MITEL SL6609AKGNPDE

SL6609A
Direct Conversion FSK Data Receiver
Advance Information
DS4015 - 2.5 July 1995
This device is an advanced direct conversion receiver for
operation up to 470MHz. The design is based on the SL6609
receiver and is a pin for pin product upgrade. The device
integrates all functions to translate a binary FSK modulated
RF signal into a demodulated data stream. Adjacent channel
rejection is provided using tuneable gyrator filters. To assist
operation in the presence of large interfering signals both RF
and audio AGC functions are provided.
The device also includes a 1 volt regulator capable of
sourcing up to 5mA, a battery flag and the facility of incorporating
a more complex post detection filter off-chip. Both battery flag
and data outputs have open collector outputs to ease their
interface with other devices.
TPX
1
28
IAGCOUT
RFIADJ
2
27
IRFAMP
LOY
3
26
MIXA
GYRI
4
25
GND
LOX
5
24
MIXB
VR
6
23
VREG
TPY
7
22
REGCNT
GTHADJ
8
21
VCC1
TCADJ
9
20
VBATT
BEC
10
19
VBG
BATTFL
11
18
DIGGND
TPLIMY
12
17
BRF1
VCC2
13
16
BRF2
DATAOP
14
15
TPLIMX
FEATURES
■
■
■
■
■
■
Very low power operation - typ 3.0mW
Single cell operation for most of the device.
Limited functional blocks operating via an inverter
Superior sensitivity of -130dBm
Operation at wide range of paging data rates
512, 1200, 2400 baud
On chip 1 volt regulator
Small package offering SSOP
NP28
Fig.1 Pin connections
ABSOLUTE MAXIMUM RATINGS
Supply voltage
Storage temperature
Operating temperature
APPLICATIONS
■
■
■
■
Credit card pagers
Watch pagers
Small form factor pagers i.e. PCMCIA
Low data rate data receivers i.e. Security/remote
control
23
22
4
+
-
VR
1
ORDERING INFORMATION
SL6609A / KG / NPDS
SL6609A / KG / NPDE
20
VR
6V
-55°C to +150°C
-20°C to +70°C
11
15
+
6
10
VR
BEC
- SSOP devices in anti-static sticks
- SSOP devices in tape and reel
21
13
18
VCC1 VCC2 GND
19
VBG
GND
25
17
MIXER
24
16
14
LIMITER
4Ø
DETECTOR
LIMITER
9
26
28
5
3
2
27
7
12
Fig.2 Block diagram of SL6609A
8
SL6609A
ELECTRICAL CHARACTERISTICS
These characteristics are guaranteed over the following conditions unless otherwise stated:
Tamb = 25°C, VCC1 = 1.3V, VCC2 = 2.7V
Value
Characteristics
Pin
Units
Min
Typ
Max
VCC1 - Supply voltage
21
0.95
1.3
2.8
V
VCC2 - Supply voltage
13
1.8
2.7
3.5
V
ICC1 - Supply current
21,27,28
1.5
1.8
mA
ICC2 - Supply current
11,13,14
550
700
µA
Power down ICC1
Power down ICC2
21,27,28
11,13,14
1
8
µA
µA
1 volt regulator
23
0.95
1.0
1.05
V
Band gap voltage reference
Band gap current source
Voltage reference
Voltage reference sink/source
1 volt regulator load current
19
19
6
6
1.15
1.21
0.93
1.0
0.25
3
1.27
20
1.07
10
5
V
µA
V
µA
mA
Comments
VCC1 < VCC2 - 0.7 volts
Includes IRF. Does not include
regulator supply. Audio
AGC inactive
Batt flag & Data O/P high
Pin 27 voltage: 0.3 - 1.3V
I Load = 3mA. Ext PNP.
