
storage temperature
−55
+150
°C
Tj
operating junction temperature
0
125
°C
10 THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
Rth(j-a)
thermal resistance from junction to ambient
Rth(j-c)
thermal resistance from junction to case
1999 May 03
36
in free air
VALUE
UNIT
25
K/W
2
K/W
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
11 CHARACTERISTICS
VDDD = VDDA = 3.3 V; AGC at 0 dB; Tamb = 25 °C; nominal parameter settings: 2fH/100 Hz mode; features transparent;
equalized frequency response test signal: EBU colour bar 100/0/75/0 “CCIR471-1”; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDDD
digital supply voltage
3.0
3.3
3.6
V
VDDA
analog supply voltage
3.15
3.3
3.45
V
VDD(I/O)
microcontroller I/O supply
voltage
3.0
−
5.5
V
VDDO
digital supply voltage for
outputs
3.0
3.3
3.6
V
total power dissipation
−
−
1.6
W
Dissipation
Ptot
YUV input processing (including AGC)
YAGC
Y AGC setting to obtain
full ADC range
Vi(Y)(b-w) = 1.0 V (p-p);
note 1
117
132
148
−
UAGC
U AGC setting to obtain
full ADC range
Vi(U) = 1.33 V (p-p); note 1 120
136
151
−
VAGC
V AGC setting to obtain
full ADC range
Vi(V) = 1.05 V (p-p); note 1 117
132
148
−
∆EG(YUV)all
overall input to output gain f = 0 to 2.5 MHz (analog
error between Y, U and V filters off)
−5.6
−
+5.6
%
∆EG(UV)i
gain error between
U and V inputs
f = 0 to 2.5 MHz (analog
filters off) from input to
digital domain
−
1
3.2
%
∆EG(UV)all
overall gain error between
U and V
f = 0 to 2.5 MHz (analog
filters off) from input to
output
−
1.2
4.0
%
∆EG(f)(UV)i
filtered gain error
between U and V input
f = 0 to 1.25 MHz (analog
filters on) from input to
digital domain
−
2
6.4
%
∆EG(f)(UV)all
overall filtered gain error
between U and V
f = 0 to 2.5 MHz (analog
filters on) from input to
output
−
2.5
8
%
Ci
input capacitance
−
7
15
pF
ILI
input leakage current
−
−
100
nA
∆GAGC(min-max) difference in gain
between AGC minimum
and maximum
9
9.5
10
dB
GAGC(acc)
AGC gain accuracy digital
−
9
−
bits
Gstep(AGC)
step resolution gain of
AGC
−
−
0.4
%
1999 May 03
clamp not active;
0 < Vi < VDDA + 0.3
maximum gain variation
per step
37
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SYMBOL
αct
PARAMETER
crosstalk between inputs
and outputs
SAA4978H
CONDITIONS
MIN.
TYP.
MAX.
