NEC UPD64GS

DATA SHEET
MOS INTEGRATED CIRCUIT
µPD63, 63A, 64
4-BIT SINGLE-CHIP MICROCONTROLLER
FOR INFRARED REMOTE CONTROL TRANSMISSION
DESCRIPTION
Equipped with low-voltage 1.8 V operation, a carrier generation circuit for infrared remote control transmission,
a standby release function through key entry, and a programmable timer, the µPD63, 63A, and 64 are suitable for
infrared remote control transmitters.
For the µPD63, 63A and 64, we have made available the one-time PROM product µPD6P4B for program
evaluation or small-quantity production.
FEATURES
• Program memory (ROM)
· µPD63 : 512 × 10 bits
· µPD63A: 768 × 10 bits
· µPD64 : 1002 × 10 bits
• Data memory (RAM): 32 × 4 bits
• Built-in carrier generation circuit for infrared remote control
• 9-bit programmable timer
: 1 channel
• Command execution time
: 8 µs (when operating at fX = 8 MHz: ceramic oscillation)
• Stack level
: 1 level (Stack RAM is for data memory RF as well.)
• I/O pins (KI/O)
: 8 units
• Input pins (KI)
: 4 units
• Sense input pin (S0)
: 1 unit
• S1/LED pin (I/O)
: 1 unit (When in output mode, this is the remote control transmission display
pin.)
: VDD = 1.8 to 3.6 V (when operating at fX = 4 MHz)
• Power supply voltage
VDD = 2.2 to 3.6 V (when operating at fX = 8 MHz)
• Operating ambient temperature : TA = –40 to +85 ˚C
• Oscillator frequency
: fX = 2.4 to 8 MHz
• POC circuit (Mask option)
APPLICATION
Infrared remote control transmitter (for AV and household electric appliances)
Unless otherwise stated, the µPD63 is taken as a representative product in this document.
The information in this document is subject to change without notice.
Document No. U11371EJ3V0DS00 (3rd edition)
Date Published November 1998 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1996
µPD63, 63A, 64
ORDERING INFORMATION
Part Number
Package
µPD63GS-×××
20-pin plastic SOP (300 mil)
µPD63AGS-×××
20-pin plastic SOP (300 mil)
µPD64GS-×××
20-pin plastic SOP (300 mil)
µPD64MC-×××-5A4
20-pin plastic SSOP (300 mil)
Remark ××× indicates ROM code suffix.
PIN CONFIGURATION (TOP VIEW)
20-pin Plastic SOP (300 mil)
• µPD63GS-×××
• µPD63AGS-×××
• µPD64GS-×××
20-pin Plastic SSOP (300 mil)
• µPD64MC-×××-5A4
KI/O6
1
20
KI/O5
KI/O7
2
19
KI/O4
S0
3
18
KI/O3
S1/LED
4
17
KI/O2
REM
5
16
KI/O1
VDD
6
15
KI/O0
XOUT
7
14
KI3
XIN
8
13
KI2
GND
9
12
KI1
10
11
KI0
RESET
Caution The pin numbers of KI and KI/O are in the reverse order of the µPD6600A, and 6124A.
2
µPD63, 63A, 64
BLOCK DIAGRAM
CARRIER
GENERATOR
REM
CPU
CORE
PORT KI
4
KI0-KI3
8
PORT KI/O
8
KI/O0-KI/O7
2
PORT S
2
S0, S1/LED
ROM
9-bit
TIMER
S1/LED
4
RESET
RAM
SYSTEM
CONTROL
XIN
XOUT
VDD
GND
LIST OF FUNCTIONS
µPD63
µPD63A
512 × 10 bits
768 × 10 bits
Item
ROM capacity
µPD64
1002 × 10 bits
Mask ROM
RAM capacity
µPD6P4B
1002 × 10 bits
One-time PROM
32 × 4 bits
Stack
1 level (multiplexed with RF of RAM)
I/O pins
•
•
•
•
Number of keys
• 32 keys
• 48 keys (when extended by key extension input)
• 96 keys (when extended by key extension input and diode)
Clock frequency
Ceramic oscillation
• fX = 2.4 to 8 MHz
• fX = 2.4 to 4 MHz
Key input (KI)
Key I/O (KI/O)
Key extended input (S0, S1)
Remote control transmission display output (LED)
:
:
:
:
4
8
2
1 (multiplexed with S1 pin)
Instruction execution time
8 µs (fX = 8 MHz)
Carrier frequency
fX/8, fX/16, fX/64, fX/96, fX/128, fX/192, no carrier (high level)
Timer
9-bit programmable timer: 1 channel
POC circuit
Mask option
Internal
Supply voltage
• VDD = 1.8 to 3.6 V
• VDD = 2.2 to 3.6 V (with POC circuit)
VDD = 2.2 to 3.6 V
(fX = 2.4 to 4 MHz)
VDD = 2.7 to 3.6 V
(fX = 4 to 8 MHz)
Operating ambient temperature
• T A = –40 to +85 °C
• T A = –20 to +70 °C (with POC circuit)
Package
• 20-pin plastic SOP (300 mil)
• 20-pin plastic
SOP (300 mil)
• 20-pin plastic
SSOP (300 mil)
• 20-pin plastic
SOP (300 mil)
3
µPD63, 63A, 64
TABLE OF CONTENTS
1. PIN FUNCTIONS .........................................................................................................................
6
1.1
List of Pin Functions .........................................................................................................................
6
1.2
INPUT/OUTPUT Circuits of Pins ......................................................................................................
7
1.3
Dealing with Unused Pins ................................................................................................................
8
2. INTERNAL CPU FUNCTIONS ....................................................................................................
9
2.1
Program Counter (PC) ......................................................................................................................
9
2.2
Stack Pointer (SP) .............................................................................................................................
9
2.3
Address Stack Register (ASR (RF)) .................................................................................................
9
2.4
Program Memory (ROM) ................................................................................................................... 10
2.5
Data Memory (RAM) .......................................................................................................................... 10
2.6
Data Pointer (DP) ............................................................................................................................... 11
2.7
Accumulator (A) ................................................................................................................................ 11
2.8
Arithmetic and Logic Unit (ALU) ...................................................................................................... 12
2.9
Flags ................................................................................................................................................... 12
2.9.1
Status flag (F) .......................................................................................................................... 12
2.9.2
Carry flag (CY) ........................................................................................................................ 13
3. PORT REGISTERS (PX) ............................................................................................................. 14
3.1
KI/O Port (P0) ....................................................................................................................................... 15
3.2
KI Port/Special Ports (P1) ................................................................................................................. 16
3.2.1
KI port (P11: bits 4-7 of P1) ...................................................................................................... 16
3.2.2
S0 port (P1’s bit 2) ................................................................................................................... 16
3.2.3
S1/LED (port bit 3 of p1) .......................................................................................................... 16
3.3
Control Register 0 (P3) ..................................................................................................................... 17
3.4
Control Register 1 (P4) ..................................................................................................................... 18
4. TIMER ......................................................................................................................................... 19
4.1
Timer Configuration .......................................................................................................................... 19
4.2
Timer Operation ................................................................................................................................. 20
4.3
Carrier Output .................................................................................................................................... 21
4.4
Software Control of Timer Output ................................................................................................... 21
5. STANDBY FUNCTION ................................................................................................................ 22
5.1
Outline of Standby Function ............................................................................................................ 22
5.2
Standby Mode Setup and Release ................................................................................................... 23
5.3
Standby Mode Release Timing ........................................................................................................ 24
6. RESET PIN .................................................................................................................................. 26
7. POC CIRCUIT (MASK OPTION) ................................................................................................ 27
7.1
Functions of POC Circuit .................................................................................................................. 28
7.2
Oscillation Check at Low Supply Voltage ....................................................................................... 28
8. SYSTEM CLOCK OSCILLATION CIRCUIT ............................................................................... 29
4
µPD63, 63A, 64
9. INSTRUCTION SET .................................................................................................................... 30
9.1
Machine Language Output by Assembler ....................................................................................... 30
9.2
Circuit Symbol Description .............................................................................................................. 31
9.3
Mnemonic to/from Machine Language (Assembler Output) Contrast Table ............................... 32
9.4
Accumulator Operation Instructions ............................................................................................... 36
9.5
Input/Output Instructions ................................................................................................................. 39
9.6
Data Transfer Instructions ................................................................................................................ 40
9.7
Branch Instructions .......................................................................................................................... 42
9.8
Subroutine Instructions .................................................................................................................... 43
9.9
Timer Operation Instruction ............................................................................................................. 44
9.10 Others ................................................................................................................................................. 45
10. ASSEMBLER RESERVED WORDS .......................................................................................... 47
10.1 Mask Option Directives ..................................................................................................................... 47
10.1.1 OPTION and ENDOP directives ............................................................................................. 47
10.1.2 Mask option definition directive ............................................................................................... 47
11. ELECTRICAL SPECIFICATIONS ............................................................................................... 48
12. CHARACTERISTIC CURVE (REFERENCE VALUES) .............................................................. 53
13. APPLIED CIRCUIT EXAMPLE ................................................................................................... 55
14. PACKAGE DRAWINGS .............................................................................................................. 56
15. RECOMMENDED SOLDERING CONDITIONS .......................................................................... 58
APPENDIX A. DEVELOPMENT TOOLS ......................................................................................... 59
APPENDIX B. FUNCTIONAL COMPARISON BETWEEN µPD63 SUBSERIES AND OTHER
SUBSERIES.............................................................................................................. 60
APPENDIX C. EXAMPLE OF REMOTE-CONTROL TRANSMISSION FORMAT .......................... 61
5
µPD63, 63A, 64
1. PIN FUNCTIONS
1.1 List of Pin Functions
Pin No.
Symbol
Function
1
2
15-20
KI/O0-KI/O7
These pins refer to the 8-bit I/O ports. I/O switching can
be made in 8-bit units.
In INPUT mode, a pull-down resistor is added.
In OUTPUT mode, they can be used as the key scan
output of the key matrix.
3
S0
Refers to the input port.
Can also be used as the key return input of the key
matrix.
In INPUT mode, the availability of the pull-down resistor
of the S0 and S1 ports can be specified by software in
Output Format
CMOS
push-pullNote 1
—
When Reset
High-level output
High-impedance
(OFF mode)
terms in 2-bit units.
If INPUT mode is canceled by software, this pin is placed
in OFF mode and enters the high-impedance state.
4
S1/LED
Refers to the I/O port.
In INPUT mode (S1), this pin can also be used as the key
return input of the key matrix.
The availability of the pull-down resistor of the S0 and S1
ports can be specified by software in 2-bit units.
In OUTPUT mode (LED), it becomes the remote control
transmission display output (active low). When the
remote control carrier is output from the REM output, this
pin outputs the low level from the LED output synchronously
with the REM signal.
CMOS push-pull
High-level output
(LED)
5
REM
Refers to the infrared remote control transmission output.
The output is active high.
Carrier frequency: fX/8, fX/64, fX/96, high-level, fX /16,
fX/128, fX /192 (usable on software)
CMOS push-pull
Low-level output
6
VDD
Refers to the power supply.
—
—
7
8
XOUT
XIN
—
Low level
(oscillation stopped)
9
GND
These pins are connected to system clock ceramic
resonators.
Refers to the ground.
—
—
10
RESET
Normally, this pin is a system reset input. By inputting
a low level, the CPU can be reset. When resetting with
the POC circuit (mask option) a low level is output. A
pull-up resistor is incorporated.
—
—
11-14
KI0-KI3Note 2 These pins refer to the 4-bit input ports.
They can be used as the key return input of the key
matrix.
The use of the pull-down resistor can be specified by
software in 4-bit units.
—
Input (low-level)
Notes 1. Be careful about this because the drive capability of the low-level output side is held low.
2. In order to prevent malfunction, be sure to input a low level to more than one of pins KI0 to KI3 when
reset is released (when RESET pin changes from low level to high level, or POC is released due to
supply voltage startup).
6
µPD63, 63A, 64
1.2 INPUT/OUTPUT Circuits of Pins
The input/output circuits of the µPD63 pins are shown in partially simplified forms below.
(1) K I/O0-K I/O7
(4) S 0
VDD
data
Output
latch
Input buffer
P-ch
OFF mode
N-chNote
standby
release
Selector
output
disable
N-ch
pull-down flag
Input buffer
N-ch
(5) S1/LED
VDD
Note The drive capability is held low.
