AQY212GH.fm1 y [ W Q O O Q N U S œ @ ˛ j œ @ ª P Q Q T “ 6.4 .252 3.2 .126 mm inch 1 4 2 3 VDE pending PhotoMOS RELAYS GU (General Use) Type 1-Channel (Form A) High Capacity 4-Pin Type 4.78 .188 cUL pending FEATURES TYPICAL APPLICATIONS 1. Greatly increased load current. 2. Reinforced insulation 5,000 V type. 3. Greatly improved specs allow you to use this in place of mercury and mechanical relays. 4. Compact 4-pin DIP size. • Security market (use in I/O for alarm and security devices, etc.) • Measuring instrument market TYPES Part No. Output rating* Type AC/DC type I/O isolation voltage Reinforced 5,000 V Load voltage Load current 60 V 1.1 A Through hole terminal Tube packing style AQY212GH Packing quantity Surface-mount terminal AQY212GHA Tape and reel packing style Picked from the Picked from the 1/2-pin side 3/4-pin side AQY212GHAX AQY212GHAZ Tube Tape and reel 1 tube contains 100 pcs. 1 batch contains 1,000 pcs. 1,000 pcs. *Indicate the peak AC and DC values. Note: For space reasons, the initial letters of the product number “AQY”, the SMD terminal shape indicator “A” and the package type indicator "X" and "Z" are omitted from the seal. RATING 1. Absolute maximum ratings (Ambient temperature: 25°C 77°F) Item LED forward current LED reverse voltage Input Peak forward current Power dissipation Load voltage (peak AC) Continuous load current (peak AC) Output Peak load current Power dissipation Total power dissipation I/O isolation voltage Operating Temperature limits Storage Symbol IF VR IFP Pin VL AQY212GH IL 1.1 A Ipeak Pout PT Viso Topr Tstg 3.0 A 500 mW 550 mW 5,000 V AC –40°C to +85°C –40°F to +185°F –40°C to +100°C –40°F to +212°F 50 mA 5V 1A 75 mW 60 V Remarks f = 100 Hz, Duty factor = 0.1% 100ms (1 shot), VL = DC Non-condensing at low temperatures AQY212GH.fm2 y [ W Q O O Q N U S œ @ ˛ j œ @ ª P Q Q T “ AQY212GH 2. Electrical characteristics (Ambient temperature: 25°C 77°F) Item LED turn off current Input Symbol AQY212GH IFon 1.1 mA 3 mA Typical Maximum Minimum Typical Typical Maximum LED operate current LED dropout voltage VF 0.5 ms Ciso 0.8 pF 1.5 pF f = 1 MHz VB = 0 Riso 1,000 MΩ 500 V DC 0.7 Ω Maximum Maximum 1 µA ILeak Typical 1.3 ms Turn on time* Ton Maximum 5.0 ms Typical Transfer characteristics IF = 5 mA IF = 5 mA IL = Max. Within 1 s on time IF = 0 VL = Max. IF = 5 mA IL = 100 mA VL = 10 V IF = 5 mA IL = 100 mA VL = 10 V Ron Off state leakage current IL = 100mA 0.34 Ω Typical Output IL = 100mA 0.3 mA 1.0 mA 1.14 V (1.32 V at IF = 50 mA) 1.5 V IFoff On resistance Condition 0.1 ms Turn off time* Toff Maximum Typical Maximum Initial I/O isolation Minimum resistance I/O capacitance Note: Recommendable LED forward current IF = 5 to 10 mA. For type of connection, see Page 4. *Turn on/Turn off time Input 90% Output 10% Ton Toff REFERENCE DATA 1. Load current vs. ambient temperature characteristics 2. On resistance vs. ambient temperature characteristics 3. Turn on time vs. ambient temperature characteristics Allowable ambient temperature: –40°C to +85°C –40°F to +185°F Measured portion: between terminals 3 and 4; LED current: 5 mA; Load voltage: Max. (DC) Continuous load current: Max.(DC) LED current: 5 mA; Load voltage: 10 V (DC); Continuous load current: 100 mA (DC) On resistance, Ω Load current, A 2.5 2 1.5 1 5 0.8 4 Turn on time, ms 3 0.6 0.4 3 2 1 0 –40 –20 0 20 40 60 8085 100 Ambient temperature, °C 2 1 0.2 0.5 0 –40 –20 80 85 0 20 40 60 Ambient temperature, °C 0 –40 –20 0 20 40 60 Ambient temperature, °C 80 85 AQY212GH.fm3 y [ W Q O O Q N U S œ @ ˛ j œ @ ª P Q Q T “ AQY212GH 4. Turn off time vs. ambient temperature characteristics 5. LED operate current vs. ambient temperature characteristics 6. LED turn off current vs. ambient temperature characteristics LED current: 5 mA; Load voltage: 10 V (DC); Continuous load current: 100 mA (DC) Load voltage: 10 V (DC); Continuous load current: 100mA (DC) Load voltage: 10 V (DC); Continuous load current: 