WINBOND W78LE51-24

Preliminary W78LE51
8-BIT MTP MICROCONTROLLER
GENERAL DESCRIPTION
The W78LE51 is an 8-bit microcontroller which can accommodate a wide supply voltage range with
low power consumption. The instruction set for the W78LE51 is fully compatible with the standard
8051. The W78LE51 contains an 4K bytes MTP ROM (Multiple-Time Programmable ROM); a 128
bytes RAM; four 8-bit bi-directional and bit-addressable I/O ports; an additional 4-bit I/O port P4; two
16-bit timer/counters; a hardware watchdog timer and a serial port. These peripherals are supported
by seven sources two-level interrupt capability. To facilitate programming and verification, the MTPROM inside the W78LE51 allows the program memory to be programmed and read electronically.
Once the code is confirmed, the user can protect the code for security.
The W78LE51 microcontroller has two power reduction modes, idle mode and power-down mode,
both of which are software selectable. The idle mode turns off the processor clock but allows for
continued peripheral operation. The power-down mode stops the crystal oscillator for minimum power
consumption. The external clock can be stopped at any time and in any state without affecting the
processor.
FEATURES
• Fully static design 8-bit CMOS microcontroller
• Wide supply voltage of 2.4V to 5.5V
• 128 bytes of on-chip scratchpad RAM
• 4 KB electrically erasable/programmable MTP-ROM
• 64 KB program memory address space
• 64 KB data memory address space
• Four 8-bit bi-directional ports
• One extra 4-bit bit-addressable I/O port, additional INT2 / INT3
(available on 44-pin PLCC/QFP package)
• Two 16-bit timer/counters
• One full duplex serial port(UART)
• Watchdog Timer
• seven sources, two-level interrupt capability
• EMI reduction mode
• Built-in power management
• Code protection mechanism
• Packages:
− DIP 40: W78LE51-24
− PLCC 44: W78LE51P-24
− PQFP 44: W78LE51F-24
-1-
Publication Release Date: December 1998
Revision A1
Preliminary W78LE51
PIN CONFIGURATIONS
40-Pin DIP (W78LE51)
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5
P1.6
P1.7
RST
RXD, P3.0
TXD, P3.1
INT0, P3.2
INT1, P3.3
T0, P3.4
T1, P3.5
WR, P3.6
RD, P3.7
XTAL2
XTAL1
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
44-Pin PLCC (W78LE51P)
/
I
A
N
D
T
0
3
,
,
P P P P P P
P
1 1 1 1 1 4 V 0
. . . . . . D .
4 3 2 1 0 2 D 0
P1.5
P1.6
P1.7
RST
RXD, P3.0
INT2, P4.3
TXD, P3.1
INT0, P3.2
INT1, P3.3
T0, P3.4
T1, P3.5
A
D
1
,
P
0
.
1
P
3
.
7
,
/
R
D
X
T
A
L
2
X V P P
T S 4 2
A S . .
L
0 0
1
,
A
8
P
2
.
1
,
A
9
P
2
.
2
,
A
1
0
P0.0, AD0
P0.1, AD1
P0.2, AD2
P0.3, AD3
P0.4, AD4
P0.5, AD5
P0.6, AD6
P0.7, AD7
EA
ALE
PSEN
P2.7, A15
P2.6, A14
P2.5, A13
P2.4, A12
P2.3, A11
P2.2, A10
P2.1, A9
P2.0, A8
44-Pin QFP (W78LE51F)
A
D
2
,
P
0
.
2
P
2
.
3
,
A
1
1
/
I
A
N
D
T
0
3
,
,
P P P P P P
P
1 1 1 1 1 4 V 0
. . . . . . D .
4 3 2 1 0 2 D 0
A
D
3
,
P
0
.
3
6 5 4 3 2 1 44 43 42 41 40
7
39
8
38
9
37
10
36
11
35
12
34
13
33
14
32
15
31
16
30
17
29
18 19 20 21 22 23 24 25 26 27 28
P
3
.
6
,
/
W
R
VDD
ALE
P1.5
P1.6
P1.7
RST
RXD, P3.0
INT2, P4.3
TXD, P3.1
PSEN
P2.7, A15
P2.6, A14
P2.5, A13
INT1, P3.3
T0, P3.4
T1, P3.5
P0.4, AD4
P0.5, AD5
P0.6, AD6
P0.7, AD7
EA
P4.1
INT0, P3.2
P
2
.
4
,
A
1
2
A
D
2
,
P
0
.
2
A
D
3
,
P
0
.
3
44 43 42 41 40 39 38 37 36 35 34
33
32
31
3
30
4
29
5
28
6
27
7
8
26
9
25
10
24
11
23
12 13 14 15 16 17 18 19 20 21 22
1
2
P
3
.
6
,
/
W
R
-2-
A
D
1
,
P
0
.
1
P
3
.
7
,
/
R
D
X
T
A
L
2
X V P P
T S 4 2
A S . .
L
0 0
,
1
A
8
P
2
.
1
,
A
9
P
2
.
2
,
A
1
0
P
2
.
3
,
A
1
1
P
2
.