REM
output latch
(2) K I0-K I3
standby
release
P-ch
output
disable
Input buffer
N-ch
standby
release
Input buffer
pull-down flag
N-ch
N-ch
pull-down flag
(3) REM
(6) RESET
VDD
VDD
P-ch
P-ch
data
Output
latch
N-ch
Carrier
generator
Input buffer
Internal reset signal
other than POC
N-ch
POC circuit
Mask option
7
µPD63, 63A, 64
1.3 Dealing with Unused Pins
The following connections are recommended for unused pins.
Table 1-1. Connections for Unused Pins
Connection
Pin
Inside the microcontroller
KI/O
INPUT mode
OUTPUT mode
REM
—
High-level output
—
S1/LED
OUTPUT mode (LED) setting
S0
OFF mode setting
KI
RESETNote
Outside the microcontroller
Leave open
—
Built-in POC circuit
Directly connect these
pins to GND
Leave open
Note If the circuit is an applied one requiring high reliability, be sure to design it in such a manner that the RESET
signal is entered externally.
Caution The I/O mode and the terminal output level are recommended to be fixed by setting them
repeatedly in each loop of the program.
8
µPD63, 63A, 64
2. INTERNAL CPU FUNCTIONS
2.1 Program Counter (PC): 10 Bits
Refers to the binary counter that holds the address information of the program memory.
Figure 2-1. Program Counter Organization
PC
PC9
PC8
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
The program counter contains the address of the instruction that should be executed next. Normally, the counter
contents are automatically incremented in accordance with the instruction length (byte count) each time an
instruction is executed.
However, when executing JUMP instructions (JMP, JC, JNC, JF, JNF), the program counter contains the jump
destination address written in the operand.
When executing the subroutine call instruction (CALL), the call destination address written in the operand is
entered in the PC after the PC contents at the time are saved in the address stack register (ASR). If the return
instruction (RET) is executed after the CALL instruction is executed, the address saved in the ASR is restored to
the PC.
When reset, the value of the program counter becomes “000H”.
2.2 Stack Pointer (SP): 1 Bit
Refers to the 1-bit register which holds the status of the address stack register.
The stack pointer contents are incremented when the call instruction (CALL) is executed; they are decremented
when the return instruction (RET) is executed.
When reset, the stack pointer contents are cleared to “0”.
When the stack pointer overflows (stack level 2 or more) or underflows, the CPU is hung up thus a system reset
signal is generated and the PC becoming “000H”.
As no instruction is available to set a value directly for the stack pointer, it is not possible to operate the pointer
by means of a program.
2.3 Address Stack Register (ASR (RF)): 10 Bits
The address stack register saves the return address of the program after a subroutine call instruction is executed.
The low-order 8 bits are arranged in the RF of the data memory as a dual-function RAM. The register holds
the ASR value even after the RET is executed.
When reset, it holds the previous data (undefined when turning on the power).
Caution If the RF is accessed as the data memory, the high-order 2 bits of the ASR become undefined.
Figure 2-2.
Address Stack Register Organization
RF
ASR
ASR9
ASR8
ASR7
ASR6
ASR5
ASR4
ASR3
ASR2
ASR1
ASR0
9
µPD63, 63A, 64
2.4 Program Memory (ROM): 512 steps × 10 bits ( µ PD63)
768 steps × 10 bits (µ PD63A)
1002 steps × 10 bits ( µ PD64)
The ROM consists of 10 bits per step, and is addressed by the program counter.
The program memory stores programs and table data, etc.
The 22 steps from 3EAH to 3FFH cannot be used in the test program area.
Figure 2-3.
(a) µ PD63
Program Memory Map
(b) µ PD63A
10 bits
(c) µ PD64
10 bits
10 bits
000H
000H
000H
0FFH
100H
0FFH
100H
0FFH
100H
1FFH
200H
1FFH
200H
1FFH
200H
2FFH
300H
2FFH
300H
Unmounted areaNote
Unmounted areaNote
3E9H
3EAH
3FFH
Test program
areaNote
3E9H
3EAH
3FFH
Test program
areaNote
3E9H
3EAH
3FFH
Test program areaNote
Note The unmounted area and the test program area are so designed that a program or data placed in either
of them by mistake is returned to the 000H address.
2.5 Data Memory (RAM): 32 × 4 Bits
The data memory, which is a static RAM consisting of 32 × 4 bits, is used to retain processed data. The data
memory is sometimes processed in 8-bit units. R0 can be used as the ROM data pointer.
RF is also used as the ASR.
When reset, R0 is cleared to “00H” and R1 to RF retain the previous data (undefined when turning on the power).
10
µPD63, 63A, 64
Figure 2-4. Data Memory Organization
R1n (high-order 4 bits) R0n (low-order 4 bits)
→DP (refer to 2.6 Data Pointer (DP))
R0
R10
R00
R1
R11
R01
R2
R12
R02
R3
R13
R03
R4
R14
R04
R5
R15
R05
R6
R16
R06
R7
R17
R07
R8
R18
R08
R9
R19
R09
RA
R1A
R0A
RB
R1B
R0B
RC
R1C
R0C
RD
R1D
R0D
RE
R1E
R0E
RF
R1F
R0F
→ASR (refer to 2.3 Address Stack Register (ASR (RF)))
2.6 Data Pointer (DP): 10 Bits
The ROM data table can be referenced by setting the ROM address in the data pointer to call the ROM contents.
The low-order 8 bits of the ROM address are specified by R0 of the data memory; and the high-order 2 bits by
bits 4 and 5 of the P3 register (CR0).
When reset, the pointer contents become “000H”.
P3 Register
P3
b5
b4
DP9
DP8
Figure 2-5. Data Pointer Organization
R10
DP7
DP6
R00
DP5
DP4
DP3
DP2
DP1
DP0
R0
2.7 Accumulator (A): 4 Bits
The accumulator, which refers to a register consisting of 4 bits, plays a leading role in performing various
operations.
When reset, the accumulator contents are left undefined.
Figure 2-6. Accumulator Organization
A3
A2
A1
A0
A
11
µPD63, 63A, 64
2.8 Arithmetic and Logic Unit (ALU): 4 Bits
The arithmetic and logic unit (ALU), which refers to an arithmetic circuit consisting of 4 bits, executes simple
manipulations with priority given to logical operations.
2.9 Flags
2.9.1 Status flag (F)
Pin and timer statuses can be checked by executing the STTS instruction to check the status flag.
The status flag is set (to 1) in the following cases.
• If the condition specified with the operand is met when the STTS instruction has been executed
• When STANDBY mode is canceled.
• When the cancelation condition is met at the point of executing the HALT instruction. (In this case, the system
is not placed in STANDBY mode.)
Conversely, the status flag is cleared (to 0) in the following cases:
• If the condition specified with the operand is not met when the STTS instruction has been executed.
• When the status flag has been set (to 1), the HALT instruction executed, but the cancelation condition is not
met at the point of executing the HALT instruction. (In this case, the system is not placed in STANDBY mode.)
Table 2-1. Conditions for Status Flag (F) to be Set by STTS Instruction
Operand Value of STTS Instruction
b2
b1
b0
0
0
0
0
High level is input to at least one of KI pins.
0
1
1
High level is input to at least one of KI pins.
1
1
0
High level is input to at least one of KI pins.
1
0
1
The down counter of the timer is 0.
1
12
Condition for Status Flag (F) to be Set
b3
Either of the combinations
of b2, b1, and b0 above.
[The following condition is added in addition to the above.]
High level is input to at least one of S0 and S1 pins.
µPD63, 63A, 64
2.9.2 Carry flag (CY)
The carry flag is set (to 1) in the following cases:
• If the ANL instruction or the XRL instruction is executed when bit 3 of the accumulator is “1” and bit 3 of the
operand is “1”.
• If the RL instruction or the RLZ instruction is executed when bit 3 of the accumulator is “1”.
• If the INC instruction or the SCAF instruction is executed when the value of the accumulator is 0FH.
The carry flag is cleared (to 0) in the following cases:
• If the ANL instruction or the XRL instruction is executed when at least either bit 3 of the accumulator or bit
3 of the operand is “0”.
• If the RL instruction or the RLZ instruction is executed when bit 3 of the accumulator is “0”.
• If the INC instruction or the SCAF instruction is executed when the value of the accumulator is other than 0FH.
• If the ORL instruction is executed.
• When Data is written to the accumulator by the MOV instruction or the IN instruction.
13
µPD63, 63A, 64
3. PORT REGISTERS (PX)
The KI/O port, the KI port, the special ports (S0, S1/LED), and the control register are treated as port registers.
At reset, port register values are shown below.
Figure 3-1. Port Register Organization
Port Register
At Reset
P0
FFH
P10
KI/O7
P00
KI/O5
KI/O6
KI/O4
KI/O3
KI/O2
KI/O1
KI/O0
× FHNote
P1
P11
KI3
KI2
P01
KI1
KI0
S1/LED
S0
1
1
P3 (Control register 0)
03H
P13
0
0
P03
DP9
DP8
TCTL
CARY
MOD1
MOD0
P4 (Control register 1)
26H
P14
0
Note
P04
KI
S0/S1
pull-down pull-down
0
0
S1/LED mode KI/O mode
S0 mode
×: Refers to the value based on the KI pin state.
Table 3-1. Relationship between Ports and their Read/Write
Port Name
INPUT Mode
Read
OUTPUT Mode
Write
Read
Write
KI/O
Pin state
Output latch
Output latch
Output latch
KI
Pin state
—
S0
Pin state
—
Note
—
S1/LED
Pin state
—
Pin state
—
—
Note When in OFF mode, “1” is normally read.
14
—
µPD63, 63A, 64
3.1 K I/O Port (P0)
The KI/O port is an 8-bit input/output port for key scan output.
INPUT/OUTPUT mode is set by bit 1 of the P4 register.
If a read instruction is executed, the pin state can be read in INPUT mode, whereas the output latch contents
can be read in OUTPUT mode.
If the write instruction is executed, data can be written to the output latch regardless of INPUT or OUTPUT mode.
When reset, the port is placed in OUTPUT mode; and the value of the output latch (P0) becomes 1111 1111B.
The KI/O port contains the pull-down resistor, allowing pull-down in INPUT mode only.
Caution During double pressing of a key, a high-level output and a low-level output may coincide with
each other at the KI/O port. To avoid this, the low-level output current of the KI/O port is held
low. Therefore, be careful when using the KI/O port for purposes other than key scan output.
The KI/O port is so designed that, even when connected directly to VDD within the normal supply
voltage range (VDD = 1.8 to 3.6 V), no problem may occur.
Table 3-2. KI/O Port (P0)
b0-b7
Bit
b7
b6
b5
b4
b3
b2
b1
b0
Name
KI/O7
KI/O6
KI/O5
KI/O4
KI/O3
KI/O2
KI/O1
KI/O0
: In reading : In INPUT mode, the KI/O pin’s state is read.
In OUTPUT mode, the KI/O pin’s output latch contents are read.
In writing
: Data is written to the KI/O pin’s output latch regardless of INPUT or OUTPUT mode.
15
µPD63, 63A, 64
3.2 K I Port/Special Ports (P1)
3.2.1 K I port (P 11: bits 4-7 of P1)
The KI port is to the 4-bit input port for key entry.
The pin state can be read.
Software can be used to set the availability of the pull-down resistor of the KI port in 4-bit units by means of bit
5 of the P4 register.
When reset, the pull-down resistor is connected.
Table 3-3. KI/Special Port Register (P1)
b2
Bit
b7
b6
b5
b4
b3
b2
b1
b0
Name
KI3
KI2
KI1
KI0
S1/LED
S0
(Fixed to “1”)
: In INPUT mode, state of the S0 pin is read (Read only).
In OFF mode, this bit is fixed to “1”.
b3
: The state of the S1/LED pin is read regardless of INPUT/OUTPUT mode (Read only).
b4-b7
: The state of the KI pin is read (Read only).
Caution In order to prevent malfunction, be sure to input a low level to more than one of pins KI0 to KI3
when reset is released (when RESET pin changes from low level to high level, or POC is released
due to supply voltage startup).
3.2.2 S 0 port (P1’s bit 2)
The S0 port is the INPUT/OFF mode port.
The pin state can be read by setting this port to INPUT mode with bit 0 of the P4 register.
In INPUT mode, software can be used to set the availability of the pull-down resistor of the S0 and S1/LED port
in 2-bit units by means of bit 4 of the P4 register.
If INPUT mode is canceled (thus set to OFF mode), the pin becomes high-impedance but it also makes that the
through current does not flow internally. In OFF mode, “1” can be read regardless of the pin state.
When reset, it is set to OFF mode, thus becoming high-impedance.
3.2.3 S 1/LED (port bit 3 of P1)
The S1/LED port is the input/output port.