ß >= 100, VCE = 0.1 volt
VCC1 > 1.1V
Turn on Time
5
ms
Stable data o/p when 3dB above
sensitivity. CBG and CVR = 2.2µF
Turn off Time
1
ms
Fall to 10% of steady state current
CBG and CVR = 2.2µF
+/-4
µA
Detector output current
17
RF current source
Current Source
(IRF)
27
400
500
600
µA
Pin 27 voltage: 0.3 - 1.3V
Decoder
Output mark space ratio
Data O/P Sink Current
Data O/P Leakage Current
2
µVrms
40
Sensitivity
14
14
14
7:9
100
9:7
500
1.0
µA
µA
Signal injected at TPX and TPY
B.E.R. < 1 in 30
5KHz deviation @ 1200 bits/sec
BRF capacitor = 1nF
Output logic low
Output Iogic high
SL6609A
ELECTRICAL CHARACTERISTICS
These characteristics are guaranteed over the following conditions unless otherwise stated:
Tamb = 25°C, VCC1 = 1.3V, VCC2 = 2.7V
Value
Characteristics
Pin
Min
Battery Economy
Input logic high
Input logic low
Input current
Input current
10
10
10
10
Battery Flag Input
Input current
20
Battery Flag Output
Battfl Sink Current
Battfl leakage current
11
11
Mixers
Gain to "IF Test"
RF input impedance
LO input impedance
LO DC bias voltage
Audio AGC
Max Audio AGC Sink Current
Max
0.05
6
0.3
1
8
(VCC2 - 0.3)
V
V
µA
µA
Powered Up
Powered Down
Powered Up
Powered down transient initial
µA
1
50
500
1
µA
µA
(VBATT-VR) > 20mV
(VBATT-VR) < -20mV
34
41
dB
LO inputs driven in parallel with
50mVRMS @ 50MHz.IF = 2kHz
See Figs.8a, 8b
See Fig.9
Equal to Pin 21 (VCC1)
24, 26
3, 5
3, 5
28
Comments
Units
Typ
V
45
65
85
µA
RECEIVER CHARACTERISTICS (Demonstration board)
Measurement conditions unless stated VCC1 = 1.3V, VCC2 = 2.7V, LNA = 18dB Power Gain, 2dB Noise figure,
Carrier frequency 153MHz, BER 1 in 30, Tamb = 25°C
(TPx/TPy typically:- 160mVPP ± 10% for - 73dBm RF input to the LNA)
Value
Characteristics
Units
Pin
Min
Typ
Max
-130
-128
-125
Intermodulation
52
Adjacent channel
68
Comments
dBm
1200 bps ∆f = 4kHz
LO = -18dBm
56
dB
1200 bps ∆f = 4kHz
LO = -18dBm
73
dB
1200 bps ∆f = 4kHz
LO = -18dBm
Channel spacing 25kHz
Centre frequency acceptance
+/-2.3
kHz
1200 bps ∆f = 4kHz
LO = -18dBm
Deviation acceptance
+/-2.2
kHz
1200 bps ∆f = 4kHz
LO = -18dBm
Sensitivity
3
SL6609A
RECEIVER CHARACTERISTICS (Demonstration board)
Measurement conditions unless stated VCC1 = 1.3V, VCC2 = 2.7V, LNA = 20dB Power Gain, 2dB Noise figure,
Carrier frequency 282MHz, BER 1 in 30, Tamb = 25°C
(TPx/TPy typically:- 160mVPP ± 10% for - 73dBm RF input to the LNA)
Value
Characteristics
Units
Pin
Min
Typ
Max
-130
-128
-125.5
-125
-122
Intermodulation (IP3)
52
49
Intermodulation (IP2)
Adjacent channel
Sensitivity
Centre frequency acceptance
Comments
dBm
dBm
1200 bps ∆f = 4kHz
2400 bps ∆f = 4.5kHz
LO = -15dBm
56
53.5
dB
1200 bps ∆f = 4kHz
2400 bps ∆f = 4.5kHz
LO = -15dBm
47
52
dB
1200 bps ∆f = 4kHz
LO = -15dBm
67
64
72.5
69.5
dB
1200 bps ∆f = 4kHz
2400 bps ∆f = 4.5kHz
LO = -15dBm
Channel spacing 25kHz
+/-1.9
+/-2.3
+/-2
kHz
1200 bps ∆f = 4kHz
2400 bps ∆f = 4.5kHz
LO = -15dBm
+/-2.2
+/-2
kHz
1200 bps ∆f = 4kHz
2400 bps ∆f = 4.5kHz
LO = -15dBm
Deviation acceptance
RECEIVER CHARACTERISTICS
Measurement conditions unless stated VCC1 = 1.3V, VCC2 = 2.7V, LNA = 22dB Power Gain, 2dB Noise figure,
Carrier frequency 470MHz, BER 1 in 30, Tamb = 25°C
(TPx/TPy typically:- 140mVPP ± 10% for - 73dBm RF input to the LNA)
Value
Characteristics
Min
Typ
Max
-128
-126
-123
Intermodulation
50
Adjacent channel
67
Comments
dBm
1200 bps ∆f = 4kHz
LO = -15dBm
55.5
dB
1200 bps ∆f = 4kHz
LO = -15dBm
72.5
dB
1200 bps ∆f = 4kHz
LO = -15dBm