4
,
A
1
2
P0.4, AD4
P0.5, AD5
P0.6, AD6
P0.7, AD7
EA
P4.1
ALE
PSEN
P2.7, A15
P2.6, A14
P2.5, A13
Preliminary W78LE51
PIN DESCRIPTION
SYMBOL
EA
PSEN
ALE
RST
XTAL1
XTAL2
VSS
VDD
P0.0−P0.7
P1.0−P1.7
P2.0−P2.7
P3.0−P3.7
DESCRIPTIONS
EXTERNAL ACCESS ENABLE: This pin forces the processor to execute out of
external ROM. It should be kept high to access internal ROM. The ROM address and
data will not be presented on the bus if EA pin is high and the program counter is
within on-chip ROM area.
PROGRAM STORE ENABLE: PSEN enables the external ROM data onto the Port 0
address/ data bus during fetch and MOVC operations. When internal ROM access is
performed, no PSEN strobe signal outputs from this pin.
ADDRESS LATCH ENABLE: ALE is used to enable the address latch that separates
the address from the data on Port 0.
RESET: A high on this pin for two machine cycles while the oscillator is running resets
the device.
CRYSTAL1: This is the crystal oscillator input. This pin may be driven by an external
clock.
CRYSTAL2: This is the crystal oscillator output. It is the inversion of XTAL1.
GROUND: Ground potential
POWER SUPPLY: Supply voltage for operation.
PORT 0: Port 0 is a bi-directional I/O port which also provides a multiplexed low order
address/data bus during accesses to external memory. The pins of Port 0 can be
individually configured to open-drain or standard port with internal pull-ups.
PORT 1: Port 1 is a bi-directional I/O port with internal pull-ups. The bits have
alternate functions which are described below:
T2(P1.0): Timer/Counter 2 external count input
T2EX(P1.1): Timer/Counter 2 Reload/Capture control
PORT 2: Port 2 is a bi-directional I/O port with internal pull-ups. This port also provides
the upper address bits for accesses to external memory.
PORT 3: Port 3 is a bi-directional I/O port with internal pull-ups. All bits have alternate
functions, which are described below:
RXD(P3.0) : Serial Port receiver input
TXD(P3.1) : Serial Port transmitter output
INT0 (P3.2) : External Interrupt 0
INT1 (P3.3) : External Interrupt 1
T0(P3.4) : Timer 0 External Input
T1(P3.5) : Timer 1 External Input
WR (P3.6) :External Data Memory Write Strobe
RD (P3.7) : External Data Memory Read Strobe
P4.0−P4.3
PORT 4: Another bit-addressable bidirectional I/O port P4. P4.3 and P4.2 are
alternative function pins. It can be used as general I/O port or external interrupt input
sources ( INT2 / INT3 ).
-3-
Publication Release Date: December 1998
Revision A1
Preliminary W78LE51
BLOCK DIAGRAM
P1.0
~
P1.7
Port
1
Port 1
Latch
B
ACC
INT2
Port 0
Latch
Interrupt
INT3
T2
T1
Port
0
P0.0
~
P0.7
Port
2
P2.0
~
P2.7
DPTR
Timer
0
Stack
Pointer
PSW
ALU
Temp Reg.
Timer
1
PC
Incrementor
UART
Addr. Reg.
P3.0
~
P3.7
Port
3
Port 3
Latch
SFR RAM
Address
Instruction
Decoder
&
Sequencer
128 bytes
RAM & SFR
ROM
Port 2
Latch
Bus & Clock
Controller
P4.0
~
P4.3
Port
4
Port 4
Latch
Watchdog
Timer
Oscillator
Reset Block
XTAL1 XTAL2 ALE PSEN
RST
Power control
VDD
Vss
FUNCTIONAL DESCRIPTION
The W78LE51 architecture consists of a core controller surrounded by various registers, five general
purpose I/O ports, 128 bytes of RAM, two timer/counters, and a serial port. The processor supports
111 different opcodes and references both a 64K program address space and a 64K data storage
space.
New Defined Peripheral
In order to be more suitable for I/O, an extra 4-bit bit-addressable port P4 and two external interrupt
INT2 , INT3 has been added to either the PLCC or QFP 44 pin package. And description follows:
1. INT2 / INT3
Two additional external interrupts, INT2 and INT3 , whose functions are similar to those of external
interrupt 0 and 1 in the standard 80C52. The functions/status of these interrupts are determined/
shown by the bits in the XICON (External Interrupt Control) register. The XICON register is bit-
-4-
Preliminary W78LE51
addressable but is not a standard register in the standard 80C52. Its address is at 0C0H. To set/clear
bits in the XICON register, one can use the "SETB (/CLR) bit" instruction. For example, "SETB 0C2H"
sets the EX2 bit of XICON.
XICON - external interrupt control (C0H)
PX3
PX3:
EX3:
IE3:
IT3:
PX2:
EX2:
IE2:
IT2:
EX3
IE3
IT3
PX2
EX2
IE2
IT2
External interrupt 3 priority high if set
External interrupt 3 enable if set
If IT3 = 1, IE3 is set/cleared automatically by hardware when interrupt is detected/serviced
External interrupt 3 is falling-edge/low-level triggered when this bit is set/cleared by software
External interrupt 2 priority high if set
External interrupt 2 enable if set
If IT2 = 1, IE2 is set/cleared automatically by hardware when interrupt is detected/serviced
External interrupt 2 is falling-edge/low-level triggered when this bit is set/cleared by software
Eight-source interrupt informations:
INTERRUPT
SOURCE
VECTOR
ADDRESS
External Interrupt 0
Timer/Counter 0
External Interrupt 1
Timer/Counter 1
Serial Port
External Interrupt 2
External Interrupt 3
03H
0BH
13H
1BH
23H
33H
3BH
POLLING
SEQUENCE WITHIN
PRIORITY LEVEL
0 (highest)
1
2
3
4
5
6 (lowest)
ENABLE
REQUIRED
SETTINGS
IE.0
IE.1
IE.2
IE.3
IE.4
XICON.2
XICON.6
INTERRUPT
TYPE
EDGE/LEVEL
TCON.0
TCON.2
XICON.0
XICON.3
2. PORT4
Another bit-addressable port P4 is also available and only 4 bits (P4<3:0>) can be used. This port
address is located at 0D8H with the same function as that of port P1, except the P4.3 and P4.2 are
alternative function pins. It can be used as general I/O pins or external interrupt input sources ( INT2 ,
INT3 ).
