16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 SST34HF1621/ 164116 Mb CSF (x16) + 2/4 Mb SRAM (x16) ComboMemories Data Sheet FEATURES: • Flash Organization: 1M x16 • Dual-Bank Architecture for Concurrent Read/Write Operation – 16 Mbit: 12 Mbit + 4 Mbit • SRAM Organization: – 2 Mbit: 256K x8 or 128K x16 – 4 Mbit: 512K x8 or 256K x16 • Single 2.7-3.3V Read and Write Operations • Superior Reliability – Endurance: 100,000 Cycles (typical) – Greater than 100 years Data Retention • Low Power Consumption: – Active Current: 25 mA (typical) – Standby Current: 20 µA (typical) • Hardware Sector Protection (WP#) – Protects 4 outer most sectors (4 KWord) in the larger bank by holding WP# low and unprotects by holding WP# high • Hardware Reset Pin (RST#) – Resets the internal state machine to reading data array • Sector-Erase Capability – Uniform 1 KWord sectors • Block-Erase Capability – Uniform 32 KWord blocks • Read Access Time – Flash: 70 and 90 ns – SRAM: 70 and 90 ns • Latched Address and Data • Fast Erase and Word-Program: – Sector-Erase Time: 18 ms (typical) – Block-Erase Time: 18 ms (typical) – Chip-Erase Time: 70 ms (typical) – Word-Program Time: 14 µs (typical) – Chip Rewrite Time: 8 seconds (typical) • Automatic Write Timing – Internal VPP Generation • End-of-Write Detection – Toggle Bit – Data# Polling – Ready/Busy# pin • CMOS I/O Compatibility • JEDEC Standard Command Set • Conforms to Common Flash Memory Interface (CFI) • Packages Available – 56-ball LFBGA (8mm x 10mm) PRODUCT DESCRIPTION The SST34HF1621/1641 ComboMemory devices integrate a 1M x16 CMOS flash memory bank with a 256K x8/ 128K x16 or 512K x8/ 256K x16 CMOS SRAM memory bank in a Multi-Chip Package (MCP). These devices are fabricated using SST’s proprietary, high-performance CMOS SuperFlash technology incorporating the split-gate cell design and thick oxide tunneling injector to attain better reliability and manufacturability compared with alternate approaches. The SST34HF1621/1641 devices are ideal for applications such as cellular phones, GPSs, PDAs and other portable electronic devices in a low power and small form factor system. The SST34HF1621/1641 features dual flash memory bank architecture allowing for concurrent operations between the two flash memory banks and the SRAM. The devices can read data from either bank while an Erase or Program operation is in progress in the opposite bank. The two flash memory banks are partitioned into 4 Mbit and 12 Mbit with top or bottom sector protection options for storing boot code, program code, configuration/parameter data and user data. ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 1 The SuperFlash technology provides fixed Erase and Program times, independent of the number of Erase/Program cycles that have occurred. Therefore, the system software or hardware does not have to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Program times increase with accumulated Erase/Program cycles. The SST34HF1621/1641 devices offer a guaranteed endurance of 10,000 cycles. Data retention is rated at greater than 100 years. With high performance Word-Program, the flash memory banks provide a typical Word-Program time of 14 µsec. The entire flash memory bank can be erased and programmed word-byword in typically 8 seconds for the SST34HF1621/1641, when using interface features such as Toggle Bit or Data# Polling to indicate the completion of Program operation. To protect against inadvertent flash write, the SST34HF1621/ 1641 devices contain on-chip hardware and software data protection schemes. The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc. Concurrent SuperFlash and ComboMemory are trademarks of Silicon Storage Technology, Inc. These specifications are subject to change without notice. 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet The flash and SRAM operate as two independent memory banks with respective bank enable signals. The memory bank selection is done by two bank enable signals. The SRAM bank enable signal, BES1# and BES2, selects the SRAM bank. The flash memory bank enable signal, BEF#, has to be used with Software Data Protection (SDP) command sequence when controlling the Erase and Program operations in the flash memory bank. The memory banks are superimposed in the same memory address space where they share common address lines, data lines, WE# and OE# which minimize power consumption and area. Bus contention is eliminated as the device will not recognize both bank enables as being simultaneously active. CONCURRENT READ/WRITE STATE TABLE Flash Bank 1 Bank 2 SRAM Read Write No Operation Write Read No Operation Write No Operation Read No Operation Write Read Write No Operation Write No Operation Write Write Note: For the purposes of this table, write means to Block-, Sector, or Chip-Erase, or Word-Program as applicable to the appropriate bank. Designed, manufactured, and tested for applications requiring low power and small form factor, the SST34HF1621/ 1641 are offered in both commercial and extended temperatures and a small footprint package to meet board space constraint requirements. Flash Read Operation The Read operation of the SST34HF1621/1641 is controlled by BEF# and OE#, both have to be low for the system to obtain data from the outputs. BEF# is used for device selection. When BEF# is high, the chip is deselected and only standby power is consumed. OE# is the output control and is used to gate data from the output pins. The data bus is in high impedance state when either BEF# or OE# is high. Refer to the Read cycle timing diagram for further details (Figure 6). Device Operation The SST34HF1621/1641 uses BES1#, BES2 and BEF# to control operation of either the flash or the SRAM memory bank. When BEF# is low, the flash bank is activated for Read, Program