TRIQUINT TQM7M4014

TQM 7M4014
3V Quad-Band GSM850/GSM900/DCS/PCS Power Amplifier Module
Package Outline:
Description:
TQS
Advanced quad-band, compact 3V power amplifier module
designed for mobile handset applications. The small size and
high performance is achieved with high-reliability InGaP HBT
technology. The module is fully integrated, providing a simple
50 Ohms interface on all input and output ports. It includes
internal closed-loop power control. No external matching or
bias components are required. Despite its very compact size,
the module has exceptional efficiency in all bands.
1.32±.10
6.9
2.4
3.1
3.9
4.5
5.3
5.9
9.9
9.1
8.4
8.5
7.6
6.9
6.1
5.4
4.6
3.9
3.1
2.4
1.5
1.6
0.9
0.1
Vcc2
4.0
1.6
0,0
Description:
DCS/PCS-in
1
Band select
2
16
Tx enable
3
15
V batt.
4
V reg.
5
13
V ramp
6
12
Cell/GSM in
7
20
19
18
14
ASIC
8
9
17
10
11
DCS/PCS-out
Vcc
Cell/GSM out
Vcc2
The module incorporates two highly-integrated InGaP power
amplifier die with a CMOS controller. Each amplifier has three
gain stages with on-die interstage matching implemented with
a high Q passives technology for optimal performance. The
CMOS controller implements a fully integrated closed-loop
power control within the module. This eliminates the need for
any external couplers, power detectors, current sensing etc.,
to assure the output power level. The latter is set directly from
the Vramp input from the DAC. The module has Tx enable and
band select inputs. Excellent performance is achieved across
the 824 – 849 MHz, 880 – 915 MHz, 1710 – 1785 MHz, and
1850 – 1910 MHz bands. Module construction is a low-profile
overmolded land-grid array on laminate.
0.9
1.6
0.9±.05
0.1
Features:
• Very compact size – 10×7×1.4 mm3.
• High efficiency – typical GSM850 47%,
GSM900 56%, DCS 51%, PCS 50%.
• Positive supply voltage – 2.9 to 4.5 V.
• 50 Ω input and output impedances.
• GPRS class 12 compatible.
• CMOS band select and internal closed-loop
power control.
• High-reliability InGaP technology.
• Ruggedness 10:1.
• Few external components.
7M4014
C352
0301
A213505
Dimensions in mm
Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (rev. 20040517)
All specifications subject to change without notice
2
Absolute Maximum Ratings:
Parameter
Symbol
Min.
Max.
Units
Vbat
Ibat
Vramp
δ
VSWR
Tc
-0.3
Vdc
-25
6.0
2.4
2.2
50
10:1
85
Ts
Pin
-55
150
ºC
11.5
dBm
Supply voltage
DC supply current
Power control voltage
Duty cycle at max. power
Output load
Operating case temperature
Storage temperature
Input power
-0.3
A
V
%
ºC
Note: The amplifier will survive over the full range specified for any individual input, while
other parameters are nominal and with no RF input.
Operating Parameters:
Parameter
Supply voltage
Supply current
Band select voltage
Txen High
GSM
DCS/PCS
Tx enable input
Low
Symbol
Min.
Typ.
Max.
Units
Vbat
2.9
3.5
4.5
Vdc
A
V
Ibat
Vbs-L
0
0.5
Vbs-H
Txen
2
3.0
0
0.5
V
2
2.7
3.0
2.9
V
High
Regulator voltage
Regulator current
Vreg
Txen Low
1.8
Ireg
Txen High
Leakage current
Txen Low, Vramp = 0.19V, BS=Low
Il
Leakage current
Txen Low, Vramp = 0.19V, BS=High
Il
2.8
µA
10
160
250
1
10
µA
40
µΑ
Moisture Sensitivity Levels:
Required Moisture Sensitivity Level is MSL 3, 240C minimum. Moisture sensitivity classification will
be conducted in accordance with JEDEC J_STD_020B. Table 5.1 of JEDEC J_STD_020B identifies
the floor life for given levels of MSL classification. Floor life is defined as the time from removal of a
device from dry pack until it absorbs sufficient moisture to be at risk during re-flow soldering.
Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (rev. 20040517)
All specifications subject to change without notice
3
Typical Performance:
GSM850 Electrical Characteristics:
Test conditions (unless noted): Vbat = +3.5 V, Vramp = 1.6 V, Pin = 2 dBm, Duty Cycle =25%, Tc = 25ºC
Parameter
Frequency Range
Input Power for Pout max.
Output Power
Symbol
Min.
f
824
Pin
0.0
33.0
2.0
34.5
31.0
32.6
47
Pout
Typ.
Max.
Units
849
MHz
5.0
dBm
dBm
Conditions
Vbat = 2.9 V, Pin = Pin min.
Tmin ≤ Tc ≤ Tmax
Power Added Efficiency
η
40
Power Control Voltage
Vramp
0.2
Power Control Current
Iramp
Power Control Range
33
Input VSWR
Forward Isolation
Harmonics
%
1.6
V
50
µA
36
dB
1.5:1
2.5:1
Iso
-45
-30
2f0
-23
-5.0
3f0
-20
-10.0
Ruggedness
Vramp min ≤ Vramp ≤ Vramp max
0 ≤ Pout ≤ 34.5 dBm
Txen = L, Pin ≤ Pin max
-10.0
> 3f0
Rx noise power:
869 - 879 MHz
879 - 894 MHz
Stability
dBm
dBm
Pout = Pout max.
