Obsolescence Notice This product is obsolete. This information is available for your convenience only. For more information on Zarlink’s obsolete products and replacement product lists, please visit http://products.zarlink.com/obsolete_products/ JULY 1995 ADVANCE INFORMATION DS4015 - 2.5 SL6609A DIRECT CONVERSION FSK DATA RECEIVER This device is an advanced direct conversion receiver for operation up to 470MHz. The design is based on the SL6609 receiver and is a pin for pin product upgrade. The device integrates all functions to translate a binary FSK modulated RF signal into a demodulated data stream. Adjacent channel rejection is provided using tuneable gyrator filters. To assist operation in the presence of large interfering signals both RF and audio AGC functions are provided. The device also includes a 1 volt regulator capable of sourcing up to 5mA, a battery flag and the facility of incorporating a more complex post detection filter off-chip. Both battery flag and data outputs have open collector outputs to ease their interface with other devices. FEATURES ■ ■ ■ ■ ■ ■ Very low power operation - typ 3.0mW Single cell operation for most of the device. Limited functional blocks operating via an inverter Superior sensitivity of -130dBm Operation at wide range of paging data rates 512, 1200, 2400 baud On chip 1 volt regulator Small package offering SSOP APPLICATIONS ■ ■ ■ ■ Credit card pagers Watch pagers Small form factor pagers i.e. PCMCIA Low data rate data receivers i.e. Security/remote control TPX 1 28 IAGCOUT RFIADJ 2 27 IRFAMP MIXA LOY 3 26 GYRI 4 25 GND LOX 5 24 MIXB VR 6 23 VREG TPY 7 22 REGCNT GTHADJ 8 21 VCC1 TCADJ 9 20 VBATT BEC 10 19 VBG BATTFL 11 18 DIGGND TPLIMY 12 17 BRF1 VCC2 13 16 BRF2 DATAOP 14 15 TPLIMX NP28 Fig.1 Pin connections ABSOLUTE MAXIMUM RATINGS Supply voltage Storage temperature Operating temperature 6V -55°C to +150°C -20°C to +70°C ORDERING INFORMATION SL6609A / KG / NPDS SL6609A / KG / NPDE Fig.2 Block diagram of SL6609A - SSOP devices in anti-static sticks - SSOP devices in tape and reel SL6609A ELECTRICAL CHARACTERISTICS These characteristics are guaranteed over the following conditions unless otherwise stated: Tamb = 25°C, VCC1 = 1.3V, VCC2 = 2.7V Value Characteristics Units Pin Min Typ Max VCC1 - Supply voltage 21 0.95 1.3 2.8 V VCC2 - Supply voltage 13 1.8 2.7 3.5 V ICC1 - Supply current 21,27,28 1.5 1.8 mA ICC2 - Supply current 11,13,14 550 700 µA Power down ICC1 Power down ICC2 21,27,28 11,13,14 1 8 µA µA 1 volt regulator 23 0.95 1.0 1.05 V Band gap voltage reference Band gap current source Voltage reference Voltage reference sink/source 1 volt regulator load current 19 19 6 6 1.15 1.21 0.93 1.0 0.25 3 1.27 20 1.07 10 5 V µA V µA mA Comments VCC1 < VCC2 - 0.7 volts Includes IRF. Does not include regulator supply. Audio AGC inactive Batt flag & Data O/P high Pin 27 voltage: 0.3 - 1.3V I Load = 3mA. Ext PNP. ß >= 100, VCE = 0.1 volt VCC1 > 1.1V Turn on Time 5 ms Stable data o/p when 3dB above sensitivity. CBG and CVR = 2.2µF Turn off Time 1 ms Fall to 10% of steady state current CBG and CVR = 2.2µF +/-4 µA Detector output current 17 RF current source Current Source (IRF) 27 400 500 600 µA Pin 27 voltage: 0.3 - 1.3V Decoder Output mark space ratio Data O/P