Channel spacing 25kHz
Centre frequency acceptance
+/- 2.3
kHz
1200 bps ∆f = 4kHz
LO = -15dBm
Deviation acceptance
+/- 2.2
kHz
1200 bps ∆f = 4kHz
LO = -15dBm
Sensitivity
4
Units
Pin
SL6609A
OPERATION OF SL6609A
The SL6609A is a Direct Converson Receiver designed for
use up to 470MHz. It is available in a 28 pin SSOP package
and it integrates all the facilities required for the conversion of
an RF FSK signal to a base-band data signal.
Low Noise Amplifier
To achieve optimum performance it is necessary to
incorporate a Low Noise RF Amplifier at the front end of the
receiver. This is easily biased using the on chip voltage and
current sources provided.
Gyrator Filters
The on chip filters include an adjustable gyrator filter. This
may be adjusted with the use of an additional resistor between
Pin 4 and GND. This allows flexibility of filter characterstics
and also allows for compensation for possible process
variations.
Audio AGC
All voltages and current sources used for bias of the RF
amplifier, receiver and mixers should be RF decoupled using
suitable capacitors (see Fig.4 for a suitable Low-NoiseAmplifier).
The Audio AGC fundamentally consists of a current sink
which is controlled by the audio (baseband data) signal. It has
three parameters that may be controlled by the user. These
are the Attack (turn on) time, Decay (duration) time and
Threshold level (see Figs.6 and 7). See Application note for
details.
Local Oscillator
Regulator
The Local Oscillator signal is applied to the device in phase
quadrature. This can be achieved with the use of two RC
networks operating at the -3dB/45° transfer characteristic,
giving a full 90° phase differential between the LO ports of the
device. Each LO port of the device also requires an equal level
of drive from the Oscillator. (see Fig.5).
The on chip regulator must be used in conjunction with a
suitable PNP transistor to achieve regulation. As the
transistor forms part of the regulator feedback loop the
transistor should exhibit the following characteristics:HFE > = 100 for VCE > = 0.1V
Pin Number
Pin Name
Pin Description
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
TPX
RFIADJ
LOY
GYRI
LOX
VR
TPY
GTHADJ
TCADJ
BEC
BATTFL
TPLIMY
VCC2
DATAOP
TPLIMX
BRF2
BRF1
DIG GND
VBG
VBATT
VCC1
REGCNT
VREG
MIXB
GND
MIXA
IRFAMP
28
IAGCOUT
X channel pre-gyrator filter test-point. This can be used for input and output
RF current source adjustment pin
LO input channel Y
Gyrator current adjust pin
LO input channel X
VREF 1.0 V internal signal ground
Y channel pre-gyrator filter test point, input or output
Audio AGC gain and threshold adjust. RSSI signal indicator
Audio AGC time constant adjust
Battery economy control
Battery flag output
Y channel limiter (post gyrator filter) test point, output only
Supply connection
Data output pin
X channel limiter (post gyrator filter) test point, output only
Bit rate filter 2, input to data output stage
Bit rate filter 1, output from detector
Digital ground
Bandgap voltage output
Battery flag input voltage
Supply connection
1V regulator control external PNP drive
1V regulator output voltage
Mixer input B
Ground
Mixer input A
Current source for external LNA. Value of current output will decrease at high mixer
input signal levels due to RF AGC
Audio AGC output current
5
Fig.3 Application circuit board
6
Vbg
SL6609A
note 3
SL6609A
SL6609A
COMPONENTS LIST FOR APPLICATION BOARD At 282MHz, 25kHz Channel Spacing.
