MOSEL VITELIC PRELIMINARY V62C31864 2.7 VOLT 8K X 8 STATIC RAM ■ Packages – 28-pin TSOP (Standard) – 28-pin 300 mil SOP (450 mil pin-to-pin) Features ■ High-speed: 35, 70 ns ■ Ultra low DC operating current of 2mA (Max.) ■ Low Power Dissipation: – TTL Standby: 1 mA (Max.) – CMOS Standby: 10 mA (Max.) ■ Fully static operation ■ All inputs and outputs directly compatible ■ Three state outputs ■ Ultra low data retention current (VCC = 2V) ■ Extended operating voltage: 2.7V–3.6V Description The V62C31864 is a 65,536-bit static random access memory organized as 8,192 words by 8 bits. It is built with MOSEL VITELIC’s high performance CMOS process. Inputs and threestate outputs are TTL compatible and allow for direct interfacing with common system bus structures. Functional Block Diagram A0 VCC Row Decoder GND 512 x 128 Memory Array A8 I/O0 Column I/O Input Data Circuit Column Decoder I/O7 A9 CE2 CE1 OE WE A12 Control Circuit 31864 01 Device Usage Chart Operating Temperature Range Package Outline Access Time (ns) Power T F 35 70 L LL Temperature Mark 0°C to 70 °C • • • • • • Blank –40°C to +85°C • • • • I V62C31864 Rev. 1.6 August 1998 1 V62C31864 MOSEL VITELIC Pin Descriptions WE Write Enable Input An active LOW input, WE input controls read and write operations. When CE1 and WE inputs are both LOW with CE2 HIGH, the data present on the I/O pins will be written into the selected memory location. A0–A12 Address Inputs These 13 address inputs select one of the 8,192 x 8 bit segments in the RAM. CE1, CE2 Chip Enable Inputs CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active to read from or write to the device. If either chip enable is not active, the device is deselected and is in a standby power mode. The I/O pins will be in the high-impedance state when deselected. I/O0–I/O7 Data Input and Data Output Ports These 8 bidirectional ports are used to read data from and write data into the RAM. Output Enable Input OE The Output Enable input is active LOW. When OE is LOW with CE1 LOW, CE2 HIGH, and WE HIGH, data of the selected memory location will be available on the I/O pins. When OE is HIGH, the I/O pins will be in the high impedance state. VCC Power Supply GND Ground Pin Configurations (Top View) 28-Pin SOP 28-Pin TSOP (Standard) NC 1 28 VCC A12 2 27 WE A7 3 26 CE2 A6 4 25 A8 A5 5 24 A9 A4 6 23 A11 A3 7 22 OE A2 8 21 A10 A1 9 20 CE1 A0 10 19 I/O7 I/O0 11 18 I/O6 I/O1 12 17 I/O5 I/O2 13 16 I/O4 GND 14 15 I/O3 OE A11 A9 A8 CE2 WE VCC NC A12 A7 A6 A5 A4 A3 21 20 19 18 17 16 15 14 13 12 11 10 9 8 51864 03 51864 02 V62C31864 Rev. 1.6 August 1998 22 23 24 25 26 27 28 1 2 3 4 5 6 7 2 A10 CE1 I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 V62C31864 MOSEL VITELIC Part Number Information V MOSEL-VITELIC MANUFACTURED 62 C 31 8 64 – TEMP. SRAM FAMILY OPERATING VOLTAGE DENSITY SPEED PKG BLANK = 0¡C to 70¡C I = -40¡C to +85¡C 64K 62 = ASYNCHRONOUS, SLOW F = 330 mil SOP T = TSOP standard C = CMOS PROCESS 31 = 2.7V – 3.6V ORGANIZATION 35 ns 70 ns PWR. 8 = 8-bit 31864 05 L = LOW POWER LL =DOUBLE LOW POWER Absolute Maximum Ratings (1) Symbol Parameter Commercial Industrial Units VCC Supply Voltage -0.5 to VCC+0.5 -0.5 to VCC+0.5 V VN Input Voltage -0.5 to VCC+0.5 -0.5 to VCC+0.5 V VDQ Input/Output Voltage Applied VCC + 0.3 VCC + 0.3 V TBIAS Temperature Under Bias -10 to +125 -65 to +135 °C TSTG Storage Temperature -55 to +125 -65 to +150 °C NOTE: 