RF (Radio Frequency) C (by) ✕ R 5 SSOP Type 4.45 .175 1.80 .071 2.65 .104 mm inch 1 4 2 3 UL CSA pending pending PhotoMOS RELAYS FEATURES TYPICAL APPLICATIONS 1. Reduced package size Lower surface has been reduced 60% and mounting space 40% compared to conventional 4-pin SOP type. 2. Lower output capacitance and onresistance Output capacitance(C): 1.0pF (typ.) ON resistance(R): 5.5Ω (typ.) 3. Mounting space has been reduced and output signals have been improved by using new flat lead terminals. Measuring and testing equipment 1. Test equipment IC tester, Liquid crystal driver tester, semiconductor performance tester 2. Board tester Bear board tester, In-circuit tester, function tester 3. Medical equipment Ultrasonic wave diagnostic machine 4. Multi-point recorder Warping, thermo couple Conventional SOP type SSOP Flat lead 4. High speed switching Turn on time: 0.02ms Turn off time: 0.02ms TYPES Circuit arrangement Type 1 Form A AC/DC type Output rating* Load voltage Load current 25 V 150 mA Tape and reel packing style Picked from the 1/4-pin side Picked from the 2/3-pin side AQY221N3VY AQY221N3VW Packing quantity in tape and reel 3,500 pcs. * Indicate the peak AC and DC values. Notes: (1)Tape package is the standard packing style. (2)For space reasons, the initial letters of the product number “AQY and V”, the package type indicator “Y” and “W” are omitted from the seal. RATING 1. Absolute maximum ratings (Ambient temperature: 25°C 77°F) Item LED forward current LED reverse voltage Input Peak forward current Power dissipation Load voltage (peak AC) Continuous load current (peak AC) Output Peak load current Power dissipation Total power dissipation I/O isolation voltage Temperature Operating limits Storage Symbol IF VR IFP Pin VL IL Ipeak Pout PT Viso Topr Tstg AQY221N3V 50mA 5V 1A 75mW 25V 0.15A 0.4A 250mW 300mW 1,500V AC –40°C to +85°C –40°F to +185°F –40°C to +100°C –40°F to +212°F Remarks f=100 Hz, Duty factor=0.1% Peak AC,DC 100 ms (1 shot), VL= DC Non-condensing at low temperatures PhotoMOS Relays RF C✕R5 SSOP ASCT1B268E ’03.3 http://www.naisrelay.com/ New 1 AQY221N3V 2. Electrical characteristics (Ambient temperature: 25°C 77°F) Item Symbol AQY221N3V Typical 1.0 mA LED operate current IFon IL = 80 mA Maximum 3.0 mA Minimum Input 0.2 mA LED turn off current IFoff IL = 80 mA Typical 0.9 mA Typical 1.14 V (1.35 V at IF = 50mA) LED dropout voltage VF IF = 5mA Maximum 1.5 V 5.5Ω Typical On resistance Ron IF = 5mA IL = 80 mA Within 1 s on time IF = 0 VB = 0 V f = 1 MHz 7.5Ω Maximum Typical Output Condition 1.0 pF Cout Output capacitance Maximum 1.5 pF Typical 0.01 nA Off state leakage current IF = 0 VL = Max. ILeak Maximum 10 nA Typical IF = 5mA VL = 10V RL = 125Ω IF = 5mA VL = 10V RL = 125Ω 0.02 ms Turn on time* Ton Maximum 0.5ms Typical 0.02ms Switching speed Turn off time* Transfer characteristics Toff Maximum 0.2 ms Typical 0.8 pF I/O capacitance 1.5 pF f = 1MHz VB = 0 1,000MΩ 500V DC Ciso Maximum Initial I/O isolation resistance Minimum Riso Note: Recommendable LED forward current IF = 5 mA. For type of connection, see Page 5. *Turn on/Turn off time Input 90% 10% Output Ton Toff REFERENCE DATA 1. Load current vs. ambient temperature characteristics Allowable ambient temperature: –40°C to +85°C –40°F to +185°F 2. Load current vs. Load voltage characteristics Ambient temperature: 25°C 77°F Measured portion: between terminals 3 and 4 LED current: 5 mA; Load voltage: Max. (DC); Load current: 80mA (DC) 25 150 100 50 On resistance, Ω 200 Load current, mA 200 Load current, mA 3. On resistance vs. ambient temperature characteristics 150 100 20 15 10 50 5 0 –40 –20 0 20 40 60 8085 100 Ambient temperature, °C 2 0 0 5 10 15 20 Load voltage, V 25 30 0 –40 –20 0 20 40 60 8085 Ambient temperature, °C