TI SN74ABT377APW

SN54ABT377, SN74ABT377
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH CLOCK ENABLE
SCBS156B – FEBRUARY 1991 – REVISED JULY 1994
•
•
•
•
State-of-the-Art EPIC-ΙΙB  BiCMOS Design
Significantly Reduces Power Dissipation
Latch-Up Performance Exceeds 500 mA
Per JEDEC Standard JESD-17
Typical VOLP (Output Ground Bounce)
< 1 V at VCC = 5 V, TA = 25°C
High-Drive Outputs (– 32-mA IOH,
64-mA IOL )
Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, Ceramic
Chip Carriers (FK), and Plastic (N) and
Ceramic (J) DIPs
SN54ABT377 . . . J PACKAGE
SN74ABT377 . . . DB, DW, OR N PACKAGE
(TOP VIEW)
CLKEN
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
description
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
SN54ABT377 . . . FK PACKAGE
(TOP VIEW)
1D
1Q
CLKEN
VCC
The ′ABT377 are 8-bit positive-edge-triggered
D-type flip-flops with a clock (CLK) input. They are
particularly suitable for implementing buffer and
storage registers, shift registers, and pattern
generators.
2D
2Q
3Q
3D
4D
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
8D
7D
7Q
6Q
6D
4Q
GND
CLK
5Q
5D
Data (D) input information that meets the setup
time requirements is transferred to the Q outputs
on the positive-going edge of the clock pulse if the
common clock-enable (CLKEN) input is low. Clock
triggering occurs at a particular voltage level and
is not directly related to the transition time of the
positive-going pulse. When the buffered clock
(CLK) input is at either the high or low level, the
D input signal has no effect at the output. The
circuits are designed to prevent false clocking by
transitions at CLKEN.
8Q
•
The SN74ABT377 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count
and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54ABT377 is characterized for operation over the full military temperature range of – 55°C to 125°C. The
SN74ABT377 is characterized for operation from – 40°C to 85°C.
FUNCTION TABLE
(each flip-flop)
INPUTS
D
OUTPUT
Q
X
X
Q0
↑
H
H
CLKEN
CLK
H
L
L
↑
L
L
X
H or L
X
Q0
EPIC-ΙΙB is a trademark of Texas Instruments Incorporated.
Copyright  1994, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
2–1
SN54ABT377, SN74ABT377
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH CLOCK ENABLE
SCBS156B – FEBRUARY 1991 – REVISED JULY 1994
logic symbol†
CE
CLK
1D
2D
3D
4D
5D
6D
7D
8D
1
11
3
G1
1C2
2
2D
4
5
7
6
8
9
13
12
14
15
17
16
18
19
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
CLK
CLKEN
1D
11
1
3
1D
C1
To Seven Other Channels
2–2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
2
1Q
SN54ABT377, SN74ABT377
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH CLOCK ENABLE
SCBS156B – FEBRUARY 1991 – REVISED JULY 1994
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V
Voltage range applied to any output in the high state or power-off state, VO . . . . . . . . . . . . . – 0.5 V to 5.5 V
Current into any output in the low state, IO: SN54ABT377 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74ABT377 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 50 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . 0.6 W
DW package . . . . . . . . . . . . . . . . . . . 1.6 W
N package . . . . . . . . . . . . . . . . . . . . . 1.3 W
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils,
except for the N package, which has a trace length of zero. For more information, refer to the Package Thermal Considerations
application note in the 1994 ABT Advanced BiCMOS Technology Data Book, literature number SCBD002B.
recommended operating conditions (see Note 3)
SN54ABT377
SN74ABT377
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
IOH
IOL
High-level output current
VCC
– 24
Low-level output current
48
64
mA
∆t /∆v
Input transition rise or fall rate
5
5
ns / V
85
°C
High-level input voltage
2
2
0.8
Input voltage
0
TA
Operating free-air temperature
NOTE 3: Unused or floating inputs must be held high or low.