100mA (DC) 5 0.8 0.6 0.4 0.2 LED turn off current, mA 5 LED operate current, mA 4 3 2 1 0 –40 –20 0 20 40 0 80 85 60 –40 –20 Ambient temperature, °C 0 20 40 60 2 0 80 85 –40 –20 LED current: 5 to 50 mA Measured portion: between terminals 3 and 4; Ambient temperature: 25°C 77°F 1.5 0 20 40 60 80 85 Ambient temperature, °C 8. Voltage vs. current characteristics of output at MOS portion 9. Off state leakage current Measured portion: between terminals 3 and 4; Ambient temperature: 25°C 77°F 3 Current, mA LED dropout voltage, V 3 Ambient temperature, °C 7. LED dropout voltage vs. ambient temperature characteristics 1.4 2 1 1.3 –1 50mA 1.2 –0.5 0.5 Voltage, V 30mA 20mA 1 –1 10mA 1.1 –40 –20 0 20 40 60 10-4 10-6 10-8 10-10 –2 5mA 1 4 1 Off state leakage current, A Turn off time, ms 1 –3 80 85 10-120 10 20 Ambient temperature, °C 30 40 50 60 Load voltage, V 11. LED forward current vs. turn off time characteristics 12. Applied voltage vs. output capacitance characteristics Measured portion: between terminals 3 and 4; Load voltage: 10 V (DC); Continuous load current: 100 mA (DC); Ambient temperature: 25°C 77°F Measured portion: between terminals 3 and 4; Load voltage: 10 V (DC); Continuous load current: 100 mA (DC); Ambient temperature: 25°C 77°F Measured portion: between terminals 3 and 4; Frequency: 1 MHz; Ambient temperature: 25°C 77°F 0.5 4 0.4 3 2 800 Output capacitance, pF 5 Turn off time, ms Turn on time, ms 10. LED forward current vs. turn on time characteristics 0.3 0.2 1 0.1 0 0 700 600 500 400 300 200 100 0 10 20 30 40 LED forward current, mA 50 0 10 20 30 40 LED forward current, mA 50 0 0 10 20 30 40 50 60 Applied voltage, V 3 AQY212GH.fm4 y [ W Q O O Q N U S œ @ ˛ j œ @ ª P Q Q T “ AQY212GH DIMENSIONS mm inch Through hole terminal type Surface mount terminal type Max. 10° 6.4 .252 PC board pattern (BOTTOM VIEW) 4-0.8 dia. 4-.031 dia. Max. 10° 7.62±0.05 .300±.002 2.54 .100 7.62 .300 6.4 .252 6.4 .252 7.62±0.05 .300±.002 Max. 10° 2.54 .100 4.78 .188 2.7 .106 1.0 .039 4.78 .188 Tolerance: ±0.1 ±.004 2.7 .106 Mounting pad (TOP VIEW) 3.2±0.1 .126±.004 3.0 .118 0.2 .008 0.33 .013 0.47 .019 1.0 .039 0.47 .019 2.7 .106 0.2 ±0.2 0 .008 0±.008 0.47 .019 1.0 .039 2.54 .100 Terminal thickness = 0.2 .008 General tolerance: ±0.1 ±.004 8.3 .327 0.47 .019 2.54 .100 1.0 .039 1.9 .075 1.5 .059 2.54 .100 Terminal thickness = 0.2 .008 General tolerance: ±0.1 ±.004 Tolerance: ±0.1 ±.004 SCHEMATIC AND WIRING DIAGRAMS Notes: E1: Power source at input side; IF: LED forward current; VL: Load voltage; IL: Load current; Output configuration Schematic 1 Connection Wiring diagram 4 1a 2 Load 3 AC/DC — E1 1 4 2 3 IF 4 IL IL 3 Load 4 VL (AC,DC) Load VL (AC,DC) AQY212GH.fm5 y [ W Q O O Q N U S œ @ ˛ j œ @ ª P Q Q T “ AQY212GH Cautions for Use SAFETY WARNINGS • Do not use the product under conditions that exceed the range of its specifications. It may cause overheating, smoke, or fire. • Do not touch the recharging unit while the power is on. There is a danger of electrical shock. Be sure to turn off the power when performing mounting, maintenance, or repair operations on the relay (including connecting parts such as the terminal board and socket). • Check the connection diagrams in the catalog and be sure to connect the terminals correctly. Erroneous connections could lead to unexpected operating errors, overheating, or fire. 2) Keep the LED operate current at 50 mA or less at Emax. 2) If spike voltages generated at the load are limited with a clamp diode and the circuit wires are long, spike voltages will occur by inductance. Keep wires as short as possible to minimize inductance. 