UNIT
f = 0 to 1 MHz;
Zsource = 200 Ω
−
−
50
dB
f = 1 to 5 MHz;
Zsource = 200 Ω
−
−
44
dB
Input clamp processing (Y clamp level digital 32; U and V clamp level digital 0 in twos complement)
Eclamp(stat)(Y)
static clamp error in
Y channel
−5.0
−
+2.0
LSB
Eclamp(stat)(UV)
static clamp error in
UV channel
digital correction circuit off −3.0
−
+3.0
LSB
Eclamp(dyn)
dynamic clamp error
average value (1 σ)
−
−
0.25
LSB
Cclamp
clamping capacitance
10
22
−
nF
Rsource
source resistance
−
−
350
Ω
Iclamp(max)
maximum clamp current
−160
−
+160
µA
Tilt
maximum drift in one line
period
−
−
0.25
LSB
Vi(clamp)(Y)
Y input clamping voltage
−
−
mV
over complete AGC range 600
Input transfer functions (sample rate 16 MHz; 9 bits); see Fig.7
fi(s)(max)
maximum input sample
frequency
18
−
−
MHz
δclk
duty factor of (internal)
clock cycle
40
−
60
%
INL
DC integral non linearity
ramp input signal; AGC
on; filters off
−2
−
+2
LSB
DNL
DC differential non
linearity
ramp input signal; note 2
−0.99
−
+0.99
LSB
SNR
overall signal-to-noise
ratio (no harmonics) from
input to output
note 3
50
52
−
dB
Φdiff(UV)
differential phase in
U and V
−
1
2.5
deg
Gdiff(Y)
differential gain in Y
front-end
Y within 0.2 to 0.75 V
−
−
1.5
%
Φdiff(Y)
differential phase in Y
front-end
Y within 0.2 to 0.75 V
−
−
1
deg
SVRR
supply voltage ripple
rejection
filters off; note 4
35
−
−
dB
PLL function (base frequency 32 MHz)
σline-line
sigma value of line-to-line
jitter
locked to stable HA;
note 5
−
0.4
1.0
ns
σfield-field
sigma value of
field-to-field jitter
locked to stable HA;
note 5
−
0.4
1.0
ns
funlock
frequency in unlocked
state
30.7
32
33.3
MHz
1999 May 03
38
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SYMBOL
PARAMETER
SAA4978H
CONDITIONS
MIN.
TYP.
MAX.
UNIT
YUV output processing; note 6; see Fig.6
Vo(Y)(b-w)
Y black-to-white output
voltage
ZL = 10 kΩ
0.96
1.00
1.04
V
Vo(U)(p-p)
U output voltage
(peak-to-peak value)
ZL = 10 kΩ
1.27
1.33
1.38
V
Vo(V)(p-p)
V output voltage
(peak-to-peak value)
ZL = 10 kΩ
1.01
1.05
1.09
V
∆EG(UV)o
gain error between
U and V output
f = 0 to 2.5 MHz (analog
filters off) from digital
domain to output
−
−
2.5
%
∆EG(f)(UV)o
filtered gain error
between U and V output
f = 0 to 2.5 MHz (analog
filters on) from digital
domain to output
−
−
5
%
Zo
output impedance
f = 0 to 10 MHz
65
75
85
Ω
VY(d)(0)
Y super black level
voltage at 0
VbY = black level voltage
VbY − 0.63 VbY − 0.6
VY(d)(1023)
Y super white (headroom)
voltage at 1023
VbY = black level voltage
VbY + 1.47 VbY + 1.53 VbY + 1.59 V
VY(d)(288)
Y black level voltage
at 288
VbY = black level voltage
−
VY(d)(768)
Y white level voltage
at 768
VbY = black level voltage
VbY + 0.96 VbY + 1.0
VbY + 1.04 V
VU(d)(0)
U voltage at 0
−
−
VU(d)(1023)
U voltage at 1023
VbU = lower U voltage;
note 7
VV(d)(0)
V voltage at 0
−
VV(d)(1023)
V voltage at 1023
VbV = lower V voltage;
note 7
VbV + 1.13 VbV + 1.18 VbV + 1.23 V
αres(clk)
residual clock attenuation
related to YOUT
f = 32 or 16 MHz
−
−
40
dB
33.4
−
−
MHz
VbY
VbU
VbY − 0.57 V
−
V
V
VbU + 1.43 VbU + 1.49 VbU + 1.55 V
VbV
−
V
Output transfer functions (sample rate 32 MHz; 10 bits)
fclk(max)
maximum sample clock
δclk
duty factor of clock cycle
40
−
60
%
INL
DC integral non linearity
−2
−
+2
LSB
DNL
DC differential non
linearity
−0.75
−
+0.75
LSB
note 2
Digital output bus A and C, WEA, WEC, IEC and HREFEXT (CL = 15 pF; IOL = 2 mA; RL = 2 kΩ); timing referred
to CLK16, HREFEXT is not a 3-state output
VOH
HIGH-level output voltage
2.4
−
−
V
VOL
LOW-level output voltage
−
−
0.4
V
IOZ
output current in 3-state
mode
−
−
1.0
µA
Vext(OZ)
external applied voltage
in 3-state mode
−
−
VDDO + 0.3 V
td(o)
output delay time
−
−
30
1999 May 03
−0.1 < Vo < VDDO + 0.1
see Fig.4
39
ns
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SYMBOL
PARAMETER
th(o)
output hold time
SR
slew rate
SAA4978H
CONDITIONS
see Fig.4
MIN.
