ICX414AQ Diagonal 8mm (Type 1/2) Progressive Scan CCD Image Sensor with Square Pixel for Color Cameras Description The ICX414AQ is a diagonal 8mm (Type 1/2) interline CCD solid-state image sensor with a square pixel array suitable for VGA format. Progressive scan allows all pixel's signals to be output independently within approximately 1/60 second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. High resolution and high color reproductivity are achieved through the use of R, G, B primary color mosaic filters. Further, high sensitivity and low dark current are achieved through the adoption of HAD (HoleAccumulation Diode) sensors. This chip is suitable for applications such as FA and surveillance cameras. 22 pin DIP (Cer-DIP) Pin 1 Features • Progressive scan allows individual readout of the image signals from all pixels. • High sensitivity • Low smear • High vertical resolution still images without a mechanical shutter • Square pixel • Supports VGA format • Horizontal drive frequency: 24.54MHz • R, G, B primary color mosaic filters on chip • No voltage adjustments (reset gate and substrate bias are not adjusted.) • High resolution, low dark current, high color reproductivity • Continuous variable-speed shutter • Excellent anti-blooming characteristics 2 V 8 2 Pin 12 H 31 Optical black position (Top View) Device Structure • Interline CCD image sensor • Image size: Diagonal 8mm (Type 1/2) • Number of effective pixels: 659 (H) × 494 (V) approx. 330K pixels • Total number of pixels: 692 (H) × 504 (V) approx. 350K pixels • Chip size: 7.48mm (H) × 6.15mm (V) • Unit cell size: 9.9µm (H) × 9.9µm (V) • Optical black: Horizontal (H) direction: Front 2 pixels, rear 31 pixels Vertical (V) direction: Front 8 pixels, rear 2 pixels • Number of dummy bits: Horizontal 16 Vertical 5 • Substrate material: Silicon ∗ Wfine CCD is trademark of Sony corporation. Represents a CCD adopting progressive scan, primary color filter and square pixel. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E02403B35 ICX414AQ CGG VOUT NC GND NC Vφ1 Vφ2 Vφ3 NC NC 11 10 9 8 7 6 5 4 3 2 1 Vertical register NC Block Diagram and Pin Configuration (Top View) R G R G B G G B R G R G G B G B R G R G G B G B R G R G Note) Horizontal register 20 21 22 NC 19 SUBCIR 18 CSUB 17 NC VL 16 NC φRG 15 Hφ2 14 Hφ1 13 φSUB 12 VDD Note) : Photo sensor Pin Description Pin No. Symbol Description Pin No. Symbol Description 1 NC 12 VDD Supply voltage 2 NC 13 φRG Reset gate clock 3 Vφ3 Vertical register transfer clock 14 VL Protective transistor bias 4 Vφ2 Vertical register transfer clock 15 φSUB Substrate clock 5 Vφ1 Vertical register transfer clock 16 Hφ1 Horizontal register transfer clock 6 NC 17 Hφ2 Horizontal register transfer clock 7 GND 18 NC 8 NC 19 NC 9 VOUT Signal output 20 CSUB Substrate bias∗2 10 CGG Output amplifier gate∗1 21 SUBCIR Supply voltage for the substrate voltage generation 11 NC 22 NC GND ∗1 DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance of 1µF or more. ∗2 DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance of 0.1µF or more. –2– ICX414AQ Absolute Maximum Ratings Item Ratings Unit –0.3 to +55 V VDD, VOUT, CGG, SUBCIR – GND –0.3 to +18 V VDD, VOUT, CGG, SUBCIR – φSUB –55 to +10 V Vφ1, Vφ2, Vφ3 – GND –15 to +20 V to +10 V Voltage difference between vertical clock input pins to +15 V Voltage difference between horizongal clock input pins to +17 V Hφ1, Hφ2 – Vφ3 –16 to +16 V Hφ1, Hφ2 – GND –10 to +15 V Hφ1, Hφ2 – φSUB –55 to +10 V VL – φSUB –65 to +0.3 V Vφ2, Vφ3 – VL –0.3 to +27.5 V RG – GND –0.3 to +22.5 V Vφ1, Hφ1, Hφ2, GND – VL –0.3 to +17.5 V Storage temperature –30 to +80 °C Performance guarantee temperature –10 to +60 °C Operating temperature –10 to +75 °C Substrate clock φSUB – GND Supply voltage Clock input voltage Vφ1, Vφ2, Vφ3 – φSUB ∗1 +27V (Max.) when clock width < 10µs, clock duty factor < 0.1%. +16V (Max.) is guaranteed for power-on and power-off. –3– Remarks ∗1 ICX414AQ Bias Conditions Symbol Item Min. Typ. Max. Unit 14.55 15.0 15.45 V Supply voltage VDD Protective transistor bias VL ∗1 Substrate clock φSUB ∗2 Reset gate clock φRG ∗3 Remarks ∗1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same voltage as the VL power supply for the V driver should be used. ∗2 Indications of substrate voltage setting value Set SUBCIR pin to open when applying a DC bias the substrate clock pin. Adjust the substrate voltage because the setting value of the substrate voltage is indicated on the back of image sensor by a special code when applying a DC bias the substrate clock pin. VSUB code – two characters indication ↑ Integer portion ↑ Decimal portion The integer portion of the code and the actual value correspond to each other as follows. Integer portion of code A C d E f G h J Value 5 6 7 8 9 10 11 12 [Example] "A5" → VSUB = 5.5V ∗3 Do not apply a DC bias to the reset gate clock pins, because a DC bias is generated within the CCD. DC Characteristics Item Supply current Symbol Min. Typ. Max. Unit IDD 4.0 7.0 9.0 mA –4– Remarks ICX414AQ Clock Voltage Conditions Symbol Readout clock voltage Vertical transfer clock voltage Horizontal transfer clock voltage Reset gate clock voltage Waveform Diagram Min. Typ. Max. Unit VVT 14.55 15.0 15.45 V 1 VVH02 –0.05 0 0.05 V 2 VVH1, VVH2, VVH3 –0.2 0 0.05 V 2 VVL1, VVL2, VVL3 –7.8 –7.5 –7.2 V 2 VVL = (VVL1 + VVL3)/2 (During 24.54MHz) VVL1, VVL2, VVL3 –8.0 –7.5 –7.0 V 2 VVL = (VVL1 + VVL3)/2 (During 12.27MHz) Vφ1, Vφ2, Vφ3 6.8 7.5 8.05 V 2 | VVL1 – VVL3 | 0.1 V 2 VVHH 0.5 V 2 High-level coupling VVHL 0.5 V 2 High-level coupling VVLH 0.5 V 2 Low-level coupling VVLL 0.5 V 2 Low-level coupling Item Remarks VVH = VVH02 VφH 4.75 5.0 5.25 V 3 VHL –0.05 0 0.05 V 3 VCR 0.8 2.5 V 3 VφRG 4.5 5.0 5.5 V 4 VRGLH – VRGLL 0.8 V 4 Low-level coupling VRGL – VRGLm 0.5 V 4 Low-level coupling 23.5 V 5 Substrate clock voltage VφSUB 21.5 22.5 –5– Cross-point voltage ICX414AQ Clock Equivalent Circuit Constants Symbol Item Capacitance between vertical transfer clock and GND Capacitance between vertical transfer clocks Min. Typ. Max. Unit CφV1 3900 pF CφV2 3300 pF CφV3 3300 pF CφV12 2200 pF CφV23 2200 pF CφV31 1800 pF 47 pF Capacitance between horizontal transfer clock and GND CφH1, CφH2 Capacitance between horizontal transfer clocks CφHH 30 pF Capacitance between reset gate clock and GND CφRG 6 pF Capacitance between substrate clock and GND CφSUB 390 pF R1 , R 2 27 Ω R3 22 Ω Vertical transfer clock ground resistor RGND 100 Ω Horizontal transfer clock series resistor RφH1, RφH2 16 