6. Cleaning solvents compatibility Dip cleaning with an organic solvent is recommended for removal of solder flux, dust, etc. Select a cleaning solvent from the following table. If ultrasonic cleaning is used, the severity of factors such as frequency, output power and cleaning solvent selected may cause loose wires and other defects. Make sure these conditions are correct before use. For details, please consult us. NOTES 1. Short across terminals Do not short circuit between terminals when relay is energized. There is possibility of breaking the internal IC. 2. Surge voltages at the input If reverse surge voltages are present at the input terminals, connect a diode in reverse parallel across the input terminals and keep the reverse voltages below the reverse breakdown voltage. 1 4 2 3 Emin. 5. Output spike voltages 1) If an inductive load generates spike voltages which exceed the absolute maximum rating, the spike voltage must be limited. Typical circuits are shown below. 1 3. Recommended LED forward current (IF) It is recommended that the LED forward current (IF) be kept at 5mA. 4. Ripple in the input power supply If ripple is present in the input power supply, observe the following: 1) For LED operate current at Emin, maintain the value mentioned in the table of “Note 3. Recommended LED forward current (IF).” 7. Soldering 1) When soldering PC board terminals, keep soldering time to within 10 s at 260°C 500°F. (1) IR (Infrared reflow) soldering method T3 Emax. 4 3 2 1 4 2 3 Add a clamp diode to the load Load Add a CR snubber circuit to the load 2) When soldering surface-mount terminals, the following conditions are recommended. (2) Vapor phase soldering method T2 T2 Cleaning solvent Load Compatibility (❍: Yes ✕: No) Chlorine- • Trichlene base • Chloroethlene • Indusco Adueous • Hollis • Lonco Terg Alcohol- • IPA base • Ethanol • Thinner Others • Gasoline ❍ ❍ ❍ ✕ (3) Double wave soldering method T2 T1 T1 T1 t1 t2 T1 = 155 to 165°C 311 to 329°F T2 = 180°C 200°C 356 to 392°F T3 = 245°C 473°F or less t1 = 120 s or less t2 = 30 s or less (4) Soldering iron method Tip temperature: 280 to 300°C 536 to 572°F Wattage: 30 to 60 W Soldering time: within 5 s t1 t2 T1 = 180 to 200°C 366 to 392°F T2 = 215°C 419°F or less t1 = 40 s t2 = 90 s or less (5) Others Check mounting conditions before using other soldering methods (hot-air, hot plate, pulse heater, etc.) • The temperature profile indicates the temperature of the soldered terminal on the surface of the PC board. The ambient t1 t2 t3 T1 = 155 to 165°C 311 to 329°F T2 = 260°C 500°F or less t1 = 60 s or less t2+t3 = 5 s or less temperature may increase excessively. Check the temperature under mounting conditions. • The conditions for the infrared reflow soldering apply when preheating using the VPS method. 5 AQY212GH.fm6 y [ W Q O O Q N U S œ @ ˛ j œ @ ª P Q Q T “ AQY212GH 8. The following shows the packaging format 1) Tape and reel mm inch Tape dimensions Type Dimensions of paper tape reel 21±0.8 .827±.031 80±1 dia. 3.150±.039 dia. Direction of picking 0.3±0.05 .012±.002 4-pin SMD type Tractor feed holes ±0.1 1.5 – 0 dia. .059 ±.004 dia. –0 4±0.1 .157±.004 10.2±0.1 .402±.004 5.25±0.1 .207±.004 Device mounted on tape 12±0.1 .472±.004 4.2±0.3 .165±.012 1.75±0.1 .069±.004 5.5±0.1 .217±.004 2±0.1 .079±.004 2±0.5 .079±.020 1.55±0.1 dia. .061±.004 dia. (1) When picked from 1/2-pin side: Part No. AQY❍❍❍GHAX (Shown above) (2) When picked from 3/4-pin side: Part No. AQY❍❍❍GHAZ 2) Tube Devices are packaged in a tube so pin No. 1 is on the stopper B side. Observe correct orientation when mounting them on PC boards. Stopper B Stopper A 9. Transportation and storage 1) Extreme vibration during transport will warp the lead or damage the relay. Handle the outer and inner boxes with care. 6 300±2 dia. 11.811±.079 dia. 80±1 dia. 3.150±.039 dia. 12±0.3 .472±.012 2) Storage under extreme conditions will cause soldering degradation, external appearance defects, and deterioration of the characteristics. The following storage conditions are recommended: • Temperature: 0 to 45°C 32 to 113°F • Humidity: Less than 70% R.H. • Atomosphere: No harmful gasses such as sulfurous acid gas, minimal dust. 13±0.5 dia. .512±.020 dia. 13.5±2.0 .531±.079 2±0.5 .079±.020