or Erase operation. When BES1# is low, and BES2 is high the SRAM is activated for Read and Write operation. BEF# and BES1# cannot be at low level, and BES2 cannot be at high level at the same time. If all bank enable signals are asserted, bus contention will result and the device may suffer permanent damage. All address, data, and control lines are shared by flash and SRAM memory banks which minimizes power consumption and loading. The device goes into standby when BEF# and BES1# bank enables are raised to VIHC (Logic High) or when BEF# is high and BES2 is low. Flash Word-Program Operation The SST34HF1621/1641 are programmed on a word-byword basis. Before Program operations, the memory must be erased first. The Program operation consists of three steps. The first step is the three-byte load sequence for Software Data Protection. The second step is to load word address and word data. During the Word-Program operation, the addresses are latched on the falling edge of either BEF# or WE#, whichever occurs last. The data is latched on the rising edge of either BEF# or WE#, whichever occurs first. The third step is the internal Program operation which is initiated after the rising edge of the fourth WE# or BEF#, whichever occurs first. The Program operation, once initiated, will be completed typically within 10 µs. See Figures 7 and 8 for WE# and BEF# controlled Program operation timing diagrams and Figure 21 for flowcharts. During the Program operation, the only valid reads are Data# Polling and Toggle Bit. During the internal Program operation, the host is free to perform additional tasks. Any commands issued during the internal Program operation are ignored. Concurrent Read/Write Operation Dual bank architecture of SST34HF1621/1641 devices allows the Concurrent Read/Write operation whereby the user can read from one bank while program or erase in the other bank. This operation can be used when the user needs to read system code in one bank while updating data in the other bank. See Figure 1 for Dual-Bank Memory Organization. ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 2 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet Flash Sector/Block-Erase Operation i.e., valid data may appear to conflict with either DQ7 or DQ6. In order to prevent spurious rejection, if an erroneous result occurs, the software routine should include a loop to read the accessed location an additional two (2) times. If both reads are valid, then the device has completed the Write cycle, otherwise the rejection is valid. The Sector/Block-Erase operation allows the system to erase the device on a sector-by-sector or block-by-block basis. The SST34HF1621/1641 offer both Sector-Erase and Block-Erase mode. The sector architecture is based on uniform sector size of 1 KWord. The Block-Erase mode is based on uniform block size of 32 KWord. The SectorErase operation is initiated by executing a six-byte command sequence with Sector-Erase command (30H) and sector address (SA) in the last bus cycle. The Block-Erase operation is initiated by executing a six-byte command sequence with Block-Erase command (50H) and block address (BA) in the last bus cycle. The sector or block address is latched on the falling edge of the sixth WE# pulse, while the command (30H or 50H) is latched on the rising edge of the sixth WE# pulse. The internal Erase operation begins after the sixth WE# pulse. See Figures 12 and 13 for timing waveforms. Any commands issued during the Sector- or Block-Erase operation are ignored. Ready/Busy# (RY/BY#) The SST34HF1621/1641 includes a Ready/Busy# (RY/ BY#) output signal. RY/BY# is actively pulled low during internal Program/Erase operation. The status of RY/BY# is valid after the rising edge of fourth WE# (or CE#) pulse for Program operation. For Sector-, Block- or Bank-Erase, the RY/BY# is valid after the rising edge of sixth WE# or (CE#) pulse. RY/BY# is an open drain output that allows several devices to be tied in parallel to VDD via an external pull up resistor. Ready/Busy# is in high impedance whenever OE# or CE# is high or RST# is low. Flash Data# Polling (DQ7) Flash Chip-Erase Operation When the SST34HF1621/1641 are in the internal Program operation, any attempt to read DQ7 will produce the complement of the true data. Once the Program operation is completed, DQ7 will produce true data. Note that even though DQ7 may have valid data immediately following the completion of an internal Write operation, the remaining data outputs may still be invalid: valid data on the entire data bus will appear in subsequent successive Read cycles after an interval of 1 µs. During internal Erase operation, any attempt to read DQ7 will produce a ‘0’. Once the internal Erase operation is completed, DQ7 will produce a ‘1’. The Data# Polling (DQ7) is valid after the rising edge of fourth WE# (or BEF#) pulse for Program operation. For Sector-, Block- or Chip-Erase, the Data# Polling (DQ7) is valid after the rising edge of sixth WE# (or BEF#) pulse. After the completion of a Program operation, Data# Polling on DQ7 remains active and the device may not return to the Read mode for approximately 1 µs. See Figure 9 for Data# Polling (DQ7) timing diagram and Figure 22 for a flowchart. The SST34HF1621/1641 provide a Chip-Erase operation, which allows the user to erase all unprotected sectors/ blocks to the “1” state. This is useful when the device must be quickly erased. The Chip-Erase operation is initiated by executing a sixbyte command sequence with Chip-Erase command (10H) at address 5555H in the last byte sequence. The Erase operation begins with the rising edge of the sixth WE# or BEF#, whichever occurs first. During the Erase operation, the only valid read is Toggle Bit or Data# Polling. See Table 4 for the command sequence, Figure 