Example:
P4
MOV
MOV
SETB
CLR
REG 0D8H
P4, #0AH
; Output data "A" through P4.0−P4.3.
A, P4
; Read P4 status to Accumulator.
P4.0
; Set bit P4.0
P4.1
; Clear bit P4.1
3. Reduce EMI Emission
Because of on-chip MTP-ROM, when a program is running in internal ROM space, the ALE will be
unused. The transition of ALE will cause noise, so it can be turned off to reduce the EMI emission if it
-5-
Publication Release Date: December 1998
Revision A1
Preliminary W78LE51
is useless. Turning off the ALE signal transition only requires setting the bit 0 of the AUXR SFR,
which is located at 08Eh. When ALE is turned off, it will be reactivated when the program accesses
external ROM/RAM data or jumps to execute an external ROM code. The ALE signal will turn off
again after it has been completely accessed or the program returns to internal ROM code space. The
AO bit in the AUXR register, when set, disables the ALE output. In order to reduce EMI emission from
oscillation circuitry, W78LE51 allows user to diminish the gain of on-chip oscillator amplifiers by using
programmer to clear the B7 bit of security register. Once B7 is set to 0, a half of gain will be
decreased. Care must be taken if user attempts to diminish the gain of oscillator amplifier, reducing a
half of gain may effect to external crystal operating improperly at high frequency above 24 MHz. The
value of R and C1,C2 may need some adjustment while running at lower gain.
***AUXR - Auxiliary register (8EH)
-
-
-
-
-
-
-
AO
POF
GF1
GF0
PD
IDL
AO: Turn off ALE output.
4. Power-off Flag
***PCON - Power control (87H)
-
-
-
POF:
Power off flag. Bit is set by hardware when power on reset. It can be cleared by software
to determine chip reset is a warm boot or cold boot.
GF1, GF0: These two bits are general-purpose flag bits for the user.
PD:
Power down mode bit. Set it to enter power down mode.
IDL:
Idle mode bit. Set it to enter idle mode.
The power-off flag is located at PCON.4. This bit is set when VDD has been applied to the part. It can
be used to determine if a reset is a warm boot or a cold boot if it is subsequently reset by software.
Watchdog Timer
The Watchdog timer is a free-running timer which can be programmed by the user to serve as a
system monitor, a time-base generator or an event timer. It is basically a set of dividers that divide
the system clock. The divider output is selectable and determines the time-out interval. When the
time-out occurs a system reset can also be caused if it is enabled. The main use of the Watchdog
timer is as a system monitor. This is important in real-time control applications. In case of power
glitches or electro-magnetic interference, the processor may begin to execute errant code. If this is
left unchecked the entire system may crash. The watchdog time-out selection will result in different
time-out values depending on the clock speed. The Watchdog timer will de disabled on reset. In
general, software should restart the Watchdog timer to put it into a known state. The control bits that
support the Watchdog timer are discussed below.
Watchdog Timer Control Register
Bit:
7
ENW
6
CLRW
5
WIDL
Mnemonic: WDTC
ENW : Enable watch-dog if set.
-6-
4
-
3
-
Address: 8FH
2
PS2
1
PS1
0
PS0
Preliminary W78LE51
CLRW: Clear watch-dog timer and prescaler if set. This flag will be cleared automatically
WIDL : If this bit is set, watch-dog is enabled under IDLE mode. If cleared, watch-dog is disabled
under IDLE mode. Default is cleared.
PS2, PS1, PS0: Watch-dog prescaler timer select. Prescaler is selected when set PS2−0 as follows:
PS2 PS1 PS0
PRESCALER SELECT
0
0
0
0
1
0
1
0
1
0
0
0
1
1
0
2
4
8
16
32
1
1
1
0
1
1
1
0
1
64
128
256
The time-out period is obtained using the following equation:
1
× 2 14 × PRESCALER × 1000 × 12 mS
OSC
Before Watchdog time-out occurs, the program must clear the 14-bit timer by writing 1 to WDTC.6
(CLRW). After 1 is written to this bit, the 14-bit timer , prescaler and this bit will be reset on the next
instruction cycle. The Watchdog timer is cleared on reset.