1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Capacitance* Truth Table TA = 25°C, f = 1.0MHz Symbol Parameter CIN Input Capacitance COUT Output Capacitance Max. Unit Mode CE1 CE2 OE WE I/O Operation VIN = 0V 6 pF Standby H X X X High Z VI/O = 0V 8 pF Standby X L X X High Z Output Disable L H H H High Z Read L H L H DOUT Write L H X L DIN Conditions NOTE: * This parameter is guaranteed and not tested. NOTE: X = Don’t Care, L = LOW, H = HIGH V62C31864 Rev. 1.6 August 1998 3 V62C31864 MOSEL VITELIC DC Electrical Characteristics (over all temperature ranges, VCC = 2.7V – 3.6V) Symbol Parameter Test Conditions Min. Typ. Max. Units VCC Power Supply Voltage 2.7 — 3.6 V VIL Input LOW Voltage(1,2) -0.3 — 0.4 V VIH Input HIGH Voltage(1) 2.2 — VCC+0.3 V IIL Input Leakage Current VCC = Max, VIN = 0V to VCC -2 — 2 mA IOL Output Leakage Current VCC = Max, CE = VIH, VOUT = 0V to VCC -2 — 2 mA VOL Output LOW Voltage VCC = Min, IOL = 2.1mA — — 0.4 V VOH Output HIGH Voltage VCC = Min, IOH = -1mA 2.4 — — V Symbol Com.(4) Ind.(4) Parameter Units ICC Operating Power Supply Current, CE1 = VIL, CE2 = VIH, Output Open, VCC = Max., f = 0 2 2 mA ICC1 Average Operating Current, CE1 = VIL, CE2 = VIH, Output Open, VCC = Max., f = fMAX(3) 40 40 mA ISB TTL Standby Current CE1 ³ VIH, CE2 £ VIL, VCC = Max. L 2 3 mA LL 1 1 CMOS Standby Current, CE1 ³ VCC – 0.2V, CE2 £ 0.2V, VIN ³ VCC – 0.2V or VIN £ 0.2V, VCC = Max. L 40 50 LL 10 15 ISB1 NOTES: 1. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included. 2. VIL (Min.) = -3.0V for pulse width < 20ns. 3. fMAX = 1/tRC. 4. Maximum values. AC Test Conditions Key to Switching Waveforms Input Pulse Levels 0 to 3V Input Rise and Fall Times 5 ns Timing Reference Levels 1.5V Output Load WAVEFORM see below INPUTS OUTPUTS MUST BE STEADY WILL BE STEADY MAY CHANGE FROM H TO L WILL BE CHANGING FROM H TO L MAY CHANGE FROM L TO H WILL BE CHANGING FROM L TO H DON'T CARE: ANY CHANGE PERMITTED CHANGING: STATE UNKNOWN DOES NOT APPLY CENTER LINE IS HIGH IMPEDANCE “OFF” STATE AC Test Loads and Waveforms +3V 1103 ½ I/O Pins 1554 ½ CL = 30 pF* * Includes scope and jig capacitance 51864 06 V62C31864 Rev. 1.6 August 1998 4 mA V62C31864 MOSEL VITELIC Data Retention Characteristics Symbol VDR ICCDR VCC for Data Retention tR Typ.(2) Max. Units 2.0 — 3.6 V L — 0.5 40 mA LL — 0.5 10 L — — 45 LL — — 15 0 — — ns tRC(1) — — ns CE1 ³ VCC – 0.2V, CE2 £ 0.2V, VIN ³ VCC – 0.2V, or VIN £ 0.2V Data Retention Current CE1 ³ VDR – 0.2V, CE2 £ 0.2V, VIN ³ VCC – 0.2V, or VIN £ 0.2V Com’l Ind. tCDR Min. Parameter Chip Deselect to Data Retention Time Operation Recovery Time (see Retention Waveform) NOTES: 1. tRC = Read Cycle Time 2. TA = +25°C. Low VCC Data Retention Waveform (1) (CE1 Controlled) Data Retention Mode VCC 2.7V VDR ³ 2V tCDR CE1 2.2V 2.7V tR CE1 ³ VCC – 0.2V 2.2V 31864 14 Low VCC Data Retention Waveform (2) (CE2 Controlled) Data Retention Mode VCC 2.7V VDR ³ 2V tCDR CE2 V62C31864 Rev. 1.6 August 1998 2.2V 2.7V tR CE2 ² 0.2V 5 2.2V 31864 15 V62C31864 MOSEL VITELIC AC Electrical Characteristics (over all temperature ranges, VCC = 2.7V – 3.6V) Read Cycle Parameter Name -35 Parameter -70 Min. Max. Min. Max. Unit tRC Read Cycle Time 35 — 70 — ns tAA Address Access Time — 35 — 70 ns tACS1 Chip Enable Access Time — 35 — 70 ns tACS2 Chip Enable Access Time — 35 — 70 ns Output Enable to Output Valid — 15 — 30 ns tCLZ1 Chip Enable to Output in Low Z 5 — 5 — ns tCLZ2 