Sink Current Data O/P Leakage Current 2 µVrms 40 Sensitivity 14 14 14 7:9 100 9:7 500 1.0 µA µA Signal injected at TPX and TPY B.E.R. < 1 in 30 5KHz deviation @ 1200 bits/sec BRF capacitor = 1nF Output logic low Output Iogic high SL6609A ELECTRICAL CHARACTERISTICS These characteristics are guaranteed over the following conditions unless otherwise stated: Tamb = 25°C, VCC1 = 1.3V, VCC2 = 2.7V Value Characteristics Units Pin Min Battery Economy Input logic high Input logic low Input current Input current 10 10 10 10 Battery Flag Input Input current 20 Battery Flag Output Battfl Sink Current Battfl leakage current 11 11 Mixers Gain to "IF Test" RF input impedance LO input impedance LO DC bias voltage Audio AGC Max Audio AGC Sink Current Typ Max 0.05 6 0.3 1 8 (VCC2 - 0.3) 1 Powered Up Powered Down Powered Up Powered down transient initial µA 50 500 1 µA µA (VBATT-VR) > 20mV (VBATT-VR) < -20mV 34 41 dB LO inputs driven in parallel with 50mVRMS @ 50MHz.IF = 2kHz See Figs.8a, 8b See Fig.9 Equal to Pin 21 (VCC1) 24, 26 3, 5 3, 5 28 V V µA µA Comments V 45 65 85 µA RECEIVER CHARACTERISTICS (GPS Demonstration board) Measurement conditions unless stated VCC1 = 1.3V, VCC2 = 2.7V, LNA = 18dB Power Gain, 2dB Noise figure, Carrier frequency 153MHz, BER 1 in 30, Tamb = 25°C (TPx/TPy typically:- 160mVPP ± 10% for - 73dBm RF input to the LNA) Value Characteristics Units Pin Min Typ Max -130 -128 -125 Intermodulation 52 Adjacent channel 68 Comments dBm 1200 bps ∆f = 4kHz LO = -18dBm 56 dB 1200 bps ∆f = 4kHz LO = -18dBm 73 dB 1200 bps ∆f = 4kHz LO = -18dBm Channel spacing 25kHz Centre frequency acceptance +/-2.3 kHz 1200 bps ∆f = 4kHz LO = -18dBm Deviation acceptance +/-2.2 kHz 1200 bps ∆f = 4kHz LO = -18dBm Sensitivity 3 SL6609A RECEIVER CHARACTERISTICS (GPS Demonstration board) Measurement conditions unless stated VCC1 = 1.3V, VCC2 = 2.7V, LNA = 20dB Power Gain, 2dB Noise figure, Carrier frequency 282MHz, BER 1 in 30, Tamb = 25°C (TPx/TPy typically:- 160mVPP ± 10% for - 73dBm RF input to the LNA) Value Characteristics Pin Units Min Typ Max -130 -128 -125.5 -125 -122 Intermodulation (IP3) 52 49 Intermodulation (IP2) Adjacent channel Sensitivity Centre frequency acceptance Comments dBm dBm 1200 bps ∆f = 4kHz 2400 bps ∆f = 4.5kHz LO = -15dBm 56 53.5 dB 1200 bps ∆f = 4kHz 2400 bps ∆f = 4.5kHz LO = -15dBm 47 52 dB 1200 bps ∆f = 4kHz LO = -15dBm 67 64 72.5 69.5 dB 1200 bps ∆f = 4kHz 2400 bps ∆f = 4.5kHz LO = -15dBm Channel spacing 25kHz +/-1.9 +/-2.3 +/-2 kHz 1200 bps ∆f = 4kHz 2400 bps ∆f = 4.5kHz LO = -15dBm +/-2.2 +/-2 kHz 1200 bps ∆f = 4kHz 2400 bps ∆f = 4.5kHz LO = -15dBm Deviation acceptance RECEIVER CHARACTERISTICS Measurement conditions unless stated VCC1 = 1.3V, VCC2 = 2.7V, LNA = 22dB Power Gain, 2dB Noise figure, Carrier frequency 470MHz, BER 1 in 30, Tamb = 25°C (TPx/TPy typically:- 140mVPP ± 10% for - 73dBm RF input to the LNA) Value Characteristics Units Min Typ Max -128 -126 -123 Intermodulation 50 Adjacent channel 67 Comments dBm 1200 bps ∆f = 4kHz LO = -15dBm 55.5 dB 1200 bps ∆f = 4kHz LO = -15dBm 72.5 dB 1200 bps ∆f = 4kHz LO = -15dBm Channel spacing 25kHz Centre frequency acceptance +/- 2.3 kHz 1200 bps ∆f = 4kHz LO = -15dBm Deviation acceptance +/- 2.2 kHz 1200 bps ∆f = 4kHz LO = -15dBm Sensitivity 4 