TPD4E101 www.ti.com SLVSBG0 – MAY 2012 4-CH Bidirectional Low Capacitance ESD Protection Device with 15kV Contact and Ultra Low Clamping Voltage Check for Samples: TPD4E101 FEATURES 1 • • • • • • • Provides System Level ESD Protection for Low-voltage IO Interface IEC 61000-4-2 Level 4 – ±15kV (Air discharge) – ±15kV (Contact discharge) IO Capacitance < 5pF Ultra low Leakage Current Ultra Low Clamping Voltage Industrial Temperature Range: –40°C to 125°C Space Saving µQFN package DEVICE SCHEMATIC 1 2 3 4 APPLICATIONS • • • • • • Cell Phones eBook Portable Media Players Digital Camera Tablet PC Set Top Box GND DESCRIPTION The TPD4E101 is a four channel ESD protection device in an ultra small package. It is the industry’s smallest 4ch ESD protection device. A larger pitch helps save on PCB manufacturing costs. The device provides IEC61000-4-2 compliance up to 15kV contact discharge. It has an ESD clamp circuit with back-to-back diodes for bipolar/bidirectional signal support. The low line capacitance is suitable for a wide range of applications supporting data rate up to 700Mbps.Typical application areas in portable applications are: • Audio lines (Microphone, Earphone and Speakerphone) • SD interface • SIM interface • Keypad or other buttons 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated To request a full datasheet, please send an email to: Ipd‐[email protected] PACKAGE OPTION ADDENDUM www.ti.com 28-May-2012 PACKAGING INFORMATION Orderable Device TPD4E101DPWR Status (1) ACTIVE Package Type Package Drawing X2SON DPW Pins Package Qty 4 3000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-May-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPD4E101DPWR Package Package Pins Type Drawing X2SON DPW 4 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 180.0 9.5 Pack Materials-Page 1 0.91 B0 (mm) K0 (mm) P1 (mm) 0.91 0.5 4.0 W Pin1 (mm) Quadrant 8.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 26-May-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD4E101DPWR X2SON DPW 4 3000 180.0 180.0 30.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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