(LO Circuit in Fig.3)
Resistors
R1
open circuit
R2
open circuit
R3
100
R4
100k
R5
1k
R6
1k
R7
100
R8
open circuit
R9
220k
R10
1M
R11
100k (6)
R12
not used
R13
1k5(1)
R14
4k7
R15
4k7
R16
33k
R17
not used
R18
0R (3)
R19
10k
R20
620
R21
1k
R22
open circuit
Capacitors
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C17
C17a
1n
2p7
4p7
1n
2p7
2u2
1n
100n
1n (2)
2u2
100n
1n
1n
1n
1n
1n
1n
1n
C18
C19
C20
C21
C22
C23
C24
C25
C26
C27
C28
C29
C30
C31
C32
C33
C34
C35
VC1
VC2
VC3
1n
not used
1n
1n
not used
1n
1n
1n
6p8
1n
1n
100p
2u2
2u2
4p7
4p7
3p3
not used
1-10p
1-10p
1-10p
Inductors
L1
L2
L3
L4
L5
68n (4)
not used (3)
470n
39n
680n
Active Components
Q1
FMMT589
Q2
2SC5065 (Toshiba)
Q3
BFT25A (Philips)
Q4
not used
Q5
2SC5065 (Toshiba)
D1
Panasonic MA862 (5)
Misc
T1
Xtal
30nH 1:1
Coilcraft M1686-A
5th Overtone
94.075MHz
Notes
1.
The values of R13 is determined by the set-up procedure. See Application Note.
2.
The value of C9 is determined by the output data rate.
Use 2nF for 512bps, 1nF for 1200bps and 470pF for
2400bps.
3.
L2 is used in the Audio AGC circuit (see Fig. 6). For the
characteristics of the Audio AGC current source see
Fig.7. If the audio AGC is not required then the current
source (Pin 28) may be disabled by connecting Pin 9
(TCADJ) to VR (Pin 6) and by connecting Pin 28
(IAGCOUT) to Vcc1, (R18). The voltage at Pin 8 may
still be used as an RSSI. R9, C8, C14, C19, R17 and
D1 may then be omitted. See Fig.6 for AGC
component values.
4.
L1and C26 form the low noise matching network for the
RF amplifier. The values given are for the RF amplifier
specified in the Applications Circuit with no Audio AGC
connected. i.e. R17 and D1 omitted.
5.
Suggested diode for use with the Audio AGC circuit
(see Fig.6) (D1 is not included on the general demonstration circuit).
6.
The value of R11 is dependent on the data output load.
R11 should allow sufficient current to drive the data
output load.
7
SL6609A
COMPONENTS LIST FOR APPLICATION BOARD At 470MHz, 25kHz Channel Spacing.
(LO circuit is 50Ω network as in Fig.5 - crystal oscillator not specified)
Resistors
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R11
R12
R13
R14
R15
R16
R17
R18
R22
open circuit
open circuit
100
100k
100
100
100
open circuit
220k
1M
100k (2)
300 (3)
3k9 (1)
4k7
4k7
33k
open circuit (4)
0R (4)
open circuit
1n
1n
1n
1n
1n
not used
1n
1n
not used
not used
1n
1n
open circuit
not used
not used
100p
2u2
2u2
1p5
1-3pF
Inductors
Capacitors
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
C21
C22
C23
C24
C25
C26
C27
C28
C29
C30
C31
C34
VC1
1n
3.3pF
1n
1n
3.9pF
2u2
1n
100n
1n (2)
2u2
100n
1n
1n
L1
L2
T1
47nH (5)
not used (3)
16nH 2 Turn 1:1 (Coilcraft) Q4123-A
Active Components
Q1
Q2
Q3
Q4
Q5
D1
Zetex FMMT589
Philips BFT25A
Not Used
Philips BFT25A(3)
Philips BFT25A
Panasonic MA862(6)
Notes
1.