ENW
WIDL
IDLE
EXTERNAL
RESET
OSC
PRESCALER
1/12
14-BIT TIMER
INTERNAL
RESET
CLEAR
CLRW
Watchdog Timer Block Diagram
Typical Watch-Dog time-out period when OSC = 20 MHz
PS2 PS1 PS0
0
0
0
0
0
1
0
1
WATCHDOG TIME-OUT PERIOD
0
0
1
1
19.66 mS
39.32 mS
78.64 mS
157.28 mS
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Publication Release Date: December 1998
Revision A1
Preliminary W78LE51
Continued
PS2 PS1 PS0
WATCHDOG TIME-OUT PERIOD
1
1
0
0
0
1
314.57mS
629.14 mS
1
1
1
1
0
1
1.25 S
2.50 S
Clock
The W78LE51 is designed to be used with either a crystal oscillator or an external clock. Internally,
the clock is divided by two before it is used. This makes the W78LE51 relatively insensitive to duty
cycle variations in the clock. The W78LE51 incorporates a built-in crystal oscillator. To make the
oscillator work, a crystal must be connected across pins XTAL1 and XTAL2. In addition, a load
capacitor must be connected from each pin to ground. An external clock source should be connected
to pin XTAL1. Pin XTAL2 should be left unconnected. The XTAL1 input is a CMOS-type input, as
required by the crystal oscillator.
Power Management
Idle Mode
The idle mode is entered by setting the IDL bit in the PCON register. In the idle mode, the internal
clock to the processor is stopped. The peripherals and the interrupt logic continue to be clocked. The
processor will exit idle mode when either an interrupt or a reset occurs.
Power-down Mode
When the PD bit of the PCON register is set, the processor enters the power-down mode. In this
mode all of the clocks are stopped, including the oscillator. The only way to exit power-down mode is
by a reset.
Reset
The external RESET signal is sampled at S5P2. To take effect, it must be held high for at least two
machine cycles while the oscillator is running. An internal trigger circuit in the reset line is used to
deglitch the reset line when the W78LE51 is used with an external RC network. The reset logic also
has a special glitch removal circuit that ignores glitches on the reset line.
During reset, the ports are initialized to FFH, the stack pointer to 07H, PCON (with the exception of
bit 4) to 00H, and all of the other SFR registers except SBUF to 00H. SBUF is not reset.
ON-CHIP MTP ROM CHARACTERISTICS
The W78LE51 has several modes to program the on-chip MTP-ROM. All these operations are
configured by the pins RST, ALE, PSEN , A9CTRL(P3.0), A13CTRL(P3.1), A14CTRL(P3.2),
OECTRL(P3.3), CE (P3.6), OE (P3.7), A0(P1.0) and VPP( EA ). Moreover, the A15−A0(P2.7−P2.0,
P1.7−P1.0) and the D7−D0(P0.7−P0.0) serve as the address and data bus respectively for these
operations.
Read Operation
This operation is supported for customer to read their code and the Security bits. The data will not be
valid if the Lock bit is programmed to low.
-8-
Preliminary W78LE51
Output Disable Condition
When the OE is set to high, no data output appears on the D7..D0.
Program Operation
This operation is used to program the data to MTP ROM and the security bits. Program operation is
done when the Vpp is reach to Vcp (12.5V) level, CE set to low, and OE set to high.
Program Verify Operation
All the programming data must be checked after program operations. This operation should be
performed after each byte is programmed; it will ensure a substantial program margin.
Erase Operation
An erase operation is the only way to change data from 0 to 1. This operation will erase all the MTP
ROM cells and the security bits from 0 to 1. This erase operation is done when the Vpp is reach to
Vep level, CE set to low, and OE set to high.
Erase Verify Operation
After an erase operation, all of the bytes in the chip must be verified to check whether they have been
successfully erased to 1 or not. The erase verify operation automatically ensures a substantial erase
margin. This operation will be done after the erase operation if Vpp = Vep(14.5V), CE is high and
OE is low.
Program/Erase Inhibit Operation
This operation allows parallel erasing or programming of multiple chips with different data. When
P3.6( CE ) = VIH, P3.7( OE ) = VIH, erasing or programming of non-targeted chips is inhibited. So,
except for the P3.6 and P3.7 pins, the individual chips may have common inputs.
Company/Device ID Read Operation
This operation is supported for MTP ROM programmer to get the company ID or device ID on the
W78LE51.
OPERATIONS P3.0
P3.1
P3.2
P3.3
P3.6
P3.7
(A9
(A13
(A14
(OE
( CE )
( OE )
EA
P2,P1
P0
NOTE
(VPP) (A15..A0) (D7..D0)
CTRL) CTRL) CTRL) CTRL)
Read
0
0
0
0
0
0
1
Address
Data Out
Output Disable
0
0
0
0
0
1
1
X
Hi-Z
Program
0
0
0
0
0
1
VCP
Address
Data In
Program Verify
0
0
0
0
1
0
VCP
Address
Data Out
@3
Erase
1
0
0
0
0
1
VEP
A0:0,
others: X
Data In
@4
Address
Data Out
Erase Verify
1
0
0
0
1
-9-
0
VEP
0FFH
@5
Publication Release Date: December 1998
Revision A1
Preliminary W78LE51
Continued
OPERATIONS P3.0
P3.1
P3.2
P3.3
P3.6
P3.7
(A9
(A13
(A14
(OE
( CE )
( OE )
EA
P2,P1
P0
NOTE
(VPP) (A15..A0) (D7..D0)
CTRL) CTRL) CTRL) CTRL)
Program/Erase
Inhibit
X
0
0
0
1
1
VCP/
VEP
X
X
Company ID
1
0
0
0
0
0
1
A0 = 0
Data Out
Device ID
1
0
0
0
0
0
1
A0 = 1
Data Out
Notes:
