® SP3203E 3V RS-232 Serial Transceiver with Logic Selector and15kV ESD Protection ■ 3 Driver/ 2 Receiver Architecture ■ Logic selector function (VL) sets TTL input/output levels for mixed logic systems ■ Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply ■ Interoperable with EIA/TIA-232 and adheres to EIA/TIA-562 down to a +2.7V power source ■ Minimum 250Kbps data rate under load ■ Regulated Charge Pump Yields Stable RS-232 Outputs Regardless of VCC Variations ■ Enhanced ESD Specifications: +15KV Human Body Model +15KV IEC1000-4-2 Air Discharge +8KV IEC1000-4-2 Contact Discharge ■ Applications ■ Palmtops ■ Cell phone Data Cables ■ PDA's DESCRIPTION The SP3203E provides a RS-232 transceiver solution for portable and hand-held applications such as palmtops, PDA's and cell phones. The SP3203E uses an internal highefficiency, charge-pump that requires only 0.1µF capacitors during 3.3V operation. This charge pump and Sipex's driver architecture allow the SP3203E to deliver compliant RS-232 performance from a single power supply ranging from +3.0V to +5.5V. The SP3203E is a 3-driver/2-receiver device, with a unique VL pin to program the TTL input and output logic levels to allow interoperation in mixed-logic voltage systems such as PDA's and cell phones. Receiver outputs will not exceed VL for VOH and transmitter input logic levels are scaled by the magnitude of the VL input. Rev. 2/7/01 SP3203E 1 © Copyright 2001 Sipex Corporation ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. VCC..................................................................-0.3V to +6.0V V+ (NOTE 1)..................................................-0.3V to +7.0V V- (NOTE 1)...................................................+0.3V to -7.0V V+ + |V -| (NOTE 1).......................................................+13V ICC (DC VCC or current)........................................... +100mA Input Voltages TxIN, SHUTDOWN = GND..........................-0.3V to +6.0V RxIN...............................................................................+25V Output Voltages TxOUT......................................................................+13.2V RxOUT..............................................-0.3V to (VL + 0.3V) Short-Circuit Duration TxOUT................................................................Continuous Storage Temperature...............................-65°C to +150°C Power Dissipation per Packages 20-Pin TSSOP (derate 7.0mW/°C above+70°C)..........................560mW NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. SPECIFICATIONS (VCC = VL = +3V to +5.5V, C1-C4 = 0.1uF, tested at +3.3V +10%, C1 = 0.047uF, C2-C4 = 0.33uF, tested at +5.0V +10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = VL +3.3V, TA = +25°C.) PARAMETER MIN. TYP. MAX. UNITS CONDITIONS DC CHARACTERISTICS (VCC = +3.3V or +5V, TA = +25oC) Supply Current Shutdown Supply Current 0.3 1 mA Shutdown = VCC, no load 1 10 µA Shutdown = GND V TxIN, Shutdown LOGIC INPUTS 0.8 Input Logic Threshold Low VL = 3.3V or 5.0V VL = 2.5V 0.6 2.4 VL = 5.0V 2.0 Input Logic Threshold High V TxIN, Shutdown 1.4 VL = 2.5V 0.9 Transmitter Input Hystersis VL = 1.8V 0.5 Input Leakage Current VL = 3.3V V ±0.01 ±1 µA TxIN, Shutdown ±0.05 ±1 0 µA RxOUT, receivers disabled 0.4 V IOUT = 1.6mA V IOUT = -1mA RECEIVER OUTPUTS Output Leakage Currents Output Voltage Low VL - VL - 0.6 0.1 Output Voltage High Rev. 2/7/01 SP3203E 2 © Copyright 2001 Sipex Corporation SPECIFICATIONS (continued) (VCC = VL = +3V to +5.5V, C1-C4 = 0.1uF, tested at +3.3V +10%, C1 = 0.047uF, C2-C4 = 0.33uF, tested at +5.0V +10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = VL +3.3V, TA = +25°C.) PARAMETER MIN. TYP. MAX. UNITS +25 V CONDITIONS RECEIVER INPUTS Input Voltage Range -25 0.8 1.5 Input Threshold Low V 0.6 1.2 1.8 2.4 Input Threshold High V 1.5 Input Hysteresis Input Resistance 2.4 0. 