The values of R13 is determined by the set-up procedure. See Application Note.
2.
The value of "C9" is determined by the output data rate.
Use 2nF for 512bps, 1nF for 1200bps and 470pF for
2400bps.
3.
4.
8
R12 & Q4 form a dummy load for the regulator.
Permitted load currents for the regulator are 250µA to
5mA. The 1V regulator (output Pin 23) can be switched
off by connecting Pin 23 directly to VCC2. Q1, Q4, R12
and C12 must then be omitted
L2 is used in the Audio AGC circuit (see Fig.6). For the
characteristics of the Audio AGC current source see
figure 7. If the Audio AGC is not required then the
current source (Pin 28) may be disabled by connecting
Pin 9 (TCADJ) to VR (Pin 6) and by connecting Pin 28
(IAGCOUT) to Vcc1, (R18). The voltage at Pin 8 may
still be used as an RSSI. R9, C8, C14, C19, R17 and
D1 may then be omitted.
5.
L1and C26 form the low noise matching network for the
RF amplifier. The values given are for the RF amplifier
specified in the Applications Circuit with no Audio AGC
connected. i.e. R17 and D1 omitted.
6.
Suggested diode for use with the Audio AGC circuit
(D1 is not included on the general demonstration
circuit).
7.
The value of R11 is dependent on the data output load.
R11 should allow sufficient current to drive the data
output load.
SL6609A
Fig.4 RF amplifier
RF Amplifier Components Values
Resistors
R14, R15
R13
R22
4k7
see note 1
47k
Capacitors
C13, C15
C16, C17
C20, C21
C24, C25
L2
1nF
1nF
1nF see note 2
1nF
820nH
Active components
D1 MA862 (Panasonic)
Notes:
(1) The value of R13 is determined by the set up procedure (See "Set up for optimum performance").
(2)
C20 and C21 are purely for deomonstration purposes. Pin 24 and Pin 26 may be DC coupled provided that no DC voltage is applied to the
mixer inputs.
Frequency Dependent Components
153MHz
not used
not used
150nH
3p3
100nH
Coilcraft N2261-A
VC1
1-10pF
Q4, Q5
Toshiba 2SC5065
(See also Lo drive Network)
C26
C27
L1
C34
T1
280MHz
6.8p
not used
68nH
2p2
30nH
Coilcraft M1686-A
1-10pF
Toshiba 2SC5065
450MHz
not used
not used
39nH
1p5
16nH
Coilcraft Q4123-A
1-3pF
Philips BFT25A
Fig.5 Local oscillator drive network
LO Drive Network Component Values
50Ohm input impedance (External LO injection)
153MHz
280MHz
450MHz
C2
10p
5p6
3p3
C5
10p
5p6
3p9
C3, C4, C18 = 1n
R3, R5, R6, R7 = 100Ohms
Higher Input Impedance (crystal oscillator input)
153MHz
280MHz
450MHz
C3
Set by load allowable on crystal oscillator (typical 4p7)
C2
10p
5p6
3p3
C5
10p
5p6
3p9
R3
100
100
100
R7
100
100
100
R5, R6 = 1k
C4, C18 = 1n
9
SL6609A
Vcc1
RF
input
current
source 1
Vr
100k
+
pin 8
Vcc1
C15
-
-
R22
L1
Pin 28 L2
C26
Ctc
C8
Rdecay
R9
Vr
D1
to RF
Amp
+
Pin 9
R16
C22
Vr
current