AQY221N3V 5. Turn off time vs. ambient temperature characteristics 6. LED operate current vs. ambient temperature characteristics Measured portion: between terminals 3 and 4 LED current: 5 mA; Load voltage: 10V (DC); Continuous load current: 80mA (DC) LED current: 5 mA; Load voltage: 10V (DC); Continuous load current: 80mA (DC) Load voltage: Max. (DC); Continuous load current: 80mA (DC) 0.1 0.08 0.08 0.06 0.04 2 LED operate current, mA 0.1 Turn on time, ms Turn on time, ms 4. Turn on time vs. ambient temperature characteristics 0.06 0.04 1.5 1 0.5 0.02 0 0.02 –40 –20 0 20 40 60 0 8085 –40 –20 Ambient temperature, °C 0 20 40 60 0 8085 –40 –20 Ambient temperature, °C 0 20 40 60 8085 Ambient temperature, °C 7. LED turn off current vs. ambient temperature characteristics 8. LED dropout voltage vs. ambient temperature characteristics 9. Voltage vs. current characteristics of output at MOS portion Load voltage: Max. (DC); Continuous load current: 80mA (DC) LED current: 5 to 50 mA Measured portion: between terminals 3 and 4 Ambient temperature: 25°C 77°F LED dropout voltage, V LED operate current, mA 1.5 1 0.5 Current, mA 1.5 2 1.4 150 100 50 1.3 –2 –1.5 –1 –0.5 50mA 1.2 0.5 30mA 20mA 1.1 1 1.5 2 Voltage, V –50 10mA –100 5mA 0 –40 –20 0 20 40 60 1.0 8085 –40 –20 Ambient temperature, °C 0 20 40 60 –150 8085 100 Ambient temperature, °C 10. Off state leakage current Measured portion: between terminals 3 and 4 Ambient temperature: 25°C 77°F 11. LED forward current vs. turn on time characteristics 12. LED forward current vs. turn off time characteristics Measured portion: between terminals 3 and 4 Load voltage: 10V (DC); Continuous load current: 80mA (DC); Ambient temperature: 25°C 77°F Measured portion: between terminals 3 and 4 Load voltage: 10V (DC); Continuous load current: 80mA (DC); Ambient temperature: 25°C 77°F 0.1 10-5 10-7 0.08 0.09 Turn off time, µs Turn on time, µs Off state leakage current, A 0.12 10-3 0.06 0.06 0.04 10-9 0.03 0.02 10-11 10-13 0 0 5 10 15 20 25 0 30 10 20 30 50 40 0 60 0 Load voltage, V 10 20 30 40 50 14. Isolation characteristics (50Ω impedance) 15. Insertion loss characteristics (50Ω impedance) Measured portion: between terminals 3 and 4 Frequency: 1 MHz, 30m Vrms; Ambient temperature: 25°C 77°F Measured portion: between terminals 3 and 4 Ambient temperature: 25°C 77°F Measured portion: between terminals 3 and 4 Ambient temperature: 25°C 77°F 2 80 1.5 2 Insertion loss, dB 100 Isolation, dB Output capacitance, pF 13. Applied voltage vs. output capacitance characteristics 2.5 60 1 40 0.5 20 60 LED forward current, mA LED forward current, mA 1.5 1 0.5 0 0 5 10 15 20 25 Applied boltage, V 30 0 4 10 105 106 107 Frequency, Hz 108 0 104 105 106 107 Frequency, Hz 3 AQY221N3V 16. On resistance distribution 17. Turn on time distribution 18. Turn off time distribution Measured portion: between terminals 3 and 4 Continuous load current: 80mA (DC) Quantity, n=60; Ambient temperature: 25°C 77°F Load voltage: 10V (DC) Continuous load current: 80mA (DC) Quantity, n = 60; Ambient temperature: 25°C 77°F Load voltage: 10V (DC) Continuous load current: 80mA (DC) Quantity, n = 60; Ambient temperature: 25°C 77°F 40 60 50 35 50 25 20 Quantity, n Quantity, n Quantity, n 40 30 30 40 30 20 15 20 10 10 10 5 0 2 3 4 5 6 7 0 8 0 0.02 0.04 On resistance, Ω 0.06 0.08 0 0.1 0 0.02 Turn on time, ms 0.04 0.06 0.08 0.1 Turn on time, ms 19. LED operate current distribution Load voltage: 10V (DC) Continuous load current: 80mA (DC) Quantity, n = 60; Ambient temperature: 25°C 77°F 30 Quantity, n 25 20 15 10 5 0 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 LED operate current, mA DIMENSIONS mm inch 4.45 .175 Recommended mounting pad (TOP VIEW) 0.70 .028 2.65 .104 0.90 .035 1.27 .050 4.35 .171 Tolerance:±0.1 ±.004 1.80 .071 0.20 .008 0.20 .008 (4.85) (.191) 0.40 .016 0.40 .016 1.27 .050 Terminal thickness = 0.15 .006 General tolerance: ±0.1 ±.004 SCHEMATIC AND WIRING DIAGRAMS Notes: 1. E1: Power source at input side; IF: LED forward current; VL: Load voltage; IL: Load current Output configuration Schematic 1 Wiring diagram 4 1a 2 Load 3 AC/DC E1 1 4 2 3 IF 4 IL IL 3 Load 4 VL (AC,DC) Load VL (AC,DC) AQY221N3V CAUTIONS FOR USE 1. Short across terminals Do not short circuit between terminals when relay is energized. There is possibility of breaking the internal IC. 2. Surge voltages at the input If reverse surge voltages are present at the input terminals, connect a diode in reverse parallel across the input terminals and keep the reverse voltages below the reverse breakdown voltage. 5. Output spike voltages 1) If an inductive load generates spike voltages which exceed the absolute maximum rating, the spike voltage must be limited. Typical circuits are shown below. 1 4 2 3 Load 6. Cleaning solvents compatibility Dip cleaning with an organic solvent is recommended for removal of solder flux, dust, etc. Select a cleaning solvent from the following table. If ultrasonic cleaning is used, the severity of factors such as frequency, output power and cleaning solvent selected may cause loose wires and other defects. Make sure these conditions are correct before use. For details, please consult us. Cleaning solvent 1 4 2 3 3. Recommended LED forward current (IF) It is recommended that the LED forward current (IF) be kept at 5mA. 4. Ripple in the input power supply If ripple is present in the input power supply, observe the following: 1) For LED operate current at Emin, maintain the value mentioned in the table of "3. Recommended LED forward current (IF)." 2) Keep the LED operate current at 50 mA or less at Emax. Emin. 1 4 2 3 Add a clamp diode to the load Load Add a CR snubber circuit to the load Chlorine base Adueous Alcohol base Others Compatibility (❍: Yes ✕: No) • Trichlene • Chloroethlene • Indusco • Hollis • Lonco Terg • IPA • Ethanol • Thinner • Gasoline ❍ ❍ ❍ ✕ 2) If spike voltages generated at the load are limited with a clamp diode and the circuit wires are long, spike voltages will occur by inductance. Keep wires as short as possible to minimize inductance. Emax. 7. Soldering When soldering this terminals, the following conditions are recommended. (1) IR (Infrared reflow) soldering method (2) Vapor phase soldering method T3 T2 T2 (3) Double wave soldering method T2 T1 T1 T1 t1 t2 T1 = 155 to 165°C 311 to 329°F T2 = 180°C 200°C 356 to 392°F T3 = 245°C 473°F or less t1 = 120 s or less t2 = 30 s or less (4) Soldering iron method Tip temperature: 280 to 300°C 536 to 572°F Wattage: 30 to 60 W Soldering time: within 5 s t1 t2 T1 = 180 to 200°C 366 to 392°F T2 = 215°C 419°F or less t1 = 40 s t2 = 40 s or less (5) Others Check mounting conditions before using other soldering methods (hot-air, hot plate, pulse heater, etc.) • The temperature profile indicates the temperature of the soldered terminal on the surface of the PC board. The ambient t1 t2 t3 T1 = 155 to 165°C 311 to 329°F T2 = 260°C 500°F or less t1 = 60 s or less t2+t3 = 5 s or less temperature may increase excessively. Check the temperature under mounting conditions. • The conditions for the infrared reflow soldering apply when preheating using the VPS method. 