TI TPS65197RUYT

TPS65197
SLVSBD7 – APRIL 2012
www.ti.com
8-Channel Level-Shifter Supporting Different Charge-Sharing Methods and Panel
Discharge
Check for Samples: TPS65197
FEATURES
DESCRIPTION
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The TPS65197 is an 8-channel level-shifter with
discharge function intended for use in LCD display
applications such as TVs and monitors.
8-Channel Level-Shifter Supporting STV,
RESET, 6 × CLK
2-Channel Panel Discharge
High Output-Voltage Level up to 45 V
Low Output-Voltage Level Down to –20 V
Selectable Charge-Sharing
– Disabled
– Method 1
– Method 2
Supports 100-kHz Clock Operating Frequency
28-Terminal 4-mm × 4-mm QFN Package
The device converts the timing-controller (T-CON)
logic-level signals to the high-level signals needed by
the gate-in-panel (GIP) display.
The clock outputs, CLKOUTx, support normal
operation and two different charge-sharing methods,
which can be used to improve picture quality and
power consumption. At power down, all outputs follow
their input signals as long as possible; when the
discharge function is used, the outputs are pulled
high (VGH).
APPLICATIONS
•
Gate-in-Panel (GIP) LCD TVs and Monitors
SEL_CS
VGH
CLKIN1
CLKOUT1
VGH
CS_1
VGL1
CLKIN2
CLKOUT2
VGH
CS_2
VGL1
CLKOUT3
CLKIN3
VGH
VGL1
CLKIN4
VGH
ChargeSharing
logic
CS_3
CLKOUT4
CS_4
VGL1
CLKOUT5
CLKIN5
VGH
VGL1
CLKIN6
CLKOUT6
VGH
VGL1
STVIN
STVOUT
VGH
VGL1
RESETIN
RESETOUT
VGH
VGL1
DIS_SENSE
VGH
VGL1
VGL2
GND
DISCH1
VGH
VREF
VGL1
Logic all outputs = VGH
when DIS_SENSE < VREF
DISCH2
VGL2
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
To request a full data sheet, please send an email to:
[email protected]
PACKAGE OPTION ADDENDUM
www.ti.com
9-May-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
TPS65197RUYR
ACTIVE
WQFN
RUY
28
3000
Green (RoHS
& no Sb/Br)
TPS65197RUYT
PREVIEW
WQFN
RUY
28
250
TBD
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAU Level-2-260C-1 YEAR
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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Addendum-Page 1
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