CC2591 www.ti.com ........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008 2.4-GHz RF Front End FEATURES APPLICATIONS • • • • • • • 1 • • • • • • • • • • Seamless Interface to 2.4-GHz Low Power RF Devices from Texas Instruments Up to 22-dBm Output Power 6-dB Typical Improved Sensitivity on CC24xx and CC2500, CC2510, and CC2511 Few External Components – Integrated Switches – Integrated Matching Network – Integrated Balun – Integrated Inductors – Integrated PA – Integrated LNA Digital Control of LNA Gain by HGM Pin 100-nA in Power Down (EN = PAEN = 0) Low Transmit Current Consumption (100-mA at 3-V for 20-dBm Out, PAE = 33%) Low Receive Current Consumption – 3.4-mA for High Gain Mode – 1.7-mA for Low Gain Mode 4.8-dB LNA Noise Figure, including T/R Switch and external antenna match RoHS Compliant 4×4-mm QFN-16 Package 2-V to 3.6-V Operation All 2.4-GHz ISM Band Systems Wireless Sensor Networks Wireless Industrial Systems IEEE 802.15.4 and ZigBee Systems Wireless Consumer Systems Wireless Audio Systems DESCRIPTION CC2591 is a cost-effective and high performance RF Front End for low-power and low-voltage 2.4-GHz wireless applications. CC2591 is a range extender for all existing and future 2.4-GHz low-power RF transceivers, transmitters and System-on-Chip products from Texas Instruments. CC2591 increases the link budget by providing a power amplifier for increased output power, and an LNA with low noise figure for improved receiver sensitivity. CC2591 provides a small size, high output power RF design with its 4x4-mm QFN-16 package. CC2591 contains PA, LNA, switches, RF-matching, and balun for simple design of high performance wireless applications. CC2591 BLOCK DIAGRAM PA BALUN 4 RF_P 3 RXTX 2 RF_N 5 PAEN 6 EN 11 ANT LNA Logic Bias 15 7 BIAS HGM 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated CC2591 SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................ www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device. PARAMETER Supply voltage VALUE All supply pins must have the same voltage Voltage on any digital pin UNIT –0.3 to 3.6 V –0.3 to VDD + 0.3, max 3.6 Input RF level Storage temperature range 10 dBm –50 to 150 °C RECOMMENDED OPERATING CONDITIONS The operating conditions for CC2591 are listed below. PARAMETER MIN Ambient temperature range –40 85 2 3.6 2400 2483.5 Operating supply voltage Operating frequency range MAX UNIT °C V MHz ELECTRICAL CHARACTERISTICS TC = 25°C, VDD = 3 V , fRF= 2440MHz (unless otherwise noted). Measured on CC2591EM reference design including external matching components. PARAMETER TEST CONDITIONS MIN TYP MAX Receive current, High Gain Mode HGM = 1 3.4 4 Receive current, Low Gain Mode Transmit current HGM = 0 1.7 2 PIN = 0.5 dBm 112 Transmit current No input signal 40 50 Power down current EN = PAEN = 0 0.1 0.3 High input level (control pins) EN, PAEN, HGM, RXTX Low input level (control pins) EN, PAEN, HGM, RXTX 1.3 VDD 0.3 UNIT mA µA V Power down - Receive mode switching time 12 µs Power down - Transmit mode switching time 1 µs RF Receive Gain, High Gain Mode HGM = 1 11 dB Gain, Low Gain Mode HGM = 0 1 dB Gain variation, 2400 – 2483.5 MHz, High Gain Mode HGM = 1 1.3 dB Gain variation, 2.0V – 3.6V, High Gain Mode HGM = 1 1.5 dB Gain variation, -40°C – 85°C, High Gain Mode HGM = 1 3 dB Noise figure, High Gain Mode HGM = 1, including internal T/R switch and external antenna match 4.8 dB Input 1 dB compression, High Gain Mode HGM = 1 –17 dBm Input IP3, High Gain Mode HGM = 1 –2 dBm Input reflection coefficient, S11 HGM = 1, measured at antenna port –11 dB 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2591 CC2591 www.ti.com ........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008 ELECTRICAL CHARACTERISTICS (continued) TC = 25°C, VDD = 3 V , fRF= 2440MHz (unless otherwise noted). Measured on CC2591EM reference design including external matching components. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RF Transmit Gain 22 Output power, POUT PIN = 0.5 dBm Maximum output power PIN = 5 dBm Power Added Efficiency, PAE PIN = 0.5 dBm dB 20.6 dBm 22 dBm 34% Output 1 dB compression 19 dBm Output IP3 32 dBm Output power variation over frequency 2400 – 2483.5 MHz, PIN = 0.5 dBm 0.5 dB Output power variation over power supply 2V – 3.6V , PIN = 0.5 dBm 3.5 dB Output power variation over temperature -40°C – 85°C, PIN = 0.5 dBm 1.5 dB 2nd harmonic power PIN = 0.5 dBm. The 2nd harmonic can be reduced to below regulatory limits by using an external LC filter and antenna. –15 dBm 3rd harmonic power PIN = 0.5 dBm. The 3rd harmonic can be reduced to below regulatory limits by using an external LC filter and antenna. –30 dBm Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2591 3 CC2591 SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................ www.ti.com DEVICE INFORMATION The CC2591 pinout and description are shown in Figure 1 and Table 1, respectively. 15 14 AVDD_LNA BIAS 16 GND AVDD_BIAS PIN AND I/O CONFIGURATION (TOP VIEW) 13 AVDD_PA1 1 12 GND RF_N 2 11 ANT RXTX 3 10 AVDD_PA2 RF_P 4 9 6 7 8 HGM GND PAEN 5 EN QFN-16 4x4mm GND Figure 1. NOTE: The exposed die attach pad must be connected to a solid ground plane as this is the primary ground connection for the chip. Inductance in vias to the pad should be minimized. It is highly recommended to follow the reference layout. Changes will alter the performance. Also see the PCB landpattern information in this data sheet. For best performance, minimize the length of the ground vias, by using a 4-layer PCB with ground plane as layer 2 when CC2591 is mounted onto layer 1. 4 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2591 CC2591 www.ti.com ........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008 Table 1. TERMINAL FUNCTIONS TERMINAL TYPE DESCRIPTION NO. NAME — GND Ground The exposed die attach pad must be connected to a solid ground plane. See CC2591EM reference design for recommended layout. AVDD_PA1 Power 2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA . See CC2591EM reference design for recommended layout. 2 RF_N RF 3 RXTX Analog/Control 1 RF interface towards CC24xx or CC25xx device. RXTX switching voltage when connected to CC24xx devices. See Table 3 and Table 4 for details. 4 RF_P RF 5 PAEN Digital Input RF interface towards CC24xx or CC25xx device Digital control pin. See Table 3 and Table 4 for details. 6 EN Digital Input Digital control pin. See Table 3 and Table 4 for details. 7 HGM Digital Input Digital control pin. HGM=1 → Device in High Gain Mode HGM=0 → Device in Low Gain Mode (RX only) 8, 9, 12, 14 GND Ground Secondary ground connections. Should be shorted to the die attach pad on the top PCB layer. 10 AVDD_PA2 Power 2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA. See CC2591EM reference design for recommended layout. 11 ANT RF 13 AVDD_LNA Power 2 V – 3.6 V Power. PCB trace to this pin serves as inductive load to LNA. See CC2591EM reference design for recommended layout. 15 BIAS Analog Biasing input. Resistor between this node and ground sets bias current to PAs. 16 AVDD_BIAS Power 2 V – 3.6 V Power. Antenna interface. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2591 5 CC2591 SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................ www.ti.com CC2591EM Evaluation Module VDD VDD C11/C12 C101/C102 = TLINE inductor VDD VDD C131/C132 TL131 AVDD_LNA TL101 AVDD_PA2 AVDD_BIAS AVDD_PA1 TL11 C161 LDB182G4520C-110 RF_P RXTX RXTX Balun RXTX SMA L111 L112 CC2591 ANT C111 SMA RF_P RF_P C2 RF_N RF_N RF_N PAEN PAEN EN EN HGM BIAS HGM RXTX R151 Figure 2. CC2591EM Evaluation Module Table 2. List of Materials (See CC2591EM Reference Design) DEVICE FUNCTION VALUE L112 Part of antenna match. 1.5 nH: LQW15AN1N5B00 from Murata L111 DC block. 