TYP.
MAX.
UNIT
4
−
−
ns
200
500
700
mV
--------ns
Digital input bus B and D; timing referred to CLK32 for bus D and to CLK16, CLK32 or CLKAS for bus B (see
Fig.4); the reference for bus B depends on the selected mode respectively single clock, double clock or
asynchronous clock
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
tsu(i)
input set-up time
th(i)
input hold time
0
−
0.8
5 V tolerant
2.0
−
5.5
V
see Fig.4
6
−
−
ns
see Fig.4
1
−
−
ns
0
−
0.8
V
2.0
−
5.5
V
V
CLKAS
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
th(i)(async)
asynchronous input hold
time
4
−
−
ns
tL(min)
minimum LOW time
−
−
10
ns
tH(min)
minimum HIGH time
−
−
10
ns
TCLKAS(min)
minimum period time
TCLK32
−
−
ns
5 V tolerant
the asynchronous clock
may not be faster than
CLK32
CLK16 and CLK32 (CL = 30 pF; IOL = 2 mA; RL = 2 kΩ)
VOL
LOW-level output voltage
0
−
0.4
V
VOH
HIGH-level output voltage
2.4
−
−
V
to(r)
output rise time
see Fig.4
2
3
4
ns
to(f)
output fall time
see Fig.4
2
3
4
ns
tdHO
CLK16 HIGH transition
delay time
see Fig.5
−
−
20
ns
thHO
CLK16 HIGH transition
hold time
see Fig.5
4
−
−
ns
tdLO
CLK16 LOW transition
delay time
see Fig.5
−
−
20
ns
thLO
CLK16 LOW transition
hold time
see Fig.5
4
−
−
ns
RED, HD and VD (CL = 15 pF; IOL = 2 mA; RL = 2 kΩ); timing referred to CLK32; see Fig.4
VOH
HIGH-level output voltage
2.4
−
−
V
VOL
LOW-level output voltage
−
−
0.4
V
td(o)
output delay time
see Fig.4
−
−
20
ns
th(o)
output hold time
see Fig.4
4
−
−
ns
SR
slew rate
200
500
700
mV
--------ns
1999 May 03
40
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SYMBOL
PARAMETER
SAA4978H
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Oscillator stage (operation with crystal or external clock)
fosc
oscillator frequency
CL34
CL35
recommended load
capacitor
Rser1(xtal)
crystal series resistance
Cpar(xtal)
crystal parallel
capacitance
−
12
−
MHz
−
12
−
pF
−
18
−
pF
see Fig.12
−
−
250
Ω
see Fig.12
−
−
7
pF
0.7VDDIO
−
−
V
−
−
0.3VDDIO
V
−
−
0.4
V
see Fig.11
I2C-bus signal: SDA and SCL; note 8
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
VOL
LOW-level output voltage
fSCL
SCL clock frequency
−
−
400
kHz
tHD;STA
hold time START condition
0.6
−
−
µs
tSCLL
SCL LOW time
1.3
−
−
µs
tSCLH
SCL HIGH time
0.6
−
−
µs
tSU;DAT
data set-up time
100
−
−
ns
tSU;DAT1
data set-up time (before
repeated START
condition)
0.6
−
−
µs
tSU;DAT2
data set-up time (before
STOP condition)
0.6
−
−
µs
tSU;STA
set-up time repeated
START
0.6
−
−
µs
tSU;STO
set-up time STOP
condition
0.6
−
−
µs
IOL = 3.0 mA
SNERT bus timing valid for both 1 and 2 Mbaud: SNDA and SNCL; see Fig.10
VOH
HIGH-level output voltage
IOH = −0.06 mA
2.4
−
−
V
VOL
LOW-level output voltage
IOL = 1.6 mA
−
−
0.4
V
VIL
LOW-level input voltage
0
−
0.8
V
VIH
HIGH-level input voltage
2.0
−
5.5
V
tsu(i)(SNCL)
input set-up time to SNCL
80
−
−
ns
th(i)(SNCL)
input hold time to SNCL
0
−
−
ns
th(o)
output hold time
50
−
−
ns
tsu(o)
output set-up time
260
−
−
ns
tdis(o)
output disable time
−
−
200
ns
tcy(SNCL)
SNCL cycle time
500
−
1000
ns
tSNRSTH
SNRST pulse HIGH time
500
−
−
ns
td(SNRST-DAT)
delay SNRST pulse to
data
200
−
−
ns
1999 May 03
41
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SYMBOL
PARAMETER
SAA4978H
CONDITIONS
MIN.
