ICX085AL Diagonal 11mm (Type 2/3) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras Description The ICX085AL is a diagonal 11mm (Type 2/3) interline CCD solid-state image sensor with a square pixel array. Progressive scan allows all pixels signals to be output independently within approximately 1/12 second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. High sensitivity and low dark current are achieved through the adoption of HAD (Hole-Accumulation Diode) sensors. This chip is suitable for image input applications such as still cameras which require high resolution. 20 pin DIP (Ceramic) AAAAA AAAAA AAAAA AAAAA AAAAA Pin 1 1 V Features • Progressive scan allows individual readout of the image signals from all pixels. • High vertical resolution (1024TV-lines) still image without a mechanical shutter. • Square pixel unit cell • Aspect ratio 5:4 • Horizontal drive frequency: 20.25MHz • Reset gate bias is not adjusted. • Substrate voltage: 5.5 to 12.5V • Continuous variable-speed shutter • High resolution, high sensitivity, low dark current • Low smear • Excellent antiblooming characteristics • Horizontal register: 5V drive 4 Pin 11 H 3 56 Optical black position (Top View) Device Structure • Interline CCD image sensor • Image size: Diagonal 11mm (Type 2/3) • Number of effective pixels: 1300 (H) x 1030 (V) approx. 1.3M pixels • Total number of pixels: 1360 (H) x 1034 (V) approx. 1.4M pixels • Chip size: 10.0mm (H) x 8.7mm (V) • Unit cell size: 6.7µm (H) x 6.7µm (V) • Optical black: Horizontal (H) direction: Front 4 pixels, rear 56 pixels Vertical (V) direction: Front 3 pixels, rear 1 pixel • Number of dummy bits: Horizontal 24 Vertical 1 • Substrate material: Silicon Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E95Z10D99 ICX085AL GND CGG NC GND GND VL Vφ1 Vφ2 Vφ3 10 9 8 7 6 5 4 3 2 1 Vertical register VOUT Block Diagram and Pin Configuration (Top View) Note) Horizontal register 14 15 16 17 18 VDD GND SUB NC NC RG GND 19 20 Hφ2 13 Hφ1 12 VRD Note) 11 : Photo sensor Pin Description Pin No. Symbol Description Pin No. Symbol Description 1 Vφ3 Vertical register transfer clock 11 VRD Reset drain power supply 2 Vφ2 Vertical register transfer clock 12 VDD Supply voltage 3 Vφ1 Vertical register transfer clock 13 GND GND 4 VL Protective transistor bias 14 SUB Substrate (overflow drain) 5 GND GND 15 NC 6 GND GND 16 NC 7 NC 17 RG Reset gate clock 18 GND GND 8 CGG Output amplifier gate∗1 9 GND GND 19 Hφ1 Horizontal register transfer clock 10 VOUT Signal output 20 Hφ2 Horizontal register transfer clock ∗1 DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance of 1µF or more. –2– ICX085AL Absolute Maximum Ratings Item Ratings Unit –0.3 to +55 V VDD, VOUT, VRD, CGG–GND –0.3 to +18 V VDD, VOUT, VRD, CGG–SUB –55 to +9 V Vφ1, Vφ2, Vφ3–GND –15 to +16 V Vφ1, Vφ2, Vφ3–SUB to +10 V Voltage difference between vertical clock input pins to +15 V Voltage difference between horizontal clock input pins to +16 V Hφ1, Hφ2–Vφ3 –16 to +16 V Hφ1, Hφ2–GND –10 to +15 V Hφ1, Hφ2–SUB –55 to +10 V VL–SUB –65 to +0.3 V Vφ2, Vφ3–VL –0.3 to +27.5 V RG–GND –0.3 to +20.5 V Vφ1, Hφ1, Hφ2, GND–VL –0.3 to +17.5 V Storage temperature –30 to +80 °C Operating temperature –10 to +60 °C Substrate voltage SUB–GND Supply voltage Vertical clock input voltage ∗1 +24V (Max.) when clock width < 10µs, clock duty factor < 0.1%. –3– Remarks ∗1 ICX085AL Bias Conditions Item Symbol Min. Typ. Max. Unit Remarks Supply voltage VDD 14.55 15.0 15.45 V