Ω Reset gate clock series resistor RφRG 39 Ω Vertical transfer clock series resistor Vφ1 R1 R2 CφV12 CφV1 Remarks Vφ2 CφV2 RφH1 RφH2 Hφ1 Hφ2 RGND CφHH CφV31 CφV3 CφV23 CφH1 CφH2 R3 Vφ3 Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit RφRG CφRG Reset gate clock equivalent circuit –6– ICX414AQ Drive Clock Waveform Conditions (1) Readout clock waveform VT 100% 90% φM VVT φM 2 10% 0% tr twh 0V tf Note) Readout clock is used by composing vertical transfer clocks Vφ2 and Vφ3. (2) Vertical transfer clock waveform VVH1 Vφ1 VVHH VVH VVHL VVLH VVL01 VVL1 VVL VVLL Vφ2 VVH02 VVH2 VVHH VVH VVHL VVLH VVL2 VVL VVLL VVH3 Vφ3 VVHH VVH VVHL VVLH VVL03 VVL VVLL VVH = VVH02 VVL = (VVL01 + VVL03)/2 VVL3 = VVL03 –7– VφV1 = VVH1 – VVL01 VφV2 = VVH02 – VVL2 VφV3 = VVH3 – VVL03 ICX414AQ (3) Horizontal transfer clock waveform tr Hφ1, Hφ2 tf twh Hφ2 90% VCR VφH twl VφH 2 10% Hφ1 VHL two Cross-point voltage for the Hφ1 rising side of the horizontal transfer clocks Hφ1 and Hφ2 waveforms is VCR. The overlap period for twh and twl of horizontal transfer clocks Hφ1 and Hφ2 is two. (4) Reset gate clock waveform φRG tr twh tf VRGH RG waveform twl VφRG Point A VRGLH VRGLL VRGLm VRGL VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL)/2 Assuming VRGH is the minimum value during the interval twh, then: VφRG = VRGH – VRGL Negative overshoot level during the falling edge of RG is VRGLm. (5) Substrate clock waveform φSUB 100% 90% φM VφSUB 10% VSUB 0% (A bias generated within the CCD) tr twh –8– φM 2 tf ICX414AQ Clock Switching Characteristics (Horizontal drive frequency: 24.54MHz) twh Item Symbol twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Readout clock VT Vertical transfer clock Vφ1, Vφ2, Vφ3 Horizontal transfer clock Hφ1 10.5 14.6 10.5 14.6 6.4 10.5 6.4 10.5 Hφ2 10.5 14.6 10.5 14.6 6.4 10.5 6.4 10.5 2.3 2.5 Reset gate clock φRG Substrate clock 0.5 15 6 φSUB 0.5 8 25.8 4 0.75 0.9 Symbol Horizontal transfer clock Hφ1, Hφ2 3 0.5 two Item 250 Min. Typ. Max. 10.5 14.6 Unit Remarks ns ∗1 Unit Remarks µs During readout ns When using CXD3400N ns tf ≥ tr – 2ns ns 0.5 µs When draining charge Unit Remarks Clock Switching Characteristics (Horizontal drive frequency: 12.27MHz) twh Item Symbol Readout clock VT Vertical transfer clock Vφ1, Vφ2, Vφ3 Horizontal transfer clock Hφ1 Hφ2 Reset gate clock φRG Substrate clock φSUB twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 4.6 5.0 0.5 0.5 15 24 30 26.5 31.5 11 25 31.5 10 17.5 10 17.5 25 30 10 10 62.5 3 13 1.5 1.8 Item Symbol Horizontal transfer clock Hφ1, Hφ2 350 15 3 0.5 two Min. Typ. Max. 21.5 25.5 Unit Remarks ns ∗1 ∗1 The overlap period of twh and twl of horizontal transfer clocks Hφ1 and Hφ2 is two. –9– 15 µs During readout ns When using CXD3400N ns tf ≥ tr – 2ns ns 0.5 µs When draining charge ICX414AQ Image Sensor Characteristics (Ta = 25°C) Symbol Min. Typ. Max. Unit Measurement method Remarks G Sensitivity Sg 670 840 1100 mV 1 1/30s accumulation conversion value Sensitivity comparison Rr 0.4 0.55 0.7 1 Rb 0.3 0.45 0.6 1 Saturation signal Vsat 500 Smear Sm Item Ta = 60°C mV 2 –100 –92 dB 3 Video signal shading SHg 25 % 4 Uniformity between video signal channels ∆Srg 8 % 5 ∆Sbg 8 % 5 Dark signal Vdt 2 mV 6 Ta = 60°C Dark signal shading ∆Vdt 1 mV 7 Ta = 60°C