Pin SL6609A OPERATION OF SL6609A The SL6609A is a Direct Converson Receiver designed for use up to 470MHz. It is available in a 28 pin SSOP package and it integrates all the facilities required for the conversion of an RF FSK signal to a base-band data signal. Low Noise Amplifier To achieve optimum performance it is necessary to incorporate a Low Noise RF Amplifier at the front end of the receiver. This is easily biased using the on chip voltage and current sources provided. Gyrator Filters The on chip filters include an adjustable gyrator filter. This may be adjusted with the use of an additional resistor between Pin 4 and GND. This allows flexibility of filter characterstics and also allows for compensation for possible process variations. Audio AGC All voltages and current sources used for bias of the RF amplifier, receiver and mixers should be RF decoupled using suitable capacitors (see Fig.4 for a suitable Low-NoiseAmplifier). The Audio AGC fundamentally consists of a current sink which is controlled by the audio (baseband data) signal. It has three parameters that may be controlled by the user. These are the Attack (turn on) time, Decay (duration) time and Threshold level (see Figs.6 and 7). See Application note for details. Local Oscillator Regulator The Local Oscillator signal is applied to the device in phase quadrature. This can be achieved with the use of two RC networks operating at the -3dB/45° transfer characteristic, giving a full 90° phase differential between the LO ports of the device. Each LO port of the device also requires an equal level of drive from the Oscillator. (see Fig.5). The on chip regulator must be used in conjunction with a suitable PNP transistor to achieve regulation. As the transistor forms part of the regulator feedback loop the transistor should exhibit the following characteristics:HFE > = 100 for VCE > = 0.1V Pin Number Pin Name Pin Description 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 TPX RFIADJ LOY GYRI LOX VR TPY GTHADJ TCADJ BEC BATTFL TPLIMY VCC2 DATAOP TPLIMX BRF2 BRF1 DIG GND VBG VBATT VCC1 REGCNT VREG MIXB GND MIXA IRFAMP 28 IAGCOUT X channel pre-gyrator filter test-point. This can be used for input and output RF current source adjustment pin LO input channel Y Gyrator current adjust pin LO input channel X VREF 1.0 V internal signal ground Y channel pre-gyrator filter test point, input or output Audio AGC gain and threshold adjust. RSSI signal indicator Audio AGC time constant adjust Battery economy control Battery flag output Y channel limiter (post gyrator filter) test point, output only Supply connection Data output pin X channel limiter (post gyrator filter) test point, output only Bit rate filter 2, input to data output stage Bit rate filter 1, output from detector Digital ground Bandgap voltage output Battery flag input voltage Supply connection 1V regulator control external PNP drive 1V regulator output voltage Mixer input B Ground Mixer input A Current source for external LNA. Value of current output will decrease at high mixer input signal levels due to RF AGC Audio AGC output current 5 SL6609A Fig.3 Application circuit board 6 SL6609A COMPONENTS LIST FOR APPLICATION BOARD At 282MHz, 25kHz Channel Spacing. (LO Circuit in