ICX205AL Diagonal 8mm (Type 1/2) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras Description The ICX205AL is a diagonal 8mm (Type 1/2) interline CCD solid-state image sensor with a square pixel array and 1.45M effective pixels. Progressive scan allows all pixels' signals to be output independently within approximately 1/7.5 second. Also, the adoption of high frame rate readout mode supports 30 frames per second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. High sensitivity and low dark current are achieved through the adoption of HAD (Hole-Accumulation Diode) sensors. This chip is suitable for applications such as electronic still cameras, PC input cameras, etc. Features • Progressive scan allows individual readout of the image signals from all pixels. • High horizontal and vertical resolution (both approx. 1024TV-lines) still image without a mechanical shutter. • Supports high frame rate readout mode (effective 256 lines output, 30 frame/s) • Square pixel • Horizontal drive frequency: 14.318MHz • No voltage adjustments (reset gate and substrate bias are not adjusted.) • High resolution, high sensitivity, low dark current • Low smear, excellent antiblooming characteristics • Continuous variable-speed shutter Device Structure • Interline CCD image sensor • Image size: • Total number of pixels: • Number of effective pixels: • Number of active pixels: • Chip size: • Unit cell size: • Optical black: • Number of dummy bits: • Substrate material: 20 pin DIP (Cer-DIP) AAAAA AAAAA AAAAA AAAAA AAAAA Pin 1 2 V 2 Pin 11 H 8 40 Optical black position (Top View) Diagonal 8mm (Type 1/2) 1434 (H) × 1050 (V) approx. 1.50M pixels 1392 (H) × 1040 (V) approx. 1.45M pixels 1360 (H) × 1024 (V) approx. 1.40M pixels (7.959mm diagonal) 7.60mm (H) × 6.20mm (V) 4.65µm (H) × 4.65µm (V) Horizontal (H) direction: Front 2 pixels, rear 40 pixels Vertical (V) direction: Front 8 pixels, rear 2 pixels Horizontal 20 Vertical 3 Silicon Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E98619A99 ICX205AL GND NC GND NC NC Vφ3 Vφ2B Vφ2A Vφ1 10 9 8 7 6 5 4 3 2 1 Vertical register VOUT Block Diagram and Pin Configuration (Top View) Note) Note) 16 NC CSUB NC 17 18 19 20 Hφ2 15 Hφ1 14 φRG 13 VL 12 φSUB VDD 11 GND Horizontal register : Photo sensor Pin Description Pin No. Symbol Description Pin No. Symbol Description 1 Vφ1 Vertical register transfer clock 11 VDD Supply voltage 2 Vφ2A Vertical register transfer clock 12 GND GND 3 Vφ2B Vertical register transfer clock 13 φSUB Substrate clock 4 Vφ3 Vertical register transfer clock 14 NC 5 NC 15 CSUB 6 NC 16 NC 7 GND 17 VL Protective transistor bias 8 NC 18 φRG Reset gate clock 9 GND GND 19 Hφ1 Horizontal register transfer clock 10 VOUT Signal output 20 Hφ2 Horizontal register transfer clock GND Substrate bias∗1 ∗1 DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance of 0.1µF. –2– ICX205AL Absolute Maximum Ratings Item Ratings Unit Remarks VDD, VOUT, φRG – φSUB –40 to +10 V Vφ2A, Vφ2B – φSUB –50 to +15 V Vφ1, Vφ3, VL – φSUB –50 to +0.3 V Hφ1, Hφ2, GND – φSUB –40 to +0.3 V –25 to V VDD, VOUT, φRG, CSUB – GND –0.3 to +18 V Vφ1, Vφ2A, Vφ2B, Vφ3 – GND –10 to +18 V Hφ1, Hφ2 – GND –10 to +15 V Vφ2A, Vφ2B – VL –0.3 to +28 