Chip Enable to Output in Low Z 5 — 5 — ns tOLZ Output Enable to Output in Low Z 5 — 5 — ns tCHZ Chip Disable to Output in High Z 0 20 0 20 ns tOHZ Output Disable to Output in High Z 0 20 0 20 ns tOH Output Hold from Address Change 5 — 5 — ns tOE Write Cycle Parameter Name -35 Parameter -70 Min. Max. Min. Max. Unit tWC Write Cycle Time 35 — 70 — ns tCW1 Chip Enable to End of Write 35 — 70 — ns tCW2 Chip Enable to End of Write 35 — 70 — ns tAS Address Setup Time 0 — 0 — ns tAW Address Valid to End of Write 35 — 70 — ns tWP Write Pulse Width 25 — 50 — ns tWR Write Recovery Time 0 — 0 — ns tWHZ Write to Output High-Z 0 20 0 25 ns tDW Data Setup to End of Write 25 — 30 — ns tDH Data Hold from End of Write 0 — 0 — ns tOW Output Active from End of Write 5 — 5 — ns V62C31864 Rev. 1.6 August 1998 6 V62C31864 MOSEL VITELIC Switching Waveforms (Read Cycle) Read Cycle 1(1, 2) tRC ADDRESS tAA OE tOE tOLZ tOH tOHZ(5) I/O 51864 11 Read Cycle 2(1, 2, 4) tRC ADDRESS tAA tOH tOH I/O 51864 09 Read Cycle 3(1, 3, 4) ADDRESS CE1 tACS1 CE2 I/O tACS2 tCLZ1 tCHZ(5) (5) tCLZ2(5) 51864 10 NOTES: 1. WE = VIH. 2. CE1 = VIL and CE2 = VIH. 3. Address valid prior to or coincident with CE1 transition LOW and/or CE2 transition HIGH. 4. OE = VIL. 5. Transition is measured ±500mV from steady state with CL = 5pF. This parameter is guaranteed and not 100% tested. V62C31864 Rev. 1.6 August 1998 7 V62C31864 MOSEL VITELIC Switching Waveforms (Write Cycle) Write Cycle 1 (WE Controlled)(4) tWC ADDRESS tWR(2) (6) tCW CE1 tAW CE2 tCW(6) tAS WE tWP(1) OUTPUT tDW tWHZ tDH INPUT 51864 12 Write Cycle 2 (CE Controlled)(4) tWC ADDRESS tWR(2) tCW(6) (4) CE1 tAW tCW(6) CE2 tAS WE OUTPUT High-Z tDW tDH (5) INPUT 51864 13 NOTES: 1. The internal write time of the memory is defined by the overlap of CE1 and CE2 active and WE low. Both signals must be active to initiate and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 2. tWR is measured from the earlier of CE1 or WE going HIGH, or CE2 going LOW at the end of the write cycle. 3. During this period, I/O pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 4. OE = VIL or VIH. However it is recommended to keep OE at VIH during write cycle to avoid bus contention. 5. If CE1 is LOW and CE2 is HIGH during this period, I/O pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 6. tCW is measured from CE1 going LOW or CE2 going HIGH to the end of write. V62C31864 Rev. 1.6 August 1998 8 V62C31864 MOSEL VITELIC Package Diagrams 28-pin 330 mil SOP Units in inches [mm] 0 MIN (STAND OFF) 0.339 ± 0.008 [8.61 ± 0.203] 0.402 ±0.012 [10.21 ± 0.203] 0.465 ± 0.012 [11.81 ± 0.305] 0.031 ± 0.008 [0.787 ± 0.203] INDEX 0.006 ± 0.002 [0.152 ± 0.051] 0.713 [18.11] TYP 0.112 [0.285] MAX "A" 0.098 ± 0.005 [2.49 ± 0.127] 0.008 [0.203] View "A" 0.050 [1.27] TYP 0.018 ± 0.004 [0.457 ± 0.102] 0.024 [0.610] 0.008 [0.203] MAX 0.027 [0.686] MAX V62C31864 Rev. 1.6 August 1998 9 V62C31864 MOSEL VITELIC Package Diagrams (Cont’d) 28-Pin TSOP Unit in inches [mm] 0.463 ±0.003 [11.76 ± 0.076] 0.046 ±0.004 [1.17 ± 0.102] 0.528 ±0.008 [13.41 ± 0.203] 0.315 ±0.004 [8.00 ± 0.102] +0.007 0.020 –0.008 +0.178 0.508 –0.305 V62C31864 Rev. 1.6 August 1998 0.006 ±0.002 [0.152 ± 0.051] 0.022 [0.559] BSC 10 0.006 ±0.004 [0.152 ± 0.102] V62C31864 MOSEL VITELIC Notes V62C31864 Rev. 1.6 August 1998 11 MOSEL VITELIC WORLDWIDE OFFICES V62C31864 U.S.A. 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