1. All these operations happen in RST = VIH, ALE = VIL and PSEN = VIH.
2. VCP = 12.5V, VEP = 14.5V, VIH = VDD, VIL = Vss.
3. The program verify operation follows behind the program operation.
4. This erase operation will erase all the on-chip MTP-ROM cells and the Security bits.
5. The erase verify operation follows behind the erase operation.
SECURITY BITS
During the on-chip MTP-ROM operation mode, the MTP-ROM can be programmed and verified
repeatedly. Until the code inside the MTP-ROM is confirmed OK, the code can be protected. The
protection of MTP ROM and those operations on it are described below. The W78LE51 has several
Special Setting Registers, including the Security Register and Company/Device ID Registers, which
can not be accessed in normal mode. These registers can only be accessed from the MTP-ROM
operation mode. Those bits of the Security Registers can not be changed once they have been
programmed from high to low. They can only be reset through erase-all operation. The contents of the
Company ID and Device ID registers have been set in factory. Both registers are addressed by the A0
address line during the same specific condition. The Security Register is addressed in the MTP-ROM
operation mode by address #0FFFFh.
D7 D6 D5 D4 D3 D2 D1 D0
1
1
0
1
1
0
1
0
Company ID (#DAH)
1
1
1
0 0
0
0
0
Device ID (#E0H)
B7
Reserved
B2 B1 B0
4KB MTP ROM
0000h
Program Memory
0FFFh
Security Bits
Reserved
B0 : Lock bit, logic 0 : active
B1 : MOVC inhibit,
logic 0 : the MOVC instruction in external memory
cannot access the code in internal memory.
logic 1 : no restriction.
B2 : Encryption
logic 0 : the encryption logic enable
logic 1 : the encryption logic disable
Security Register
B7 : Osillator Control
logic 0 : 1/2 gain
logic 1 : Full gain
Default 1 for all security bits.
Reserved bits must be kept in logic 1.
Special Setting Registers
- 10 -
0FFFFh
Preliminary W78LE51
Lock bit
This bit is used to protect the customer's program code in the W78LE51. It may be set after the
programmer finishes the programming and verifies sequence. Once this bit is set to logic 0, both the
MTP ROM data and Special Setting Registers can not be accessed again.
MOVC Inhibit
This bit is used to restrict the accessible region of the MOVC instruction. It can prevent the MOVC
instruction in external program memory from reading the internal program code. When this bit is set
to logic 0, a MOVC instruction in external program memory space will be able to access code only in
the external memory, not in the internal memory. A MOVC instruction in internal program memory
space will always be able to access the ROM data in both internal and external memory. If this bit is
logic 1, there are no restrictions on the MOVC instruction.
Encryption
This bit is used to enable/disable the encryption logic for code protection. Once encryption feature is
enabled, the data presented on port 0 will be encoded via encryption logic. Only whole chip erase will
reset this bit.
+5V
+5V
VDD
A0 to A7
P1
VIL
P3.0
VIL
P3.1
VIL
P3.2
VIL
VIL
P3.3
P0
EA/Vpp
P3.7
X'tal1
VIL
RST
VIH
PSEN
VIH
P2
A0 to A7
VCP
ALE
P3.6
VIH
VDD
PGM DATA
P1
VIL
P3.0
VIL
P3.1
VIL
VIL
P3.2
VIH
P3.6
VIL
P3.7
P3.3
X'tal1
A8 to A15
X'tal2
X'tal2
Vss
Vss
Programming Configuration
PGM DATA
P0
EA/Vpp
VCP
ALE
VIL
RST
VIH
PSEN
VIH
A8 to A15
P2
Programming Verification
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
MIN.
MAX.
UNIT
VDD−VSS
-0.3
+7.0
V
Input Voltage
VIN
VSS -0.3
VDD +0.3
V
Operating Temperature
TA
0
70
°C
Storage Temperature
TST
-55
+150
°C
DC Power Supply
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the
device.
- 11 -
Publication Release Date: December 1998
Revision A1
Preliminary W78LE51
DC CHARACTERISTICS
VSS = 0V, TA = 25° C, unless otherwise specified.
PARAMETER
SYM.
20
3
6
1.5
50
mA
mA
mA
mA
µA
No load VDD = 5.5V
No load VDD = 2.4V
VDD = 5.5V, Fosc = 20 MHz
VDD = 2.4V, Fosc = 12 MHz
VDD = 5.5V, Fosc = 20 MHz
-
20
µA
VDD = 2.4V, Fosc = 12 MHz
IIN1
-50
+10
µA
IIN2
-10
+300
µA
ILK
-10
+10
µA
VDD = 5.5V
VIN = 0V or VDD
VDD = 5.5V
0 < VIN < VDD
VDD = 5.5V
0V < VIN < VDD
ITL
[*4]
-500
-
µA
VDD = 5.5V
VIN = 2.0V
VIL1
0
0
0.8
0.5
V
V
VDD = 4.5V
VDD = 2.4V
VIL2
0
0
0
0
2.4
1.4
0.8
0.3
0.8
0.6
VDD +0.2
VDD +0.2
V
V
V
V
V
V
VDD = 4.5V
VDD = 2.4V
VDD = 4.5V
VDD = 2.4V
VDD = 5.5V
VDD = 2.4V
3.5
1.7
3.5
1.6
-
VDD +0.2
VDD +0.2
VDD +0.2
VDD +0.2
0.45
0.25
0.45
0.25
V
V
V
V
V
V
V
V
VDD = 5.5V
VDD = 2.4V
VDD = 5.5V
VDD = 2.4V
VDD = 4.5V, IOL = +2 mA
VDD = 2.4V, IOL = +1 mA
VDD = 4.5V, IOL = +4 mA
VDD = 2.4V, IOL = +2 mA
4
1.8
12
5.4
mA
mA
VDD = 4.5V, Vin = 0.45V
VDD = 2.4V, Vin = 0.45V
Operating Current
IDD
Idle Current
IIDLE
P0, EA
Logic 1 to 0 Transition
Current
P1, P2, P3, P4
Input Low Voltage
P0, P1, P2, P3, P4, EA
Input Low Voltage
RST[*1]
Input Low Voltage
XTAL1 [*3]
Input High Voltage
P0, P1, P2, P3, P4, EA
Input High Voltage
RST[*1]
Input High Voltage
XTAL1 [*3]
Output Low Voltage
P1, P2, P3, P4
Output Low Voltage
IPWDN
VIL3
VIH1
VIH2
VIH3
VOL1
VOL2
P0, ALE, PSEN [*2]
Sink Current
P1, P2, P3, P4
TEST CONDITIONS
-
VDD
Input Current
P1, P2, P3, P4
Input Current
RST
Input Leakage Current
UNIT
MAX.