11 for timing diagram, and Figure 24 for the flowchart. Any commands issued during the Chip-Erase operation are ignored. Flash Write Operation Status Detection The SST34HF1621/1641 provide one hardware and two software means to detect the completion of a Write (Program or Erase) cycle, in order to optimize the system Write cycle time. The hardware detection uses the Ready/Busy# (RY/BY#) pin. The software detection includes two status bits: Data# Polling (DQ7) and Toggle Bit (DQ6). The End-of-Write detection mode is enabled after the rising edge of WE#, which initiates the internal Program or Erase operation. Flash Toggle Bit (DQ6) During the internal Program or Erase operation, any consecutive attempts to read DQ6 will produce alternating 1s and 0s, i.e., toggling between 1 and 0. When the internal Program or Erase operation is completed, the DQ6 bit will stop toggling. After the completion of a Program operation, DQ6 will stop toggling for approximately 1 µs. The device is then ready for the next operation. The Toggle Bit (DQ6) is valid after the rising edge of fourth WE# (or BEF#) pulse for Program operation. For Sector-, Block- or Chip-Erase, the The actual completion of the nonvolatile write is asynchronous with the system; therefore, either a Ready/Busy# (RY/ BY#), Data# Polling (DQ7) or Toggle Bit (DQ6) read may be simultaneous with the completion of the Write cycle. If this occurs, the system may possibly get an erroneous result, ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 3 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet Toggle Bit (DQ6) is valid after the rising edge of sixth WE# (or BEF#) pulse. See Figure 10 for Toggle Bit timing diagram and Figure 22 for a flowchart. Write operations, e.g., during the system power-up or power-down. Any Erase operation requires the inclusion of six-byte sequence. The SST34HF1621/1641 are shipped with the Software Data Protection permanently enabled. See Table 4 for the specific software command codes. During SDP command sequence, invalid commands will abort the device to Read mode within TRC. The contents of DQ15DQ8 are “Don’t Care” during any SDP command sequence. Data Protection The SST34HF1621/1641 provide both hardware and software features to protect nonvolatile data from inadvertent writes. Common Flash Memory Interface (CFI) Hardware Data Protection Write Inhibit Mode: Forcing OE# low, BEF# high, or WE# high will inhibit the Write operation. This prevents inadvertent writes during power-up or power-down. The SST34HF1621/1641 also contain the CFI information to describe the characteristics of the device. In order to enter the CFI Query mode, the system must write threebyte sequence, same as Software ID Entry command with 98H (CFI Query command) to address 555H in the last byte sequence. Once the device enters the CFI Query mode, the system can read CFI data at the addresses given in Tables 5 through 7. The system must write the CFI Exit command to return to Read mode from the CFI Query mode. Hardware Block Protection Product Identification The SST34HF1621/1641 provide a hardware block protection which protects the outermost 4 KWord in the larger bank.The block is protected when WP# is held low. See Figure 1 for Block-Protection location. The Product Identification mode identifies the devices as the SST34HF1621/1641 and manufacturer as SST. This mode may be accessed by software operations only. The hardware device ID Read operation, which is typically used by programmers cannot be used on this device because of the shared lines between flash and SRAM in the multi-chip package. Therefore, application of high voltage to pin A9 may damage this device. Users may use the software Product Identification operation to identify the part (i.e., using the device ID) when using multiple manufacturers in the same socket. For details, see Tables 3 and 4 for software operation, Figure 14 for the software ID entry and read timing diagram and Figure 23 for the ID entry command sequence flowchart. Noise/Glitch Protection: A WE# or BEF# pulse of less than 5 ns will not initiate a Write cycle. VDD Power Up/Down Detection: The Write operation is inhibited when VDD is less than 1.5V. A user can disable block protection by driving WP# high thus allowing erase or program of data into the protected sectors. WP# must be held high prior to issuing the write command and remain stable until after the entire Write operation has completed. Hardware Reset (RST#) The RST# pin provides a hardware method of resetting the device to read array data. When the RST# pin is held low for at least TRP, any in-progress operation will terminate and return to Read mode (see Figure 18). When no internal Program/Erase operation is in progress, a minimum period of TRHR is required after RST# is driven high before a valid Read can take place (see Figure 17). TABLE 1: PRODUCT IDENTIFICATION ADDRESS DATA 0000H 00BFH SST34HF1621 0001H 2761H SST34HF1641 0001H 2761H Manufacturer’s ID Device ID The Erase operation that has been interrupted needs to be reinitiated after the device resumes normal operation mode to ensure data integrity. T1.2 523 Software Data Protection (SDP) The SST34HF1621/1641 provide the JEDEC standard Software Data Protection scheme for all data alteration operations, i.e., Program and Erase. Any Program operation requires the inclusion of the three-byte sequence. The three-byte load sequence is used to initiate the Program operation, providing optimal protection from inadvertent ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 4 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet Product Identification Mode Exit/ CFI Mode Exit deselected and the device enters standby. Read and Write cycle times are equal. The control signals UBS# and LBS# provide access to the upper