It uses bit 2 of the P4 register to set INPUT or OUTPUT mode. The pin state can be read in both INPUT mode
and OUTPUT mode.
When in INPUT mode, software can be used to set the availability of the pull-down resistor of the S0 and
S 1/LED ports in 2-bit units by means of bit 4 of the P4 register.
When in OUTPUT mode, the pull-down resistor is automatically disconnected thus becoming the remote control
transmission display pin (refer to 4. TIMER).
When reset, it is placed in OUTPUT mode, and high level is output.
16
µPD63, 63A, 64
3.3 Control Register 0 (P3)
Control register 0 consists of 8 bits. The contents that can be controlled are as shown below.
When reset, the register becomes 0000 0011B.
Table 3-4. Control Register 0 (P3)
Bit
b7
Name
b6
b5
—
—
b4
b3
DP (Data pointer) TCTL
b2
b1
b0
CARY
MOD1
MOD0
DP9
DP8
Set
0
Fixed
Fixed
0
0
1/1
ON
value
1
to “0”
to “0”
1
1
1/2
OFF
0
0
0
0
0
0
When reset
Refer to Table 3-5.
1
1
b0, b1 : These bits specify the carrier frequency and duty ratio of the REM output.
b2
: This bit specifies the availability of the carrier of the frequency specified by b0 and b1.
“0” = ON (with carrier); “1” = OFF (without carrier; high level)
b3
: This bit changes the carrier frequency and the timer clock’s frequency division ratio.
“0” = 1/1 (carrier frequency: the specified value of b0 and b1; timer clock: fX/64)
“1” = 1/2 (carrier frequency: half of the specified value of b0 and b1; timer clock: fX/128)
Table 3-5. Timer Clock and Carrier Frequency Setup
b3
0
0
b2
0
Remark
b0
Timer Clock
fX/64
Carrier Frequency (Duty Ratio)
0
0
0
1
fX/64 (Duty 1/2)
1
0
fX/96 (Duty 1/2)
1
1
fX/96 (Duty 1/3)
1
×
×
0
0
0
0
1
fX/128 (Duty 1/2)
1
0
fX/192 (Duty 1/2)
1
1
fX/192 (Duty 1/3)
×
×
Without carrier (high level)
1
b4 and b5
b1
fX/8 (Duty 1/2)
Without carrier (high level)
fX/128
fX/16 (Duty 1/2)
: These bits specify the high-order 2 bits (DP8 and DP9) of ROM’s data pointer.
×: don’t care
17
µPD63, 63A, 64
3.4 Control Register 1 (P4)
Control register 1 consists of 8 bits. The contents that can be controlled are as shown below.
When reset, the register becomes 0010 0110B.
Table 3-6. Control Register 1 (P4)
Bit
b7
Name
b6
—
—
b5
b4
KI
S0/S1
b3
—
Pull-down Pull-down
b2
b1
b0
S1/LED
KI/O
S0
mode
mode
mode
Set
0
Fixed
Fixed
OFF
OFF
Fixed
S1
IN
OFF
value
1
to “0”
to “0”
ON
ON
to “0”
LED
OUT
IN
0
0
1
0
0
1
1
0
When reset
b0
: Specifies the input mode of the S0 port. “0” = OFF mode (high impedance); “1” = IN (INPUT mode).
b1
: Specifies the I/O mode of the KI/O port.
“0” = IN (INPUT mode); “1” = OUT (OUTPUT mode).
b2
: Specifies the I/O mode of the S1/LED port. “0” = S1 (INPUT mode); “1” = LED (output mode).
b4
: Specifies the availability of the pull-down resistor in S0/S 1 port INPUT mode. “0” = OFF (unavailable);
b5
: Specifies the availability of the pull-down resistor in KI port. “0” = OFF (unavailable);
“1” = ON (available)
“1” = ON (available).
Remark In OUTPUT mode or in OFF mode, all the pull-down resistors are automatically disconnected.
18
µPD63, 63A, 64
4. TIMER
4.1 Timer Configuration
The timer is the block used for creating a remote control transmission pattern. As shown in Figure 4-1, it consists
of a 9-bit down counter (t8 to t0), a flag (t9) permitting the 1-bit timer output, and a zero detecting circuit.
Figure 4-1. Timer Configuration
T1
t9
t8
T0
t7
t6
t5
t4
t3
t2
9-bit down counter
t0
fX/64
fX/128
Timer operation end signal
(HALT # ×101B release
signal)
S1/LED
Carrier
synchronous
circuit
REM
t1
Count
clock
Selector
Bit 3 of control register 0 (P3)
T
Zero detecting circuit
Bit 2 of control register 0 (P3)
Carrier signal
19
µPD63, 63A, 64
4.2 Timer Operation
The timer starts (counting down) when a value other than 0 is set for the down counter with a timer operation
instruction. The timer operation instructions for making the timer start operation are shown below:
MOV T0, A
MOV T1, A
MOV T, #data10
MOV T, @R0
The down counter is decremented (–1) in the cycle of 64/fX or 128/fXNote. If the value of the down counter becomes
0, the zero detecting circuit generates the timer operation end signal to stop the timer operation. At this time, if
the timer is in HALT mode (HALT #×101B) waiting for the timer to stop its operation, the HALT mode is canceled
and the instruction following the HALT instruction is executed. The output of the timer operation end signal is
continued while the down counter is 0 and the timer is stopped. There is the following relational expression between
the timer’s time and the down counter’s set value.
Timer time = (Set value + 1) × 64/f X (or 128/fXNote)
Note This becomes 128/fX if bit 3 of the control register is set (to 1).
By setting 1 for the flag (t9) which enables the timer output, the timer can output its operation status from the
S1/LED pin and the REM pin. The REM pin can also output the carrier while the timer is in operation.
Table 4-1. Timer Output (at t9 = 1)
Timer operating
Timer halting
S 1/LED Pin
REM Pin
L
H
H (or carrier output Note)
L
Note The carrier output results if bit 2 of the control register 0 is cleared (to 0).
Figure 4-2. Timer Output (when carrier is not output)
Timer value: (set value + 1) × 64/fX (or 128/fX)
LED
REM
20
µPD63, 63A, 64
4.3 Carrier Output
The carrier for remote-controlled transmission can be output from the REM pin by clearing (to 0) bit 2 of the control
register 0.
As shown in Figure 4-3, in the case where the timer stops when the carrier is at a high level, the carrier continues
to be output until its next fall and then stops due to the function of the carrier synchronous circuit. When the timer
starts operation, however, the high-level width of the first carrier may become shorter than the specified width.
Figure 4-3. Timer Output (when carrier is output)
Timer value: (Set value+1) × 64/fX (or 128/fX)
LED
REM (at low-level start)
Note 1
REM (at high-level start)
Note 2
Notes 1. Error when the REM output ends: Lead by “the carrier’s low-level width” to lag by “the carrier’s highlevel width”
2. Error of the carrier’s high-level width: 0 to “the carrier’s high-level width”
4.4 Software Control of Timer Output
The timer output can be controlled by software. As shown in Figure 4-4, the pulse with a minimum width of 1instruction cycle (64/fX) can be output.
…
Figure 4-4. Pulse Output of 1-Instruction Cycle Width
…
MOV T, #0000000000B; low-level output from the REM pin
MOV T, #1000000000B; high-level output from the REM pin
…
MOV T, #0000000000B; low-level output from the REM pin
64/fX
LED
REM
21
µPD63, 63A, 64
5. STANDBY FUNCTION
5.1 Outline of Standby Function
To save current consumption, two types of standby modes, i.e., HALT mode and STOP mode, are made available.
In STOP mode, the system clock stops oscillation. At this time, the XIN and XOUT pins are fixed at a low level.
In HALT mode, CPU operation halts, while the system clock continues oscillation. When in HALT mode, the
timer (including REM output and LED output) operates.
In either STOP mode or HALT mode, the statuses of the data memory, accumulator, and port register, etc.
immediately before the standby mode is set are retained. Therefore, make sure to set the port status for the system
so that the current consumption of the whole system is suppressed before the standby mode is set.
Table 5-1. Statuses During Standby Mode
STOP Mode
Setting instruction
HALT instruction
Clock oscillation circuit
Oscillation stopped
CPU
• Operation halted
Data memory
• Immediately preceding status retained
Operation
Accumulator
• Immediately preceding status retained
statuses
Flag
Port register
Timer
HALT Mode
Oscillation continued
F
• 0 (When 1, the flag is not placed in the standby mode.)
CY
• Immediately preceding status retained
• Immediately preceding status retained
• Operation halted
• Operable
(The count value is reset to “0”)
Cautions 1. Write the NOP instruction as the first instruction after STOP mode is canceled.
2. When standby mode is canceled, the status flag (F) is set (to 1).
3. If, at the point the standby mode has been set, its cancelation condition is met, then the
system is not placed in the standby mode. However, the status flag (F) is set (1).
22
µPD63, 63A, 64
5.2 Standby Mode Setup and Release
The standby mode is set with the HALT #b3b 2b1b 0B instruction for both STOP mode and HALT mode. For the
standby mode to be set, the status flag (F) is required to have been cleared (to 0).
The standby mode is released by the release condition specified with the RESET (RESET input; POC) or the
operand of HALT instruction. If the standby mode is released, the status flag (F) is set (to 1).
Even when the HALT instruction is executed in the state that the status flag (F) has been set (to 1), the standby
mode is not set. If the release condition is not met at this time, the status flag is cleared (to 0). If the release condition
is met, the status flag remains set (to 1).
Even in the case when the release condition has been already met at the point that the HALT instruction is
executed, the standby mode is not set. Here, also, the status flag (F) is set (to 1).
Caution Depending on the status of the status flag (F), the HALT instruction may not be executed. Be
careful about this. For example, when setting HALT mode after checking the key status with
the STTS instruction, the system does not enter HALT mode as long as the status flag (F)
remains set (to 1) thus sometimes performing an unintended operation. In this case, the
intended operation can be realized by executing the STTS instruction immediately after timer
setting to clear (to 0) the status flag.
#03H
;To check the KI pin status.
MOV
T, #0xxH
;To set the timer
STTS
#05H
;To clear the status flag
STTS
…
…
Example
HALT
(During this time, be sure not to execute an instruction that may set the status flag.)
#05H
;To set HALT mode
Table 5-2. Addresses Executed After Standby Mode Release
Release Condition
Address Executed After Release
Reset
0 address
Release condition shown in Table 5-3
The address following the HALT instruction
23
µPD63, 63A, 64
Table 5-3. Standby Mode Setup (HALT #b3b2b1b0B) and Release Conditions
Operand Value of
HALT Instruction
Setting Mode
Precondition for Setup
Release Condition
b3
b2
b1
b0
0
0
0
0
STOP
All KI/O pins are high-level output.
High level is input to at least one
of KI pins.
0
1
1
STOP
All KI/O pins are high-level output.
High level is input to at least one
of KI pins.
1
1
0
STOPNote 1
The KI/O0 pin is high-level output.
High level is input to at least one
of KI pins.
1
Any of the
STOP
[The following condition is added in addition to the above.]
combinations of
—
High level is input to at least one
of S0 and S1 pins Note 2.
b2b1b0 above
0/1
1
0
1
HALT
—
When the timer’s down counter is 0
Notes 1. When setting HALT #×110B, configure a key matrix by using the KI/O0 pin and the KI pin so that an
internal reset takes effect at the time of program hang-up.
2. At least one of the S0 and S1 pins (the pin used for releasing the standby) must be in INPUT mode.
(The internal reset does not take effect even when both pins are in OUTPUT mode.)
Cautions 1. The internal reset takes effect when the HALT instruction is executed with an operand value
other than that above or when the precondition has not been satisfied when executing the
HALT instruction.
2. If STOP mode is set when the timer’s down counter is not 0 (timer operating), the system
is placed in STOP mode only after all the 10 bits of the timer’s down counter and the timer
output permit flag are cleared to 0.
3. Write the NOP instruction as the first instruction after STOP mode is released.
5.3 Standby Mode Release Timing
(1) STOP Mode Release Timing
Figure 5-1. STOP Mode Cancelation by Release Condition
HALT instruction
(STOP mode)
Wait
(52/fX + α)
Standby
release signal
OPERATING
mode
STOP mode
Oscillation
Oscillation
stopped
HALT mode
OPERATING
mode
Oscillation
Clock
α : Oscillation growth time
Caution When a release condition is established in the STOP mode, the device is released from the STOP
mode, and goes into a wait state. At this time, if the release condition is not held, the device
goes into STOP mode again after the wait time has elapsed. Therefore, when releasing the STOP
mode, it is necessary to hold the release condition longer than the wait time.