Substrate voltage adjustment range VSUB 5.5 12.5 V ∗1 Protective transistor bias VL Typ. Max. Unit Remarks 6 8 mA ∗2 DC Characteristics Item Symbol Supply current Min. IDD ∗1 Indications of substrate voltage (VSUB) setting value The setting value of the substrate voltage is indicated on the back of image sensor by a special code. Adjust the substrate voltage (VSUB) to the indicated voltage. VSUB code – two characters indication ↑ ↑ Integer portion Decimal portion Integer portion of code and optimal setting correspond to each other as follows. Integer portion of code A C d E f G h J Optimal setting 5 6 7 8 9 10 11 12 <Example> “G5”→ VSUB = 10.5V ∗2 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same supply voltage as the VL power supply for the V driver should be used. Clock Voltage Conditions Typ. Max. Unit VVT 14.55 15.0 15.45 V 1 VVH02 –0.05 0 0.05 V 2 VVH1,VVH2,VVH3 –0.2 0 0.05 V 2 VVL1,VVL2,VVL3 –8.0 –7.5 –7.0 V 2 Vφ1, Vφ2, Vφ3 Vertical transfer clock | VVL1–VVL3 | voltage VVHH 6.8 7.5 8.05 V 2 0.1 V 2 0.5 V 2 High-level coupling VVHL 0.5 V 2 High-level coupling VVLH 0.5 V 2 Low-level coupling VVLL 0.5 V 2 Low-level coupling Readout clock voltage Horizontal transfer clock voltage Symbol Waveform diagram Min. Item Substrate clock voltage VVH = VVH02 VVL = (VVL1 + VVL3)/2 VφH 4.75 5.0 5.25 V 3 VHL –0.05 0 0.05 V 3 4.5 5.0 5.5 V 4 Input through 0.01µF capacitance 0.8 V 4 Low-level coupling V 4 V 5 VφRG Reset gate clock voltage Remarks VRGLH–VRGLL VRGH VDD +0.4 VDD +0.6 VDD +0.8 VφSUB 21.5 22.5 23.5 –4– ICX085AL Clock Equivalent Circuit Constant Symbol Item Min. Typ. Max. Unit CφV1 5000 pF CφV2, CφV3 10000 pF CφV12 1200 pF CφV23 100 pF CφV31 3300 pF CφH1 82 pF CφH2 68 pF Capacitance between horizontal transfer clocks CφHH 22 pF Capacitance between reset gate clock and GND CφRG 6 pF Capacitance between substrate clock and GND CφSUB 800 pF Vertical transfer clock series resistor R1, R2, R3 30 Ω Vertical transfer clock ground resistor RGND 30 Ω Horizontal transfer clock series resistor RφH1, RφH2 10 Ω Reset gate clock series resistor RφRG 20 Ω Capacitance between vertical transfer clock and GND Capacitance between vertical transfer clocks Capacitance between horizontal transfer clock and GND Vφ1 R1 R2 CφV12 CφV1 Vφ2 CφV2 RφH1 RφH2 Hφ1 RGND Cφv31 Remarks Hφ2 CφHH CφV3 Cφv23 CφH1 CφH2 R3 Vφ3 Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit RφRG RGφ CφRG Reset gate clock equivalent circuit –5– ICX085AL Drive Clock Waveform Conditions (1) Readout clock waveform VT 100% 90% II II φM VVT φM 2 10% 0% tr twh 0V tf (2) Vertical transfer clock waveform Vφ1 VVH1 VVHH VVH VVHL VVLH VVL01 VVL1 VVL VVLL Vφ2 VVH02 VVH2 VVHH VVH VVHL VVLH VVL2 VVL VVLL Vφ3 VVH3 VVHH VVH VVHL VVLH VVL03 VVL VVLL VφV1 = VVH1 – VVL01 VφV2 = VVH02 – VVL2 VφV3 = VVH3 – VVL03 VVH = VVH02 VVL = (VVL01 + VVL03) /2 –6– ICX085AL (3) Horizontal transfer clock waveform Hφ1, Hφ2 tr twh tf 90% twl VφH 10% VHL (4) Reset gate clock waveform φRG tr twh tf VRGH twl RG waveform Point A VφRG VRGL + 0.5V VRGLH VRGL VRGLL Hφ1 waveform 2.5V VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL) /2 Assuming VRGH is the minimum value during the interval twh, then: VφRG = VRGH – VRGL (5) Substrate clock waveform φSUB 100% 90% φM Vφ SUB VSUB 10% 0% tr –7– twh φM 2 tf ICX085AL Clock Switching Characteristics Item Symbol VT Vertical transfer clock Vφ1, Vφ2, Vφ3 Horizontal transfer clock Readout clock During imaging twh twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 