5 AQY221N3V 8. The following shows the packaging format 1) Tape and reel Type mm inch Tape dimensions 0.3±0.05 .012±.002 Dimensions of paper tape reel Tractor feed holes 1.50 +0.5 -0 dia. Direction of picking 1.50 +0.5 -0 dia. 3.0±0.1 4.0±0.1 1.75±0.1 .118±.004 .157±.004 .069±.004 5.1±0.2 .201±.008 21±0.8 .827±.031 80±1 dia. 3.150±.039 dia. 2±0.5 .079±.020 250±2 dia. 9.843±.079 dia. 80±1 dia. 3.150±.039 dia. 12.0±0.3 .472±.012 SSOP 4-pin type Device mounted on tape 2.7±0.3 .106±.012 4.0±0.1 .157±.004 1.50-0+0.1 dia. 5.5±0.1 .059-0+.004 dia. .217±.004 13±0.5 dia. .512±.020 dia. 14±1.5 .551±.059 (1) When picked from 1/4-pin side: Part No. AQY❍❍❍VY (Shown above) (2) When picked from 2/3-pin side: Part No. AQY❍❍❍VW 2) Storage PhotoMOS relays implemented in SSOP types are sensitive to moisture and come in sealed moisture-proof packages. Observe the following cautions on storage. • After the moisture-proof package is unsealed, take the devices out of storage as soon as possible (within 1 month at the most). • If the devices are to be left in storage for a considerable period after the moistureproof package has been unsealed, it is recommended to keep them in another moisture-proof bag containing silica gel (within 3 months at the most). 9. Transportation and storage 1) Extreme vibration during transport will warp the lead or damage the relay. Handle the outer and inner boxes with care. 2) Storage under extreme conditions will cause soldering degradation, external appearance defects, and deterioration of the characteristics. The following storage conditions are recommended: • Temperature: 0 to 45°C 32 to 113°F • Humidity: Less than 70% R.H. • Atomosphere: No harmful gasses such as sulfurous acid gas, minimal dust. 10. Applying stress that exceeds the absolute maximum rating If the voltage or current value for any of the terminals exceeds the absolute maximum rating, internal elements will deteriorate because of the excessive voltage or current. In extreme cases, wiring may melt, or silicon P/N junctions may be destroyed. As a result, the design should ensure that the absolute maximum ratings will never be exceeded, even momentarily. (Use at 15 V DC or lower and 9 V DC or lower is recommended.) 11. Deterioration and destruction caused by discharge of static electricity This phenomenon is generally called static electricity destruction. This occurs when static electricity generated by various factors is discharged while the relay terminals are in contact. The result can producing internal destruction of the element. To prevent problems from static electricity, the following precautions and measures should be taken when using your device. 1) Employees handling relays should wear anti-static clothing and should be grounded through protective resistance of 500 kΩ to 1 MΩ. 2±0.5 .079±.020 2) A conductive metal sheet should be placed over the work table. Measuring instruments and jigs should be grounded. 3) When using soldering irons, either use irons with low leakage current, or ground the tip of the soldering iron. (Use of lowvoltage soldering irons is also recommended.) 4) Devices and equipment used in assembly should also be grounded. 5) When packing printed circuit boards and equipment, avoid using high-polymer materials such as foam styrene, plastic, and other materials which carry an electrostatic charge. 6) When storing or transporting relays, the environment should not be conducive to generating static electricity (for instance, the humidity should be between 45 and 60%). Relays should always be protected using non-conductive packing materials. These materials are printed on ECF pulp. These materials are printed with earth-friendly vegetable-based (soybean oil) ink. Please contact .......... Matsushita Electric Works, Ltd. Automation Controls Company Head Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan Telephone: Japan (81) Osaka (06) 6908-1050 Facsimile: Japan (81) Osaka (06) 6908-5781 http://www.nais-e.com/ COPYRIGHT © 2003 All Rights Reserved ASCT1B268E 6 200303 Specifications are subject to change without notice. Printed in Japan.