Fig.3) Resistors R1 open circuit R2 open circuit R3 100 R4 100k R5 1k R6 1k R7 100 R8 open circuit R9 220k R10 1M R11 100k (6) R12 not used R13 1k5(1) R14 4k7 R15 4k7 R16 33k R17 not used R18 0R (3) R19 10k R20 620 R21 1k R22 open circuit Capacitors C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C17a 1n 2p7 4p7 1n 2p7 2u2 1n 100n 1n (2) 2u2 100n 1n 1n 1n 1n 1n 1n 1n C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C29 C30 C31 C32 C33 C34 C35 VC1 VC2 VC3 1n not used 1n 1n not used 1n 1n 1n 6p8 1n 1n 100p 2u2 2u2 4p7 4p7 3p3 not used 1-10p 1-10p 1-10p Inductors L1 L2 L3 L4 L5 68n (4) not used (3) 470n 39n 680n Active Components Q1 FMMT589 Q2 2SC5065 (Toshiba) Q3 BFT25A (Philips) Q4 not used Q5 2SC5065 (Toshiba) D1 Panasonic MA862 (5) Misc T1 Xtal 30nH 1:1 Coilcraft M1686-A 5th Overtone 94.075MHz Notes 1. The values of R13 is determined by the set-up procedure. See Application Note. 2. The value of C9 is determined by the output data rate. Use 2nF for 512bps, 1nF for 1200bps and 470pF for 2400bps. 3. L2 is used in the Audio AGC circuit (see Fig. 6). For the characteristics of the Audio AGC current source see Fig.7. If the audio AGC is not required then the current source (Pin 28) may be disabled by connecting Pin 9 (TCADJ) to VR (Pin 6) and by connecting Pin 28 (IAGCOUT) to Vcc1, (R18). The voltage at Pin 8 may still be used as an RSSI. R9, C8, C14, C19, R17 and D1 may then be omitted. See Fig.6 for AGC component values. 4. L1and C26 form the low noise matching network for the RF amplifier. The values given are for the RF amplifier specified in the Applications Circuit with no Audio AGC connected. i.e. R17 and D1 omitted. 5. Suggested diode for use with the Audio AGC circuit (see Fig.6) (D1 is not included on the general demonstration circuit). 6. The value of R11 is dependent on the data output load. R11 should allow sufficient current to drive the data output load. 7 SL6609A COMPONENTS LIST FOR APPLICATION BOARD At 470MHz, 25kHz Channel Spacing. (LO circuit is 50Ω network as in Fig.5 - crystal oscillator not specified) Resistors R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 R17 R18 R22 open circuit open circuit 100 100k 100 100 100 open circuit 220k 1M 100k (2) 300 (3) 3k9 (1) 4k7 4k7 33k open circuit (4) 0R (4) open circuit 1n 1n 1n 1n 1n not used 1n 1n not used not used 1n 1n open circuit not used not used 100p 2u2 2u2 1p5 1-3pF Inductors Capacitors C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C29 C30 C31 C34 VC1 1n 3.3pF 1n 1n 3.9pF 2u2 1n 100n 1n (2) 2u2 100n 1n 1n L1 L2 T1 47nH (5) not used (3) 16nH 2 Turn 1:1 (Coilcraft) Q4123-A Active Components Q1 Q2 Q3 Q4 Q5 D1 Zetex FMMT589 Philips BFT25A Not Used Philips BFT25A(3) Philips BFT25A Panasonic MA862(6) Notes 1. The values of R13 is determined by the set-up procedure. See Application Note. 2. The value of "C9" is determined by the output data rate. Use 2nF for 512bps, 1nF for 1200bps and 470pF for 2400bps. 3. 4. 