24
µPD63, 63A, 64
Figure 5-2. STOP Mode Release by RESET Input
HALT instruction
(STOP mode)
Wait
(246 to 694)/fX + α
0 address start
RESET
OPERATING
mode
Oscillation
STOP
mode
Reset
HALT mode
Oscillation stopped
OPERATING
mode
Oscillation
Clock
α : Oscillation growth time
(2) HALT Mode Release Timing
Figure 5-3. HALT Mode Release by Cancelation Condition
Standby
release signal
HALT instruction
(HALT mode)
OPERATING
mode
HALT mode
OPERATING mode
Oscillation
Clock
Figure 5-4. HALT Mode Release by RESET Input
HALT instruction
(HALT mode)
Wait
(246 to 694)/fX + α
0 address start
RESET
OPERATING
HALT mode
mode
Oscillation
Reset
Oscillation
stopped
HALT mode
OPERATING
mode
Oscillation
Clock
α : Oscillation growth time
25
µPD63, 63A, 64
6. RESET PIN
The system reset takes effect by inputting low level to the RESET pin.
While the RESET pin is at low level, the system clock oscillation circuit is stopped and the XIN and XOUT pins
are fixed to the GND.
If the RESET pin is raised from low level to high level, it executes the program from the 0 address after counting
246 to 694 of the system clock (fX).
Figure 6-1. Reset Operation by RESET Input
Wait
(246 to 694)/fX + α
0 address start
RESET
OPERATING mode or Oscillation
STANDBY mode
stopped
HALT mode
OPERATING
mode
α : Oscillation growth time
The RESET pin outputs low level when the POC circuit (mask option) is in operation.
Caution When connecting a reset IC to the RESET pin, ensure that the IC is of the N-ch open drain output
type.
Table 6-1. Hardware Statuses After Reset
• RESET Input in Operation
• Resetting by Internal POC Circuit in Operation
• Resetting by Other FactorsNote 1
Hardware
PC (10 bits)
000H
SP (1 bit)
0B
Data
R0 = DP
000H
memory
R1-RF
Undefined
Accumulator (A)
Undefined
Status flag (F)
0B
Carry flag (CY)
0B
Timer (10 bits)
000H
Port register
P0
FFH
P1
×FHNote 2
Control register P3
P4
• RESET Input During STANDBY Mode
• Resetting by the Internal POC Circuit During
STANDBY Mode
Previous status retained
03H
26H
Notes 1. The following resets are available.
• Reset when executing the HALT instruction (when the operand value is illegal or does not satisfy
the precondition)
• Reset when executing the RLZ instruction (when A = 0)
• Reset by stack pointer’s overflow or underflow
2. Refers to the value by the KI pin status.
In order to prevent malfunction, be sure to input a low level to more than one of pins KI0 to KI3 when
reset is released (when RESET pin changes from low level to high level, or POC is released due to
supply voltage startup).
26
µPD63, 63A, 64
7. POC CIRCUIT (MASK OPTION)
The POC circuit monitors the power supply voltage and applies an internal reset in the microcontroller at the
time of battery replacement. If the applied circuit satisfies the following conditions, the POC circuit can be
incorporated by the mask option.
• High reliability is not required.
• Clock frequency fX =2.4 to 4 MHz
• Power supply voltage VDD = 2.2 to 3.6 V
• Operating ambient temperature TA = –20 to +70 ˚C
Cautions 1. The one-time PROM product (µPD6P4B) originally contains the POC circuit.
2. There are cases in which the POC circuit cannot detect a low power supply voltage of less
than 1 ms. Therefore, if the power supply voltage has become low for a period of less than
1 ms, the POC circuit may malfunction because it does not generate an internal reset signal.
3. Clock oscillation is stopped by the resonator due to low power supply voltage before the
POC circuit generates the internal reset signal. In this case, malfunction may result, for
example when the power supply voltage is recovered after the oscillation is stopped. This
type of phenomenon takes place because the POC circuit does not generate an internal reset
signal (because the power supply voltage recovers before the low power supply voltage is
detected) even though the clock has stopped. If, by any chance, a malfunction has taken
place, remove the battery for a short time and put it back. In most cases, normal operation
will be resumed.
4. If the applied circuit does not satisfy the conditions above, design the applied circuit in such
a manner that the reset takes effect without failure within the power supply voltage range
by means of an external reset circuit.
5. In order to prevent malfunction, be sure to input a low level to more than one of pins KI0 to
KI3 when reset is released (when RESET pin changes from low level to high level, or POC
is released due to supply voltage startup).
Remarks 1. It is recommended that the POC circuit be incorporated when applied circuits are infrared remotecontrol transmitters for household appliances.
2. Even when a POC circuit is incorporated, the externally entered RESET input is valid with the OR
condition; therefore, the POC circuit and the RESET input can be used at the same time. However,
if the POC circuit detects a low power supply voltage, the RESET pin will be forced to low level;
therefore, use an N-ch open drain output or NPN open collector output for the external reset circuit.
27
µPD63, 63A, 64
7.1 Functions of POC Circuit
The POC circuit has the following functions:
• Generates an internal reset signal when VDD ≤ V POC.
• Cancels an internal reset signal when VDD > VPOC.
Here, VDD: power supply voltage, VPOC: POC-detected voltage.
VDD
Operating ambient temperature TA = – 20 to + 70°C
3.6 V
Clock frequency fX = 2.4 to 4 MHz
2.2 V
←POC-detected voltage VPOC = 0.9 to 2.2 VNote 3
VPOC
0.9 V
0V
→t
Internal reset signal
Reset
↑
Note 1
OPERATING mode
↑ Reset
Note 2
Notes 1. In reality, there is the oscillation stabilization wait time until the circuit is switched to OPERATING
mode. The oscillation stabilization wait time is about 252/fX to 700/fX (when about 70 to 190 µs; f X
= 3.64 MHz).
2. For the POC circuit to generate an internal reset signal when the power supply voltage has fallen,
it is necessary for the power supply voltage to be kept less than the VPOC for the period of 1 ms or
more. Therefore, in reality, there is the time lag of up to 1 ms until the reset takes effect.
3. The POC-detected voltage (VPOC) varies between 0.9 to 2.2 V; thus, the resetting may be canceled
at a power supply voltage smaller than the assured range (VDD = 1.8 to 3.6 V). However, as long as
the conditions for operating the POC circuit are met, the actual lowest operating power supply voltage
becomes lower than the POC-detected voltage. Therefore, there is no malfunction occurring due to
the shortage of power supply voltage. However, malfunction for such reasons as the clock not
oscillating due to low power supply voltage may occur (refer to Cautions 3. in 7. POC CIRCUIT).
7.2 Oscillation Check at Low Supply Voltage
A reliable resetting operation can be expected of the POC circuit if it satisfies the condition that the clock can
oscillate even at low power supply voltage (the oscillation start voltage of the resonator being even lower than the
POC-detected voltage). Whether this condition is being met or not can be checked by measuring the oscillation
status on a product which actually contains a POC circuit, as follows.
<1> Connect a storage oscilloscope to the X OUT pin so that the oscillation status can be measured.
<2> Connect a power supply whose output voltage can be varied and then gradually raise the power supply
voltage V DD from 0 V (making sure to avoid V DD > 3.6V).
At first (during VDD < 0.9 V), the XOUT pin is 0 V regardless of the VDD. However, at the point that VDD reaches
the POC-detected voltage (voltage somewhere between VPOC = 0.9 to 2.2 V), the voltage of the XOUT pin jumps to
about 0.5 VDD. Maintain this power supply voltage for a while to measure the waveform of the XOUT pin. If, by any
chance, the oscillation start voltage of the resonator is lower than the POC-detected voltage, the growing oscillation
of the XOUT pin can be confirmed within several ms after the VDD has reached the VPOC.
28
µPD63, 63A, 64
8. SYSTEM CLOCK OSCILLATION CIRCUIT
The system clock oscillation circuit consists of oscillation circuits for ceramic resonators (fX = 2.4 to 8 MHz).
Figure 8-1. System Clock
µ PD63, 63A, 64
XOUT
XIN
GND
Ceramic resonator
The system clock oscillation circuit stops its oscillation when reset or in STOP mode.
Caution When using the system clock oscillation circuit, wire area indicated by the dotted-line in the
diagram as follows to reduce the effects of the wiring capacitance, etc.
• Make the wiring as short as possible.
• Do not allow the wiring to intersect other signal lines. Do not wire close to lines through
which large fluctuating currents flow.
• Make sure that the point where the oscillation circuit capacitor is installed is always at the
same electric potential as the ground. Never earth with a ground pattern through which large
currents flow.
• Do not extract signals from the oscillation circuit.
29
µPD63, 63A, 64
9. INSTRUCTION SET
9.1 Machine Language Output by Assembler
The bit length of the machine language of this product is 10 bits per word. However, the machine language that
is output by the assembler is extended to 16 bits per word. As shown in the example below, the expansion is made
by inserting 3-bit extended bits (111) in two locations.
Figure 9-1. Example of Assembler Output (10 bits extended to 16 bits)
<1> In the case of “ANL A, @R0H”
1 1 1
1
1 0 1 0
1
1
1 0 1 0
1 1 1
Extended bits
0 0 0 0
1
0 0 0 0
= FAF0
1 0 0 0
= E6F8
Extended bits
<2> In the case of “OUT P0, #data8”
1 1 1
Extended bits
30
0
0 1 1 0
1
0
0 1 1 0
1 1 1
1 0 0 0
Extended bits
1
µPD63, 63A, 64
9.2 Circuit Symbol Description
A
: Accumulator
ASR
: Address Stack Register
addr
: Program memory address
CY
: Carry flag
data4
: 4-bit immediate data
data8
: 8-bit immediate data
data10
: 10-bit immediate data
F
: Status flag
PC
: Program Counter
Pn
: Port register pair (n = 0, 1, 3, 4)
P0n
: Port register (low-order 4 bits)
P1n
: Port register (high-order 4 bits)
ROMn
: Bit n of the program memory’s (n = 0-9)
Rn
: Register pair
R0n
: Data memory (General-purpose register; n = 0-F)
R1n
: Data memory (General-purpose register; n = 0-F)
SP
: Stack Pointer
T
: Timer register
T0
: Timer register (low-order 4 bits)
T1
: Timer register (high-order 4 bits)
(×)
: Content addressed with ×
31
µPD63, 63A, 64
9.3 Mnemonic to/from Machine Language (Assembler Output) Contrast Table
Accumulator Operation Instructions
Instruction Code
Operand
1st Word
Operation
Instruction
Instruction
Length
Cycle
3rd Word
A, R0n
FBEn
(A) ← (A)
A, R1n
FAEn
CY ← A3 • Rmn3
A, @R0H
FAF0
(A) ← (A)
∨
ANL
2nd Word
∨
Mnemonic
(Rmn)
m = 0, 1
n = 0-F
1
((P13), (R0))7-4
CY ← A3 • ROM7
(A) ← (A)
FBF0
∨
A, @R0L
((P13), (R0))3-0
CY ← A3 • ROM3
FBF1
data4
(A) ← (A)
∨
A, #data4
data4
2
CY ← A3 • data43
ORL
A, R0n
FDEn
(A) ← (A) ∨ (Rmn)
A, R1n
FCEn
CY ← 0
A, @R0H
FCF0
m = 0, 1
n = 0-F
1
(A) ← (A) ∨ ((P13), (R0))7-4
CY ← 0
A, @R0L
(A) ← (A) ∨ ((P13), (R0))3-0
FDF0
CY ← 0
A, #data4
FDF1
data4
(A) ← (A) ∨ data4
2
CY ← 0
XRL
A, R0n
F5En
(A) ← (A) ∨ (Rmn)
A, R1n
F4En
CY ← A3 • Rmn3
A, @R0H
F4F0
(A) ← (A) ∨ ((P13), (R0))7-4
m = 0, 1
n = 0-F
1
CY ← A3 • ROM7
A, @R0L
(A) ← (A) ∨ ((P13), (R0))3-0
F5F0
CY ← A3 • ROM3
A, #data4
F5F1
data4
(A) ← (A) ∨ data4
2
CY ← A3 • data43
INC
A
F4F3
(A) ← (A) + 1
if (A) = 0
CY ← 1
else CY ← 1
RL
A
FCF3
(An+1) ← (A n), (A 0) ← (A3)
RLZ
A
FEF3
if A = 0
CY ← A3
reset
else (An+1) ← (An), (A0) ← (A 3)
CY ← A3
32
1
1
µPD63, 63A, 64
Input/output Instructions
IN
OUT
ANL
ORL
XRL
Mnemonic
Instruction Code
Operand
2nd Word
3rd Word
A, P0n
FFF8 + n
—
—
(A) ← (Pmn)
A, P1n
FEF8 + n
—
—
CY ← 0
(Pmn) ← (A)
Remark
m = 0, 1
n = 0, 1, 3, 4
m = 0, 1
n = 0, 1, 3, 4
P0n, A
E5F8 + n
—
—
P1n, A
E4F8 + n
—
—
A, P0n
FBF8 + n
—
—
(A) ← (A)
A, P1n
FAF8 + n
—
—
CY ← A3 • Pmn3
A, P0n
FDF8 + n
—
—
(A) ← (A) ∨ (Pmn) m = 0, 1 n = 0, 1, 3, 4
A, P1n
FCF8 + n
—
—
CY ← 0
A, P0n
F5F8 + n
—
—
(A) ← (A) ∨ (Pmn) m = 0, 1 n = 0, 1, 3, 4
A, P1n
F4F8 + n
—
—
CY ← A3 • Pmn3
Pn, #data8 E6F8 + n
2nd Word
Instruction
Instruction
Length
Cycle
1
1
Instruction
Instruction
(Pmn) m = 0, 1 n = 0, 1, 3, 4
Instruction Code
Operand
1st Word
OUT
Operation
1st Word
∨
Mnemonic
Operation
3rd Word
Length
(Pn) ← data8
data8
n = 0, 1, 3, 4
2
Cycle
1
Pn: P1n-P0n are dealt with in pairs.