data byte and lower data byte. See Table 3 for SRAM Read and Write data byte control modes of operation. In order to return to the standard Read mode, the Software Product Identification mode must be exited. Exit is accomplished by issuing the Software ID Exit command sequence, which returns the device to the Read mode. This command may also be used to reset the device to the Read mode after any inadvertent transient condition that apparently causes the device to behave abnormally, e.g., not read correctly. Please note that the Software ID Exit/ CFI Exit command is ignored during an internal Program or Erase operation. See Table 4 for software command codes, Figure 16 for timing waveform and Figure 23 for a flowchart. SRAM Read The SRAM Read operation of the SST34HF1621/1641 is controlled by OE# and BES1#, both have to be low with WE# and BES2 high for the system to obtain data from the outputs. BES1# and BES2 are used for SRAM bank selection. OE# is the output control and is used to gate data from the output pins. The data bus is in high impedance state when OE# is high. Refer to the Read cycle timing diagram, Figure 3, for further details. SRAM Operation SRAM Write With BES1# low, BES2 and BEF# high, the SST34HF162x operates as 256K x8 or 128K x16 CMOS SRAM, and the SST34HF164x operates as 512K x8 or 256K x16 CMOS SRAM, with fully static operation requiring no external clocks or timing strobes. The CIOs pin configures the SRAM for x8 or x16 SRAM operation modes. The SST34HF162x SRAM is mapped into the first 256 KByte/128 KWord address space of the device, and the SST34HF164x SRAM is mapped into the first 512 KByte/256 KWord address space. When BES1#, BEF# are high and BES2 is low, all memory banks are The SRAM Write operation of the SST34HF1621/1641 is controlled by WE# and BES1#, both have to be low, BES2 have to be high for the system to write to the SRAM. During the Word-Write operation, the addresses and data are referenced to the rising edge of either BES1#, WE#, or the falling edge of BES2 whichever occurs first. The write time is measured from the last falling edge of BES#1 or WE# or the rising edge of BES2 to the first rising edge of BES1#, or WE# or the falling edge of BES2. Refer to the Write cycle timing diagram, Figures 4 and 5, for further details. FUNCTIONAL BLOCK DIAGRAM Address Buffers AMS - A0 SuperFlash Memory (Bank 1) RST# BEF# WP# SA LBS# UBS# WE# OE# BES1# BES2 CIOs RY/BY# SuperFlash Memory (Bank 2) Control Logic I/O Buffers DQ15 - DQ8 DQ7 - DQ0 2 Mbit or 4 Mbit SRAM Address Buffers 523 ILL B1.1 AMS = Most significant address ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 5 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet Bottom Sector Protection; 32 KWord Blocks; 1 KWord Sectors Block 30 Block 29 Block 28 Block 27 Block 26 Block 25 Block 24 Block 23 Block 22 Block 21 Block 20 Block 19 Block 18 Block 17 Block 16 Block 15 Block 14 Block 13 Block 12 Block 11 Block 10 Bank 1 4 KWord Sector Protection (Four 1 KWord Sectors) Block 31 Bank 2 FFFFFH F8000H F7FFFH F0000H EFFFFH E8000H E7FFFH E0000H DFFFFH D8000H D7FFFH D0000H CFFFFH C8000H C7FFFH C0000H BFFFFH B8000H B7FFFH B0000H AFFFFH A8000H A7FFFH A0000H 9FFFFH 98000H 97FFFH 90000H 8FFFFH 88000H 87FFFH 80000H 7FFFFH 78000H 77FFFH 70000H 6FFFFH 68000H 67FFFH 60000H 5FFFFH 58000H 57FFFH 50000H 4FFFFH 48000H 47FFFH 40000H 3FFFFH 38000H 37FFFH 30000H 2FFFFH 28000H 27FFFH 20000H 1FFFFH 18000H 17FFFH 10000H 00FFFFH 008000H 007FFFH 001000H 000FFFH 000000H Block 9 Block 8 Block 7 Block 6 Block 5 Block 4 Block 3 Block 2 Block 1 Block 0 523 ILL F02.1 FIGURE 1: SST34HF1621/1641, 1 MBIT X 16 CONCURRENT SUPERFLASH DUAL-BANK MEMORY ORGANIZATION ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 6 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet TOP VIEW (balls facing down) SST34HF1621/1641 8 7 6 5 4 A15 NC NC A16 A11 A12 A13 A14 SA A8 A19 A9 A10 NC VSS DQ15 DQ7 DQ14 DQ6 DQ13 DQ12 DQ5 WE# BES2 NC DQ4 VDDS CIOs WP# RST# RY/BY# DQ3 VDDF DQ11 3 LBS# UBS# A18 A17 DQ1 DQ9 DQ10 DQ2 VSS OE# 2 A7 A6 A5 A4 A3 A2 A1 DQ0 DQ8 1 A0 BEF# BES1# A B C D E F G H 523 56-lfbga ILL P01.2 FIGURE 2: PIN ASSIGNMENTS FOR 56-BALL LFBGA (8MM X 10MM) COMBOMEMORY PINOUT TABLE 2: PIN DESCRIPTION Symbol Pin Name Functions AMS1 to A0 Address Inputs To provide flash address, A19-A0. To provide SRAM address, A16-A0 for 2M and A17-A0 for 4M SA To provide SRAM address input in byte mode (x8). When CIOs is VIL, the SRAM is in Byte mode and SA provides the most significant address input. When CIOs is VIH, the SRAM is in Word mode and SA becomes a Don’t Care pin. Address Input (SRAM) DQ15-DQ0 Data Inputs/Outputs To output data during Read cycles and receive input data during Write cycles. Data is internally latched during a flash Erase/Program cycle. The outputs are in tri-state when OE# is high or BES1# is high or BES2 is low and BEF# is high. BEF# Flash Memory Bank Enable To activate the Flash memory bank when BEF# is low BES1# SRAM Memory Bank Enable To activate the SRAM memory bank when BES1# is low BES2 SRAM Memory Bank Enable To activate the SRAM memory bank when BES2 is high OE# Output Enable To gate the data output buffers WE# Write Enable To control the Write operations UBS# Upper Byte Control (SRAM) To enable DQ15-DQ8 LBS# Lower Byte Control (SRAM) To enable DQ7-DQ0 CIOs I/O Configuration (SRAM) CIOs = VIH is Word mode (x16), CIOs = VIL is Byte mode (x8) WP# Write Protect To protect and unprotect sectors from Erase or Program operation RST# Reset To Reset and return the device to Read mode RY/BY# Ready/Busy# To output the status of a Program or Erase Operation RY/BY# is a open drain output, so a 10KΩ - 100KΩ pull-up resistor is required to allow RY/BY# to transition high indicating the device is ready to read. VSS Ground VDDF VDDS Power Supply (Flash) 