8 R12 & Q4 form a dummy load for the regulator. Permitted load currents for the regulator are 250µA to 5mA. The 1V regulator (output Pin 23) can be switched off by connecting Pin 23 directly to VCC2. Q1, Q4, R12 and C12 must then be omitted L2 is used in the Audio AGC circuit (see Fig.6). For the characteristics of the Audio AGC current source see figure 7. If the Audio AGC is not required then the current source (Pin 28) may be disabled by connecting Pin 9 (TCADJ) to VR (Pin 6) and by connecting Pin 28 (IAGCOUT) to Vcc1, (R18). The voltage at Pin 8 may still be used as an RSSI. R9, C8, C14, C19, R17 and D1 may then be omitted. 5. L1and C26 form the low noise matching network for the RF amplifier. The values given are for the RF amplifier specified in the Applications Circuit with no Audio AGC connected. i.e. R17 and D1 omitted. 6. Suggested diode for use with the Audio AGC circuit (D1 is not included on the general demonstration circuit). 7. The value of R11 is dependent on the data output load. R11 should allow sufficient current to drive the data output load. SL6609A Fig.4 RF amplifier RF Amplifier Components Values Resistors R14, R15 R13 R22 4k7 see note 1 47k Capacitors C13, C15 C16, C17 C20, C21 C24, C25 L2 1nF 1nF 1nF see note 2 1nF 820nH Active components D1 MA862 (Panasonic) Notes: (1) The value of R13 is determined by the set up procedure (See "Set up for optimum performance"). (2) C20 and C21 are purely for deomonstration purposes. Pin 24 and Pin 26 may be DC coupled provided that no DC voltage is applied to the mixer inputs. Frequency Dependent Components 153MHz not used not used 150nH 3p3 100nH Coilcraft N2261-A VC1 1-10pF Q4, Q5 Toshiba 2SC5065 (See also Lo drive Network) C26 C27 L1 C34 T1 280MHz 6.8p not used 68nH 2p2 30nH Coilcraft M1686-A 1-10pF Toshiba 2SC5065 450MHz not used not used 39nH 1p5 16nH Coilcraft Q4123-A 1-3pF Philips BFT25A Fig.5 Local oscillator drive network LO Drive Network Component Values 50Ohm input impedance (External LO injection) 153MHz 280MHz 450MHz C2 10p 5p6 3p3 C5 10p 5p6 3p9 C3, C4, C18 = 1n R3, R5, R6, R7 = 100Ohms Higher Input Impedance (crystal oscillator input) 153MHz 280MHz 450MHz C3 Set by load allowable on crystal oscillator (typical 4p7) C2 10p 5p6 3p3 C5 10p 5p6 3p9 R3 100 100 100 R7 100 100 100 R5, R6 = 1k C4, C18 = 1n 9 SL6609A Fig.6 AGC Schematic Fig.7 Audio AGC current vs. IP power at 25°C 10 SL6609A S11 FREQ 50.000 100.000 150.000 200.000 250.000 300.000 350.000 400.000 450.000 500.000 550.000 600.000 650.000 700.000 750.000 800.000 850.000 900.000 950.000 1000.00 MAG 0.969 0.958 0.942 0.917 0.893 0.858 0.832 0.806 0.781 0.755 0.743 0.725 0.703 0.680 0.666 0.653 0.636 0.615 0.604 0.600 ANG -7.20 -14.45 -20.59 -26.40 -33.26 -39.84 -44.78 -49.01 -54.00 -59.53 -64-35 -68.43 -73.01 -78.74 -83.76 -87.48 -91.32 -97.17 -102.84 -105.23 1 2 .5 .2 50MHz 1GHz Fig.8a SL6609A Mixer A input S-Parameters S11 FREQ 50.000 100.000 150.000 200.000 250.000 300.000 350.000 400.000 450.000 500.000 550.000 600.000 650.000 700.000 750.000 800.000 850.000 900.000 950.000 1000.00 MAG 0.970 0.960 0.945 0.919 0.902 0.872 0.850 0.825 0.803 0.776 0.760 0.739 0.717 0.698 0.683 0.666 0.659 0.647 0.637 0.634 ANG -7.06 -13.83 -19.90 -25.70 -32.18 -38.03 -43.07 -48.27 -53.58 -58.49 -63.08 -67.98 -72.63 -76.96 -81.09 -85.49 -89.51 -93.90 -98.42 -102.40 1 2 .5 .2 50MHz 1GHz Fig.8b SL6609A Mixer B input S-Parameters S11 FREQ 50.000 100.000 150.000 200.000 250.000 300.000 350.000 400.000 450.000 500.000 550.000 600.000 650.000 700.000 750.000 800.000 850.000 900.000 950.000 1000.00 