TYP.
MAX.
UNIT
HA and VA (horizontal and vertical sync input)
VIL
LOW-level input voltage
0
−
0.8
V
VIH
HIGH-level input voltage
2.0
−
5.5
V
AC characteristics parallel bus: P0, P2, ALE and PSEN (external ROM access); see Fig.8
tW(ALE)
ALE pulse width
−
62.5
−
ns
tAVLL
address valid to ALE LOW
17
−
−
ns
tLLAX
address hold after ALE
LOW
20
−
−
ns
tLLIV
ALE LOW to instruction
input
−
−
96
ns
tLLPL
ALE LOW to PSEN LOW
−
31.25
−
ns
tW(PSEN)
PSEN pulse width
−
93.75
−
ns
tPLIV
PSEN LOW to valid
instruction input
−
−
60
ns
tPXIX
input instruction hold after
PSEN
0
−
−
ns
tPXIZ
input instruction float after
PSEN
−
−
30
ns
tAVIV
address to valid
instruction input
−
−
128
ns
tPLAZ
PSEN LOW to address
float
−
−
10
ns
DC characteristics microcontroller pins: P0, P1, INT0, INT1, T0, T1, RSTW, RSTR, SNDA, SNCL, ALE,
PSEN and EA
VOH
HIGH-level output voltage
IOH = −0.06 mA
2.4
−
−
V
VOL
LOW-level output voltage
IOL = 1.6 mA
−
−
0.4
V
VIL
LOW-level input voltage
0
−
0.8
V
VIH
HIGH-level input voltage
2.0
−
5.5
V
ILI
input leakage current
−
−
±10
µA
CI/O
pin capacitance
−
−
10
pF
Analog Y, U and V input filters (3rd-order linear phase filter with notch at fCLK); see Fig.6
f(−3dB)
3 dB down frequency
5.4
5.6
5.8
MHz
α(0.5)
attenuation at 1⁄2fCLK
(8 MHz)
7
8
−
dB
αsb
stop band attenuation
(after notch)
32
−
−
dB
fnotch
notch frequency
tuned to 1⁄2fCLK
15.3
16
16.7
MHz
td(g)
group delay
at 4 MHz signal frequency 52
55
58
ns
1999 May 03
42
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SYMBOL
PARAMETER
SAA4978H
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Analog Y, U and V output filters (3rd-order linear phase filter with notch at fCLK)
f(−3dB)
3 dB down frequency
11.3
11.7
12.1
MHz
7
8
−
dB
32
−
−
dB
30.6
32
33.4
MHz
α(0.5)
attenuation at
(16 MHz)
αsb
stop band attenuation
(after notch)
fnotch
notch frequency
tuned to 1⁄2fCLK
td(g)
group delay
at 8 MHz signal frequency 26
td(g)(tol)
group delay tolerance
between channels
1⁄ f
2 CLK
−
28
31
ns
−
5
ns
Notes
1. With AGC at −3 dB, Y full ADC range is obtained at Vi = 1.41 V; with AGC at 6 dB, Y full ADC range is obtained at
Vi = 0.5 V; with AGC at −3 dB, U full ADC range is obtained at Vi = 1.89 V; with AGC at 6 dB, U full ADC range is
obtained at Vi = 0.67 V; with AGC at −3 dB, V full ADC range is obtained at Vi = 1.48 V; with AGC at 6 dB, V full ADC
range is obtained at Vi = 0.52 V; at AGC attenuation more than 0 dB, where the input signal has an amplitude above
the nominal value, the input processing and transfer function may have decreased specification.