2.7-3.3V Power Supply to Flash only Power Supply (SRAM) 2.7-3.3V Power Supply to SRAM only NC No Connection Unconnected pins T2.5 523 1. AMS = Most Significant Address ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 7 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet TABLE 3: OPERATIONAL MODES SELECTION1 BES22 CIOs3 OE# WE# SA LBS# UBS# DQ0-7 DQ8-15 VIH X X X X X X X HIGH-Z HIGH-Z X VIL X X X X X X VIL VIH X VIH VIH X X X HIGH-Z HIGH-Z VIL VIH VIH X X X VIH VIH VIH X X VIH VIH X X X HIGH-Z HIGH-Z X VIL X VIL VIH X X X DOUT DOUT X VIH VIL X X X DIN DIN X VIH VIL X X X X X VIH VIL VIH X Mode BEF# BES1# Full Standby VIH Output Disable VIH VIL Flash Read Flash Write Flash Erase SRAM Read SRAM Write Product Identification4 VIL VIL VIL VIH VIH X X VIL VIH X X VIL VIH X X VIL VIL VIH VIH VIL VIH VIL VIL VIH SA VIH VIL VIH VIH X VIL X VIL VIL DOUT DOUT VIH VIL HIGH-Z DOUT VIL VIH DOUT HIGH-Z X X DOUT HIGH-Z VIL VIL DIN DIN VIH VIL HIGH-Z DIN VIL VIH DIN HIGH-Z VIH VIL VIH VIL X VIL SA X X DIN HIGH-Z VIL VIH X X VIL VIH X X X X VIL Manufacturer’s ID5 Device ID5 T3.6 523 1. 2. 3. 4. 5. X can be VIL or VIH, but no other value. Do not apply BEF# = VIL, BES1# = VIL and BES2 = VIH at the same time SRAM I/O configuration input CIOs; VIH = x16 (word mode), VIL = x8 (byte mode) Software mode only With A19-A1 = 0; SST Manufacturer’s ID = 00BFH, is read with A0 = 0, SST34HF1621/1641 Device ID = 2761H, is read with A0 = 1 ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 8 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet TABLE 4: SOFTWARE COMMAND SEQUENCE Command Sequence 1st Bus Write Cycle Addr1 Data2 2nd Bus Write Cycle Addr1 Data2 3rd Bus Write Cycle Addr1 4th Bus Write Cycle Data2 Addr1 Data2 Data AAH Word-Program 5555H AAH 2AAAH 55H 5555H A0H WA3 Sector-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H 5th Bus Write Cycle 6th Bus Write Cycle Addr1 Data2 Addr1 Data2 2AAAH 55H SAX4 30H 50H 10H Block-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H BAX4 Chip-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H 5555H Software ID Entry5 5555H AAH 2AAAH 55H 5555H 90H CFI Query Entry5 5555H AAH 2AAAH 55H 5555H 98H Software ID Exit/ CFI Exit6 5555H AAH 2AAAH 55H 5555H F0H T4.4 523 1. 2. 3. 4. Address format A14-A0 (Hex),Address A15-A19 can be VIL or VIH, but no other value, for the Command sequence. Data format DQ15-DQ8 can be VIL or VIH, but no other value, for Command sequence. WA = Program Word address SAX for Sector-Erase; uses A19-A11 address lines BAX for Block-Erase; uses A19-A15 address lines 5. The device does not remain in Software Product Identification mode if powered down. 6. With A20-A1 = 0; SST Manufacturer’s ID = 00BFH, is read with A0 = 0 SST34HF1621/1641 Device ID = 2761H, is read with A0 = 1. TABLE 5: CFI QUERY IDENTIFICATION STRING1 Address Data 10H 0051H 11H 0052H 12H 0059H 13H 0001H 14H 0007H 15H 0000H 16H 0000H 17H 0000H 18H 0000H 19H 0000H 1AH 0000H Data Query Unique ASCII string “QRY” Primary OEM command set Address for Primary Extended Table Alternate OEM command set (00H = none exists) Address for Alternate OEM extended Table (00H = none exits) T5.0 523 1. Refer to CFI publication 100 for more details. ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 9 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet TABLE 6: SYSTEM INTERFACE INFORMATION Address Data 1BH 0027H Data VDD Min (Program/Erase) DQ7-DQ4: Volts, DQ3-DQ0: 100 millivolts 1CH 0036H VDD Max (Program/Erase) DQ7-DQ4: Volts, DQ3-DQ0: 100 millivolts 1DH 0000H VPP Min (00H = no VPP pin) 1EH 0000H VPP Max (00H = no VPP pin) 1FH 0004H Typical time out for Word-Program 2N µs (24 = 16 µs) 20H 0000H Typical time out for Min size buffer program 2N µs (00H = not supported) 21H 0004H Typical time out for individual Sector/Block-Erase 2N ms (24 = 16 ms) 22H 0006H Typical time out for Chip-Erase 2N ms (26 = 64 ms) 23H 0001H Maximum time out for Word-Program 2N times typical (21 x 24 = 32 µs) 24H 0000H Maximum time out for buffer program 2N times typical 25H 0001H Maximum time out for individual Sector/Block-Erase 2N times typical (21 x 24 = 32 ms) 26H 0001H Maximum time out for Chip-Erase 2N times typical (21 x 26 = 128 ms) T6.0 523 TABLE 7: DEVICE GEOMETRY INFORMATION Address Data 27H 0015H Device size = 2N Byte (15H = 21; 221 = 2M Bytes) Data 28H 0001H Flash Device Interface description; 0001H = x16-only asynchronous interface 29H 0000H 2AH 0000H 2BH 0000H Maximum number of byte in multi-byte write = 2N (00H = not supported) 2CH 0002H Number of Erase Sector/Block sizes supported by device 2DH 00FFH Sector Information (y + 1 = Number of sectors; z x 256B = sector size) 2EH 0003H y = 1023 + 1 = 1024 sectors (03FF = 1023) 2FH 0008H 30H 0000H z = 8 x 256 Bytes = 2 KByte/sector (0008H = 8) 31H 001FH Block Information (y + 1 = Number of blocks; z x 256B = block size) 32H 0000H y = 31 + 1 = 32 blocks (001F = 31) 33H 0000H 34H 0001H z = 256 x 256 Bytes = 64 KByte/block (0100H = 256) T7.0 523 ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 10 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20°C to +85°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +125°C D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD1+0.3V Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to VDD1+1.0V Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C Output Short Circuit Current2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA 1. VDD = VDDF and VDDS 2. Outputs shorted for no more than one second. No more than one output shorted at a time. OPERATING RANGE Range Commercial Extended AC CONDITIONS OF Ambient Temp VDD 0°C to +70°C 2.7-3.3V -20°C to +85°C 2.7-3.3V TEST Input Rise/Fall Time . . . . . . . . . . . . . . 