5 3 5 TA = +25OC TA = +25OC VL = 5.0V VL = 2.5V or 3.3V VL = 5.0V VL = 2.5V or 3.3V V 7 kΩ TA = +25OC TRANSMITTER OUTPUTS Output Voltage Swing Output Resistance ±5 300 ± 5.4 . V All transmitter outputs loaded with 3kohm to GND. TA=25OC 10M Ω V CC = V+ = V- = 0, transmitter output = ±2V Output Short-Circuit Current ±60 mA VTxOUT = 0 Output Leakage Current ±25 µA VTxOUT = ±12, transmitter disabled; VCC = 0 or 3.0V to 5.5V ESD PROTECTION RxIN , Tx OUT ESD Protection ±15 ±15 Human Body Model kV ±8 Rev. 2/7/01 IEC 1000-4-2 Air Gap Discharg e IEC 1000-4-2 Contact Discharg e SP3203E 3 © Copyright 2001 Sipex Corporation SPECIFICATIONS (continued) +10%, C1 = 0.047uF, C2-C4 = 0.33uF, tested at +5.0V +10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = VL +3.3V, TA = +25°C.) (VCC = VL = +3V to +5.5V, C1-C4 = 0.1uF, tested at +3.3V PARAMETER MIN. Maximum Data Rate 250 TYP. MAX. UNITS kbps tPHL 0.15 tPLH 0.15 Receiver Propagation Delay CONDITIONS RL = 3kΩ, CL = 1000pF, one transmitter switching µs Receiver input to receiver output CL =150pF Receiver Output Enable Time 200 ns normal operation Receiver Output Disable Time 200 ns normal operation Time to Exit Shutdown 100 µs IVTxOUTI > 3.7V Transmitter Skew ItPHL -tPLHI 100 ns (Note 2) 50 ns Receiver Skew ItPHL -tPLHI 6 30 4 30 Transition-Region Slew Rate V/µs CL = 150pF to 1000pF CL = 150pF to 2500pF VCC = 3.3V TA = +25oC RL = 3kΩ to 7kΩ, measured from +3V to -3V or -3V to +3V Note 2. Transmitter skew is measured at the transmitter zero crosspoint. Rev. 2/7/01 SP3203E 4 © Copyright 2001 Sipex Corporation NAME PIN NUMBER FUNCTION SP3203E C1+ Positive terminal of the symmetrical charge-pump capacitor, C1. 1 V+ Regulated +5.5V output generated by the charge pump. 2 C1- Negative terminal of the symmetrical charge-pump capacitor, C1. 3 C2+ Positive terminal of the symmetrical charge-pump capacitor, C2. 4 C2- Negative terminal of the symmetrical charge-pump capacitor, C2. 5 V- Regulated -5.5V output generated by the charge pump. 6 R1IN RS-232 receiver input. 14 R2IN RS-232 receiver input. 13 R1OUT TTL/CMOS receiver output. 11 R2OUT TTL/CMOS receiver output. 10 T1IN TTL/CMOS driver input. 7 T2IN TTL/CMOS driver input. 8 T3IN TTL/CMOS driver input. 9 T1OUT RS-232 driver output. 17 T2OUT RS-232 driver output. 16 T3OUT RS-232 driver output. 15 Ground. 18 +3.0V to +5.5V supply voltage. 19 Apply logic LOW to shut down drivers and charge pump. 20 Logic-Level Supply Voltage Selection 12 GND VCC SHUTDOWN VL Rev. 2/7/01 SP3203E 5 © Copyright 2001 Sipex Corporation 20 C1+ 1 SHUTDOWN V+ 2 19 VCC C1- 3 18 GND C2+ 4 17 T1OUT C2- 5 16 T2OUT SP3203E V- 6 T1IN 7 14 R1IN T2IN 8 13 R2IN 15 T3OUT T3IN 9 12 VL R2OUT 10 11 R1OUT Figure 7. SP3203E Pinout Configuration Rev. 2/7/01 SP3203E 6 © Copyright 2001 Sipex Corporation +3V to +5.5V C5 + 0.1µF 1 C1 C2 + + 12 19 20 Shutdown VCC C1+ VL 2 V+ 0.1µF 0.1µF TTL/CMOS INPUTS C3 + 0.1µF 3 C1- 4 C2+ 5 C2- 7 T1IN T1OUT 17 8 T2IN T2OUT RS-232 16 OUTPUTS 9 T3IN T3OUT 15 R1IN 14 SP3203E 6 V- C4 11 R1OUT 5KΩ TTL/CMOS OUTPUTS 10 R2OUT + 0.1µF RS-232 INPUTS R2IN 13 5KΩ GND 18 Figure 8. SP3203E Typical Operating Circuit Rev. 2/7/01 SP3203E 7 © Copyright 2001 Sipex Corporation DESCRIPTION The SP3203E is a 3-driver/2-receiver device that can be operated as a full duplex, RS-232 serial transceiver with the 3rd driver acting as a control line allowing a Ring Indicator (RI) signal to alert the UART on the PC. The slew rate of the driver output is internally limited to a maximum of 30V/µs in order to meet the EIA standards (EIA RS-232D 2.1.7, Paragraph 5). The transition of the loaded output from HIGH to LOW also meets the monotonicity requirements of the standard. This transceiver meet the EIA/TIA-232 and ITUT V.28/V.24 communication protocols and can be implemented in battery-powered, portable, or hand-held applications such as notebook or palmtop computers, PDA's and cell phones. The SP3203E devices feature Sipex's proprietary and patented (U.S.