5.5
Operating Voltage
Power Down Current
SPECIFICATION
MIN.
2.4
ISK1
- 12 -
V
Preliminary W78LE51
DC Characteristics, continued
PARAMETER
SYM.
Sink Current
ISK2
P0, ALE, PSEN
Output High Voltage
P1, P2, P3, P4
Output High Voltage
SPECIFICATION
MIN.
8
4.5
MAX.
16
9
mA
mA
2.4
1.4
2.4
1.4
-
V
V
V
V
-100
-20
-8
-1.9
-250
-50
-14
-3.8
µA
µA
mA
mA
VOH1
VOH2
P0, ALE, PSEN [*2]
Source Current
P1, P2, P3, P4
Source Current
ISR1
ISR2
P0, ALE, PSEN
UNIT
TEST CONDITIONS
VDD = 4.5V, Vin = 0.45V
VDD = 2.4V, Vin = 0.45V
VDD = 4.5V, IOH = -100 µA
VDD = 2.4V, IOH = -8 µA
VDD = 4.5V, IOH = -400 µA
VDD = 2.4V, IOH = -200 µA
VDD = 4.5V, Vin = 2.4V
VDD = 2.4V, Vin = 1.4V
VDD = 4.5V, Vin = 2.4V
VDD = 2.4V, Vin = 1.4V
Notes:
*1. RST pin is a Schmitt trigger input.
*2. P0, ALE and /PSEN are tested in the external access mode.
*3. XTAL1 is a CMOS input.
*4. Pins of P1, P2, P3, P4 can source a transition current when they are being externally driven from 1 to 0.
AC CHARACTERISTICS
The AC specifications are a function of the particular process used to manufacture the part, the
ratings of the I/O buffers, the capacitive load, and the internal routing capacitance. Most of the
specifications can be expressed in terms of multiple input clock periods (TCP), and actual parts will
usually experience less than a ±20 nS variation. The numbers below represent the performance
expected from a 0.6micron CMOS process when using 2 and 4 mA output buffers.
Clock Input Waveform
XTAL1
T CH
T CL
F OP,
PARAMETER
Operating Speed
Clock Period
Clock High
Clock Low
T CP
SYMBOL
MIN.
TYP.
MAX.
UNIT
NOTES
FOP
TCP
TCH
TCL
0
25
10
10
-
24
-
MHz
nS
nS
nS
1
2
3
3
Notes:
1. The clock may be stopped indefinitely in either state.
2. The TCP specification is used as a reference in other specifications.
3. There are no duty cycle requirements on the XTAL1 input.
- 13 -
Publication Release Date: December 1998
Revision A1
Preliminary W78LE51
Program Fetch Cycle
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
NOTES
Address Valid to ALE Low
TAAS
1 TCP -∆
-
-
nS
4
Address Hold from ALE Low
TAAH
1 TCP -∆
-
-
nS
1, 4
ALE Low to PSEN Low
TAPL
1 TCP -∆
-
-
nS
4
PSEN Low to Data Valid
TPDA
-
-
2 TCP
nS
2
Data Hold after PSEN High
TPDH
0
-
1 TCP
nS
3
Data Float after PSEN High
TPDZ
0
-
1 TCP
nS
ALE Pulse Width
TALW
2 TCP -∆
2 TCP
-
nS
4
PSEN Pulse Width
TPSW
3 TCP -∆
3 TCP
-
nS
4
Notes:
1. P0.0−P0.7, P2.0−P2.7 remain stable throughout entire memory cycle.
2. Memory access time is 3 TCP.
3. Data have been latched internally prior to PSEN going high.
4. "∆" (due to buffer driving delay and wire loading) is 20 nS.
Data Read Cycle
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
NOTES
ALE Low to RD Low
TDAR
3 TCP -∆
-
3 TCP +∆
nS
1, 2
RD Low to Data Valid
TDDA
-
-
4 TCP
nS
1
Data Hold from RD High
TDDH
0
-
2 TCP
nS
Data Float from RD High
TDDZ
0
-
2 TCP
nS
RD Pulse Width
TDRD
6 TCP -∆
6 TCP
-
nS
Notes:
1. Data memory access time is 8 TCP.
2. "∆" (due to buffer driving delay and wire loading) is 20 nS.