5 ns Output Load . . . . . . . . . . . . . . . . . . . . CL = 30 pF See Figures 19 and 20 ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 11 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet TABLE 8: DC OPERATING CHARACTERISTICS (VDD = VDDF AND VDDS = 2.7-3.3V) Limits Symbol Parameter IDD Active VDD Current Min Max Units Test Conditions Address input=VIL/VIH, at f=1/TRC Min, VDD=VDD Max, all DQs open Read OE#=VIL, WE#=VIH Flash 35 mA BEF#=VIL, BES1#=VIH, or BES2=VIL SRAM 20 mA BEF#=VIH, BES1#=VIL , BES2=VIH 60 mA BEF#=VIH, BES1#=VIL , BES2=VIH Flash 40 mA BEF#=VIL, BES1#=VIH, or BES2=VIL, OE#=VIH SRAM 20 mA BEF#=VIH, BES1#=VIL , BES2=VIH Concurrent Operation Write1 ISB Standby VDD Current 3.0V 3.3V 40 75 µA µA VDD = VDD Max, BEF#=BES1#=VIHC, BES2=VILC IALP IRT Auto Low Power Mode 3.0V 3.3V Reset VDD Current 40 75 30 µA µA µA VDD=VDD Max, BEF#=VILC, WE#=VIHC, All I/O=VILC/VIHC Reset=VSS±0.3V ILI Input Leakage Current 1 µA VIN=GND to VDD, VDD=VDD Max ILO Output Leakage Current 1 µA VOUT=GND to VDD, VDD=VDD Max VIL Input Low Voltage 0.8 V VDD=VDD Min VILC Input Low Voltage (CMOS) 0.3 V VDD=VDD Max VIH Input High Voltage V VDD=VDD Max VIHC Input High Voltage (CMOS) V VDD=VDD Max VOLF Flash Output Low Voltage VOHF Flash Output High Voltage VOLS SRAM Output Low Voltage VOHS SRAM Output High Voltage 0.7 VDD VDD-0.3 0.2 VDD-0.2 0.4 2.2 V IOL=100 µA, VDD=VDD Min V IOH=-100 µA, VDD=VDD Min V IOL =1 mA, VDD=VDD Min V IOH =-500 µA, VDD=VDD Min T8.6 523 1. IDD active while Erase or Program is in progress. ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 12 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet TABLE 9: RECOMMENDED SYSTEM POWER-UP TIMINGS Symbol Parameter Minimum Units TPU-READ1 Power-up to Read Operation 100 µs Power-up to Write Operation 100 µs TPU-WRITE 1 T9.1 523 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. TABLE 10: CAPACITANCE (Ta = 25°C, f=1 Mhz, other pins open) Parameter Description Test Condition Maximum CI/O1 I/O Pin Capacitance VI/O = 0V 12 pF Input Capacitance VIN = 0V 6 pF CIN 1 T10.0 523 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. TABLE 11: FLASH RELIABILITY CHARACTERISTICS Symbol NEND 1 Parameter Minimum Specification Units Endurance 10,000 Cycles JEDEC Standard A117 100 Years JEDEC Standard A103 100 + IDD mA TDR1 Data Retention ILTH1 Latch Up Test Method JEDEC Standard 78 T11.1 523 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 13 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet AC CHARACTERISTICS TABLE 12: SRAM READ CYCLE TIMING PARAMETERS SST34HF1621/1641-70 Symbol Parameter Min Max Min Max Units 90 ns TRCS Read Cycle Time TAAS Address Access Time TBES Bank Enable Access Time 70 90 ns TOES Output Enable Access Time 35 45 ns TBYES UBS#, LBS# Access Time TBLZS1 BES# to Active Output 0 0 ns TOLZS1 Output Enable to Active Output 0 0 ns TBYLZS1 UBS#, LBS# to Active Output 0 0 ns TBHZS 1 TOHZS1 70 SST34HF1621/1641-90 90 70 70 ns 90 ns BES# to High-Z Output 25 35 ns Output Disable to High-Z Output 25 35 ns 45 ns TBYHZS1 UBS#, LBS# to High-Z Output TOHS Output Hold from Address Change 35 10 10 ns T12.3 523 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. TABLE 13: SRAM WRITE CYCLE TIMING PARAMETERS SST34HF1621/1641-70 Min Max SST34HF1621/1641-90 Symbol Parameter Min Max TWCS Write Cycle Time 70 90 ns TBWS Bank Enable to End-of-Write 60 80 ns TAWS Address Valid to End-of-Write 60 80 ns TASTS Address Set-up Time 0 0 ns TWPS Write Pulse Width 60 80 ns TWRS Write Recovery Time 0 0 ns TBYWS UBS#, LBS# to End-of-Write 60 TODWS Output Disable from WE# Low TOEWS Output Enable from WE# High 0 0 ns TDSS Data Set-up Time 30 40 ns TDHS Data Hold from Write Time 0 0 ns 80 30 Units ns 40 ns T13.3 523 ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 14 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet TABLE 14: FLASH READ CYCLE TIMING PARAMETERS VDD = 2.7-3.3V SST34HF1621/1641-70 Min Max SST34HF1621/1641-90 Symbol Parameter TRC Read Cycle Time TCE Chip Enable Access Time 70 90 ns TAA Address Access Time 70 90 ns TOE Output Enable Access Time 45 ns TCLZ1 BEF# Low to Active Output 0 TOLZ1 TCHZ1 TOHZ1 TOH1 TRP1 TRHR1 TRY1,2 OE# Low to Active Output 0 70 Max 90 0 ns 0 ns 20 OE# High to High-Z Output Units ns 35 BEF# High to High-Z Output Output Hold from Address Change Min 20 30 ns 30 ns 0 0 ns RST# Pulse Width 500 500 ns RST# High Before Read 50 50 ns RST# Pin Low to Read 150 150 µs T14.4 523 1. This parameter is measured only for initial qualification and after the design or process change that could affect this parameter. 2. This parameter applies to Sector-Erase and Block-Erase operations. This parameter does not apply to Chip-Erase operations. TABLE 15: FLASH PROGRAM/ERASE CYCLE TIMING PARAMETERS Symbol Parameter TBP Word-Program Time Min Max Units 20 µs TAS Address Setup Time 0 ns TAH Address Hold Time 40 ns TCS WE# and BEF# Setup Time 0 ns TCH WE# and BEF# Hold Time 0 ns TOES OE# High Setup Time 0 ns TOEH OE# High Hold Time 10 ns TCP BEF# Pulse Width 40 ns TWP WE# Pulse Width 40 ns TWPH1 WE# Pulse Width High 30 ns TCPH1 BEF# Pulse Width High 30 ns TDS Data Setup Time 30 ns TDH1 Data Hold Time 0 ns TIDA1 TBY1 Software ID Access and Exit Time TBR Bus Recovery Time 1 µs TSE Sector-Erase 25 ms TBE Block-Erase 25 ms TSCE Chip-Erase 100 150 RY/BY# Delay Time ns 90 ns ms T15.3 523 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 15 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet TRCS ADDRESSES AMSS-0 TOHS TAAS BES1# TBES BES2 TBES TBLZS TBHZS TOES OE# TOLZS TOHZS TBYES UBS#, LBS# TBYLZS TBYHZS DQ15-0 DATA VALID 523 ILL F15.0 AMSS = Most Significant SRAM Address FIGURE 3: SRAM READ CYCLE TIMING DIAGRAM TWCS ADDRESSES AMSS-0 TASTS TWPS TWRS WE# TAWS TBWS BES1# BES2 TBWS TBYWS UBS#, LBS# TODWS DQ15-8, DQ7-0 TDSS TOEWS TDHS VALID DATA IN NOTE 2 NOTE 2 523 ILL F16.2 Notes: 1. If OE# is High during the Write cycle, the outputs will remain at high impedance. 