#5,306,954) on-board charge pump circuitry that generates ±5.5V RS-232 voltage levels from a single +3.0V to +5.5V power supply. The SP3203E devices can operate at a minimum data range of 250kbps, driving a single driver. The SP3203E is a 3-driver/2-receiver device. The SP3203E driver can maintain high data rates up to 250Kbps with a single driver loaded. Figure 9 shows a loopback test circuit used to test the RS-232 Drivers. Figure 10 shows the test results of the loopback circuit with all three drivers active at 120Kbps with typical RS-232 loads in parallel with 1000pF capacitors. Figure 11 shows the test results where one driver was active at 250Kbps and all three drivers loaded with an RS-232 receiver in parallel with a 1000pF capacitor. The transmitter inputs do not have pull-up resistors. Connect unused inputs to ground or VL THEORY OF OPERATION Receivers The SP3203E contains four basic circuit blocks: 1. drivers, 2. receivers, 3. a Sipex proprietary charge pump and 4. VL circuitry. The receivers convert ±5.0V EIA/TIA-232 levels to TTL or CMOS logic output levels. Receivers are disabled when in shutdown. The truth table logic of the SP3203E driver and receiver outputs can be found in Table 1. Drivers The drivers are inverting level transmitters that convert TTL or CMOS logic levels to 5.0V EIA/ TIA-232 levels with an inverted sense relative to the input logic levels. Typically, the RS-232 output voltage swing is +5.4V with no load and +5V minimum fully loaded. The driver outputs are protected against infinite short-circuits to ground without degradation in reliability. These drivers comply with the EIA-TIA-232F and all previous RS-232 versions. The driver output stages are turned off (High Impedance) when the device is in shutdown mode. Since receiver input is usually from a transmission line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 500mV. This ensures that the receiver is immune to noisy transmission lines. Should an input be left unconnected, an internal 5KΩ pulldown resistor to ground will commit the output of the receiver to a HIGH state. Charge Pump The charge pump is a Sipex–patented design (U.S. #5,306,954) and uses a unique approach compared to older less–efficient designs. The charge pump still requires four external capacitors, but uses a four–phase voltage shifting technique to attain symmetrical 5.5V power supplies. The internal power supply The drivers typically can operate at a data rate of 250Kbps. The drivers can guarantee a data rate of 120Kbps fully loaded with 3KΩ in parallel with 1000pF, ensuring compatibility with PC-to-PC communication software. Rev. 2/7/01 SP3203E 8 © Copyright 2001 Sipex Corporation +3V to +5.5V DEVICE: SP3203E SHUTDOWN TxOUT RxOUT Charge Pump 0 High-Z High-Z Inactive C5 C1 + + 19 VCC 0.1µF 1 C1+ Active Active Active C2 Table 1. SHUTDOWN Truth Table. C3 + 0.1µF SP3203E T1IN T1OUT TXIN TXOUT + 0.1µF R1IN R1OUT TTL/CMOS OUTPUTS consists of a regulated dual charge pump that provides output voltages of 5.5V regardless of the input voltage (VCC) over the +3.0V to +5.5V range. This is important to maintain compliant RS-232 levels regardless of power supply fluctuations. 