Data Write Cycle
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
ALE Low to WR Low
TDAW
3 TCP -∆
-
3 TCP +∆
nS
Data Valid to WR Low
TDAD
1 TCP -∆
-
-
nS
Data Hold from WR High
TDWD
1 TCP -∆
-
-
nS
WR Pulse Width
TDWR
6 TCP -∆
6 TCP
-
nS
Note: "∆" (due to buffer driving delay and wire loading) is 20 nS.
- 14 -
2
Preliminary W78LE51
Port Access Cycle
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
TPDS
TPDH
TPDA
1 TCP
0
1 TCP
-
-
nS
nS
nS
Port Input Setup to ALE Low
Port Input Hold from ALE Low
Port Output to ALE
Note: Ports are read during S5P2, and output data becomes available at the end of S6P2. The timing data are referenced to
ALE, since it provides a convenient reference.
Program Operation
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
TVPS
TDS
TDH
TAS
TAH
TPWP
2.0
2.0
2.0
2.0
0
290
300
310
µS
µS
µS
µS
µS
µS
OE Setup Time
TOCS
TOCH
TOES
2.0
2.0
2.0
-
-
µS
µS
µS
OE High to Output Float
TDFP
0
-
130
nS
Data Valid from OE
TOEV
-
-
150
nS
VPP Setup Time
Data Setup Time
Data Hold Time
Address Setup Time
Address Hold Time
CE Program Pulse Width for
Program Operation
OECTRL Setup Time
OECTRL Hold Time
Note: Flash data can be accessed only in flash mode. The RST pin must pull in VIH status, the ALE pin must pull in VIL status, and
the PSEN pin must pull in VIH status.
TIMING WAVEFORMS
Program Fetch Cycle
S1
S2
S3
S4
S5
S6
S1
S2
S3
S4
S5
S6
XTAL1
TALW
ALE
T APL
PSEN
T PSW
TAAS
PORT 2
T AAH
T PDA
T PDH, T PDZ
PORT 0
Code
A0-A7
Data
A0-A7
- 15 -
Code
A0-A7
Data
A0-A7
Publication Release Date: December 1998
Revision A1
Preliminary W78LE51
Timing Waveforms, continued
Data Read Cycle
S4
S5
S6
S1
S2
S3
S4
S5
S6
S1
S2
S3
XTAL1
ALE
PSEN
PORT 2
A8-A15
DATA
A0-A7
PORT 0
T DAR
T DDA
T DDH, T DDZ
RD
T DRD
Data Write Cycle
S4
S5
S6
S1
S2
S3
S4
S5
S6
S1
S2
XTAL1
ALE
PSEN
A8-A15
PORT 2
PORT 0
A0-A7
DATA OUT
T DWD
TDAD
WR
T DWR
T DAW
Port Access Cycle
S5
S6
S1
XTAL1
ALE
TPDS
T PDA
T PDH
DATA OUT
PORT
INPUT
SAMPLE
- 16 -
S3
Preliminary W78LE51
Timing Waveforms, continued
Program Operation
Program
P2, P1
(A15... A0)
Program
Verify
Read Verify
VIH
VIL
P3.6
VIH
(CE)
VIL
P3.3
(OECTRL)
VIH
P3.7
VIH
(OE)
VIL
P0
(A7... A0)
VIH
Address Stable
TPWP
TAH
TOCS
VIL
VIL
TOCH
TOES
TDFP
TDH
D OUT
Data In
Data Out
TDS
Vcp
TOEV
Vpp
VIH
Address Valid
TAS
TVPS
- 17 -
Publication Release Date: December 1998
Revision A1
Preliminary W78LE51
TYPICAL APPLICATION CIRCUITS
Expanded External Program Memory and Crystal
VDD
VDD
31
19
10 u
R
EA
XTAL1
18
XTAL2
9
RST
12
13
14
15
INT0
INT1
T0
T1
1
2
3
4
5
6
7
8
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5
P1.6
P1.7
CRYSTAL
8.2 K
C1
C2
P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
39
38
37
36
35
34
33
32
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
21
22
23
24
25
26
27
28
RD
WR
PSEN
ALE
TXD
RXD
17
16
29
30
11
10
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
A8
A9
A10
A11
A12
A13
A14
A15
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
3
4
7
8
13
14
17
18
GND 1
11
D0
D1
D2
D3
D4
D5
D6
D7
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
2
5
6
9
12
15
16
19
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
10
9
8
7
6
5
4
3
25
24
21
23
2
26
27
1
GND
20
22
A0
A1
A2
A3
A4
A5
A6
A7
OC
G
74373
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
O0
O1
O2
O3
O4
O5
O6
O7
CE
OE
27512
W78LE51
Figure A
CRYSTAL
C1
C2
R
16 MHz
30P
30P
-
24 MHz
15P
15P
-
33 MHz
10P
10P
6.8K
40 MHz
5P
5P
4.7K
Above table shows the reference values for crystal applications (full gain).
Note: C1, C2, R components refer to Figure A.
