TPS65197 SLVSBD7 – APRIL 2012 www.ti.com 8-Channel Level-Shifter Supporting Different Charge-Sharing Methods and Panel Discharge Check for Samples: TPS65197 FEATURES DESCRIPTION 1 • • • • • • • The TPS65197 is an 8-channel level-shifter with discharge function intended for use in LCD display applications such as TVs and monitors. 8-Channel Level-Shifter Supporting STV, RESET, 6 × CLK 2-Channel Panel Discharge High Output-Voltage Level up to 45 V Low Output-Voltage Level Down to –20 V Selectable Charge-Sharing – Disabled – Method 1 – Method 2 Supports 100-kHz Clock Operating Frequency 28-Terminal 4-mm × 4-mm QFN Package The device converts the timing-controller (T-CON) logic-level signals to the high-level signals needed by the gate-in-panel (GIP) display. The clock outputs, CLKOUTx, support normal operation and two different charge-sharing methods, which can be used to improve picture quality and power consumption. At power down, all outputs follow their input signals as long as possible; when the discharge function is used, the outputs are pulled high (VGH). APPLICATIONS • Gate-in-Panel (GIP) LCD TVs and Monitors SEL_CS VGH CLKIN1 CLKOUT1 VGH CS_1 VGL1 CLKIN2 CLKOUT2 VGH CS_2 VGL1 CLKOUT3 CLKIN3 VGH VGL1 CLKIN4 VGH ChargeSharing logic CS_3 CLKOUT4 CS_4 VGL1 CLKOUT5 CLKIN5 VGH VGL1 CLKIN6 CLKOUT6 VGH VGL1 STVIN STVOUT VGH VGL1 RESETIN RESETOUT VGH VGL1 DIS_SENSE VGH VGL1 VGL2 GND DISCH1 VGH VREF VGL1 Logic all outputs = VGH when DIS_SENSE < VREF DISCH2 VGL2 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated To request a full data sheet, please send an email to: [email protected]. PACKAGE OPTION ADDENDUM www.ti.com 9-May-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) TPS65197RUYR ACTIVE WQFN RUY 28 3000 Green (RoHS & no Sb/Br) TPS65197RUYT PREVIEW WQFN RUY 28 250 TBD Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-2-260C-1 YEAR Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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