5KΩ RXIN RXOUT 5KΩ 1000pF VCC 20 1000pF SHUTDOWN 12 VL GND +3V to +5.5V 18 Figure 9. Loopback Test Circuit for RS-232 Driver Data Transmission Rates The charge pump operates in a discontinuous mode using an internal oscillator. If the output voltages are less than a of 5.5V, the charge pump is enabled. If the output voltages exceed a of 5.5V, the charge pump is disabled. This oscillator controls the four phases of the voltage shifting (Figure 12). A description of each phase follows. VSS Transfer-Phase 2 (Figure 14) Phase two of the clock connects the negative terminal of C2 to the VSS storage capacitor and the positive terminal of C2 to GND. This transfers a negative generated voltage to C3. This generated voltage is regulated to a minimum voltage of -5.5V. Simultaneous with the transfer of the voltage to C3, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND. VSS Charge Storage-Phase 1(Figure 13) During this phase of the clock cycle, the positive side of capacitors C1 and C2 are initially charged to VCC. Cl+ is then switched to GND and the charge in C1– is transferred to C2–. Since C2+ is connected to VCC, the voltage potential across capacitor C2 is now 2 times VCC. VDD Charge Storage-Phase 3 (Figure 15) The third phase of the clock is identical to the first phase — the charge transferred in C1 pro- [ ] T T1 IN 1 T ] T T1 OUT 2 T1 OUT 2 T T T T R1 OUT 3 R1 OUT 3 Ch1 5.00V Ch2 5.00V M 5.00µs Ch1 Ch3 5.00V Ch1 5.00V Ch2 5.00V M 2.50µs Ch1 Ch3 5.00V 0V Figure 10. Loopback Test Circuit Result at 120Kbps (All Drivers Fully Loaded) Rev. 2/7/01 0.1µF 6 C4 are disabled as High Impedance.) T1 IN 1 V- 5 C2- off and V+ decays to Vcc. V- is pulled to ground and the transmitter outputs T + TTL/CMOS INPUTS (Note: When device in shutdown, the SP3203E's charge pump is turned [ 2 3 C14 C2+ 1 V+ 0.1µF 0V Figure 11. Loopback Test Circuit result at 250Kbps (All Drivers Fully Loaded) SP3203E 9 © Copyright 2001 Sipex Corporation duces –VCC in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since C2+ is at VCC, the voltage potential across C2 is 2 times VCC. VDD Transfer-Phase 4 (Figure 16) The fourth phase of the clock connects the negative terminal of C2 to GND, and transfers this positive generated voltage across C2 to C4, the VDD storage capacitor. This voltage is regulated to +5.5V. At this voltage, the internal oscillator is disabled. Simultaneous with the transfer of the voltage to C4, positive side of capacitor C1 is switched to VCC and the negative side is connected to GND, allowing the charge pump cycle to begin again. The charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. Since both V+ and V– are separately generated from VCC, in a no–load condition, V+ and V– will be symmetrical. Older charge pump approaches that generate V– from V+ will show a decrease in the magnitude of V– compared to V+ due to the inherent ineffiencies in the design. The clock rate for the charge pump is typically operates at 250kHz. The external capacitors are usually 0.1µF with a 16V breakdown voltage rating. VL Supply Level Current RS-232 serial tranceivers are designed with fixed 5V or 3.3V TTL input/output voltages levels. The VL function in the SP3203E allows the end user to set the TTL input/output voltage levels independent of VCC. By connecting VL to the main logic bus of system, the TTL input/ output limits and threshold are reset to interface with the on board low voltage logic circuity. Capacitor Selection Table: VCC (V) C1 (µF) C2-C4(µF) 3.0 to 3.6 0.1 0.1 4.5 to 5.5 0.047 0.33 3.0 to 5.5 0.22 1 Rev. 2/7/01 SP3203E 10 © Copyright 2001 Sipex Corporation [ T ] +6V a) C2+ T 1 2 0V 2 0V b) C2T -6V Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 1.96V Figure 12. Charge Pump Waveforms VCC = +5V C4 +5V C1 + C2 – –5V + – – + VDD Storage Capacitor + – VSS Storage Capacitor C3 –5V Figure 13. Charge Pump — Phase 4 - VSS Charge Storage VCC = +5V C4 + C1 – C2 + – – + + – VDD Storage Capacitor VSS Storage Capacitor C3 –10V Figure 14. Charge Pump — Phase 3 - VSS Charge Transfer VCC = +5V C4 +5V + C1 + – – + C2 – –5V + – VDD Storage Capacitor VSS Storage Capacitor C3 –5V Figure 15. Charge Pump — Phase 2 - VDD Charge Storage VCC = +5V +10V C1 + – C2 C4 + – – + + – VDD Storage Capacitor VSS Storage Capacitor C3 Figure 16. Charge Pump — Phase 1 - VDD Charge Transfer Rev. 2/7/01 SP3203E 11 © Copyright 2001 Sipex Corporation +3V to +5.5V C5 C1 + + 0.1µF 19 20 Shutdown VCC 1 C1+ 12 VL V+ 2 0.1µF C3 + 0.1µF 3 C14 C2+ C2 + 0.1µF SP3203E V- 6 C4 5 C2- 7 T1IN T1OUT 8 T2IN T2OUT 16 9 T3IN T3OUT 15 + 0.1µF 17 11 R1OUT R1IN 14 10 R2OUT R2IN 13 DB-9 Connector 6 7 8 9 GND 18 DB-9 Connector Pins: 1. Received Line Signal Detector 2. Received Data 3. Transmitted Data 4. Data Terminal Ready 5. Signal Ground (Common) 6. 7. 8. 9. 1 2 3 4 5 DCE Ready Request to Send Clear to Send Ring Indicator Figure 17. Circuit for the connectivity of the SP3203E with a DB-9 connector Rev. 2/7/01 SP3203E 12 © Copyright 2001 Sipex Corporation two methods within IEC1000-4-2, the Air Discharge method and the Contact Discharge method. ESD TOLERANCE The SP3203E incorporates ruggedized ESD cells on all driver output and receiver input pins. The improved ESD tolerance is at least 15kV without damage nor latch-up. With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed. There are different methods of ESD testing applied: a) MIL-STD-883, Method 3015.7 b) IEC1000-4-2 Air-Discharge c) IEC1000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 18. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently. The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC. The IEC-1000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC1000-4-2 is shown on Figure 19. There are The circuit model in Figures 18 and 19 represent the typical ESD testing circuit used for all three methods. The CS is initially charged with the DC R RSS R RC C SW2 SW2 SW1 SW1 DC Power Source C CSS Device Under Test Figure 18. ESD Test Circuit for Human Body Model Rev. 2/7/01 SP3203E 13 © Copyright 2001 Sipex Corporation Contact-Discharge Module RV RSS R RC C SW2 SW2 SW1 SW1 Device Under Test C CSS DC Power Source RS and RV add up to 330 330Ω Ω ffor or IEC1000-4-2. Figure 19. ESD Test Circuit for IEC1000-4-2 i➙ power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage. 30A 15A For the Human Body Model, the current limiting resistor (RS) and the source capacitor (CS) are 1.5kW an 100pF, respectively. For IEC-1000-42, the current limiting resistor (RS) and the source capacitor (CS) are 330W an 150pF, respectively. 0A t=0ns The higher CS value and lower RS value in the IEC1000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point. t=30ns t➙ Figure 20. ESD Test Waveform for IEC1000-4-2 DEVICE PIN TESTED HUMAN BODY MODEL Air Discharge Driver Outputs Receiver Inputs ±15kV ±15kV ±15kV ±15kV IEC1000-4-2 Direct Contact ±8kV ±8kV Level 4 4 Table 2. Transceiver ESD Tolerance Levels Rev. 2/7/01 SP3203E 14 © Copyright 2001 Sipex Corporation PACKAGE: PLASTIC THIN SMALL OUTLINE (TSSOP) e DIMENSIONS in inches (mm) Minimum/Maximum 0.126 BSC (3.2 BSC) 0.252 BSC (6.4 BSC) 1.0 OIA 0.169 (4.30) 0.177 (4.50) 0.039 (1.0) Symbol D 20 Lead 0.252/0.260 (6.40/6.60) e 0.026 BSC (0.65 BSC) 0’-8’ 12’REF e/2 0.039 (1.0) 0.043 (1.10) Max D 0.033 (0.85) 0.037 (0.95) 0.007 (0.19) 0.012 (0.30) 0.002 (0.05) 0.006 (0.15) (θ2) 0.008 (0.20) 0.004 (0.09) Min 0.004 (0.09) Min Gage Plane (θ3) 0.010 (0.25) 0.020 (0.50) 0.026 (0.75) (θ1) 1.0 REF Rev. 2/7/01 SP3203E 15 © Copyright 2001 Sipex Corporation ORDERING INFORMATION Model SP3203ECY SP3203EEY ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ Temperature Range 0°C to +70°C -40°C to +85°C ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ Package Types 20-pin TSSOP 20-pin TSSOP ○ ○ ○ ○ Please consult the factory for pricing and availability on a Tape-On-Reel option. Corporation SIGNAL PROCESSING EXCELLENCE Sipex Corporation Headquarters and Sales Office 22 Linnell Circle Billerica, MA 01821 TEL: (978) 667-8700 FAX: (978) 670-9001 e-mail: [email protected] Sales Office 233 South Hillview Drive Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600 Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. Rev. 2/7/01 SP3203E 16 © Copyright 2001 Sipex Corporation