2. DNL is defined as deviation of the code length from the average code length in LSB;
qn
DNL = max(-----------------) : 0.99LSB means no missing code.
q av – 1
3. Measurements taken using video analyzer VM700A at YUV output, control bit SEL_1FH (address 391H) set to
logic 1, internal analog filters off, AGC gain (addresses 302H, 303H and 304H) set to 074H, digital processing in
between, digital filters off, sampling frequency of 16 MHz.
4. Supply Voltage Ripple Rejection (SVRR) is a relative variation of the full scale analog input for a supply variation of
0.25 V over a frequency range from 20 Hz to 50 kHz. This includes 1⁄2fV, fV, 2fV, fH and 2fH which are major load
frequencies.
5. Measurements carried out using Modulation Domain Analyzer HP53310A after change of control bit PLL_OPEN
(address 376H) from logic 1 to logic 0 (open to closed-circuit). Control bits PLL_CK (address 375H) set to logic 0.
Control bits PLL_CD (address 375H) set to 7.
6. The outputs are able to drive an external low-pass filter without slewing. In fH and 2fH this filter is of the type as
described in Fig.6. For calculating an output filter the typical output impedance is also given in Fig.6.
7. The output levels for U and V have 1 dB reserve headroom in case of a 75% saturated colour bar. The maximum
levels are 1.33 V + 1 dB = 1.49 V for U and 1.05 V + 1 dB = 1.18 V for V. Due to 1 dB headroom the typical AGC
setting to obtain 0 dB from input to output for U and V is 83.
8. The AC characteristics are in accordance with the I2C-bus specification for fast mode (clock frequency maximum
400 kHz). Information about the I2C-bus can be found in the brochure “I2C-bus and how to use it” (order number
9398 393 40011).
1999 May 03
43
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
tf
handbook, full pagewidth
tr
90%
90%
CLOCK
1.5 V
10%
10%
INPUT
DATA
MHB175
tsu(i)
OUTPUT
DATA
th(i)
data
valid
data transition
period
th(o)
td(o)
Fig.4 Data input/output timing diagram.
handbook, full pagewidth
CLK32
CLK16
thLO
MHB176
thHO
tdLO
tdHO
Fig.5 Timing relationship between CLK32 and CLK16.
1999 May 03
44
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
typical output
impedance internally
handbook, full pagewidth
external load
5 µH (2.5)
90 Ω
Vbuffer
70 Ω
0.3 Ω
200 Ω
Cp =
10 pF
0.5 µH
20 pF (10)
Vo
51 pF
(25.5)
210 pF
(105)
MHB177
Possible external load to be driven by output buffer without slewing.
Cp is including parasitic capacitance of the application.
Values in brackets are 2fH mode.
Fig.6 Output load circuit.
handbook, full pagewidth
4.43 MHz burst
0.2 V
64 µs
1.0 V
MHB178
Fig.7 Test signal for differential gain and phase measurements.