Lag Lag 0.5 % 8 Zone 0 Note) All image sensor characteristic data noted above is for operation in 1/60s progressive scan mode. Zone Definition of Video Signal Shading 659 (H) 4 5 4 494 (V) 2 Zone 0 Ignored region Effective pixel region Measurement System CCD signal output [∗A] Gr/Gb CCD C.D.S AMP S/H Gr/Gb channel signal output [∗B] R/B S/H R/B channel signal output [∗C] Note) Adjust the amplifier gain so that the gain between [∗A] and [∗B], and between [∗A] and [∗C] equals 1. – 10 – ICX414AQ Image Sensor Characteristics Measurement Method Measurement conditions (1) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions. (2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value of the Gr/Gb channel signal output or the R/B channel signal output of the measurement system. (2) In the following measurements, this image sensor is operated in 1/60s all pixels progressive scan mode. Color coding of this image sensor & Readout Gb B Gb B R Gr R Gr Gb B Gb B R Gr R Gr The primary color filters of this image sensor are arranged in the layout shown in the figure on the left (Bayer arrangement). Gr and Gb denote the G signals on the same line as the R signal and the B signal, respectively. Horizontal register Color Coding Diagram All pixels' signals are output successively in a 1/60s period. R signal and Gr signal lines and Gb signal and B signal lines are output sequentially. – 11 – ICX414AQ Image sensor readout mode The diagram below shows the output methods for the following two readout modes. (1) Progressive scan mode R G G B R G G B R G VOUT 1. Progressive scan mode In this mode, all pixel signals are output in non-interlace format in 1/60s. All pixel signals within the same exposure period are read out simultaneously, making this mode suitable for high resolution image capturing. (2) Center scan mode Undesired portions (Swept by vertical register high-speed transfer) Picture center cut-out portion 2. Center scan mode This is the center scan mode using the progressive scan method. The undesired portions are swept by vertical register high-speed transfer, and the picture center portion is cut out. There are the mode (120 frames/s) which outputs 222 lines of an output line portion, and the mode (240 frames/s) which outputs 76 lines. – 12 – ICX414AQ Definition of standard imaging conditions (1) Standard imaging condition I: Use a pattern box (luminance: 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. (2) Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. G Sensitivity, sensitivity comparison Set to the standard imaging condition I. After setting the electronic shutter mode with a shutter speed of 1/100s, measure the signal outputs (VGR, VGb, VR and VB) at the center of each Gr, Gb, R and B channel screen, and substitute the values into the following formulas. VG = (VGr + VGb)/2 Sg = VG × 100 [mV] 30 Rr = VR/VG Rb = VB/VG 2. Saturation signal Set to the standard imaging condition II. After adjusting the luminous intensity to 20 times the intensity with the average value of the Gr signal output, 150mV, measure the minimum values of the Gr, Gb, R and B signal outputs. 