V Vφ1, Vφ3, Hφ1, Hφ2, GND – VL –0.3 to +15 V to +15 V Hφ1 – Hφ2 –16 to +16 V Hφ1, Hφ2 – Vφ3 –16 to +16 V Storage temperature –30 to +80 °C Operating temperature –10 to +60 °C Against φSUB CSUB – φSUB Against GND Against VL Voltage difference between vertical clock input pins Between input clock pins ∗1 +24V (Max.) when clock width < 10µs, clock duty factor < 0.1%. +16V (Max.) is guaranteed for turning on or off power supply. –3– ∗1 ICX205AL Bias Conditions Item Symbol Min. Typ. Max. Unit 14.55 15.0 ∗1 15.45 V Supply voltage VDD Protective transistor bias VL Substrate clock φSUB ∗2 Reset gate clock φRG ∗2 Remarks ∗1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used. ∗2 Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD. DC Characteristics Item Symbol Supply current Min. Typ. Max. 5.5 IDD Unit Remarks mA Clock Voltage Conditions Min. Typ. Max. Unit Waveform diagram VVT 14.55 15.0 15.45 V 1 VVH02A –0.05 0 0.05 V 2 VVH1, VVH2A, VVH2B, VVH3 –0.2 0 0.05 V 2 VVL1, VVL2A, VVL2B, VVL3 –8.4 –8.0 –7.6 V 2 Vφ1, Vφ2A, Vφ2B, Vφ3 7.6 8.0 8.4 V 2 | VVL1 – VVL3 | 0.1 V 2 VVHH 0.9 V 2 High-level coupling VVHL 1.3 V 2 High-level coupling VVLH 1.0 V 2 Low-level coupling VVLL 0.9 V 2 Low-level coupling Item Readout clock voltage Vertical transfer clock voltage Horizontal transfer clock voltage Symbol VVH = VVH02A VVL = (VVL1 + VVL3)/2 VφH 4.75 5.0 5.25 V 3 VHL –0.05 0 0.05 V 3 3.0 3.3 5.5 V 4 VRGLH – VRGLL 0.4 V 4 Low-level coupling VRGL – VRGLm 0.5 V 4 Low-level coupling 23.85 V 5 VφRG Reset gate clock voltage Remarks Substrate clock voltage VφSUB 22.15 23.0 –4– ICX205AL Clock Equivalent Circuit Constant Item Symbol Capacitance between vertical transfer clock and GND Capacitance between vertical transfer clocks Min. Typ. Max. Unit CφV1 2200 pF CφV2A 1800 pF CφV2B 6800 pF CφV3 3300 pF CφV12A, CφV2B1 1200 pF CφV2A3, CφV32B 1200 pF CφV13 2200 pF Capacitance between horizontal transfer clock and GND CφH1, CφH2 47 pF Capacitance between horizontal transfer clocks CφHH 100 pF Capacitance between reset gate clock and GND CφRG 8 pF Capacitance between substrate clock and GND CφSUB 680 pF R1 36 Ω R2A, R3 56 Ω R2B 43 Ω Vertical transfer clock ground resistor RGND 30 Ω Horizontal transfer clock series resistor RφH 15 Ω Reset gate clock series resistor RφRG 20 Ω Vertical transfer clock series resistor Vφ1 Remarks Vφ2A CφV12A R1 R2A RφH RφH Hφ1 CφV1 Hφ2 CφHH CφV2A CφV2B1 CφV2A3 CφH1 CφH2 CφV13 CφV2B R2B RGND CφV3 R3 CφV32B Vφ2B Vφ3 Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit RφRG RGφ CφRG Reset gate clock equivalent circuit –5– ICX205AL Drive Clock Waveform Conditions (1) Readout clock waveform VT 100% 90% II II φM VVT φM 2 10% 0% tr twh 0V tf Note) Readout clock is used by composing vertical transfer clocks Vφ2A and Vφ2B. (2) Vertical transfer clock waveform Vφ1 VVH1 VVHH VVH VVHL VVLH VVL01 VVL1 VVL VVLL Vφ2A, Vφ2B VVH02A, VVH02B VVH2A, VVH2B VVHH VVH VVHL VVLH VVL2A, VVL2B VVL VVLL Vφ3 VVH3 VVHH VVH VVHL VVL03 VVLH VVL VVLL VφV1 = VVH1 – VVL01 VφV2A = VVH02A – VVL2A VφV2B = VVH02B – VVL2B VφV3 = VVH3 – VVL03 VVH = VVH02A VVL = (VVL01 + VVL03)/2 VVL3 = VVL03 –6– ICX205AL (3) Horizontal transfer clock waveform tr twh tf Hφ2 90 % VCR VφH twl VφH 2 10 % VHL Hφ1 two Cross-point voltage for the Hφ1 rising side of the horizontal transfer clocks Hφ1 and Hφ2 waveforms is VCR. The overlap period for twh and twl of horizontal transfer clocks Hφ1 and Hφ2 is two. (4) Reset gate clock waveform tr twh tf VRGH RG waveform twl VφRG Point A VRGLH VRGLL VRGLm VRGL VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL)/2 Assuming VRGH is the minimum value during the interval twh, then: VφRG = VRGH – VRGL. Negative overshoot level during the falling edge of RG is VRGLm. (5) Substrate clock waveform 100% 90% φM φM 2 VφSUB VSUB 10% 0% tr twh (A bias generated within the CCD) –7– tf ICX205AL Clock Switching Characteristics Item twh Symbol twl tr tf Unit Remarks Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. VT Vertical transfer clock Vφ1, Vφ2A, Vφ2B, Vφ3 Horizontal transfer clock Readout clock During imaging 2.3 2.5 0.5 0.5 15 µs During readout 450 ns ∗1 ∗2 Hφ1 20 25 20 25 10 15 10 15 Hφ2 20 25 20 25 10 15 10 15 During Hφ1 parallel-serial Hφ2 conversion Reset gate clock φRG Substrate clock φSUB 11 13 51 0.01 0.01 0.01 0.01 3 3 2.2 0.5 ns µs ns 0.5 µs During drain charge ∗1 When vertical transfer clock driver CXD1267AN × 2 is used. ∗2 tf ≥ tr – 2ns, and the cross-point voltage (VCR) for the Hφ1 rising side of the Hφ1 and Hφ2 waveforms must be at least VφH/2 [V]. Item two Symbol Unit Remarks Min. Typ. Max. Horizontal transfer clock Hφ1, Hφ2 16 20 ns Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics) 1 Relative Response 0.8 0.6 0.4 0.2 0 400 500 600 700 Wave Length [nm] –8– 800 900 1000 ICX205AL Image Sensor Characteristics Item (Ta = 25°C) Symbol Min. Typ. 450 Unit Measurement method mV 1 1/30s accumulation mV 2 Ta = 60°C 0.0025 % 3 No electronic shutter 20 % 4 Zone 0 and I 25 % 4 Zone 0 to II' Max. Remarks Sensitivity S 360 Saturation signal Vsat 450 Smear Sm Video signal shading SH Dark signal Vdt 16 mV 5 Ta = 60°C Dark signal shading ∆Vdt 4 mV 6 Ta = 60°C Lag Lag 0.5 % 7 0.001 Zone Definition of Video Signal Shading 1392 (H) 16 16 8 V 10 H 8 H 8 Zone 0, I Zone II, II' V 10 1040 (V) 8 Ignored region Effective pixel region Measurement System CCD signal output [∗A] CCD C.D.S AMP S/H Signal output [∗B] Note) Adjust the amplifier gain so that the gain between [∗A] and [∗B] equals 1. –9– ICX205AL Image Sensor Characteristics Measurement Method Readout modes The diagram below shows the output methods for the following two readout modes. Progressive scan mode VOUT High frame rate readout mode 16 16 15 15 14 14 13 13 12 12 11 11 10 10 9 9 8 8 7 7 6 6 5 5 4 4 3 3 2 2 1 1 VOUT Note) Blacked out portions in the diagram indicate pixels which are not read out. Output starts from the line 1 in high frame rate readout mode. 1. Progressive scan mode In this mode, all pixel signals are output in non-interlace format in 1/7.5s. The vertical resolution is approximately 1024TV-lines and all pixel signals within the same exposure period are read out simultaneously, making this mode suitable for high resolution image capturing. 