MAG 0.993 0.995 0.997 0.997 0.996 0.986 0.965 0.936 0.902 0.872 0.838 0.804 0.798 0.810 0.784 0.779 0.790 0.788 0.768 0.743 ANG -4.17 -8.43 -12.88 -17.57 -22.63 -28.16 -33.87 -39.17 -43.88 -48.54 -52.81 -56.60 -59.47 -65.19 -71.49 -75.97 -82.54 -91.16 -100.20 -108.52 1 2 .5 .2 50MHz 1GHz Fig.9 SL6609A LO X,Y inputs S-Parameters 11 SL6609A Fig.10a AC parameters vs. supply and temperature Conditions:- 282MHz GPS demonstration board i.e. 20dB LNA, 2dB noise figure, carrier frequency 282MHz, 1200bps baud rate, 4kHz deviation frequency, BER 1 in 30. 12 Vcc1 = 1.0V, Vcc2 = 1.8V Vcc1 = 1.3V, Vcc2 = 2.7V Vcc1 = 3.0V, Vcc2 = 4.0V SL6609A Fig.10b AC parameters vs. supply and temperature Conditions:- 282MHz GPS demonstration board i.e. 20dB LNA, 2dB noise figure, carrier frequency 282MHz, 1200bps baud rate, 4kHz deviation frequency, BER 1 in 30. Vcc1 = 1.0V, Vcc2 = 1.8V Vcc1 = 1.3V, Vcc2 = 2.7V Vcc1 = 3.0V, Vcc2 = 4.0V 13 SL6609A Fig.11 DC parameters vs. supply and temperature (IP3 vs audio AGC both on and off) Conditions:- ICC1 includes 500µA LNA current but does not include the regulator supply (audio AGC inactive). ICC2 measured with BATT FLAG and DATA O/P HIGH, Fc = 282MHz. Note 1- IP3 is level above wanted needed to reduce receiver to 1 in 30 B.E.R. 14 Vcc1 = 0.98V, Vcc2 = 1.78V Vcc1 = 1.3V, Vcc2 = 2.7V Vcc1 = 3.0V, Vcc2 = 4.0V SL6609A Fig.12 Sensitivity, IP3 vs Receiver Gain Fig.13 Sensitivity, adjacent Channel vs Receiver Gain 15 SL6609A 282MHz, 1200bps, 4kHz Deviation 56 -123 -124 55 -125 Sensitivity IP3 -126 54 -127 IP3 (dB) Sensitivity (dBm) -122 53 -128 -5 -7 -9 -11 -13 -15 -17 -19 -21 -23 52 -25 -129 LO Drive Level (dBm) Fig.14 Sensitivity, IP3 vs LO level Sensitivity (dBm) Sensitivity ACR -123 73 -124 -125 72.5 -126 72 -127 71.5 -128 LO Drive Level (dBm) Fig.15 Sensitivity, Adjacent Channel vs LO level 16 -5 -7 -9 -11 -13 -15 -17 -19 -21 -23 71 -25 -129 Adj. Channel (dB) 73.5 -122 SL6609A 17 SL6609A PACKAGE DETAILS Dimensions are shown thus: mm (in) HEADQUARTERS OPERATIONS GEC PLESSEY SEMICONDUCTORS Cheney Manor, Swindon, Wiltshire SN2 2QW, United Kingdom. Tel: (01793) 518000 Fax: (01793) 518411 GEC PLESSEY SEMICONDUCTORS P.O. Box 660017 1500 Green Hills Road, Scotts Valley, California 95067-0017, United States of America. Tel: (408) 438 2900 Fax: (408) 438 5576 CUSTOMER SERVICE CENTRES • FRANCE & BENELUX Les Ulis Cedex Tel: (1) 64 46 23 45 Fax : (1) 64 46 06 07 • GERMANY Munich Tel: (089) 3609 06-0 Fax : (089) 3609 06-55 • ITALY Milan Tel: (02) 66040867 Fax: (02) 66040993 • JAPAN Tokyo Tel: (03) 5276-5501 Fax: (03) 5276-5510 • NORTH AMERICA Scotts Valley, USA Tel (408) 438 2900 Fax: (408) 438 7023. • SOUTH EAST ASIA Singapore Tel: (65) 3827708 Fax: (65) 3828872 • SWEDEN Stockholm Tel: 46 8 702 97 70 Fax: 46 8 640 47 36 • TAIWAN, ROC Taipei Tel: 886 2 5461260. Fax: 886 2 7190260 • UK, EIRE, DENMARK, FINLAND & NORWAY Swindon Tel: (01793) 518510 Fax : (01793) 518582 These are supported by Agents and Distributors in major countries world-wide. © GEC Plessey Semiconductors 1995 Publication No. DS4015 Issue No. 2.5 July 1995 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. 18 For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request. Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE