TI TPD4E101DPWR

TPD4E101
www.ti.com
SLVSBG0 – MAY 2012
4-CH Bidirectional Low Capacitance ESD Protection Device with
15kV Contact and Ultra Low Clamping Voltage
Check for Samples: TPD4E101
FEATURES
1
•
•
•
•
•
•
•
Provides System Level ESD Protection for
Low-voltage IO Interface
IEC 61000-4-2 Level 4
– ±15kV (Air discharge)
– ±15kV (Contact discharge)
IO Capacitance < 5pF
Ultra low Leakage Current
Ultra Low Clamping Voltage
Industrial Temperature Range: –40°C to 125°C
Space Saving µQFN package
DEVICE SCHEMATIC
1
2
3
4
APPLICATIONS
•
•
•
•
•
•
Cell Phones
eBook
Portable Media Players
Digital Camera
Tablet PC
Set Top Box
GND
DESCRIPTION
The TPD4E101 is a four channel ESD protection device in an ultra small package. It is the industry’s smallest 4ch ESD protection device. A larger pitch helps save on PCB manufacturing costs. The device provides
IEC61000-4-2 compliance up to 15kV contact discharge. It has an ESD clamp circuit with back-to-back diodes for
bipolar/bidirectional signal support. The low line capacitance is suitable for a wide range of applications
supporting data rate up to 700Mbps.Typical application areas in portable applications are:
• Audio lines (Microphone, Earphone and Speakerphone)
• SD interface
• SIM interface
• Keypad or other buttons
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
To request a full datasheet, please send an email to: Ipd‐[email protected] PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2012
PACKAGING INFORMATION
Orderable Device
TPD4E101DPWR
Status
(1)
ACTIVE
Package Type Package
Drawing
X2SON
DPW
Pins
Package Qty
4
3000
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-May-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TPD4E101DPWR
Package Package Pins
Type Drawing
X2SON
DPW
4
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
180.0
9.5
Pack Materials-Page 1
0.91
B0
(mm)
K0
(mm)
P1
(mm)
0.91
0.5
4.0
W
Pin1
(mm) Quadrant
8.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-May-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPD4E101DPWR
X2SON
DPW
4
3000
180.0
180.0
30.0
Pack Materials-Page 2
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