2. High frame rate readout mode All effective areas are scanned in approximately 1/30s by reading out two out of eight lines (1st and 4th lines, 9th and 12th lines). The vertical resolution is approximately 256TV-lines. This readout mode emphasizes processing speed over vertical resolution. – 10 – ICX205AL Measurement conditions 1) In the following measurements, the device drive conditions are at the typical values of the progressive scan mode, bias and clock voltage conditions. 2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value measured at point [∗B] of the measurement system. Definition of standard imaging conditions 1) Standard imaging condition I: Use a pattern box (luminance : 706cd/m2, color temperature of 3200K halogen source) as a subject. (pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/250s, measure the signal output (VS) at the center of the screen, and substitute the value into the following formula. S = VS × 250 [mV] 30 2. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 150mV, measure the minimum value of the signal output. 3. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the luminous intensity to 500 times the intensity with the average value of the signal output, 150mV. Then after the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (Vsm [mV]) of the signal output and substitute the value into the following formula. Sm = Vsm 1 1 × × 150 500 10 × 100 [%] (1/10V method conversion value) 4. Video signal shading Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the signal output is 150mV. Then measure the maximum (Vmax [mV]) and minimum (Vmin [mV]) values of the signal output and substitute the values into the following formula. SH = (Vmax – Vmin)/150 × 100 [%] 5. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60°C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. – 11 – ICX205AL 6. Dark signal shading After measuring 5, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula. ∆Vdt = Vdmax – Vdmin [mV] 7. Lag Adjust the signal output value generated by strobe light to 150mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula. Lag = (Vlag/150) × 100 [%] VD V2A Light Strobe light timing Signal output 150mV Output – 12 – Vlag (Lag) RG H1 H2 XSUB XV3 XV2B XSG2 XV1 XV2A XSG1 –8.0V 15V 22/20V 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 10 CXD1267AN CXD1267AN 20 19 18 17 16 15 14 13 12 11 20 19 18 17 16 15 14 13 12 11 1/35V 100k 0.1 0.1 22/16V 1 2 3 4 5 6 7 8 9 10 ICX205 (Bottom View) Vφ1 Vφ2A Vφ2B Vφ3 NC NC GND NC GND VOUT 0.1 1M 2200P 22/20V Hφ2 Hφ1 φRG VL NC CSUB NC φSUB GND VDD – 13 – 20 19 18 17 16 15 14 13 12 11 Drive Circuit 3.9k CCD OUT 0.01 2SK523 100 ICX205AL – 14 – V3 V2A/V2B V1 HD XSG1/XSG2 XV3 XV2A/XV2B XV1 Sensor Readout Clock Timing Chart 55.8µs (800 bits) Progressive Scan Mode 139ns (2 bits) 3.49µs (50 bits) Sensor readout clocks XSG1 and XSG2 are used by composing XV2A and XV2B. ICX205AL XSG2 XSG1 XV3 – 15 – V3 V2B V2A V1 HD XV2A/XV2B XV1 Sensor Readout Clock Timing Chart 55.8µs (800 bits) 139ns (2 bits) 5.0µs (72 bits) 14 bits 14 bits 3.49µs (50 bits) AAAA AAAA Sensor readout clock XSG1 is used by composing XV2A. High Frame Rate Readout Mode 5.87µs (84 bits) ICX205AL – 16 – CCD OUT V3 V2B V2A V1 HD VD Progressive Scan Mode 21 12 13 11 9 10 7 8 5 6 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 10 1052 1038 1039 1040 3 4 2 1068 1 1063 1040 Drive