Data Transfer Instruction
Mnemonic
Instruction Code
Operand
1st Word
MOV
2nd Word
Operation
Instruction
Instruction
Length
Cycle
3rd Word
A, R0n
FFEn
(A) ← (Rmn)
A, R1n
FEEn
CY ← 0
A, @R0H
FEF0
(A) ← ((P13), (R0))7-4
m = 0, 1
n = 0-F
1
1
CY ← 0
A, @R0L
(A) ← ((P13), (R0))7-4
FFF0
CY ← 0
Mnemonic
A, #data4
FFF1
R0n, A
E5En
R1n, A
E4En
Instruction Code
Operand
Remark
2
(Rmn) ← (A)
1st Word
MOV
(A) ← data4
CY ← 0
data4
2nd Word
m = 0, 1
n = 0-F
Operation
1
Instruction
Instruction
Length
Cycle
3rd Word
Rn, #data8 E6En
data8
—
(R1n-R0n) ← data8
n = 0-F
2
Rn, @R0
—
—
(R1n-R0n) ← ((P13), (R0))
n = 1-F
1
E7En
1
Rn: R1n-R0n are dealt with in pairs.
33
µPD63, 63A, 64
Branch Instructions
Mnemonic
Instruction Code
Operand
1st Word
JMP
JC
JNC
JF
JNF
2nd Word
addr (Page 0) E8F1
addr
addr (Page 1) E9F1
addr
Operation
Instruction
Instruction
Length
Cycle
3rd Word
PC ← addr
2
1
PC ← addr
addr (Page 0) ECF1
addr
if CY = 1
addr (Page 1) EAF1
addr
else PC ← PC + 2
addr (Page 0) EDF1
addr
if CY = 0
addr (Page 1) EBF1
addr
else PC ← PC + 2
addr (Page 0) EEF1
addr
if F = 1
addr (Page 1) F0F1
addr
else PC ← PC + 2
addr (Page 0) EFF1
addr
if F = 0
addr (Page 1) F1F1
addr
else PC ← PC + 2
PC ← addr
PC ← addr
PC ← addr
Caution 0 and 1, which refer to PAGE0 and 1, are not written when describing mnemonics.
Subroutine Instructions
Mnemonic
Instruction Code
Operand
1st Word
CALL
2nd Word
3rd Word
addr (Page 0) E6F2
E8F1
addr
addr (Page 1) E6F2
E9F1
addr
RET
E8F2
Operation
Instruction
Instruction
Length
Cycle
SP ← SP + 1, ASR ← PC, PC ← addr
3
2
PC ← ASR, SP ← SP – 1
1
1
Caution 0 and 1, which refer to PAGE0 and 1, are not written when describing mnemonics.
Timer Operation Instructions
Mnemonic
Instruction Code
Operand
1st Word
MOV
Mnemonic
MOV
34
2nd Word
3rd Word
FFFF
A, T1
FEFF
CY ← 0
T0, A
E5FF
(Tn) ← (A)
T1, A
F4FF
(T) n ← 0
Instruction Code
1st Word
2nd Word
T, #data10
E6FF
data10
T, @R0
F4FF
Instruction
Length
(A) ← (Tn)
A, T0
Operand
Instruction
Operation
n = 0, 1
1
Cycle
1
n = 0, 1
Operation
Instruction
Instruction
Length
Cycle
3rd Word
(T) ← data10
(T) ← ((P13), (R0))
1
1
µPD63, 63A, 64
Others
Mnemonic
Instruction Code
Operand
1st Word
2nd Word
Operation
Instruction
Instruction
Length
Cycle
3rd Word
HALT
#data4
E2F1
data4
Standby mode
STTS
#data4
E3F1
data4
if statuses match
R0n
E3En
if statuses match
SCAF
FAF3
if A = 0FH
NOP
E0E0
else
else
else
2
1
F←1
F←0
F←1
F←0
1
n = 0-F
CY ← 1
CY ← 0
PC ← PC + 1
35
µPD63, 63A, 64
9.4 Accumulator Operation Instructions
ANL A, R0n
ANL A, R1n
1 1 0 1 R4 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: (A) ← (A)
∨
<1> Instruction code :
(Rmn)
m = 0, 1
n = 0 to F
CY ← A 3 • Rmn3
The accumulator contents and the register Rmn contents are ANDed and the results are entered in the
accumulator.
ANL A, @R0H
ANL A, @R0L
1 1 0 1 0/1 1 0 0 0 0
<2> Cycle count
:1
<3> Function
: (A) ← (A)
∨
<1> Instruction code :
((P13), (R0)) 7-4 (in the case of ANL A, @R0H)
CY ← A 3 • ROM7
∨
(A) ← (A)
((P13), (R0)) 3-0 (in the case of ANL A, @R0L)
CY ← A 3 • ROM3
The accumulator contents and the program memory contents specified with the control register P13 and
register pair R10-R00 are ANDed and the results are entered in the accumulator.
If H is specified, b7, b6, b5 and b4 take effect. If L is specified, b3, b2, b1 and b0 take effect.
• Program memory (ROM) organization
b7
b9
b6
b5
b4
b8
b3
H↓
b2
b1
b0
L↓
Valid bits at the time of accumulator operation
ANL A, #data4
<1> Instruction code :
1 1 0 1 1 1 0 0 0 1
0 0 0 0 0 0 d3 d2 d1 d0
:1
<3> Function
: (A) ← (A)
∨
<2> Cycle count
data4
CY ← A 3 • data43
The accumulator contents and the immediate data are ANDed and the results are entered in the
accumulator.
36
µPD63, 63A, 64
ORL A, R0n
ORL A, R1n
<1> Instruction code :
1 1 1 0 R4 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ (Rmn)
m = 0, 1
n = 0 to F
CY ← 0
The accumulator contents and the register Rmn contents are ORed and the results are entered in the
accumulator.
ORL A, @R0H
ORL A, @R0L
<1> Instruction code :
1 1 1 0 0/1 1 0 0 0 0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ (P13), (R0))7-4 (in the case of ORL A, @R0H)
(A) ← (A) ∨ (P13), (R0))3-0 (in the case of ORL A, @R0L)
CY ← 0
The accumulator contents and the program memory contents specified with the control register P13 and
register pair R10-R00 are ORed and the results are entered in the accumulator.
If H is specified, b7, b6, b5 and b4 take effect. If L is specified, b3, b2, b1 and b0 take effect.
ORL A, #data4
<1> Instruction code :
1 1 1 0 1 1 0 0 0 1
0 0 0 0 0 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ data4
CY ← 0
The accumulator contents and the immediate data are exclusive-ORed and the results are entered in
the accumulator.
XRL A, R0n
XRL A, R1n
<1> Instruction code :
1 0 1 0 R4 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ (Rmn)
m = 0, 1
n = 0 to F
CY ← A 3 • Rmn3
The accumulator contents and the register Rmn contents are ORed and the results are entered in the
accumulator.
37
µPD63, 63A, 64
XRL A, @R0H
XRL A, @R0L
<1> Instruction code :
1 0 1 0 0/1 1 0 0 0 0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ (P13), (R0)) 7-4 (in the case of XRL A, @R0H)
CY ← A 3 • ROM7
(A) ← (A) ∨ (P13), (R0)) 3-0 (in the case of XRL A, @R0L)
CY ← A 3 • ROM3
The accumulator contents and the program memory contents specified with the control register P13 and
register pair R10-R00 are exclusive-ORed and the results are entered in the accumulator.
If H is specified, b7, b6, b5, and b4 take effect. If L is specified, b3, b2, b1, and b0 take effect.
XRL A, #data4
<1> Instruction code :
1 0 1 0 1 1 0 0 0 1
0 0 0 0 0 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ data4
CY ← A 3 • data43
The accumulator contents and the immediate data are exclusive-ORed and the results are entered in
the accumulator.
INC A
<1> Instruction code :
1 0 1 0 0 1 0 0 1 1
<2> Cycle count
:1
<3> Function
: (A) ← (A) + 1
if
A = 0
else
CY ← 1
CY ← 0
The accumulator contents are incremented (+1).
RL A
<1> Instruction code :
1 1 1 0 0 1 0 0 1 1
<2> Cycle count
:1
<3> Function
: (A n + 1) ← (An), (A 0) ← (A3)
CY ← A 3
The accumulator contents are rotated anticlockwise bit by bit.
RLZ A
<1> Instruction code :
1 1 1 1 0 1 0 0 1 1
<2> Cycle count
:1
<3> Function
: if
A = 0
else
reset
(A n + 1) ← (An), (A 0) ←(A3)
CY ← A 3
The accumulator contents are rotated anticlockwise bit by bit.
If A = 0H at the time of command execution, an internal reset takes effect.
38
µPD63, 63A, 64
9.5 Input/Output Instructions
IN A, P0n
IN A, P1n
<1> Instruction code :
1 1 1 1 P4 1 1 P2 P1 P0
<2> Cycle count
:1
<3> Function
: (A) ← (Pmn)
m = 0, 1
n = 0, 1, 3, 4
CY ← 0
The port Pmn data is loaded (read) onto the accumulator.
OUT P0n, A
OUT P1n, A
<1> Instruction code :
0 0 1 0 P4 1 1 P2 P1 P0
<2> Cycle count
:1
<3> Function
: (Pmn) ← (A)
m = 0, 1
n = 0, 1, 3, 4
The accumulator contents are transferred to port Pmn to be latched.
ANL A, P0n
ANL A, P1n
1 1 0 1 P4 1 1 P2 P1 P0
<2> Cycle count
:1
<3> Function
: (A) ← (A)
∨
<1> Instruction code :
(Pmn)
m = 0, 1
n = 0, 1, 3, 4
CY ← A 3 • Pmn
The accumulator contents and the port Pmn contents are ANDed and the results are entered in the
accumulator.
ORL A, P0n
ORL A, P1n
<1> Instruction code :
1 1 1 0 P4 1 1 P2 P1 P0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ (Pmn)
m = 0, 1
n = 0, 1, 3, 4
CY ← 0
The accumulator contents and the port Pmn contents are ORed and the results are entered in the
accumulator.
XRL A, P0n
XRL A, P1n
<1> Instruction code :
1 0 1 0 P4 1 1 P2 P1 P0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ (Pmn)
m = 0, 1
n = 0, 1, 3, 4
CY ← A 3 • Pmn
The accumulator contents and the port Pmn contents are exclusive-ORed and the results are entered
in the accumulator.
39
µPD63, 63A, 64
OUT Pn, #data8
<1> Instruction code :
0 0 1 1 0 1 1 P2 P1 P0
:
0 d7 d6 d5 d4 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: (Pn) ← data8
n = 0, 1, 3, 4
The immediate data is transferred to port Pn. In this case, port Pn refers to P1n-P 0n operating in pairs.
9.6 Data Transfer Instruction
MOV A, R0n
MOV A, R1n
<1> Instruction code :
1 1 1 1 R4 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: (A) ← (Rmn)
m = 0, 1
n = 0 to F
CY ← 0
The register Rmn contents are transferred to the accumulator.