4.6 5.0 0.5 0.5 52.5 110 Hφ1 15 18 15 19 6 10.6 6 10.6 Hφ2 16 19 15 18 6 10.6 6 10.6 During Hφ1 parallel-serial Hφ2 conversion Reset gate clock φRG Substrate clock φSUB 7 8 37.9 1.8 2.1 0.01 0.01 0.01 0.01 2.5 2.5 0.5 Unit Remarks µs During readout ns ∗1 ns ∗2 µs ns 0.5 µs During drain charge ∗1 When vertical transfer clock driver CXD1268M × 2 is used. ∗2 tf ≥ tr – 2ns, and the cross-point voltage (VCR) for the Hφ1 rising side of the Hφ1 and Hφ2 waveforms must be at least 2.5V. two Item Horizontal transfer clock Symbol Hφ1, Hφ2 Min. Typ. Max. 13.0 15.5 Unit ns Remarks ∗3 ∗3 The overlap period for twh and twl of horizontal transfer clocks Hφ1 and Hφ2 is two. –8– ICX085AL Image Sensor Characteristics (1/12 second accumulation mode, Ta = 25°C) Symbol Min. Typ. Unit Measurement method Sensitivity S 1300 1600 mV 1 Saturation signal Vsat 400 mV 2 Smear Sm 0.008 % 3 Video signal shading SH 20 % 4 Zone 0 and I 25 % 4 Zone 0 to II' Dark signal Vdt 8 mV 5 Ta = 60°C Dark signal shading ∆Vdt 4 mV 6 Ta = 60°C Lag Lag 0.5 % 7 Item Max. 0.005 Zone Definition of Video Signal Shading 1300 (H) 10 H 8 10 V 10 3 H 8 Zone 0, I Zone II, II' V 10 1030 (V) 3 Ignored region Effective pixel region Measurement System CCD signal output [∗A] CCD C.D.S AMP S/H Signal output [∗B] Note) Adjust the amplifier gain so that the gain between [∗A] and [∗B] equals 1. –9– Remarks Ta = 60°C ICX085AL Image Sensor Characteristics Measurement Method Measurement conditions 1) In the following measurements, the substrate voltage is set to the value indicated on the device, and the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value measured at point [∗B] of the measurement system. Definition of standard imaging conditions 1) Standard imaging condition I: Use a pattern box (luminance: 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0 mm) as an IR cut filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0 mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/80s, measure the signal output (VS) at the center of the screen, and substitute the value into the following formula. S = VS x 80 [mV] 12 2. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 150mV, measure the minimum value of the signal output. 3. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the luminous intensity to 500 times the intensity with the average value of the signal output, 150mV. Then after the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (VSm [mV]) of the signal output and substitute the value into the following formula. Sm = 1 VSm 1 x x x 100 [%] (1/10 V method conversion value) 10 150 500 – 10 – ICX085AL 4. Video signal shading Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the signal output is 150mV. Then measure the maximum (Vmax [mV]) and minimum (Vmin [mV]) values of the signal output and substitute the values into the following formula. SH = (Vmax – Vmin)/150 x 100 [%] 5. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60°C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 6. Dark signal shading After measuring 5, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula. ∆Vdt=Vdmax – Vdmin [mV] 7. Lag Adjust the signal output value generated by strobe light to 150mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula. Lag = (Vlag/150) x 100 [%] FLD SG Light Strobe light timing Signal output 150mV Output – 11 – Vlag (Lag) – 12 – XH1 RG XH2 VSUB XSUB XV1 XV3 XV2 XSG 5V –7.5V 15V 22/20V 22/10V 22/16V 1 2 3 4 5 6 7 N.C. 