source 2
D1 = MA862
R9 = 220k
C8 = 100nF
L2 = 820nH
R22 = 47k
R16 = 33k
C22 = 1n
Note L1, C26 and C15 are part of
RF Amplifier (see Fig.4)
Fig.6 AGC Schematic
50
VCC2=4 VCC1=3
45
Pin 28 OP Current (µA)
40
VCC2=1.8
VCC1=1.0
35
30
VCC2=2.7
VCC1=1.3
25
20
15
10
5
0
-120
-115
-110
-105
-100
-95
-90
-85
-80
IP Level dBm
Fig.7 Audio AGC current vs. IP power at 25°C
10
-75
-70
-65
-60
SL6609A
S11
FREQ
50.000
100.000
150.000
200.000
250.000
300.000
350.000
400.000
450.000
500.000
550.000
600.000
650.000
700.000
750.000
800.000
850.000
900.000
950.000
1000.00
MAG
0.969
0.958
0.942
0.917
0.893
0.858
0.832
0.806
0.781
0.755
0.743
0.725
0.703
0.680
0.666
0.653
0.636
0.615
0.604
0.600
ANG
-7.20
-14.45
-20.59
-26.40
-33.26
-39.84
-44.78
-49.01
-54.00
-59.53
-64-35
-68.43
-73.01
-78.74
-83.76
-87.48
-91.32
-97.17
-102.84
-105.23
1
2
.5
.2
50MHz
1GHz
Fig.8a SL6609A Mixer A input S-Parameters
S11
FREQ
50.000
100.000
150.000
200.000
250.000
300.000
350.000
400.000
450.000
500.000
550.000
600.000
650.000
700.000
750.000
800.000
850.000
900.000
950.000
1000.00
MAG
0.970
0.960
0.945
0.919
0.902
0.872
0.850
0.825
0.803
0.776
0.760
0.739
0.717
0.698
0.683
0.666
0.659
0.647
0.637
0.634
ANG
-7.06
-13.83
-19.90
-25.70
-32.18
-38.03
-43.07
-48.27
-53.58
-58.49
-63.08
-67.98
-72.63
-76.96
-81.09
-85.49
-89.51
-93.90
-98.42
-102.40
1
2
.5
.2
50MHz
1GHz
Fig.8b SL6609A Mixer B input S-Parameters
S11
FREQ
50.000
100.000
150.000
200.000
250.000
300.000
350.000
400.000
450.000
500.000
550.000
600.000
650.000
700.000
750.000
800.000
850.000
900.000
950.000
1000.00
MAG
0.993
0.995
0.997
0.997
0.996
0.986
0.965
0.936
0.902
0.872
0.838
0.804
0.798
0.810
0.784
0.779
0.790
0.788
0.768
0.743
ANG
-4.17
-8.43
-12.88
-17.57
-22.63
-28.16
-33.87
-39.17
-43.88
-48.54
-52.81
-56.60
-59.47
-65.19
-71.49
-75.97
-82.54
-91.16
-100.20
-108.52
1
2
.5
.2
50MHz
1GHz
Fig.9 SL6609A LO X,Y inputs S-Parameters
11
SL6609A
Fig.10a AC parameters vs. supply and temperature
Conditions:- 282MHz demonstration board i.e. 20dB LNA, 2dB
noise figure, carrier frequency 282MHz, 1200bps
baud rate, 4kHz deviation frequency, BER 1 in 30.
Vcc1 = 1.0V, Vcc2 = 1.8V
Vcc1 = 1.3V, Vcc2 = 2.7V
Vcc1 = 3.0V, Vcc2 = 4.0V
12
SL6609A
Fig.10b AC parameters vs. supply and temperature
Conditions:- 282MHz demonstration board i.e. 20dB LNA, 2dB
noise figure, carrier frequency 282MHz, 1200bps
baud rate, 4kHz deviation frequency, BER 1 in 30.
Vcc1 = 1.0V, Vcc2 = 1.8V
Vcc1 = 1.3V, Vcc2 = 2.7V
Vcc1 = 3.0V, Vcc2 = 4.0V
13
SL6609A
Fig.11 DC parameters vs. supply and temperature
(IP3 vs audio AGC both on and off)
Conditions:- ICC1 includes 500µA LNA current but does not
include the regulator supply (audio AGC inactive).
ICC2 measured with BATT FLAG and DATA O/P
HIGH, Fc = 282MHz.
Note 1- IP3 is level above wanted needed to reduce
receiver to 1 in 30 B.E.R.
14
Vcc1 = 0.98V, Vcc2 = 1.78V
Vcc1 = 1.3V, Vcc2 = 2.7V
Vcc1 = 3.0V, Vcc2 = 4.0V
SL6609A
Fig.12 Sensitivity, IP3 vs Receiver Gain
Fig.13 Sensitivity, adjacent Channel vs Receiver Gain
15
SL6609A
-124
55
-125
Sensitivity
IP3
-126
54
-127
(dB)
56
-123
IP3
Sensitivity
(dBm)
-122
53
-128
- 5
- 7
- 9
-11
-13
-15
-17
-19
-21
-23
52
-25
-129
LO Drive Level (dBm)
Fig.14 Sensitivity, IP3 vs LO level
(dBm)
Sensitivity
Sensitivity
ACR
-123
73
-124
-125
72.5
-126
72
-127
71.5
-128
LO Drive Level (dBm)
Fig.15 Sensitivity, Adjacent Channel vs LO level
16
- 5
- 7
- 9
-11
-13
-15
-17
-19
-21
-23
71
-25
-129
Adj. Channel (dB)
73.5
-122
SL6609A
17
SL6609A
PACKAGE DETAILS
Dimensions are shown thus: mm (in)
10·07/10·33
(0·396/0·407)
28
5·20/5·38
(0·205/0·212)
0-8°
15
7·65/7·90
(0·301/0·311)
PIN 1 IDENT
0·55/0·95
(0·022/0·037)
14
1
0·13/0·20
(0·005/0·008)
0·25/0·38
(0·010/0·015)
1·68/1·78
(0·066/0·070)
1·73/1·99
(0·065/0·078)
28 LEADS AT
0·65 (0·0256)
NOM. SPACING
0·05/0·21
(0·002/0·008)
NOTES
1. Controlling dimensions are millimetres.
2. This package outline diagram is for guidance
only. Please contact your Mitel Semiconductor
Customer Service Centre for further information.
28-LEAD SHRUNK MINIATURE PLASTIC DIL (SSOP) - NP28
HEADQUARTERS OPERATIONS
MITEL SEMICONDUCTOR
Cheney Manor, Swindon,
Wiltshire SN2 2QW, United Kingdom.
Tel: (01793) 518000
Fax: (01793) 518411
MITEL SEMICONDUCTOR
1500 Green Hills Road,
Scotts Valley, California 95066-4922
United States of America.
Tel (408) 438 2900
Fax: (408) 438 5576/6231
Internet: http://www.gpsemi.com
CUSTOMER SERVICE CENTRES
● FRANCE & BENELUX Les Ulis Cedex Tel: (1) 69 18 90 00 Fax : (1) 64 46 06 07
● GERMANY Munich Tel: (089) 419508-20 Fax : (089) 419508-55
● ITALY Milan Tel: (02) 6607151 Fax: (02) 66040993
● JAPAN Tokyo Tel: (03) 5276-5501 Fax: (03) 5276-5510
● KOREA Seoul Tel: (2) 5668141 Fax: (2) 5697933
● NORTH AMERICA Scotts Valley, USA Tel: (408) 438 2900 Fax: (408) 438 5576/6231
● SOUTH EAST ASIA Singapore Tel:(65) 3827708 Fax: (65) 3828872
● SWEDEN Stockholm Tel: 46 8 702 97 70 Fax: 46 8 640 47 36
● TAIWAN, ROC Taipei Tel: 886 2 25461260 Fax: 886 2 27190260
● UK, EIRE, DENMARK, FINLAND & NORWAY
Swindon Tel: (01793) 726666 Fax : (01793) 518582
These are supported by Agents and Distributors in major countries world-wide.
© Mitel Corporation 1998 Publication No. DS4015 Issue No. 2.5 July 1995
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded
as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company
reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any
guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and
to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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