1 nF: GRM1555C1H102JA01 from Murata C111 Part of antenna match. 1 pF: GRM1555C1H1R0BZ01 from Murata C161 Decoupling capacitor. 1 nF: GRM1555C1H102JA01 from Murata C11/C12 Decoupling. Will affect PA resonance. 10 pF || 1 nF. The smallest cap closest. See CC2591EM reference design for placement. 10 pF: GRM1555C1H100JZ01 from Murata 1 nF: GRM1555C1H102JA01 from Murata C101/C102 Decoupling. Will affect PA resonance. 18 pF || 1 nF. The smallest cap closest. See for CC2591EM reference design placement. 18 pF: GRM1555C1H180JZ01 from Murata 1 nF: GRM1555C1H102JA01 from Murata C131/C132 Decoupling. Will affect PA resonance. 10 pF || 1 nF. The smallest cap closest. See CC2591EM reference design for placement. 10 pF: GRM1555C1H100JZ01 from Murata 1 nF: GRM1555C1H102JA01 from Murata C2 Decoupling of external balun 1 nF: GRM1555C1H102JA01 from Murata TL11 Transmission line. Will affect PA resonance. See CC2591EM reference design. TL101 Transmission line. Will affect PA resonance. See CC2591EM reference design. TL131 Transmission line. Will affect LNA resonance. See CC2591EM reference design. R151 Bias resistor 4.3 kΩ: RK73H1ETTP4301F from Koa 6 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2591 CC2591 www.ti.com ........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008 TYPICAL CHARACTERISTICS LNA GAIN AND NOISE FIGURE vs FREQUENCY 12 5.4 13 11 5.3 12 HGM 5.1 8 5 4.9 NF HGM 6 4.8 5 4.7 4 4.6 3 4.5 2 9 8 7 6 5 4 3 1 0 1 4.3 -1 0 4.2 -2 -40 2400 2410 2420 2430 2440 2450 2460 2470 LGM 2 4.4 LGM HGM 10 Gain − dB 9 7 11 5.2 Noise Figure − dB 10 Gain − dB LNA GAIN vs TEMPERATURE 2480 -20 0 20 40 60 80 o T − Temperature − C f − Frequency − MHz Figure 3. Figure 4. LNA GAIN vs POWER SUPPLY 12 11 10 HGM 9 Gain − dB 8 7 6 5 4 3 2 LGM 1 0 -1 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Power Supply − V Figure 5. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2591 7 CC2591 SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................ www.ti.com TYPICAL CHARACTERISTICS (continued) I_VDD POUT 0 2 4 6 135 130 36 PAE 34 125 32 120 30 28 110 26 105 24 100 22 20 90 85 18 2400 2410 2420 2430 2440 2450 2460 2470 2480 f − Frequency − MHz Figure 6. Figure 7. OUTPUT POWER, PAE AND CURRENT CONSUMPTION vs TEMPERATURE OUTPUT POWER, PAE AND CURRENT CONSUMPTION vs POWER SUPPLY 38 145 38 140 36 34 135 34 125 32 130 32 120 36 125 I_VDD 28 120 26 115 24 110 22 105 POUT 20 18 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Output Power (dBm) and PAE − % 30 Current Consumption − mA PAE Output Power (dBm) and PAE − % 95 POUT Input Power − dBM 135 130 PAE 115 30 I_VDD 28 110 26 105 24 100 22 95 POUT 20 90 100 18 85 95 16 80 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 T − Temperature − oC 3 3.1 3.2 3.3 3.4 3.5 3.6 Power Supply − V Figure 8. 8 115 I_VDD Current Consumption − mA -6 -4 -2 38 Current Consumption − mA PAE 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 Output Power (dBm) and PAE − % 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 -20 -18 -16 -14 -12 -10 -8 OUTPUT POWER, PAE AND CURRENT CONSUMPTION vs FREQUENCY Current Consumption − mA Output Power (dBm) and PAE − % OUTPUT POWER, PAE AND CURRENT CONSUMPTION vs INPUT POWER Figure 9. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2591 CC2591 www.ti.com ........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008 Controlling the Output Power from CC2591 The output power of CC2591 is controlled by controlling the input power. The CC2591 PA is designed to work in compression (class AB), and the best efficiency is reached when a strong input signal is applied. Input Levels on Control Pins The four digital control pins (PAEN, EN, HGM, RXTX) have built-in level-shifting functionality, meaning that if the CC2591 is operating from a 3.6-V supply voltage, the control pins will still sense 1.6-V - 1.8-V signals as logical ‘1’. An example of the above