ZXCL200 ULTRA SMALL MICROPOWER SC70 2V 100mA REGULATOR DESCRIPTION The ZXCL200 is a very small 2 volt regulator designed for use in low power and severely space limited applications. Supply current is minimised with a ground pin current of only 40µA at full 100mA load. Logic control allows the device to be shut down, consuming typically less than 10nA. These features make it ideal for battery powered applications where power economy is critical. The part has been designed with space sensitive systems in mind. It is available in the ultra small SC70 package, which is half the size of other SOT23 based regulator devices For applications requiring improved performance over alternative devices, the ZXCL200 is also offered in the 5 pin SOT23 package with an industry standard pinout. The device features thermal overload and over-current protection. T h e Z X C L 2 0 0 i s m a n u f a ct u r e d u si n g C M O S processing, however advanced design techniques mean that output noise is improved even when compared to other bipolar devices. FEATURES APPLICATIONS • 5-pin SC70 package for the ultimate in space • Cellular and Cordless phones saving • Palmtop and laptop computers • 5-pin SOT23 industry standard pinout • PDA • 40µA ground pin current with full 100mA load • Hand held instruments • Typically less than 10nA ground pin current on • Camera, Camcorder, Personal Stereo shutdown • 2 volt output • PCMCIA cards • Very low noise, without bypass capacitor • Portable and Battery-powered equipmenth • Thermal overload and over-current protection • -40 to +85°C operating temperature range TYPICAL APPLICATION CIRCUIT PACKAGE FOOTPRINT Total Aea 2.1mm x 2mm =4.2mm2 Output Voltage Battery Supply ZXCL Total Aea 2.8mm x 2.9mm =8.12mm2 ISSUE 1 - SEPTEMBER 2001 1 ZXCL200 ABSOLUTE MAXIMUM RATINGS Terminal Voltage with respect to GND VIN EN VO Output short circuit duration Continuous Power Dissipation Operating Temperature Range Storage Temperature Range -0.3V to 7.0V -0.3V to 10V -0.3V to 5.5V Package Power Dissipation (TA=25°C) SC70 300mW (Note 1) SOT23-5 450mW (Note 1) Infinite Internally limited -40⬚C to + 85⬚C -55⬚C to + 125⬚C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS VIN = VO + 0.5V, typical values at TA=25°C (Unless otherwise stated) SYMBOL PARAMETER CONDITIONS LIMITS MIN V IN Input Voltage T A =-40⬚C (note2) VO Output Voltage I O = 1mA I O = 100mA 1.96 1.94 (Note 3) TYP 2 UNITS MAX 5.5 V 2.04 2.06 V V V O +0.5V < V IN < V IN max ∆V O /∆T Output Voltage Temperature Coefficient -15 I O(MAX) Output Current 100 I OLIM Over Current Limit 105 IQ Ground pin current ⌬V LNR Line Regulation ⌬V LDR Load Regulation EN Output Noise Voltage f=10Hz to 100kHz, C O =10µF, V ENH Enable pin voltage for normal operation T A = -40°C V ENL Enable pin voltage for output shutdown ppm/°C mA 750 mA 25 40 50 100 A A VIN=(VO+0.5V) to 5.5V, IO=1mA 0.02 0.1 %/V IO=1mA to 100mA 0.01 0.04 %/mA No Load IO = 100mA µV rms 50 2 2.2 10 V 0 0.8 V Device testing is performed at T A =25⬚C. Device thermal performance is guaranteed by design. Note 1: Maximum power dissipation is calculated assuming the device is mounted on a PCB measuring 2 inches square Note 2: Output Voltage will start to rise when V IN exceeds a value or approximately 1.3V. For normal operation, V IN (min) > V OUT (nom) + 0.5V. Note 3: Nominal value of V O is defined at V IN =V O +0.5V. ISSUE 1 - SEPTEMBER 2001 2 ZXCL200 TYPICAL CHARACTERISTICS ISSUE 1 - SEPTEMBER 2001 3 ZXCL200 TYPICAL CHARACTERISTICS ISSUE 1 - SEPTEMBER 2001 4 ZXCL200 PIN DESCRIPTION Pin Name Pin Function V IN Supply Voltage G ND Ground EN Active HIGH Enable input. TTL/CMOS logic compatible. Connect to V IN or logic high for normal operation N/C No Connection