-84
-85
-74.0
-82.0
8:1
10:1
dBm
RBW = 100 kHz
Pout > 5 dBm
All phase angles
Pout ≤ 34.2 dBm
All phase angles
Pout ≤ 34.2 dBm
Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (rev. 20040517)
All specifications subject to change without notice
4
GSM900 Electrical Characteristics:
Test conditions (unless noted): Vbat = +3.5 V, Vramp = 1.6 V, Pin = 2 dBm, Duty Cycle =25%, Tc = 25ºC
Parameter
Frequency Range
Input Power for Pout max.
Output Power
Symbol
Min.
Typ.
f
Pin
Pout
880
0.0
34.5
2.0
35.0
32.0
33.5
50
0.2
56
33
36
Max.
Units
915
5.0
MHz
dBm
dBm
Vbat = 2.9 V, Pin = Pin min.
Tmin ≤ Tc ≤ Tmax
Power Added Efficiency
Power Control Voltage
Power Control Current
Power Control Range
Input VSWR
Forward Isolation
Cross-band Isolation
η
Vramp
Iramp
Iso
Iso
-45
-21
Harmonics
2f0
3f0
> 3f0
-25
-28
-5.0
-15.0
-10.0
dBm
-83
-84
-74.0
-82.0
8:1
dBm
Rx noise power:
925 - 935 MHz
935 - 960 MHz
Stability
Ruggedness
Conditions
1.6
50
2.5:1
-30
-19
10:1
%
V
µA
dB
dBm
dBm
Pout = Pout max.
Vramp min ≤ Vramp ≤ Vramp max
0 ≤ Pout ≤ 34.5 dBm
Txen = L, Pin ≤ Pin max
Pin = Pin max., Vbs = Low
1710 ≤ f ≤ 1785 MHz
RBW = 100 kHz
Pout > 5 dBm
All phase angles
Pout ≤ 34.2 dBm
All phase angles
Pout ≤ 34.2 dBm
Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (rev. 20040517)
All specifications subject to change without notice
5
DCS1800/PCS1900 Electrical Characteristics:
Test conditions (unless noted): Vbat = +3.5 V, Vramp = 1.6 V, Pin = 2 dBm, Duty Cycle = 25%, Tc = 25ºC
Parameter
Frequency Range
Input Power for Pout max.
Output Power
Symbol
Min.
Typ.
Max.
Units
f
1710
1850
0.0
MHz
2.0
1785
1910
5.0
32.0
33.3
29.5
31.2
Pin
Pout
1710 - 1785 MHz
Conditions
dBm
dBm
Vbat = 2.9 V, Pin = Pin min.
Tmin ≤ Tc ≤ Tmax
1850 - 1910 MHz
31.5
32.5
29.5
30.6
Vbat = 2.9 V, Pin = Pin min.
Tmin ≤ Tc ≤ Tmax
Power Added Efficiency
1710 - 1785 MHz
1850 - 1910 MHz
Power Control Voltage
Power Control Current
Power Control Range
η
45
Vramp
Iramp
Iso
2f0
3f0
> 3f0
Rx noise power
Pout = Pout max.
Tc = 25°C
51
50
0.2
33
Input VSWR
Forward Isolation
Harmonics
%
1.6
50
36
2.0:1
2.5:1
-38
-30
-20
-20
-5.0
-5.0
-10.0
-83.0
-77.0
Stability
8:1
Ruggedness
10:1
V
µA
dB
dBm
dBm
dBm
Vramp min ≤ Vramp ≤ Vramp max
5 ≤ Pout ≤ Pout max
Txen = H, Pin ≤ Pin max
RBW = 100 kHz
Pin = Pin min., Pout = Pout max.
All phase angles
Pout ≤ 32 dBm
All phase angles
Pout ≤ 32 dBm
Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (rev. 20040517)
All specifications subject to change without notice
6
Pin Out:
Vcc2
Top view
DCS/PCS-in
1
Band select
2
16
Tx enable
3
15
V batt.
4
V reg.
5
13
V ramp
6
12
Cell/GSM in
7
20
19
18
ASIC
9
14
10
11
DCS/PCS-out
Vcc
Cell/GSM out
Vcc2
8
17
Pin
Symbol
RFin - DCS/PCS
1
Vbs
2
Txen
3
Vbat
4
Vreg
5
Vramp
6
RFin - Cell/GSM
7
Vcc2
8
RFout - Cell/GSM
11
Vcc
14
RFout - DCS/PCS
17
Vcc2
20
All other pins are ground
Description
DCS/PCS power in
Band select voltage
Transmit enable
Supply voltage
Regulated voltage input
DAC voltage input
GSM850/900 power in
Vcc voltage input
GSM850/900 power out
Vcc voltage output
DCS/PCS power out
Vcc voltage input
Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (rev. 20040517)
All specifications subject to change without notice
7
Schematic:
P-in DCS
/PCS
Input
Match
Interstage
Match
Interstage
Match
Output
Match
P-out DCS
/PCS
ESD
Bias
Network
Vbat
Vramp
Tx enable
Vreg
ASIC
Vbs
Bias
Network
ESD
P-in Cell
/GSM
Input
Match
Interstage
Match
Interstage
Match
Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (rev. 20040517)
All specifications subject to change without notice
Output
Match
P-out Cell
/GSM
8
Tape and Reel Information:
PIN 1
position
Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (rev. 20040517)
All specifications subject to change without notice
9