Timing Chart (Vertical Sync) 1 2 3 4 5 6 7 8 1 2 3 4 5 ICX205AL 1068 1 1063 1044 – 17 – CCD OUT V3 V2B V2A V1 HD 1 4 1 4 9 12 17 20 25 1/30s 1020 1025 1028 1033 1036 VD 266 267 1 2 3 4 5 6 7 8 High Frame Rate Readout Mode 1 4 1 4 9 12 17 20 25 260 261 262 263 264 265 266 267 1 2 3 4 5 6 7 8 Drive Timing Chart (Vertical Sync) 1/30s 1 4 1 4 9 12 17 20 25 ICX205AL 1020 1025 1028 1033 1036 – 18 – RGφ 1 1 1 1 SUB 16 1 56 Vφ3 Vφ2B Vφ2A Vφ1 Hφ2 Hφ1 CLK 1 1790 1 HD 32 32 1 1 96 64 1 96 1 96 1 96 1 96 1 Progressive Scan Mode 64 1 96 1 392 176 176 208 208 240 2 430 Drive Timing Chart (Horizontal Sync) ICX205AL 412 – 19 – RGφ 1 1 14 1 14 1 SUB 16 1 56 Vφ3 Vφ2B Vφ2A Vφ1 Hφ2 Hφ1 CLK 1 1790 1 HD 28 1 1 1 42 96 1 42 42 1 1 42 1 42 1 42 42 42 1 1 1 42 42 42 1 1 1 42 168 1 42 High Frame Rate Readout Mode 42 42 1 1 42 1 1 1 42 1 42 42 1 1 42 1 42 1 42 42 42 112 1 1 1 1 42 1 42 42 1 1 42 392 56 1 14 28 28 42 2 430 Drive Timing Chart (Horizontal Sync) ICX205AL 412 ICX205AL Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.) AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA Upper ceramic Lower ceramic 29N 39N 29N 0.9Nm Low melting point glass Compressive strength Shearing strength – 20 – Tensile strength Torsional strength ICX205AL b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portions. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to other locations as a precaution. d) The upper and lower ceramic are joined by low melting point glass. Therefore, care should be taken not to perform the following actions as this may cause cracks. • Applying repeated bending stress to the outer leads. • Heating the outer leads for an extended period with a soldering iron. • Rapidly cooling or heating the package. • Applying any load or impact to a limited portion of the low melting point glass using tweezers or other sharp tools. • Prying at the upper or lower ceramic using the low melting point glass as a fulcrum. Note that the same cautions also apply when removing soldered products from boards. e) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. – 21 – – 22 – ~ ~ Cer-DIP TIN PLATING 42 ALLOY 2.6g LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT 0.3 3 14.6 M 1.778 10 11 18.0 ± 0.4 H 0.4 V PACKAGE MATERIAL 1 20 A 0.8 0.46 B' C 0° to 9° 1.4 10 11 (R0.7) (1.0) 17.6 φ1.4 1 20 (1.7) 9. The notch and the hole on the bottom must not be used for reference of fixing. 8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5. 7. The tilt of the effective image area relative to the bottom “C” is less than 60µm. 6. The height from the bottom “C” to the effective image area is 1.41 ± 0.15mm. 5. The rotation angle of the effective image area relative to H and V is ± 1°. 4. The center of the effective image area, relative to “B” and “B'” is (H, V) = (9.0, 7.55) ± 0.15mm. 3. The bottom “C” of the package is the height reference. 2. The two points “B” of the package are the horizontal reference. The point “B'” of the package is the vertical reference. 1. “A” is the center of the effective image area. 0.25 3 11.55 PACKAGE STRUCTURE B 3 0.55 9.0 15.1 ± 0.3 0.7 0.7 7.55 0.4 0.83 (4.0) 20pin DIP (600mil) 1.27 15.24 3.4 ± 0.3 4.0 ± 0.3 Unit: mm ~ Package Outline ICX205AL