2. If BES1# goes Low or BES2 goes high coincident with or after WE# goes Low, the output will remain at high impedance. If BES1# goes High or BES2 goes low coincident with or before WE# goes High, the output will remain at high impedance. Because DIN signals may be in the output state at this time, input signals of reverse polarity must not be applied. FIGURE 4: SRAM WRITE CYCLE TIMING DIAGRAM (WE# CONTROLLED)1 ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 16 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet TWCS ADDRESSES AMSS-0 TWPS TWRS WE# TBWS BES1# TBWS BES2 TAWS TASTS TBYWS UBS#, LBS# TDSS DQ15-8, DQ7-0 NOTE 2 TDHS VALID DATA IN NOTE 2 523 ILL F18.0 Notes: 1. If OE# is High during the Write cycle, the outputs will remain at high impedance. 2. Because DIN signals may be in the output state at this time, input signals of reverse polarity must not be applied. FIGURE 5: SRAM WRITE CYCLE TIMING DIAGRAM (UBS#, LBS# CONTROLLED)1 ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 17 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet TAA TRC ADDRESS A19-0 TCE BEF# TOE OE# TOHZ TOLZ VIH WE# HIGH-Z DQ15-0 TCHZ TOH TCLZ HIGH-Z DATA VALID DATA VALID 523 ILL F04.0 FIGURE 6: FLASH READ CYCLE TIMING DIAGRAM TBP 5555 TAH ADDRESS A19-0 2AAA 5555 ADDR TWP WE# TAS TWPH OE# TCH BEF# TCS TBY RY/BY# TBR TDS TDH DQ15-0 XXAA XX55 XXA0 SW0 SW1 SW2 DATA WORD (ADDR/DATA) VALID 523 ILL F05.3 Note: X can be VIL or VIH, but no other value. FIGURE 7: FLASH WE# CONTROLLED WORD-PROGRAM CYCLE TIMING DIAGRAM ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 18 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet TBP 5555 TAH ADDRESS A19-0 2AAA 5555 ADDR TCP BEF# TAS TCPH OE# TCH WE# TCS TBY RY/BY# TBR TDS TDH DQ15-0 XXAA XX55 XXA0 DATA SW0 SW1 SW2 WORD (ADDR/DATA) VALID 523 ILL F06.3 Note: X can be VIL or VIH, but no other value. FIGURE 8: FLASH BEF# CONTROLLED WORD-PROGRAM CYCLE TIMING DIAGRAM ADDRESS A19-0 TCE BEF# TOES TOEH OE# TOE WE# TBR DQ7 DATA# DATA# VALID DATA 523 ILL F07.2 FIGURE 9: FLASH DATA# POLLING TIMING DIAGRAM ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 19 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet ADDRESS A19-0 TCE BEF# TOE TOEH OE# WE# TBR VALID DATA DQ6 TWO READ CYCLES WITH SAME OUTPUTS 523 ILL F08.2 FIGURE 10: FLASH TOGGLE BIT TIMING DIAGRAM TSCE SIX-BYTE CODE FOR CHIP-ERASE 5555 ADDRESS A19-0 2AAA 5555 5555 2AAA 5555 BEF# OE# TWP WE# TBY TBR RY/BY# DQ15-0 XXAA XX55 XX80 XXAA XX55 SW0 SW1 SW2 SW3 SW4 XX10 VALID SW5 523 ILL F09.5 Note: This device also supports BEF# controlled Chip-Erase operation. The WE# and BEF# signals are interchageable as long as minimum timings are met. (See Table 15) X can be VIL or VIH, but no other value. FIGURE 11: FLASH WE# CONTROLLED CHIP-ERASE TIMING DIAGRAM ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 20 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet TBE SIX-BYTE CODE FOR BLOCK-ERASE ADDRESS A19-0 5555 2AAA 5555 5555 2AAA BAX BEF# OE# TWP WE# TBR TBY RY/BY# DQ15-0 XXAA XX55 XX80 XXAA XX55 XX50 SW0 SW1 SW2 SW3 SW4 SW5 VALID 523 ILL F10.4 Note: This device also supports BEF# controlled Block-Erase operation. The WE# and BEF# signals are interchageable as long as minimum timings are met. (See Table 15) BAX = Block Address X can be VIL or VIH, but no other value. FIGURE 12: FLASH WE# CONTROLLED BLOCK-ERASE TIMING DIAGRAM TSE SIX-BYTE CODE FOR SECTOR-ERASE ADDRESS A19-0 5555 2AAA 5555 5555 2AAA SAX BEF# OE# TWP WE# TBY TBR RY/BY# DQ15-0 XXAA XX55 XX80 XXAA XX55 XX30 SW0 SW1 SW2 SW3 SW4 SW5 VALID 523 ILL F11.4 Note: This device also supports BEF# controlled Sector-Erase operation. The WE# and BEF# signals are interchageable as long as minimum timings are met. (See Table 15) SAX = Sector Address X can be VIL or VIH, but no other value. FIGURE 13: FLASH WE# CONTROLLED SECTOR-ERASE TIMING DIAGRAM ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 21 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet THREE-BYTE SEQUENCE FOR SOFTWARE ID ENTRY 5555 ADDRESS A14-0 2AAA 5555 0000 0001 BEF# OE# TIDA TWP WE# TWPH DQ15-0 TAA XXAA XX55 XX90 SW0 SW1 SW2 00BF Device ID 523 ILL F12.5 Device ID = 2761H for SST34HF1621 and 2761H for SST34HF1641 Note: X can be VIL or VIH, but no other value FIGURE 14: FLASH SOFTWARE ID ENTRY AND READ THREE-BYTE SEQUENCE FOR CFI QUERY ENTRY 5555 ADDRESS A14-0 2AAA 5555 BEF# OE# TIDA TWP WE# TWPH DQ15-0 TAA XXAA XX55 XX98 SW0 SW1 SW2 523 ILL F13.1 Note: X can be VIL or VIH, but no other value. FIGURE 15: FLASH CFI ENTRY AND READ ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 22 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet THREE-BYTE SEQUENCE FOR SOFTWARE ID EXIT AND RESET 5555 ADDRESS A14-0 DQ15-0 2AAA XXAA 5555 XX55 XXF0 TIDA BEF# OE# TWP WE# T WHP SW0 SW1 SW2 523 ILL F14.2 Note: X can be VIL or VIH, but no other value FIGURE 16: FLASH SOFTWARE ID EXIT/CFI EXIT RY/BY# 0V TRP RST# CE#/OE# TRHR 523 ILL F29.0 FIGURE 17: RST# TIMING (WHEN NO INTERNAL OPERATION IS IN PROGRESS) TRY RY/BY# RST# TRP CE# TBR OE# 523 ILL F30.0 FIGURE 18: RST# TIMING (DURING SECTOR- OR BLOCK-ERASE ©2001 Silicon Storage Technology, Inc. OPERATION) S71172-05-000 10/01 523 23 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet VIHT INPUT VIT REFERENCE POINTS VOT OUTPUT VILT 523 ILL F19.0 AC test inputs are driven at VIHT (0.9 VDD) for a logic “1” and VILT (0.1 VDD) for a logic “0”. Measurement reference points for inputs and outputs are VIT (0.5 VDD) and VOT (0.5 VDD). Input rise and fall times (10% ↔ 90%) are <5 ns. Note: VIT - VINPUT Test VOT - VOUTPUT Test VIHT - VINPUT HIGH Test VILT - VINPUT LOW Test FIGURE 19: AC INPUT/OUTPUT REFERENCE WAVEFORMS TO TESTER TO DUT CL 523 ILL F20.0 FIGURE 20: A TEST LOAD EXAMPLE ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 24 