3. Smear Set to the standard imaging condition III. With the lens diaphragm at F5.6 to F8, first adjust the average value of the Gr signal output to 150mV. Measure the average values of the Gr signal output, Gb signal output, R signal output and B signal output (Gra, Gba, Ra, Ba), and then adjust the luminous intensity to 500 times the intensity with the average value of the Gr signal output, 150mV. After the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (Vsm [mV]) independent of the Gr, Gb, R and B signal outputs, and substitute the values into the following formula. ( Sm = 20 × log Vsm ÷ Gra + Gba + Ra + Ba 1 1 × 500 × 4 10 – 13 – ) [dB] (1/10V method conversion value) ICX414AQ 4. Video signal shading Set to the standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjusting the luminous intensity so that the average value of the Gr signal output is 150mV. Then measure the maximum value (Grmax [mV]) and minimum value (Grmin [mV]) of the Gr signal output and substitute the values into the following formula. SHg = (Grmax – Grmin)/150 × 100 [%] 5. Unifoemity between video signal channels After measuring 4, measure the maximum (Rmax [mV]) and minimum (Rmin [mV]) values of R signal, and the maximum (Bmax [mV]) and minimum (Bmin [mV]) values of B signal. Substitute the values into the following formula. ∆Srg = (Rmax – Rmin )/150 × 100 [%] ∆Sbg = (Bmax – Bmin )/150 × 100 [%] 6. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature of 60°C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 7. Dark signal shading After measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula. ∆Vdt = Vdmax – Vdmin [mV] 8. Lag Adjust the Gr signal output value generated by the strobe light to 150mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal amount (Vlag). Substitute the value into the following formula. Lag = (Vlag/150) × 100 [%] VD V2 Light Strobe light timing Gr signal output 150mV Output – 14 – Vlag(lag) φRG Hφ1 Hφ2 XV1 XSG2 XV2 11 12 9 10 13 14 8 7 15 16 5 6 17 4 CXD3400N 18 3 XV3 XSG3 19 2 XSUB 0.1 0.1 0.1 2 NC SUBCIR 1 NC NC ICX414 (BOTTOM VIEW) 10 11 9 8 7 6 5 4 3 Vφ3 CSUB 1/10V Vφ2 0.1 2200p 3.3/16V 22 21 20 19 18 17 16 15 14 13 12 NC 1/35V Vφ1 NC 20 NC Hφ2 1 GND Hφ1 – 15 – φSUB 3.3V 0.1 0.1 NC VL 100k VOUT φRG 15V CGG NC VDD Drive Circuit 1M 3.3/20V 0.01 4.7k 2SC4250 CCD OUT –7.5V ICX414AQ ICX414AQ Spectral Sensitivity Characteristics (Excludes lens characteristics and light source characteristics) 1.0 G R 0.8 Relative Response B 0.6 0.4 0.2 0 400 450 500 550 Wave Length [nm] – 16 – 600 650 700 – 17 – OUT V3 V2 V1 510 494 1 2 HD "a" 7 1 2 3 4 5 6 7 8 1 2 3 525 1 VD 510 508 494 1 2 Progressive Scan Mode 7 1 2 3 4 5 6 7 8 Drive Timing Chart (Vertical Sync) ICX414AQ 525 1 V3 V2 V1 H1 "a" Enlarged 12 12 12 12 12 12 Drive Timing Chart (Vertical Sync "a" Enlarged) 520 62 582 50 Progressive Scan Mode/Center Scand Mode 12 12 12 12 12 12 ICX414AQ – 18 – – 19 – 780 1 RG 1 1 SUB 35 1 1 1 1 V3 V2 V1 SHD SHP H2 H1 CLK 12 1 Progressive Scan Mode 24 1 37 1 36 1 36 1 23 1 36 1 1 72 107 12 12 24 36 123 125 16 Drive Timing Chart (Horizontal Sync) ICX414AQ – 20 – OUT V3 V2 V1 HD 245 246 356 357 "a" "b" 261 262 1 2 3 4 5 6 7 8 1 "d" "c" 24 136 137 VD "d" 245 246 356 357 Center Scan Mode 1 "a" "b" 261 262 1 2 3 4 5 6 7 8 1 20 21 Drive Timing Chart (Vertical Sync) ICX414AQ – 21 – V3 V2 V1 H2 H1 #142 #1 10920 bits = 14H 12 