MOV A, @R0H
<1> Instruction code :
1 1 1 1 0 1 0 0 0 0
<2> Cycle count
:1
<3> Function
: (A) ← ((P13), (R0)) 7-4
CY ← 0
The high-order 4 bits (b7 b6 b5 b4) of the program memory specified with control register P13 and register
pair R10-R00 are transferred to the accumulator. b9 is ignored.
MOV A, @R0L
<1> Instruction code :
1 1 1 1 1 1 0 0 0 0
<2> Cycle count
:1
<3> Function
: (A) ← ((P13), (R0)) 3-0
CY ← 0
The low-order 4 bits (b3 b 2 b1 b0) of the program memory specified with control register P13 and register
pair R10-R00 are transferred to the accumulator. b8 is ignored.
• Program memory (ROM) contents
@R0 H
b9
b7
b6
b5
@R0 L
b4
b8
b3
b2
b1
b0
MOV A, #data4
<1> Instruction code :
1 1 1 1 1 1 0 0 0 1
:
0 0 0 0 0 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: (A) ← data4
CY ← 0
The immediate data is transferred to the accumulator.
40
µPD63, 63A, 64
MOV R0n, A
MOV R1n, A
<1> Instruction code :
0 0 1 0 R4 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: (Rmn) ← (A)
m = 0, 1
n = 0 to F
The accumulator contents are transferred to register Rmn.
MOV Rn, #data8
<1> Instruction code :
0 0 1 1 0 0 R3 R2 R1 R0
:
0 d7 d6 d5 d4 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: (R1n-R0n) ← data8
n = 0 to F
The immediate data is transferred to the register. Using this instruction, registers operate as register
pairs.
The pair combinations are as follows:
R0 : R10 - R00
R1 : R11 - R01
:
RE : R1E - R0E
RF : R1F - R0F
Lower column
Higher column
MOV Rn, @R0
<1> Instruction code :
0 0 1 1 1 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: (R1n-R0n) ← ((P13), R0))
n = 1 to F
The program memory contents specified with control register P13 and register pair R10-R00 are
transferred to register pair R1n-R0n. The program memory consists of 10 bits and has the following
state after the transfer to the register.
Program memory
b9
b7
b6
b5
b4
@R0
b8
b3
b2
b1
b0
→
b9
b7
b6
b5
R1n
b4
b8
b3
b2
b1
b0
R0n
The high-order 2 bits of the program memory address is specified with the control register (P13).
41
µPD63, 63A, 64
9.7 Branch Instructions
The program memory consists of pages in steps of 1K (000H to 3FFH). However, as the assembler automatically
performs page optimization, it is unnecessary to designate pages. The pages allowed for each product are as
follows.
µPD63 (ROM: 0.5K steps)
: page 0
µPD63A (ROM: 0.75K steps): page 0
µPD64 (ROM: 1K steps)
: page 0
µPD6P4B (PROM: 1K steps) : page 0
JMP addr
<1> Instruction code : page 0
0 1 0 0 0 1 0 0 0 1
; page 1
0 1 0 0 1 1 0 0 0 1
a9 a7 a6 a5 a4 a8 a3 a2 a1 a0
<2> Cycle count
:1
<3> Function
: PC ← addr
The 10 bits (PC9-0) of the program counter are replaced directly by the specified address addr (a9 to
a0).
JC addr
<1> Instruction code : page 0
0 1 1 0 0 1 0 0 0 1
; page 1
0 1 0 1 0 1 0 0 0 1
a9 a7 a6 a5 a4 a8 a3 a2 a1 a0
<2> Cycle count
:1
<3> Function
: if
CY = 1
else
PC ← addr
PC ← PC + 2
If the carry flag CY is set (to 1), a jump is made to the address specified with addr (a9 to a0).
JNC addr
<1> Instruction code : page 0
0 1 1 0 1 1 0 0 0 1
; page 1
0 1 0 1 1 1 0 0 0 1
a9 a7 a6 a5 a4 a8 a3 a2 a1 a0
<2> Cycle count
:1
<3> Function
: if
CY = 0
else
PC ← addr
PC ← PC + 2
If the carry flag CY is cleared (to 0), a jump is made to the address specified with addr (a9 to a0).
JF addr
<1> Instruction code : page 0
0 1 1 1 0 1 0 0 0 1
; page 1
1 0 0 0 0 1 0 0 0 1
a9 a7 a6 a5 a4 a8 a3 a2 a1 a0
<2> Cycle count
:1
<3> Function
: if
F = 1
else
PC ← addr
PC ← PC + 2
If the status flag F is set (to 1), a jump is made to the address specified with addr (a9 to a0).
JNF addr
<1> Instruction code : page 0
0 1 1 1 1 1 0 0 0 1
; page 1
1 0 0 0 1 1 0 0 0 1
a9 a7 a6 a5 a4 a8 a3 a2 a1 a0
<2> Cycle count
:1
<3> Function
: if
F = 0
else
PC ← addr
PC ← PC + 2
If the status flag F is cleared (to 0), a jump is made to the address specified with addr (a9 to a0).
42
µPD63, 63A, 64
9.8 Subroutine Instructions
The program memory consists of pages in steps of 1K (000H to 3FFH). However, as the assembler automatically
performs page optimization, it is unnecessary to designate pages. The pages allowed for each product are as
follows.
µPD63 (ROM: 0.5K steps)
: page 0
µPD63A (ROM: 0.75K steps): page 0
µPD64 (ROM: 1K steps)
: page 0
µPD6P4B (PROM: 1K steps) : page 0
CALL addr
<1> Instruction code :
0 0 1 1 0 1 0 0 1 0
page 0
0 1 0 0 0 1 0 0 0 1
; page 1
0 1 0 0 1 1 0 0 0 1
a9 a7 a6 a5 a4 a8 a3 a2 a1 a0
<2> Cycle count
:2
<3> Function
: SP ← SP + 1
ASR ← PC
PC ← addr
Increments (+1) the stack pointer value and saves the program counter value in the address stack
register. Then, enters the address specified with the operand addr (a9 to a0) into the program counter.
If a carry is generated when the stack pointer value is incremented (+1), an internal reset takes effect.
RET
<1> Instruction code :
0 1 0 0 0 1 0 0 1 0
<2> Cycle count
:1
<3> Function
: PC ← ASR
SP ← SP – 1
Restores the value saved in the address stack register to the program counter. Then, decrements
(–1) the stack pointer.
If a borrow is generated when the stack pointer value is decremented (–1), an internal reset takes effect.
43
µPD63, 63A, 64
9.9 Timer Operation Instructions
MOV A, T0
MOV A, T1
<1> Instruction code :
1 1 1 1 0/1 1 1 1 1 1
<2> Cycle count
:1
<3> Function
: (A) ← (Tn)
n = 0, 1
CY ← 0
The timer Tn contents are transferred to the accumulator. T1 corresponds to (t9, t8, t7, t6); T0 corresponds
to (t5, t4, t3, t2).
T
t9
t8
t7
t6
t5
T1
t4
t3
t2
t1
t0
T0
↓
MOV T, #data10
Can be set with
MOV T, @R0
MOV T0, A
MOV T1, A
<1> Instruction code :
0 0 1 0 0/1 1 1 1 1 1
<2> Cycle count
:1
<3> Function
: (Tn) ← (A)
n = 0, 1
The accumulator contents are transferred to the timer register Tn. T1 corresponds to (t9, t8, t7, t6); T0
corresponds to (t5, t4, t3, t 2). After executing this instruction, if data is transferred to T1, t1 becomes 0;
if data is transferred to T0, t0 becomes 0.
MOV T, #data10
<1> Instruction code :
0 0 1 1 0 1 1 1 1 1
t1 t9 t8 t7 t6 t0 t5 t4 t3 t2
<2> Cycle count
:1
<3> Function
: (T) ← data10
The immediate data is transferred to the timer register T (t9-t0).
Remark The timer time is set with
44
(set value + 1) × 64/f X or 128/fX.
µPD63, 63A, 64
MOV T, @R0
<1> Instruction code :
0 0 1 1 1 1 1 1 1 1
<2> Cycle count
:1
<3> Function
: (T) ← ((P13), (R0))
Transfers the program memory contents to the timer register T (t9 to t0) specified with the control register
P13 and the register pair R10-R00.
The program memory, which consists of 10 bits, is placed in the following state after the transfer to the
register.
Timer
Program memory
t9
t1
t8
t7
t6
t0
T
t5
t4
t3
→
t2
@R0
t9
t8
t7
T1
t6
t5
t4
t3
t2
t1
t0
T0
The high-order 2 bits of the program memory address are specified with the control register (P13).
Caution When setting a timer value in the program memory, ensure to use the DT directive.
9.10 Others
HALT #data4
<1> Instruction code :
0 0 0 1 0 1 0 0 0 1
:
0 0 0 0 0 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: Sandby mode
Places the CPU in standby mode.
The condition for having the standby mode (HALT/STOP mode) canceled is specified with the immediate
data.
STTS R0n
<1> Instruction code :
0 0 0 1 1 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: if statuses match
else
F ← 0
F← 1
n = 0 to F
Compares the S0, S1, KI/O, KI, and TIMER statuses with the register R0n contents. If at least one of the
statuses coincides with the bits that have been set, the status flag F is set (to 1).
If none of them coincide, the status flag F is cleared (to 0).
45
µPD63, 63A, 64
STTS #data4
<1> Instruction code :
0 0 0 1 1 1 0 0 0 1
:
0 0 0 0 0 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: if statuses match
else
F← 1
F ← 0
Compares the S0, S1, KI/O, KI, and TIMER statuses with the immediate data contents. If at least one
of the statuses coincides with the bits that have been set, the status flag F is set (to 1).
If none of them coincide, the status flag F is cleared (to 0).
SCAF (Set Carry If ACC = F H)
<1> Instruction code :
1 1 0 1 0 1 0 0 1 1
<2> Cycle count
:1
<3> Function
: if
A = 0FH
else
CY ← 1
CY ← 0
Sets the carry flag CY (to 1) if the accumulator contents are FH.
The accumulator values after executing the SCAF instruction are as follows:
Accumulator Value
Before execution
×××0
0000
0 (clear)
××01
0001
0 (clear)
×011
0011
0 (clear)
0111
0111
0 (clear)
1111
1111
1 (set)
Remark
×: don’t care
NOP
<1> Instruction code :
0 0 0 0 0 0 0 0 0 0
<2> Cycle count
:1
<3> Function
: PC ← PC + 1
No operation
46
Carry Flag
After execution
µPD63, 63A, 64
10. ASSEMBLER RESERVED WORDS
10.1 Mask Option Directives
When creating the µPD63 program, it is necessary to use a mask option directive in the assembler’s source
program to specify a mask option.
10.1.1 OPTION and ENDOP directives
From the OPTION directive on to the ENDOP directive are called the mask option definition block. The format
of the mask option definition block is as follows:
Format
Symbol field
Mnemonic field
[Label:]
OPTION
Operand field
Comment field
[; Comment]
:
:
ENDOP
10.1.2 Mask option definition directive
The directives that can be used in the mask option definition block are listed in Table 10-1.
An example of the mask option definition is shown below.
Example
Symbol field
Mnemonic field
Operand field
Comment field
OPTION
USEPOC
; POC circuit incorporated
ENDOP
Table 10-1. List of Mask Option Definition Directives
Name
POC
PRO File
Mask Option Definition Directive
USEPOC
(POC circuit incorporated)
NOUSEPOC
(Without POC circuit)
Address value
Data value
2044H
01
00
47
µPD63, 63A, 64
11. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = +25 ˚C)
Parameter
Power supply voltage
Symbol
Input voltage
VI
Output voltage
VO
High-level output current
Test Conditions
Rating
Unit
–0.3 to +5.0
V
–0.3 to V DD + 0.3
V
–0.3 to V DD + 0.3
V
VDD
IOHNote
KI/O, K I, S0, S1, RESET
REM
LED
Peak value
–30
mA
rms
–20
mA
Peak value
–7.5
mA
–5
mA
–13.5
mA
–9
mA
rms
One KI/O pin
Peak value
rms
Total of LED and KI/O pins
Low-level output current
IOL Note
REM
Peak value
–18
mA
rms
–12
mA
Peak value
7.5
mA
5
mA
rms
LED
Peak value
rms
7.5
mA
5
mA
Operating ambient
temperature
TA
–40 to +85
˚C
Storage temperature
Tstg
–65 to +150
˚C
Note Work out the rms with: [rms] = [Peak value] × √ Duty.
Caution Product quality may suffer if the absolute rating is exceeded for any parameter, even momentarily. In other words, an absolute maxumum rating is a value at which the possibility of psysical
damage to the product cannnot be ruled out. Care must therefore be taken to ensure that the
these ratings are not exceeded during use of the product.