would be that RXTX is connected directly to the RXTX pin on CC24xx, but the global supply voltage is 3.6 V. The RXTX pin on CC24xx will switch between 0 V (RX) and 1.8 V(TX), which is still a high enough voltage to control the mode of CC2591. The input voltages should however not have logical ‘1’ level that is higher than the supply. Connecting CC2591 to a CC24xx Device Table 3. Control Logic for Connecting CC2591 to a CC24xx Device PAEN = EN RXTX HGM MODE OF OPERATION 0 X X Power Down 1 0 0 RX Low Gain Mode 1 0 1 RX High Gain Mode 1 1 X TX VDD VDD C11/C12 C101/C102 = TLINE inductor VDD VDD C131/C132 TL131 AVDD_LNA TL101 AVDD_PA2 AVDD_BIAS AVDD_PA1 TL11 C161 CC243x RF_P RF_P RF_P RF_P RXTX RXTX RXTX L111 ANT L112 C113 TXRX_SWITCH C112 CC2591 RF_N RF_N RF_N RF_N PAEN C111 RREG_OUT (CC243x) BIAS EN HGM R151 Connected to VDD/GND/MCU/RXTX Alternativiely from MCU Figure 10. CC2591 + CC24xx Application Circuit Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2591 9 CC2591 SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................ www.ti.com Connecting CC2591 to the CC2500, CC2510, or CC2511 Device Table 4. Control Logic for Connecting CC2591 to a CC2500/10/11 Devices PAEN EN RXTX HGM MODE OF OPERATION 0 0 NC X Power Down 0 1 NC 0 RX LGM 0 1 NC 1 RX HGM 1 0 NC X TX 1 1 NC X Not allowed VDD VDD C11/C12 C101/C102 = TLINE inductor VDD VDD C131/C132 TL131 AVDD_LNA TL101 AVDD_PA2 AVDD_BIAS AVDD_PA1 TL11 C161 CC2500 CC2510 CC2511 RF_P RF_P RF_P RXTX RXTX RXTX L111 CC2591 C111 BIAS C113 NC C112 ANT L112 RF_P RF_N RF_N RF_N RF_N PAEN GDO0 EN GDO2 HGM R151 Connected to VDD/GND/MCU Alternatively from MCU Figure 11. CC2591 + CC2500/10/11 Device Application Circuit 10 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2591 CC2591 www.ti.com ........................................................................................................................................................ SWRS070A – MARCH 2008 – REVISED JUNE 2008 Connecting CC2591 to a CC2520 Device Control Logic for Connecting CC2591 to a CC2520 Device PAEN EN RXTX HGM MODE OF OPERATION 0 0 NC X Power Down 0 1 NC 0 RX LGM 0 1 NC 1 RX HGM 1 0 NC X TX 1 1 NC X Not allowed VDD VDD C11/C12 C101/C102 = TLINE inductor VDD VDD C131/C132 TL131 TL101 CC2520 AVDD_LNA AVDD_PA2 AVDD_BIAS AVDD_PA1 TL11 C161 C41 RF_P RXTX RXTX L111 RXTX C112 CC2591 ANT L112 C113 C111 L41 RF_P RF_P RF_P NC C1 L21 RF_N RF_N RF_N RF_N PAEN PA_EN LNA_EN BIAS EN HGM R151 Connected to VDD/GND/MCU C21 Alternatively from MCU Figure 12. CC2591 + CC2520 Application Circuit Revision History Changes from Original (March 2008) to Revision A ....................................................................................................... Page • Changed the data sheet From: Product Preview To: Production Data. Multiple changes throughout. ................................. 1 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2591 11 PACKAGE OPTION ADDENDUM www.ti.com 31-Mar-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CC2591RGVR ACTIVE VQFN RGV 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CC2591RGVRG4 ACTIVE VQFN RGV 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CC2591RGVT ACTIVE VQFN RGV 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CC2591RGVTG4 ACTIVE VQFN RGV 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR HPA00420RGVR ACTIVE VQFN RGV 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Dec-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CC2591RGVR VQFN RGV 16 2500 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 CC2591RGVT VQFN RGV 16 250 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Dec-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC2591RGVR VQFN RGV 16 2500 340.5 333.0 20.6 CC2591RGVT VQFN RGV 16 250 340.5 333.0 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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