- 18 -
11
12
13
15
16
17
18
19
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
Preliminary W78LE51
Typical Application Circuits, continued
Expanded External Data Memory and Oscillator
V DD
V DD
31
10 u
EA
19
XTAL1
18
XTAL2
9
RST
12
13
14
15
INT0
OSCILLATOR
8.2 K
1
2
3
4
5
6
7
8
INT1
T0
T1
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5
P1.6
P1.7
P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
39 AD0
38 AD1
37 AD2
36 AD3
35 AD4
34 AD5
33 AD6
32 AD7
AD0 3
AD1 4
AD2 7
AD3 8
AD4 13
AD5 14
AD6 17
AD7 18
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
21
22
23
24
25
26
27
28
GND
RD
17
16
29
30
11
10
WR
PSEN
ALE
TXD
RXD
A8
A9
A10
A11
A12
A13
A14
1
11
D0
D1
D2
D3
D4
D5
D6
D7
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
OC
G
74373
2
5
6
9
12
15
16
19
A0
A1
A2
A3
A4
A5
A6
A7
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
10
9
8
7
6
5
4
3
25
24
21
23
2
26
1
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
GND
20
22
27
CE
OE
D0
D1
D2
D3
D4
D5
D6
D7
11
12
13
15
16
17
18
19
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
WR
20256
W78LE51
Figure B
- 19 -
Publication Release Date: December 1998
Revision A1
Preliminary W78LE51
PACKAGE DIMENSIONS
40-pin DIP
Dimension in inch
Dimension in mm
Min. Nom. Max. Min. Nom. Max.
Symbol
D
40
21
E1
0.010
0.150
0.155
0.160
3.81
3.937
4.064
0.016
0.018
0.022
0.406
0.457
0.559
0.048
0.050
0.054
1.219
1.27
1.372
0.008
0.010
0.014
0.203
0.254
0.356
2.055
2.070
52.20
52.58
0.600
0.610
14.986
15.24
15.494
0.540
0.545
0.550
13.72
13.84
13.97
0.090
0.100
0.110
2.286
2.54
2.794
0.120
0.130
0.140
3.048
3.302
3.556
15
0
0.670
16.00
16.51
17.01
0
eA
S
20
0.254
0.590
a
1
5.334
0.210
A
A1
A2
B
B1
c
D
E
E1
e1
L
0.630
0.650
15
0.090
2.286
Notes:
E
S
1. Dimension D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
. parting line.
are determined at the mold
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
c
A A2
A1
Base Plane
Seating Plane
L
B
e1
eA
a
B1
44-pin PLCC
HD
D
6
1
44
40
Symbol
7
39
E
17
HE
GE
29
18
28
c
A
A1
A2
b1
b
c
D
E
e
GD
GE
HD
HE
L
y
Dimension in inch Dimension in mm
Min. Nom. Max. Min. Nom. Max.
0.185
0.020
4.699
0.508
0.145
0.150
0.155
3.683
3.81
3.937
0.026
0.028
0.032
0.66
0.711
0.813
0.016
0.018
0.022
0.406
0.457
0.559
0.008
0.010
0.014
0.203
0.254
0.356
0.648
0.653
0.658
16.46
16.59
16.71
0.648
0.653
0.658
16.46
16.59
16.71
0.050
BSC
1.27
0.590
0.610
0.630
14.99
15.49
0.590
0.610
0.630
14.99
15.49
16.00
0.680
0.690
0.700
17.27
17.53
17.78
0.680
0.690
0.700
17.27
17.53
17.78
0.100
0.110
2.296
2.54
2.794
0.004
Notes:
1. Dimension D & E do not include interlead
flash.
2. Dimension b1 does not include dambar
protrusion/intrusion.
3. Controlling dimension: Inches
4. General appearance spec. should be based
on final visual inspection spec.
θ
e
b
b1
Seating Plane
A1
y
GD
- 20 -
16.00
0.090
L
A2 A
BSC
0.10
Preliminary W78LE51
Package Dimensions, continued
44-pin PQFP
HD
Symbol
34
A
A1
A2
b
c
D
E
e
HD
HE
L
L1
y
θ
33
1
E HE
11
12
e
Dimension in mm
Dimension in inch
D
44
b
22
Min. Nom. Max.
Min. Nom.
Max.
---
---
---
---
0.002
0.01
0.02
0.05
0.25
0.5
0.075
0.081
0.087
1.90
2.05
2.20
0.01
0.014
0.018
0.25
0.35
0.45
0.004
0.006
0.010
0.101
0.152
0.254
0.390
0.394
0.398
9.9
10.00
10.1
0.390
0.394
0.398
9.9
10.00
10.1
0.025
0.031
0.036
0.635
0.80
0.952
0.510
0.520
0.530
12.95
13.2
13.45
13.45
---
---
0.510
0.520
0.530
12.95
13.2
0.025
0.031
0.037
0.65
0.8
0.95
0.051
0.063
0.075
1.295
1.6
1.905
0.08
0.003
0
7
0
7
Notes:
1. Dimension D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeter
4. General appearance spec. should be based
on final visual inspection spec.
c
A2 A
θ
A1
Seating Plane
See Detail F
L
y
L1
Headquarters
Detail F
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
No. 4, Creation Rd. III,
123 Hoi Bun Rd., Kwun Tong,
Science-Based Industrial Park,
Kowloon, Hong Kong
Hsinchu, Taiwan
TEL: 852-27513100
TEL: 886-3-5770066
FAX: 852-27552064
FAX: 886-3-5792766
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: 408-9436666
FAX: 408-5441798
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-27190505
FAX: 886-2-27197502
Note: All data and specifications are subject to change without notice.
- 21 -
Publication Release Date: December 1998
Revision A1