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet Start Load data: XXAAH Address: 5555H Load data: XX55H Address: 2AAAH Load data: XXA0H Address: 5555H Load Word Address/Word Data Wait for end of Program (TBP, Data# Polling bit, or Toggle bit operation) Program Completed 523 ILL F21.4 Note: X can be VIL or VIH, but no other value. FIGURE 21: WORD-PROGRAM ALGORITHM ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 25 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet Internal Timer Toggle Bit Data# Polling Program/Erase Initiated Program/Erase Initiated Program/Erase Initiated Wait TBP, TSCE, TSE or TBE Read word Read DQ7 Read same word Program/Erase Completed No Is DQ7 = true data? Yes No Does DQ6 match? Program/Erase Completed Yes Program/Erase Completed 523 ILL F22.0 FIGURE 22: WAIT OPTIONS ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 26 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet CFI Query Entry Command Sequence Software Product ID Entry Command Sequence Software ID Exit/CFI Exit Command Sequence Load data: XXAAH Address: 5555H Load data: XXAAH Address: 5555H Load data: XXAAH Address: 5555H Load data: XX55H Address: 2AAAH Load data: XX55H Address: 2AAAH Load data: XX55H Address: 2AAAH Load data: XX98H Address: 5555H Load data: XX90H Address: 5555H Load data: XXF0H Address: 5555H Wait TIDA Wait TIDA Wait TIDA Read CFI data Read Software ID Return to normal operation 523 ILL F23.3 Note: X can be VIL or VIH, but no other value. FIGURE 23: SOFTWARE PRODUCT ID/CFI COMMAND FLOWCHARTS ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 27 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet Chip-Erase Command Sequence Sector-Erase Command Sequence Block-Erase Command Sequence Load data: XXAAH Address: 5555H Load data: XXAAH Address: 5555H Load data: XXAAH Address: 5555H Load data: XX55H Address: 2AAAH Load data: XX55H Address: 2AAAH Load data: XX55H Address: 2AAAH Load data: XX80H Address: 5555H Load data: XX80H Address: 5555H Load data: XX80H Address: 5555H Load data: XXAAH Address: 5555H Load data: XXAAH Address: 5555H Load data: XXAAH Address: 5555H Load data: XX55H Address: 2AAAH Load data: XX55H Address: 2AAAH Load data: XX55H Address: 2AAAH Load data: XX10H Address: 5555H Load data: XX30H Address: SAX Load data: XX50H Address: BAX Wait TSCE Wait TSE Wait TBE Chip erased to FFFFH Sector erased to FFFFH Block erased to FFFFH 523 ILL F24.2 Note: X can be VIL or VIH, but no other value. FIGURE 24: ERASE COMMAND SEQUENCE ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 28 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet PRODUCT ORDERING INFORMATION Device Speed SST34HF16xx - XXX Suffix1 - XX Suffix2 - XX Package Modifier P = 56 balls Package Type LF = LFBGA (8mm x 10mm x 1.4mm, 0.4mm ball size) L1 = LFBGA (8mm x 10mm x 1.4mm, 0.45mm ball size) Temperature Range C = Commercial = 0°C to +70°C E = Extended = -20°C to +85°C Minimum Endurance 4 =10,000 cycles Read Access Speed 70 = 70 ns 90 = 90 ns Bank Split 1 = 12M + 4M SRAM Density 0 = No SRAM 2 = 2 Mbit 4 = 4 Mbit Flash Density 16 = 16 Mbit Voltage H = 2.7-3.3V Valid combinations for SST34HF1621 SST34HF1621-70-4C-LFP SST34HF1621-90-4C-LFP SST34HF1621-70-4C-L1P SST34HF1621-90-4C-L1P SST34HF1621-70-4E-LFP SST34HF1621-90-4E-LFP SST34HF1621-70-4E-L1P SST34HF1621-90-4E-L1P Valid combinations for SST34HF1641 SST34HF1641-70-4C-LFP SST34HF1641-90-4C-LFP SST34HF1641-70-4C-L1P SST34HF1641-90-4C-L1P SST34HF1641-70-4E-LFP SST34HF1641-90-4E-LFP SST34HF1641-70-4E-L1P SST34HF1641-90-4E-L1P Note: Valid combinations are those products in mass production or will be in mass production. Consult your SST sales representative to confirm availability of valid combinations and to determine availability of new combinations. ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 29 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet PACKAGING DIAGRAMS BOTTOM VIEW 10.00 ± 0.20 5.60 TOP VIEW 0.80 8 8 7 7 6 6 5.60 5 4 5 4 8.00 ± 0.20 3 3 2 2 1 1 0.80 H G F E D C B A A B C D E F G H A1 CORNER 0.40 ± 0.05 (56X) A1 CORNER 1.30 ± 0.10 SIDE VIEW 0.15 SEATING PLANE 56ba-lfbga-LFP-8x10-400mic-ILL.6 0.32 ± 0.05 Note: 1. Although many dimensions are similar to those of JEDEC Publication 95, MO-210, this specific package is not registered. 2. All linear dimensions are in millimeters. 3. Coplanarity: 0.1 (±.05) mm. 4. The actual shape of the corners may be slightly different than as portrayed in the drawing. 56-BALL LOW-PROFILE, FINE-PITCH BALL GRID ARRAY (LFBGA) 8MM SST PACKAGE CODE: LFP X 10MM (64 POSSIBLE 1mm BALL POSITIONS) Note: This package will be replaced by L1P which increases the ball size from 400-micron to 450-micron. Check with factory for migration schedule. ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 30 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet BOTTOM VIEW 10.00 ± 0.20 5.60 TOP VIEW 0.80 8 8 7 7 6 6 5.60 5 4 5 4 8.00 ± 0.20 3 3 2 2 1 1 0.80 H G F E D C B A A B C D E F G H A1 CORNER 0.45 ± 0.05 (56X) A1 CORNER 1.30 ± 0.10 SIDE VIEW 0.15 56ba-lfbga-L1P-8x10-450mic-ILL.1 SEATING PLANE 0.35 ± 0.05 1mm Note: 1. Although many dimensions are similar to those of JEDEC Publication 95, MO-210, this specific package is not registered. 2. All linear dimensions are in millimeters. 3. Coplanarity: 0.1 (±.05) mm. 4. The actual shape of the corners may be slightly different than as portrayed in the drawing. 56-BALL LOW-PROFILE, FINE-PITCH BALL GRID ARRAY (LFBGA) 8MM SST PACKAGE CODE: L1P ©2001 Silicon Storage Technology, Inc. X 10MM (64 POSSIBLE BALL POSITIONS) S71172-05-000 10/01 523 31 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory SST34HF1621 / SST34HF1641 Data Sheet Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036 www.SuperFlash.com or www.ssti.com ©2001 Silicon Storage Technology, Inc. S71172-05-000 10/01 523 32