Recommended Power Supply Voltage Range (TA = –40 to +85 ˚C)
Parameter
Power supply voltage
Symbol
VDD
Test Conditions
TYP.
MAX.
Unit
fX = 2.4 to 4 MHz
1.8
3.0
3.6
V
fX = 4 to 8 MHz
2.2
3.0
3.6
V
When using the POC circuit (mask option)
2.2
3.0
3.6
V
T A = –20 to +70 ˚C
fX = 2.4 to 4 MHz
48
MIN.
µPD63, 63A, 64
DC Characteristics (TA = –40 to +85 ˚C, VDD = 1.8 to 3.6 V)
Parameter
High-level input voltage
Low-level input voltage
Symbol
MAX.
Unit
VIH1
RESET
Test Conditions
0.8 VDD
MIN.
TYP.
VDD
V
VIH2
KI/O
0.65 VDD
VDD
V
VIH3
K I , S 0 , S1
0.65 VDD
VDD
V
VIL1
RESET
0
0.2 VDD
V
VIL2
KI/O
0
0.3 VDD
V
VIL3
K I , S 0 , S1
0
0.15 VDD
V
ILH1
KI
VI = VDD, pull-down resistor not incorporated
3
µA
ILH2
S 0, S 1
VI = VDD, pull-down resistor not incorporated
3
µA
Low-level input leakage
IUL1
KI
VI = 0 V
–3
µA
current
IUL2
KI/O
VI = 0 V
–3
µA
IUL3
S 0, S 1
VI = 0 V
–3
µA
High-level output voltage
VOH1
REM, LED, KI/O
IOH = –0.3 mA
Low-level output voltage
VOL1
REM, LED
IOL = 0.3 mA
0.3
V
VOL2
KI/O
IOL = 15 µA
IOH1
REM
VDD = 3.0 V, VOH = 1.0 V
–5
–9
mA
High-level input
leakage current
High-level output current
0.8 VDD
V
0.4
V
IOH2
KI/O
VDD = 3.0 V, VOH = 2.2 V
–2.5
–5
mA
Low-level output current
IOL1
KI/O
VDD = 3.0 V, VOL = 0.4 V
30
70
µA
VDD = 3.0 V, VOL = 2.2 V
100
220
Built-in pull-up resistor
R1
RESET
25
50
Built-in pull-down resistor
µA
100
kΩ
R2
RESET
2.5
5
15
kΩ
R3
K I , S 0 , S1
75
150
300
kΩ
250
500
kΩ
3.6
V
R4
KI/O
130
Data hold power supply
voltage
VDDOR
In STOP mode
0.9
Supply currentNote
IDD1
OPERATING
fX = 8.0 MHz, VDD = 3 V ± 10 %
0.8
1.6
mA
mode
fX = 4.0 MHz, VDD = 3 V ± 10 %
0.7
1.4
mA
IDD2
IDD3
HALT mode
STOP mode
fX = 8.0 MHz, VDD = 3 V ± 10 %
0.75
1.5
mA
fX = 4.0 MHz, VDD = 3 V ± 10 %
0.65
1.3
mA
VDD = 3 V ± 10 %
1.0
8.0
µA
VDD = 3 V ± 10 %, TA = 25 ˚C
0.1
1.0
µA
Note The POC circuit current and the current flowing in the built-in pull-up resistor are not included.
49
µPD63, 63A, 64
AC Characteristics (TA = –40 to +85 ˚C, VDD = 1.8 to 3.6 V)
Parameter
Symbol
Command execution time
tCY
KI, S0, S1 high-level width
tH
RESET low-level width
Test Conditions
VDD = 2.2 to 3.6 V
MIN.
MAX.
Unit
7.9
TYP.
27
µs
15.9
27
µs
10
µs
When releasing
at HALT mode
10
µs
STANDBY mode
at STOP mode
Note
µs
10
µs
tRSL
Note 10 + 52/fX + oscillation growth time
Remark tCY = 64/fX (fX: System clock oscillator frequency)
POC Circuit (mask optionNote 1) (TA = –20 to +70 ˚C)
Parameter
POC-detected
voltageNote 2
POC circuit current
Symbol
VPOC
IPOC
Test Conditions
MIN.
TYP.
MAX.
Unit
0.9
1.6
2.2
V
0.9
1.0
µA
Notes 1. Operates effectively under the conditions of TA = –20 to +70 ˚C, VDD = 2.2 to 3.6 V, and fX = 2.4 to
4 MHz.
2. Refers to the voltage with which the POC circuit cancels an internal reset. If VPOC < VDD , the internal
reset is released.
From the time of VPOC ≥ VDD until the internal reset takes effect, lag of up to 1 ms occurs. When the
period of VPOC ≥ VDD lasts less than 1 ms, the internal reset may not take effect.
50
µPD63, 63A, 64
System Clock Oscillation Circuit Characteristics (TA = –40 to +85 ˚C, VDD = 1.8 to 3.6 V)
Parameter
Oscillator frequency
(ceramic resonator)
Symbol
Test Conditions
fX
VDD = 2.2 to 3.6 V
MIN.
TYP.
MAX.
Unit
2.4
3.64
4.0
MHz
2.4
3.64
8.0
MHz
Recommended Ceramic Resonator (TA = –40 to +85 ˚C)
(1/2)
Manufacturer
(Order Disregarded)
Part Number
Recommended Constant
C1 [pF]
TDK Corp.
FCR3.64MC5
FCR3.84MC5
C2 [pF]
Rd [kΩ]
MIN.
MAX.
0
1.8
3.6
0
1.8
3.6
0
1.8
3.6
Unnecessary
(C-containing type)
FCR4.0MC5
FCR6.0MC5
0
2.2
3.6
CCR3.2MC3
0
1.8
3.6
CCR4.0MC3
0
1.8
3.6
CCR6.0MC3
0
2.2
3.6
CCR8.0MC5
Matsushita
Power Supply
Voltage [V]Note
EFOEC3204A4
Unnecessary
(C-containing type)
0
2.2
3.6
0
1.8
3.6
Electronics
EFOEC3604A4
0
1.8
3.6
Components Co., Ltd
EFOEC4004A4
0
1.8
3.6
EFOEC5124A4
0
2.2
3.6
EFOEC6004A4
0
2.2
3.6
EFOEC8004A4
Murata Mfg. Co., Ltd
0
2.2
3.6
CSA3.64MG
30
30
0
1.8
3.6
CSA6.00MG
30
30
0
2.2
3.6
CSA8.00MTZ
30
30
0
2.2
3.6
30
30
0
2.2
3.6
0
1.8
3.6
CSA8.00MTZ093
CST3.64MGW
CST6.00MGW
Unnecessary
(C-containing type)
0
2.2
3.6
CST8.00MTW
0
2.2
3.6
CST8.00MTW093
0
2.2
3.6
Remark
Surface-mount type
Note When a POC circuit (mask option) is not incorporated
51
µPD63, 63A, 64
Recommended Ceramic Resonator (TA = –40 to +85 ˚C)
(2/2)
Manufacturer
(Order Disregarded)
Kyocera Corp.
Part Number
Recommended Constant
C1 [pF]
C2 [pF]
Rd [kΩ]
MIN.
MAX.
KBR-2.5MS
33
33
0
1.8
3.6
KBR-3.58MSB
33
33
0
1.8
3.6
0
1.8
3.6
0
1.8
3.6
0
1.8
3.6
0
2.2
3.6
0
2.2
3.6
KBR-3.58MKC
KBR-4.0MSB
KBR-4.0MKC
KBR-6.0MSB
KBR-6.0MKC
KBR-8.0M
PBRC3.58A
PBRC3.58B
PBRC4.00A
PBRC4.00B
PBRC6.00A
PBRC6.00B
Unnecessary
(C-containing type)
33
33
Unnecessary
(C-containing type)
33
33
Unnecessary
(C-containing type)
33
33
0
2.2
3.6
33
33
0
1.8
3.6
0
1.8
3.6
0
1.8
3.6
0
1.8
3.6
0
2.2
3.6
0
2.2
3.6
Unnecessary
(C-containing type)
33
33
Unnecessary
(C-containing type)
33
33
Unnecessary
(C-containing type)
Note When a POC circuit (mask option) is not incorporated
An external circuit example
XIN
XOUT
Rd
C1
52
Power Supply
Voltage [V]Note
C2
Remark
Surface-mount type
µPD63, 63A, 64
12. CHARACTERISTIC CURVE (REFERENCE VALUES)
IDD vs VDD (fX = 4 MHz)
IDD vs VDD (fX = 8 MHz)
(TA = 25 °C)
2
2
1.8
1.8
Power supply current IDD [mA]
Power supply current IDD [mA]
(TA = 25 °C)
1.6
1.4
1.2
1.0
OPERATING mode
0.8
0.6
HALT mode
0.4
0.2
1.6
1.4
1.2
1.0
OPERATING mode
0.8
HALT mode
0.6
0.4
0.2
0
0
1
1.8 2
3
3.6
4
1
IOL vs VOL (REM, LED)
IOH vs VOH (REM)
9
–18
High-level output current IOH [mA]
–20
8
7
6
5
4
3
2
3.6
4
(TA = 25 °C , VDD = 3.0 V)
10
1
–16
–14
–12
–10
–8
–6
–4
–2
0.6
1.2
1.8
2.4
0
VDD
3
Low-level output voltage VOL [V]
VDD – 0.6 VDD – 1.2 VDD – 1.8 VDD – 2.4 VDD – 3
High-level output voltage VOH [V]
IOH vs VOH (LED)
(TA = 25 °C , VDD = 3.0 V)
–10
–9
High-level output current IOH [mA]
Low-level output current IOL [mA]
3
Power supply voltage VDD [V]
(TA = 25 °C, VDD = 3.0 V)
0
2 2.2
Power supply voltage VDD [V]
–8
–7
–6
–5
–4
–3
–2
–1
0
VDD
VDD – 0.6 VDD – 1.2 VDD – 1.8 VDD – 2.4 VDD – 3
High-level output voltage VOH [V]
53
µPD63, 63A, 64
IOL vs VOL (KI/O)
IOH vs VOH (KI/O)
(TA = 25 °C, VDD = 3.0 V)
High-level output current IOH [mA]
Low-level output current IOL [ µ A]
320
280
240
200
160
120
80
40
0
0.6
1.2
1.8
2.4
Low-level output voltage VOL [V]
54
(TA = 25 °C, VDD = 3.0 V)
3
–15
–14
–13
–12
–11
–10
–9
–8
–7
–6
–5
–4
–3
–2
–1
0
VDD
VDD – 0.6 VDD – 1.2 VDD – 1.8 VDD – 2.4 VDD – 3
High-level output voltage VOH [V]
µPD63, 63A, 64
13. APPLIED CIRCUIT EXAMPLE
Example of Application to System
· Remote-control transmitter (40 keys; mode selection switch accommodated)
+
+
KI/O6
KI/O5
KI/O7
KI/O4
S0
KI/O3
S1/LED
KI/O2
REM
KI/O1
VDD
KI/O0
XOUT
KI3
XIN
KI2
GND
KI1
RESET
KI0
Mode selection switch
Key matrix
8 × 5 = 40 keys
· Remote-control transmitter (48 keys accommodated)
+
+
KI/O6
KI/O5
KI/O7
KI/O4
S0
KI/O3
S1/LED
KI/O2
REM
KI/O1
VDD
KI/O0
XOUT
KI3
XIN
KI2
GND
KI1
RESET
KI0
Key matrix
8 × 6 = 48 keys
Remark When the POC circuit of the mask option is used effectively, it is not necessary to connect the capacitor
enclosed in the dotted lines.
55
µPD63, 63A, 64
14. PACKAGE DRAWINGS
20 PIN PLASTIC SOP (300 mil)
20
11
detail of lead end
P
1
10
A
H
I
G
J
L
C
D
M
M
B
K
N
E
F
NOTE
Each lead centerline is located within 0.12 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
ITEM
MILLIMETERS
INCHES
A
12.7±0.3
0.500±0.012
B
0.78 MAX.
0.031 MAX.
C
1.27 (T.P.)
0.050 (T.P.)
D
0.42 +0.08
–0.07
0.017 +0.003
–0.004
E
0.1±0.1
0.004±0.004
F
1.8 MAX.
0.071 MAX.
G
1.55±0.05
0.061±0.002
H
7.7±0.3
0.303±0.012
I
5.6±0.2
0.220 +0.009
–0.008
J
1.1
0.043
K
0.22 +0.08
–0.07
0.009 +0.003
–0.004
L
0.6±0.2
0.024 +0.008
–0.009
M
0.12
0.005
N
0.10
0.004
P
3° +7°
–3°
3° +7°
–3°
P20GM-50-300B, C-5
Remark The dimensions and materials of the ES model are the same as those of the mass production model.