12 12 12 12 12 Center Scan Mode 1 (Frame Shift) ("b") 12 12 12 12 12 12 107 35 Drive Timing Chart (Horizontal Sync) ICX414AQ – 22 – V3 V2 V1 H2 H1 #167 #1 12480 bits = 16H 12 12 12 12 12 12 Center Scan Mode 1 (High-speed Sweep) ("d") 12 12 12 12 12 12 107 35 Drive Timing Chart (Horizontal Sync) ICX414AQ – 23 – OUT V3 V2 V1 "d" 105 106 283 284 "a" "b" 129 130 131 1 2 3 4 5 6 7 8 1 HD "c" 30 209 210 VD "d" 105 106 283 284 Center Scan Mode 2 "a" "b" 129 130 131 1 2 3 4 5 6 7 8 1 26 27 Drive Timing Chart (Vertical Sync) ICX414AQ – 24 – V3 V2 V1 H2 H1 #215 #1 15600 bits = 20H 12 12 12 12 12 12 Center Scan Mode 2 (Frame Shift) ("b") 12 12 12 12 12 12 107 35 Drive Timing Chart (Horizontal Sync) ICX414AQ – 25 – V3 V2 V1 H2 H1 #255 #1 18720 bits = 24H 12 12 12 12 12 12 Center Scan Mode 2 (High-speed Sweep) ("d") 12 12 12 12 12 12 107 35 Drive Timing Chart (Horizontal Sync) ICX414AQ ICX414AQ Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W soldering iron with a ground wire and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.) Upper ceramic Lower ceramic 39N 29N 29N 0.9Nm Low melting point glass Compressive strength Shearing strength Tensile strength Torsional stregth b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portions. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. – 26 – ICX414AQ c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to other locations as a precaution. d) The notch of the package is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch of the package. e) If the leads are bent repeatedly and metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods, as color filters will be discolored. When high luminous objects are imaged with the exposure level controlled by the electronic iris, the luminance of the image-plane may become excessive and discoloring of the color filter will possibly be accelerated. In such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the poweroff mode should be properly arranged. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) Brown stains may be seen on the bottom or side of the package. But this does not affect the CCD characteristics. – 27 – – 28 – B 0.7 3 ~ 2.60g AS-B15-03(E) PACKAGE MASS DRAWING NUMBER 9 The notches on the bottom must not be used for reference of fixing. 42 ALLOY LEAD MATERIAL 6 The height from bottom "C" to the effective image area is 1.41 ± 0.15mm 5 The rotation angle of the effective image area relative to H and V is ± 1˚ 4 The center of the effective image area,relative to "B"and "B'"is H V 9.0 7.55 ± 0.15mm 3 The bottom "C"of the package is the height reference. The point "B"of the package is the vertical reference. 2. The two points "B"of the package are the horizontal reference. 1. "A" is the center of the effective image area. 1 17.6 11 2-R0.7 8 The thickness of the cover glass is 0.75mm,and the refractive index is 1.5. 0.46 0.3 B' C 22 12 TIN PLATING M 3 12 LEAD TREATMENT 0.3 14.6 18.0 ± 0.4 H A 7 The tilt of the effective image area relative to the bottom "C" is less than 60µm 1.27 1 V 22 9.0 Cer-DIP ~ 3 11.55 0.69 (For the 1st.pin only) 7.55 22 pin DIP (600mil) 1.27 PACKAGE MATERIAL 0.55 Unit: mm 15.1 ± 0.3 0.7 15.24 3.26 ± 0.3 4.0 ± 0.3 0˚ to 9˚ 0.25 Package Outline ICX414AQ Sony Corporation