TDA8177F VERTICAL DEFLECTION BOOSTER FEATURES SUMMARY ■ POWER AMPLIFIER Figure 1. Package ■ THERMAL PROTECTION ■ OUTPUT CURRENT UP TO 3.0APP ■ FLYBACK VOLTAGE UP TO 70V (on Pin 5) ■ SUITABLE FOR DC COUPLING PPLICATION ■ EXTERNAL FLYBACK SUPPLY DESCRIPTION Designed for monitors and high performance TVs, the TDA8177F vertical deflection booster can handle flyback voltages of up to 70V. In addition, it is possible to have a flyback voltage which is more than the double that of the supply (Pin 2). This allows decreasing power consumption or decreasing the flyback time for a given supply voltage. The TDA8177F operates with supplies of up to 35V and outputs up to 3APP to drive the yoke. The TDA8177F is offered in HEPTAWATT package. HEPTAWATT (Plastic Package) Figure 2. Pin Connections 7 6 5 4 3 2 1 NON-INVERTING INPUT OUTPUT STAGE SUPPLY OUTPUT GROUND FLYBACK SUPPLY SUPPLY VOLTAGE INVERTING INPUT Tab connected to Pin 4 Rev. 2 March 2005 1/9 TDA8177F Figure 3. Block Diagram OUTPUT SUPPLY STAGE VOLTAGE SUPPLY 2 INVERTING INPUT 1 FLYBACK SUPPLY 6 3 POWER AMPLIFIER 5 OUTPUT 7 NON-INVERTING INPUT THERMAL PROTECTION TDA8177F 4 GROUND Table 1. Absolute Maximum Ratings Symbol Value Unit VS Supply Voltage (Pin 2) (see note 1) 40 V V6 Flyback Peak Voltage (Pin 6) (see note 1) 75 V –0.3, +VS V V1, V7 Amplifier Input Voltage (Pins 1-7) (see note 1) IO Maximum Output Peak Current (see notes 2 and 3) 2.5 A I3 Maximum Sink Current (< 1ms) 2.5 A I3 Maximum Source Current (t < 1ms) (in the diode, see Block Diagram) 2.5 A VESD1 ESD Susceptibility Tool Model (see note 4) 300 V VESD2 Human Model (see note 5) 2 kV V3 - V2 Voltage Difference between Flyback Supply and Supply Voltage 50 V –0.4 V V3, V5, V6 Min. Voltage (see note 1) TOPER Operating Ambient Temperature –20, +75 °C TSTG, Storage Temperature –40, +150 °C Tj Junction Temperature +150 °C Note: 1. 2. 3. 4. 5. 2/9 Parameter Versus Pin 4. The output current can reach 4A peak for t ≤10µs (up to 120Hz). Provided SOAR is respected (see Figures 6 and 7). Equivalent to discharging a 200pF capacitor through a 0kΩ series resistor. Equivalent to discharging a 150pF capacitor through a 1.5kΩ series resistor. TDA8177F Table 2. Thermal Data Symbol Value Unit 3 °C/W Temperature for Thermal Shutdown 150 °C ∆Tt Hysteresis on Tt 10 °C Tjr Recommended Max. Junction Temperature 120 °C Rth (j-c) Tt Parameter Junction-case Thermal Resistance Max Table 3. Electrical Characteristics (VS = 35V, TA = 25°C, unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Unit VS Operating Supply Voltage Range 10 35 V V3M Operating Flyback Supply Voltage VS 70 V I2 Pin 2 Quiescent Current I3 = 0, I5 = 0 10 20 mA I6 Pin 6 Quiescent Current I3 = 0, I5 = 0 25 35 mA IO Max. Scanning Peak Output Current 1.5 A I1 Amplifier Bias Current V1 = 20V, V7 = 21V – 0.4 –2 µA I7 Amplifier Bias Current V1 = 21V, V7 = 20V – 0.4 –2 µA 0 7 mV VIO ∆VIO /dt Offset Voltage Offset Drift versus Temperature – 10 µV/°C GV Voltage Gain V5L Output Saturation Voltage to GND (Pin 4) I5 = 1.5A 1.0 2 V V5H Output Saturation Voltage to Supply (Pin 6) I5 = - 1.5A 1.7 2.5 V VD5 - 6 Diode Forward Voltage between Pins 5-6 I5 = 1.5A 1.5 2.1 V VD3 - 6 Diode Forward Voltage between Pins 3-6 I3 = 1.5A 2.3 3 V Voltage Drop between Pins 3-6 (2nd part of flyback) I3 = - 1.A 4 5 V V3-6 80 dB 3/9 TDA8177F APPLICATION CIRCUITS Figure 4. AC Coupling + VS Flyback Supply 2 6 3 +VS R5 1 POWER AMPLIFIER TDA8177F 4 R3 R2 R4 CL R1 4/9 YOKE THERMAL PROTECTION VREF 2.2V 330Ω 0.47µF 1.5Ω 7 5 TDA8177F Figure 5. DC Coupling + VS Flyback Supply 2 6 3 +VS R5 1 POWER POWER AMPLIFIER AMPLIFIER TDA8177F VREF- 4 YOKE POWER AMPLIFIER 330Ω 7 5 0.47µF 1.5Ω VREF+ Vertical Position Adjustment -VEE R2 R1 Figure 6. Output Transistors SOA (for secondary breakdown) Figure 7. Secondary Breakdown Temperature Derating Curve (ISB = secondary breakdown current) IC (A) 10 ISB (%) @ Tcase = 25˚C 100 1 90 80 10-1 t = 1ms t = 10ms t = 100ms 70 VCE (V) 10-2 1 10 102 Tcase (C˚) 60 25 50 75 100 125 5/9 TDA8177F PART NUMBERING Table 4. Order Codes 6/9 Part Number Package Temperature Range TDA8177F HEPTAWATT7 -25 to 85°C TDA8177F PACKAGE MECHANICAL DATA Table 5. Heptawatt7 - Mechanical Data Symbol A C D D1 E F F1 G G1 G2 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia. Min millimeters Typ 2.4 1.2 0.35 0.6 2.41 4.91 7.49 2.54 5.08 7.62 10.05 Max 4.8 1.37 2.8 1.35 0.55 0.8 0.9 2.67 5.21 7.8 10.4 10.4 Min 0.094 0.047 0.014 0.024 0.095 0.193 0.295 Max 0.189 0.054 0.110 0.053 0.022 0.031 0.035 0.105 0.205 0.307 0.409 0.409 0.668 0.587 0.848 0.891 3 15.8 6.6 0.102 0.594 0.236 2.8 5.08 3.65 0.100 0.200 0.300 0.396 16.97 14.92 21.54 22.62 2.6 15.1 6 inches Typ 0.118 0.622 0.260 0.110 0.200 3.85 0.144 0.152 Figure 8. Heptawatt7 - Package Dimensions Note: Drawing is not to scale 7/9 TDA8177F REVISION HISTORY Table 6. Revision History 8/9 Date Revision Description of Changes December-1998 1 First Issue 29-Mar-2005 2 Stylesheet update. No content change. TDA8177F Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 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