VO Regulator Output CONNECTION DIAGRAMS SOT23-5 Package Suffix – E5 VIN GND EN 1 5 SC70 Package Suffix – H5 VO 2 3 4 N/C VIN GND EN 1 5 VO 2 4 3 Top View ZXCLXXX SC70 Package Suffix –H5 N/C EN GND N/C Top View ZXCLXXX ISSUE 1 - SEPTEMBER 2001 5 5 VIN 3 4 VO Top View ZXCL1XXX SCHEMATIC DIAGRAM 1 2 ZXCL200 Input to Output Diode Increased Output current In common with many other regulators, the ZXCL200 device has an inherent diode associated with the output series pass transistor. This diode has its anode connected to the output and its cathode to the input. The internal diode is normally reverse biased, but will conduct if the output is forced above the input by more than a VBE (approximately 0.6V). Current will then flow from Vout to Vin. For safe operation, the maximum current in this diode should be limited to 5mA continuous and 30mA peak. An external schottky diode may be used to provide protection when this condition cannot be satisfied. Any ZXCL series device may be used in conjunction with an external PNP transistor to boost the output current capability. In the application circuit shown below, a FMMT717 device is employed as the external pass element. This SOT23 device can supply up to 2.5A maximum current subject to the thermal dissipation limits of the package (625mW). Alternative devices may be used to supply higher levels of current. Note that with this arrangement, the dropout voltage will be increased by the VBE drop of the external device. Also, care should be taken to protect the pass transistor in the event of excessive output current. Q1 FMMT717 VIN VOUT R1 5.6R U1 ZXCL SERIES C3 EN VO GND VIN 1uF C2 C1 1uF 1uF Scheme to boost output current to 2A ISSUE 1 - SEPTEMBER 2001 6 ZXCL200 APPLICATIONS INFORMATION Enable Control A TTL compatible input is provided to allow the regulator to be shut down. A low voltage on the Enable pin puts the device into shutdown mode. In this mode the regulator circuit is switched off and the quiescent current reduces to virtually zero (typically less than 10nA). A high voltage on the Enable pin ensures normal operation. R C The Enable pin can be connected to VIN or driven from an independent source of up to 10V maximum. (e.g. CMOS logic) for normal operation. There is no clamp diode from the Enable pin to VIN, so the VIN pin may be at any voltage within its operating range irrespective of the voltage on the Enable pin. Figure 1 Circuit Connection Current Limit The ZXCL200 device includes a current limit circuit which restricts the maximum output current flow to typically 200mA. Practically the range of over-current should be considered as minimum 105mA to maximum 750mA. The device’s robust design means that an output short circuit to any voltage between ground and VOUT can be tolerated for an indefinite period. Td Figure 2 Start up delay (Td) Thermal Overload Thermal overload protection is included on chip. When the device junction temperature exceeds a minimum 125°C the device will shut down. The sense circuit will re-activate the output as the device cools. It will then cycle until the overload is removed. The thermal overload protection will be activated when high load currents or high input to output voltage differentials cause excess dissipation in the device. VIN Td(NOM) = RCIn VIN − 1.5 Calculation of start up delay as above Start up delay A small amount of hysteresis is provided on the Enable pin to ensure clean switching. This feature can be used to introduce a start up delay if required. Addition of a simple RC network on the Enable pin provides this function. The following diagram illustrates this circuit connection. The equation provided enables calculation of the delay period. ISSUE 1 - SEPTEMBER 