POST OFFICE BOX 655303
– 55
• DALLAS, TEXAS 75265
125
V
0.8
0
– 40
V
VCC
– 32
V
V
mA
2–3
SN54ABT377, SN74ABT377
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH CLOCK ENABLE
SCBS156B – FEBRUARY 1991 – REVISED JULY 1994
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V,
II = –18 mA
IOH = – 3 mA
VCC = 5 V,
VCC = 4
4.5
5V
MIN
TA = 25°C
TYP†
MAX
SN54ABT377
MIN
–1.2
MAX
SN74ABT377
MIN
–1.2
–1.2
2.5
2.5
2.5
IOH = – 3 mA
IOH = – 24 mA
3
3
3
2
2
IOH = – 32 mA
IOL = 48 mA
2*
VCC = 4
4.5
5V
II
Ioff
VCC = 5.5 V,
VCC = 0,
ICEX
IO‡
VCC = 5.5 V,
VCC = 5.5 V,
ICC
VCC = 5.5 V,,
IO = 0,,
VI = VCC or GND
∆ICC§
VCC = 5.5 V,
One input at 3.4 V,
Other inputs at VCC or GND
IOL = 64 mA
VI = VCC or GND
0.55*
VI or VO ≤ 4.5 V
VO = 5.5 V
±100
Outputs high
0.55
±1
50
– 50
V
V
0.55
±1
VO = 2.5 V
UNIT
2
0.55
VOL
MAX
50
– 50
–180
– 50
V
±1
µA
±100
µA
50
µA
–180
mA
–100
–180
Outputs high
1
250
250
250
µA
Outputs low
24
30
30
30
mA
1.5
1.5
1.5
mA
Ci
VI = 2.5 V or 0.5 V
3
* On products compliant to MIL-STD-883, Class B, this parameter does not apply.
† All typical values are at VCC = 5 V.
‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
§ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
pF
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
VCC = 5 V,
TA = 25°C
fclock
tw
Clock frequency
Pulse duration
tsu
Setup time before CLK↑
th
Hold time after CLK↑
SN54ABT377
MIN
MAX
0
150
MIN
MAX
0
150
SN74ABT377
MIN
MAX
0
150
CLK high or low
3.3
3.3
3.3
Data high or low
2
2.5
2
Data high or low
3
1.8¶
3
1.8¶
3
1.8¶
CLKEN high or low
1.8¶
1.8¶
1.8¶
CLKEN high or low
UNIT
MHz
ns
ns
ns
¶ This data sheet limit may vary among suppliers.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
PARAMETER
fmax
tPLH
tPHL
2–4
FROM
(INPUT)
TO
(OUTPUT)
VCC = 5 V,
TA = 25°C
MIN
SN54ABT377
TYP
MAX
2.2
4.5
6
2.2
7
2.2
6.5
3.1
5.3
6.8
2
7.6
3.1
7.3
150
CLK
Q
POST OFFICE BOX 655303
MIN
MAX
SN74ABT377
150
• DALLAS, TEXAS 75265
MIN
UNIT
MAX
150
MHz
ns
SN54ABT377, SN74ABT377
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH CLOCK ENABLE
SCBS156B – FEBRUARY 1991 – REVISED JULY 1994
PARAMETER MEASUREMENT INFORMATION
7V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
LOAD CIRCUIT FOR OUTPUTS
3V
Timing Input
1.5 V
0V
tw
tsu
3V
Input
1.5 V
th
3V
1.5 V
Data Input
1.5 V
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
Input
(see Note B)
1.5 V
0V
VOH
1.5 V
Output
1.5 V
VOL
VOH
Output
1.5 V
1.5 V
VOL
1.5 V
0V
tPLZ
Output
Waveform 1
S1 at 7 V
(see Note C)
tPLH
tPHL
1.5 V
tPZL
tPHL
tPLH
3V
Output
Control
1.5 V
Output
Waveform 2
S1 at Open
(see Note C)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
tPZH
3.5 V
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH – 0.3 V
VOH
[0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
2–5
SN54ABT377, SN74ABT377
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH CLOCK ENABLE
SCBS156B – FEBRUARY 1991 – REVISED JULY 1994
2–6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9314801Q2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
5962-9314801QRA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
1
Lead/Ball Finish
MSL Peak Temp (3)
5962-9314801QSA
ACTIVE
CFP
W
20
TBD
Call TI
Level-NC-NC-NC
SN74ABT377DBLE
OBSOLETE
SSOP
DB
20
TBD
Call TI
Call TI
SN74ABT377DW
OBSOLETE
SOIC
DW
20
TBD
Call TI
Call TI
SN74ABT377DWR
OBSOLETE
SOIC
DW
20
TBD
Call TI
Call TI
SN74ABT377N
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
SNJ54ABT377FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54ABT377J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54ABT377W
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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