56
µPD63, 63A, 64
20 PIN PLASTIC SSOP (300 mil)
20
11
detail of lead end
F
G
T
P
L
U
E
1
10
A
H
J
I
S
N
S
K
C
D
M
M
B
NOTE
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
ITEM
MILLIMETERS
A
6.65±0.15
B
0.475 MAX.
C
0.65 (T.P.)
D
0.24 +0.08
−0.07
E
0.1±0.05
F
1.3±0.1
G
1.2
H
8.1±0.2
I
J
6.1±0.2
1.0±0.2
K
L
0.17±0.03
0.5
M
0.13
N
0.10
P
3° +5°
−3°
T
U
0.25
0.6±0.15
S20MC-65-5A4-1
Remark The dimensions and materials of the ES model are the same as those of the mass production model.
57
µPD63, 63A, 64
15. RECOMMENDED SOLDERING CONDITIONS
Carry out the soldered packaging of this product under the following recommended conditions.
For details of the soldering conditions, refer to information material Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than the recommended conditions, please consult one of our NEC
sales representatives.
Table 15-1. Soldering Conditions for Surface-Mount Type
(1) µ PD63GS-×××
: 20-pin plastic SOP (300 mil)
µ PD63AGS-××× : 20-pin plastic SOP (300 mil)
µ PD64GS-×××
: 20-pin plastic SOP (300 mil)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235 °C; time: within 30 secs. max. (210 °C or higher);
count: no more than twice
IR35-00-2
VPS
Package peak temperature: 215 °C; time: 40 secs. max. (200 °C or higher); count:
no more than twice
VP15-00-2
Wave soldering
Solder bath temperature: 260 °C max.; time: 10 secs. max.; count: once;
Preliminary heat temperature: 120 °C max. (Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300 °C or less ; time: 3 secs or less (for each side of the device)
—
Caution Using more than one soldering method should be avoided (except in the case of partial
heating).
(2) µ PD64MC-×××-5A4: 20-pin plastic SSOP (300 mil)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235 °C; time: within 30 secs. max. (210 °C or higher);
count: no more than three times
IR35-00-3
VPS
Package peak temperature: 215 °C; time: 40 secs. max. (200 °C or higher); count:
no more than three times
VP15-00-3
Wave soldering
Solder bath temperature: 260 °C max.; time: 10 secs. max.; count: once;
Preliminary heat temperature: 120 °C max. (Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300 °C or less ; time: 3 secs or less (for each side of the device)
—
Caution Using more than one soldering method should be avoided (except in the case of partial
heating).
58
µPD63, 63A, 64
APPENDIX A. DEVELOPMENT TOOLS
An emulator is provided for the µPD63, 63A, and 64.
Hardware
• Emulator (EB-6133Note)
It is used to emulate the µPD63, 63A, and 64.
Note This is a product of Naito Densei Machida Mfg. Co., Ltd. For details, consult Naito Densei Machida Mfg.
Co., Ltd. (044-822-3813).
Software
• Assembler (AS6133)
• This is a development tool for remote control transmitter software.
Part Number List of AS6133
Host Machine
PC-9800 series
OS
Supply Medium
Part Number
MS-DOS (Ver. 5.0 to Ver. 6.2)
3.5-inch 2HD
µS5A13AS6133
MS-DOS (Ver. 6.0 to Ver. 6.22)
3.5-inch 2HC
µS7B13AS6133
(CPU: 80386 or more)
IBM PC/AT compatible
PC DOS (Ver. 6.1 to Ver. 6.3)
Caution Although Ver.5.0 or later has a task swap function, this function cannot be used with this
software.
59
µPD63, 63A, 64
APPENDIX B. FUNCTIONAL COMPARISON BETWEEN µPD63 SUBSERIES AND OTHER
SUBSERIES
Item
ROM capacity
µPD63
µPD63A
µPD64
µPD6134
512 × 10 bits
768 × 10 bits
1002 × 10 bits
1002 × 10 bits
µPD6600A
512 × 10 bits
RAM capacity
32 × 4 bits
32 × 5 bits
Stack
1 level (multiplexed with RF of RAM)
3 levels
(multiplexed with RAM)
Key matrix
8 × 6 = 48 keys
8 × 4 = 32 keys
S0 (S-IN) input
Read by P01 register (with function to release standby mode)
Read by left shift
instruction
S1/LED (S-OUT)
I/O (with function to release standby mode)
Output
Clock frequency
Ceramic oscillation
Ceramic oscillation
Timer
Carrier
• fX = 2.4 to 8 MHz
• fX = 2.4 to 4 MHz (with POC circuit)
• fX = 300 kHz to 1 MHz • fX = 400 to 500 kHz
• fX = 300 to 500 kHz
(with POC circuit)
Clock
fX/64, fX/128
fX/8, fX/16
Count start
Writing count value
Frequency
• fX/8, fX/64, fX/96 (timer clock: fX/64)
• fX/16, fX/128, fX/192 (timer clock: fX/128)
• No carrier
Output start
Synchronized with timer
fX/8
Writing count value
and P1 register value
• fX, fX/8, fX/12
(timer clock: fX/8)
• fX/2, fX/16, fX/24
(timer clock: fX/16)
• No carrier
• fX/8, fX/12
Not synchronized
with timer
Instruction execution time
8 µs (fX = 8 MHz)
Relative branch instruction
None
8 µs (fX = 1 MHz)
16 µs (fX = 500 kHz)
Provided
Left shift instruction
None
Provided
“MOV Rn, @RO” instruction n = 1 to F
n = 0 to F
Standby mode
(HALT instruction)
HALT mode for timer only.
STOP mode for only releasing KI
(KI/O high-level output or KI/O0 high-level output)
HALT/STOP mode
set by P1 register
value
Relation between HALT
instruction execution and
status flag (F)
HALT instruction not executed when F = 1
HALT instruction
executed regardless
of status of F
Reset function by charging/
discharging capacitor
None
Provided
POC circuit
Mask option
Low level output to RESET pin on detection
Provided (low-voltage
detection circuit)
Low level output to
S-OUT pin on detection
Mask option
POC circuit only
(Circuits other than POC circuit are set by software.)
• Pull-down resistor
• Variable duty
• Hang-up detection
Supply voltage
• VDD = 1.8 to 3.6 V
• VDD = 2.2 to 3.6 V (with POC circuit)
VDD = 2.2 to 3.6 V
Operating temperature
• TA = –40 to +85 °C
• TA = –20 to +70 °C (with POC circuit)
TA = –20 to +70 °C
Package
20-pin plastic SOP
• 20-pin plastic SOC
• 20-pin plastic shrink
DIP
One-time PROM model
µPD6P4B
60
• 20-pin plastic 20-pin plastic SOP
SOP
• 20-pin plastic
SSOP
µPD61P34B
µPD61P24
µPD63, 63A, 64
APPENDIX C. EXAMPLE OF REMOTE-CONTROL TRANSMISSION FORMAT
(in the case of NEC transmission format in command one-shot transmission mode)
Caution When using the NEC transmission format, please apply for a custom code at NEC.
(1) REM output waveform (From <2> on, the output is made only when the key is kept pressed.)
REM output
58.5 to 76.5 ms
<1>
108 ms
<2>
108 ms
Remark If the key is repeatedly pressed, the power consumption of the infrared light-emitting diode (LED) can
be reduced by sending the reader code and the stop bit from the second time.
(2) Enlarged waveform of <1>
<3>
REM output
9 ms
4.5 ms
Custom Code
8 bits
13.5 ms
Leader code
Custom Code'
8 bits
Data code
8 bits
18 to 36 ms
Data Code
8 bits
Stop bit
1 bit
27 ms
58.5 to 76.5 ms
(3) Enlarged waveform of <3>
REM output
4.5 ms
9 ms
0.56 ms
1.125 ms 2.25 ms
0
1
13.5 ms
1
0
0
(4) Enlarged waveform of <2>
REM output
9 ms
11.25 ms
Leader code
2.25 ms
0.56 ms
Stop bit
61
µPD63, 63A, 64
(5) Carrier waveform (Enlarged waveform of each code’s high period)
REM output
8.77 µ s
26.3 µ s
9 ms or 0.56 ms
Carrier frequency : 38 kHz
(6) Bit array of each code
C0 C1 C2 C3 C4 C5 C6 C7 C0' C1' C2' C3' C4' C5' C6' C7' D0 D1 D2 D3 D4 D5 D6 D7 D0 D1 D2 D3 D4 D5 D6 D7
=
=
=
=
=
=
=
=
C0 C1 C2 C3 C4 C5 C6 C7
or or or or or or or or
Co C1 C2 C3 C4 C5 C6 C7
Leader code
Custom code
Custom code'
Data code
Data code
Caution To prevent malfunction with other systems when receiving data in the NEC transmission
format, not only fully decode (make sure to check Data Code as well) the total 32 bits of the
16-bit custom codes (Custom Code, Custom Code’) and the 16-bit data codes (Data Code,
Data Code) but also check to make sure that no signals are present.
62
µPD63, 63A, 64
[MEMO]
63
µPD63, 63A, 64
[MEMO]
64
µPD63, 63A, 64
[MEMO]
65
µPD63, 63A, 64
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction of
the gate oxide and ultimately degrade the device operation. Steps must be
taken to stop generation of static electricity as much as possible, and quickly
dissipate it once, when it has occurred.
Environmental control must be
adequate. When it is dry, humidifier should be used. It is recommended to avoid
using insulators that easily build static electricity. Semiconductor devices
must be stored and transported in an anti-static container, static shielding bag
or conductive material. All test and measurement tools including work bench
and floor should be grounded. The operator should be grounded using wrist
strap. Semiconductor devices must not be touched with bare hands. Similar
precautions need to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input level
may be generated due to noise, etc., hence causing malfunction. CMOS device
behave differently than Bipolar or NMOS devices. Input levels of CMOS devices
must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to VDD or GND with a resistor, if it is considered to have
a possibility of being an output pin. All handling related to the unused pins must
be judged device by device and related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production
process of MOS does not define the initial operation status of the device.
Immediately after the power source is turned ON, the devices with reset function
have not yet been initialized. Hence, power-on does not guarantee out-pin
levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after
power-on for devices having reset function.
66
µPD63, 63A, 64
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, please contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
• Device availability
• Ordering information
• Product release schedule
• Availability of related technical literature
• Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
• Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
NEC Electronics (Germany) GmbH
NEC Electronics Hong Kong Ltd.
Santa Clara, California
Tel: 408-588-6000
800-366-9782
Fax: 408-588-6130
800-729-9288
Benelux Office
Eindhoven, The Netherlands
Tel: 040-2445845
Fax: 040-2444580
Hong Kong
Tel: 2886-9318
Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd.
Velizy-Villacoublay, France
Tel: 01-30-67 58 00
Fax: 01-30-67 58 99
Seoul Branch
Seoul, Korea
Tel: 02-528-0303
Fax: 02-528-4411
NEC Electronics (France) S.A.
NEC Electronics Singapore Pte. Ltd.
Milton Keynes, UK
Tel: 01908-691-133
Fax: 01908-670-290
Spain Office
Madrid, Spain
Tel: 01-504-2787
Fax: 01-504-2860
United Square, Singapore 1130
Tel: 65-253-8311
Fax: 65-250-3583
NEC Electronics Italiana s.r.1.
NEC Electronics (Germany) GmbH
Milano, Italy
Tel: 02-66 75 41
Fax: 02-66 75 42 99
Scandinavia Office
Taeby, Sweden
Tel: 08-63 80 820
Fax: 08-63 80 388
NEC Electronics (France) S.A.
NEC Electronics (Germany) GmbH
Duesseldorf, Germany
Tel: 0211-65 03 02
Fax: 0211-65 03 490
NEC Electronics (UK) Ltd.
NEC Electronics Taiwan Ltd.
Taipei, Taiwan
Tel: 02-2719-2377
Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division
Rodovia Presidente Dutra, Km 214
07210-902-Guarulhos-SP Brasil
Tel: 55-11-6465-6810
Fax: 55-11-6465-6829
J98. 8
67
µPD63, 63A, 64
MS-DOS is either a registered trademark or a trademark of Microsoft Corporation in the United States
and/or other countries.
PC/AT and PC DOS are trademarks of IBM Corp.
The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited
without governmental license, the need for which must be judged by the customer. The export or re-export of this product
from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales
representative.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5