1999 May 03
45
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S4
S5
S6
CDCLK
tW(ALE)
tLLIV
ALE
tAVLL
tW(PSEN)
tLLPL
tPLIV
PSEN
46
tPXIZ
tPLAZ
tPXIX
tLLAX
PORT 0
Philips Semiconductors
S3
Picture Improved Combined Network
(PICNIC)
book, full pagewidth
1999 May 03
S2
S1
A0 to A7
INSTRUCTION INPUT
tAVIV
PORT 2
A8 to A15
MHB179
Product specification
SAA4978H
Fig.8 Program memory access timing.
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
Table 1
SAA4978H
YUV formats; note 1
I/O PIN
4:2:2
FORMAT
4 : 1 : 1 FORMAT
4 : 2 : 2 FORMAT
DOUBLE CLOCK
4 : 2 : 2 DPCM
FORMAT
YX8
Y07
Y17
Y27
Y37
Y07
Y17
U07
Y07
V07
Y17
Y07
Y17
YX7
Y06
Y16
Y26
Y36
Y06
Y16
U06
Y06
V06
Y16
Y06
Y16
YX6
Y05
Y15
Y25
Y35
Y05
Y15
U05
Y05
V05
Y15
Y05
Y15
YX5
Y04
Y14
Y24
Y34
Y04
Y14
U04
Y04
V04
Y14
Y04
Y14
YX4
Y03
Y13
Y23
Y33
Y03
Y13
U03
Y03
V03
Y13
Y03
Y13
YX3
Y02
Y12
Y22
Y32
Y02
Y12
U02
Y02
V02
Y12
Y02
Y12
YX2
Y01
Y11
Y21
Y31
Y01
Y11
U01
Y01
V01
Y11
Y01
Y11
YX1
Y00
Y10
Y20
Y30
Y00
Y10
U00
Y00
V00
Y10
Y00
Y10
YX0
Y0L
Y1L
Y2L
Y3L
Y0L
Y1L
U0L
Y0L
V0L
Y1L
Y0L
Y1L
UVX8
U07
U05
U03
U01
U07
V07
−
−
−
−
UC03
VC03
UVX7
U06
U04
U02
U00
U06
V06
−
−
−
−
UC02
VC02
UVX6
V07
V05
V03
V01
U05
V05
−
−
−
−
UC01
VC01
UVX5
V06
V04
V02
V00
U04
V04
−
−
−
−
UC00
VC00
UVX4
−
−
−
−
U03
V03
−
−
−
−
−
−
UVX3
−
−
−
−
U02
V02
−
−
−
−
−
−
UVX2
−
−
−
−
U01
V01
−
−
−
−
−
−
UVX1
−
−
−
−
U00
V00
−
−
−
−
−
−
UVX0
U0L
−
V0L
−
U03
V03
−
−
−
−
−
−
Note
1. Index X refers to different I/O buses:
a) X = A: output to PALplus.
b) X = B: input from PALplus, MPEG.
c) X = C: output to first field memory for 2fH applications.
d) X = D: input from SAA4990H, SAA4991WP.
The first index digit defines the sample number, the second defines the bit number.
1999 May 03
47
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
handbook, full pagewidth
CLK
WE
prequalifier mode
WE
qualifier mode
Y7
Y7
Y7
Y7
Y7
Y7
Y7
Y7
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
UX0
YL
YL
YL
YL
YL
YL
YL
YL
UVX8
U7
U5
U3
U1
U7
U5
U3
U1
UVX7
U6
U4
U2
U0
U6
U4
U2
U0
UVX6
V7
V5
V3
V1
V7
V5
V3
V1
UVX5
V6
V4
V2
V0
V6
V4
V2
V0
UVX0
UL
YX8
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
VL
UL
•
•
•
•
•
VL
MHB180
Fig.9 YUV data relationship defined by rising edge of WE in 4 : 1 : 1 format.