2001 7 ZXCL200 APPLICATIONS INFORMATION (Cont) Capacitor Selection and Regulator Stability Power Dissipation The device is designed to operate with all types of output capacitor, including tantalum and low ESR ceramic. For stability over the full operating range from no load to maximum load, an output capacitor with a minimum value of 1µF is recommended, although this can be increased without limit to improve load transient performance. Higher values of output capacitor will also reduce output noise. Capacitors with ESR less than 0.5Ω are recommended for best results. The maximum allowable power dissipation of the device for normal operation (Pmax), is a function of the package junction to ambient thermal resistance (θja), maximum junction temperature (Tjmax), and ambient temperature (Tamb), according to the expression: Pmax = (Tjmax – Tamb) / θja The maximum output current (Imax) at a given value of Input voltage (VIN) and output voltage (VOUT) is then given by An input capacitor of 1µF (ceramic or tantalum) is recommended to filter supply noise at the device input and will improve ripple rejection. Imax = Pmax / (VIN - VOUT ) Max Power Dissipation (mW) The value of θja is strongly dependent upon the type of PC board used. Using the SC70 package it will range from approximately 280 °C/W for a multi-layer board to around 450°C/W for a single sided board. It will range from 180°C/W to 300°C/W for the SOT23-5 package. To avoid entering the thermal shutdown state, Tjmax should be assumed to be 125°C and Imax less than the over-current limit,(IOLIM). Power derating for the SC70 and SOT23-5 packages is shown in the following graph. The input and output capacitors should be positioned close to the device, and a ground plane board layout should be used to minimise the effects of parasitic track resistance. Ground Current The use of a PMOS device ensures a low value of ground current under all conditions including dropout, start-up and maximum load. Power Supply Rejection and Load Transient Response Line and Load transient response graphs are shown in the typical characteristics. 500 400 These show both the DC and dynamic shift in the output voltage with step changes of input voltage and load current, and how this is affected by the output capacitor. SOT23 300 200 If improved transient response is required, then an output capacitor with lower ESR value should be used. Larger capacitors will reduce over/undershoot, but will increase the settling time. Best results are obtained using a ground plane layout to minimise board parasitics. SC70 100 0 -40 -20 0 20 40 60 80 100 Temperature (°C) Derating Curve ISSUE 1 - SEPTEMBER 2001 8 ZXCL200 PACKAGE DIMENSIONS SOT23-5 DIM Millimetres MIN MAX A 0.90 1.45 A1 0.00 0.15 A2 0.90 1.3 b 0.35 0.50 C 0.09 0.20 D 2.80 3.00 E 2.60 3.00 E1 1.50 1.75 e 0.95 REF e1 1.90 REF L 0.10 0.60 a° 0 10 DIM Millimetres SC70 ORDERING INFORMATION MIN A DEVICE ZXCL200H5 Output Package Voltage V Partmarking 2.0 L20A SC70 ZXCL1200H5 2.0 SC70 L20C ZXCL200E5 2.0 SOT23-5 L20B MAX 1.00 A1 0.10 A2 0.70 b 0.15 C 0.08 D 2.00BSC E 2.10BSC E1 1.25BSC e 0.65BSC e1 1.30BSC L 0.26 0.46 a° 0 8 © Zetex plc 2001 Zetex plc Fields New Road Chadderton Oldham, OL9 8NP United Kingdom Telephone (44) 161 622 4422 Fax: (44) 161 622 4420 Zetex Inc Suite 315 700 Veterans Memorial Highway Hauppauge NY11788 USA Telephone: (631) 360 2222 Fax: (631) 360 8222 Zetex GmbH Streitfeldstraße 19 D-81673 München Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 Zetex (Asia) Ltd 3701-04 Metroplaza, Tower 1 Hing Fong Road Kwai Fong, Hong Kong China Telephone: (852) 26100 611 Fax: (852) 24250 494 These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com ISSUE 1 - SEPTEMBER 2001 9