8 9 N.C. 10 10 1 2 N.C. 3 4 N.C. 5 6 7 N.C. 8 9 CXD1267AN CXD1268M ×2 N.C. 20 N.C. 19 N.C. 18 17 16 15 N.C. 14 N.C. 13 12 N.C. 11 20 19 18 17 N.C. 16 15 14 N.C. 13 12 11 22/16V 1/35V 22/20V 3.3/16V AC04 AC04 1 2 3 4 5 6 7 8 9 10 1/10V 0.1 ICX085 (BOTTOM VIEW) Vφ3 Vφ2 Vφ1 VL GND GND NC CGG GND VOUT 0.01 100k 1/20V 20 19 18 17 16 15 14 13 12 11 Hφ2 Hφ1 GND RG NC NC SUB GND VDD VRD Drive Circuit 3.3/20V 2SK523 0.01 100k 2.7k 47 0.1 1M CCD OUT ICX085AL ICX085AL Spectral Sensitivity Characteristics (Includes lens characteristics, excludes light source characteristics) 1.0 0.9 0.8 Relative Response 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 400 500 600 700 Wave Length [nm] – 13 – 800 900 1000 – 14 – V3 V2 V1 SG Double-speed readout mode V3 V2 V1 SG Normal-speed readout mode HD Sensor Readout Clock Timing Chart 33.7µs (683 bits) 33.7µs (683 bits) 5.0µs (102 bits) 4.0µs (81 bits) 5.0µs (102 bits) 4.0µs (81 bits) ICX085AL – 15 – CCD OUT V3 V2 V1 SG HD VD Drive Timing Chart (Vertical Sync) 1030 1031 Normal-speed readout mode 10 1 2 3 4 5 ICX085AL 20 15 5 1044 1 – 16 – CCD OUT V3 V2 V1 SG HD VD 1030 Double-speed readout mode 522 AA AA 1029 1031 2 2 4 6 1 3 1 3 5 7 5 1 Drive Timing Chart (Vertical Sync) ICX085AL 20 15 10 – 17 – 1616 1 CCD OUT OPB (56 bits) 1 SUB 1 1 1 19 1 V3 V2 V1 SHD SHP RG H2 H1 19 1 38 1 57 1 57 1 57 1 167 1 42 1 23 137 156 175 326 OPB (4 bits) 65 65 1 CLK 297 232 1 HD Normal-speed readout mode 321 24 Drive Timing Chart (Horizontal Sync) ICX085AL – 18 – 1616 1 CCD OUT OPB (56 bits) 1 SUB 1 1 1 19 1 V3 V2 V1 SHD SHP RG H2 H1 19 1 38 1 57 1 57 1 57 1 57 1 57 1 57 1 167 57 1 57 1 57 1 1 42 1 23 23 42 61 326 OPB (4 bits) 65 65 1 CLK 297 232 1 HD Double-speed readout mode 321 24 Drive Timing Chart (Horizontal Sync) ICX085AL ICX085AL Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Operate in clean environments (around class 1000 is appropriate). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition exceeding the normal using condition, consult our company. 5) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to too much mechanical shocks. – 19 – – 20 – + 0.25 2-φ2.50 0 V H A 11 2R3 .0 ~ 8. Planar orientation of the effective image area relative to the bottom “D” is less than 60µm. 9. The thickness of the cover glass is 0.75mm and the refractive index is 1.5. GOLD PLATING 42 ALLOY 5.9g LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT 7. The height from the bottom “D” to the effective image area is 1.46 ± 0.15mm. 6. The angle of rotation relative to the reference line “B” is less than ± 1°. 5. The center of the effective image area, specified relative to the reference hole is (H, V) = (13.15, 5.0) ± 0.15mm. 4. The bottom “D” is the height reference. (Two points are specified.) 3. A straight line “C” which passes through the center of the reference hole at right angles to vertical reference line “B” is the reference axis of horizontal direction. 2. A straight line “B” which passes through the centers of the reference hole and the elongated hole is the reference axis of vertical direction. Ceramic M ~ 1. “A” is the center of the effective image sensor area. + 0.15 2.00 0 × 2.5 (Elongated Hole) D 26.0 PACKAGE MATERIAL 0.3 0.46 1.27 1 13.15 0.5 10 26.00 ± 0.25 20 PACKAGE STRUCTURE 2.54 1Pin Index B + 0.15 φ2.00 0 (Reference Hole) 0.35 5.0 31.0 ± 0.4 27.0 ± 0.3 0.25 C 20.2 ± 0.3 1.0 0° to 9° 20pin DIP (800mil) 20.32 Unit: mm 3.2 ± 0.3 5.5 ± 0.2 (AT STAND OFF) Package Outline ICX085AL