1999 May 03
48
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write sequence:
SDNA
driven by
SAA4978H
a0
a1
a2
a3
a4
a5
a6
a7
a0
a1
a2
a3
a4
a5
a6
a7
w0
w1
w2
w3
w4
w5
w6
HIGH
3-state
LOW
w7
read sequence:
SDNA
driven by
SAA4978H
HIGH
3-state
LOW
r0
SDNA
driven by
slave
r1
r2
r3
r4
r5
r6
HIGH
3-state
LOW
r7
Philips Semiconductors
LOW
Picture Improved Combined Network
(PICNIC)
andbook, full pagewidth
1999 May 03
HIGH
SNCL
49
HIGH
50%
SNCL
50%
50%
LOW
t su(o)
write sequence:
SDNA
driven by
SAA4978H
a6
t h(o)
a7
w0
HIGH
3-state
LOW
w1
t o(dis)
read sequence:
SDNA
driven by
SAA4978H
a6
HIGH
3-state
LOW
a7
t h(SNCL)
SDNA
driven by
slave
r0
MHB181
Product specification
Fig.10 Timing diagram for SNERT bus.
HIGH
3-state
LOW
SAA4978H
t su(SNCL)
r1
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SNDA
SNCL
RSTW
CLK32
62
DIFFIN
43 to 51
53 to 61
SNCL
RSTR
PLUS 2fH FEATURES
18
bus B
18
bus A
WEA
SNDA
1fH TO 2fH CONVERSATION
RSTW
PALPLUS
MODULE
CLK16
WEB
SNDA
66
67 to 84
1
SNCL
RSTW
2
8
RSTR
9
CLK32
89
CLK16
WEC
18
bus C
113 114 to 122
124 to 132
88
18
bus D
RED
110
91 to 99
101 to 109
12
21
YIN
14
23
UIN
15
25
50
VIN
YOUT
UOUT
VOUT
Philips Semiconductors
CLK16
Picture Improved Combined Network
(PICNIC)
12 APPLICATION INFORMATION
handbook, full pagewidth
1999 May 03
CLK32
SAA4978H
26
18
HA
HDFL
28
VA
29
19
FBL
VDFL
10
4
5
SCL
6
7
SDA
WDRST
34
RST
35
OSCI
36
OSCO
37
TEST
12 MHz
CL34
38
TRST
1 kΩ
TMS
39
TDI
40
TDO
41
TCK
MHB182
CL35
Product specification
SAA4978H
Fig.11 Application diagram.
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
handbook, halfpage
Cpar(xtal)
Rser1(xtal)
MHB183
Fig.12 Equivalent circuit of crystal.
output
g
rin
co
rin
g
handbook, full pagewidth
se
ar
e
fin
co
co
input
MHB184
Fig.13 Peaking coring transfer curves.
1999 May 03
51
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
13 PACKAGE OUTLINE
QFP160: plastic quad flat package;
160 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height
SOT322-2
c
y
X
A
120
121
81
80
ZE
e
E HE
A
A2
(A 3)
A1
θ
wM
Lp
bp
L
pin 1 index
detail X
41
160
1
40
ZD
wM
bp
e
v M A
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
4.07
0.50
0.25
3.70
3.15
0.25
0.38
0.22
0.23
0.13
28.1
27.9
28.1
27.9
0.65
HD
HE
31.45 31.45
30.95 30.95
L
Lp
v
w
y
1.6
1.03
0.73
0.3
0.15
0.1
Z D(1) Z E (1)
1.5
1.1
1.5
1.1
θ
o
7
0o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT322-2
1999 May 03
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
96-03-14
97-08-04
MO112DD1
52
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
If wave soldering is used the following conditions must be
observed for optimal results:
14 SOLDERING
14.1
Introduction to soldering surface mount
packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
14.2
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
14.3
14.4
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
1999 May 03
Manual soldering
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
53
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
14.5
SAA4978H
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
REFLOW(1)
WAVE
BGA, SQFP
not suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not
PLCC(3),
SO, SOJ
suitable
suitable(2)
suitable
suitable
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 May 03
54
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
15 DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
16 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
17 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1999 May 03
55
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Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1999
SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/00/02/pp56
Date of release: 1999 May 03
Document order number:
9397 750 05277