HITACHI HD151TS302RP

HD151TS302RP
Spread Spectrum Clock for EMI Solution
ADE-205-655A (Z)
Preliminary
Rev. 1
Sep. 2001
Description
The HD151TS302 is a high-performance Spread Spectrum Clock modulator. It is suitable for low EMI
solution.
Features
• Supports 10 MHz to 60 MHz operation. (Designed for XIN = 24 MHz and 48 MHz)
• 1 copy of clock out with spread spectrum modulation @3.3 V
• 1 copy of reference clock @3.3 V
• Programmable spread spectrum modulation (–0.5%, –1.0%, –3.0% down spread modulation and spread
spectrum disable mode.)
• SOP–8pin
• Pin to pin compatible with HD151TS301RP
Key Specifications
• Supply voltages : VDD = 3.3 V±0.165 V
• Ta = 0 to 70°C operating range
• Clock output duty cycle = 50±5%
• Cycle to cycle jitter = ±250 ps typ.
HD151TS302RP
Block Diagram
VDD
GND
CLKOUT
XIN
OSC
1/m
SSCCLKOUT
Synthesizer
XOUT
1/n
SSC Modulator
SEL0
Mode Control
SEL1
Pin Arrangement
SSCCLKOUT
1
8
SEL1
VDD
2
7
CLKOUT
GND
3
6
SEL0
XIN
4
5
XOUT
(Top view)
Rev.1, Sep. 2001, page 2 of 9
HD151TS302RP
SSC Function Table
SEL1 :0
Spread Percentage
00
–1.0%
01
–3.0%
10
SSC OFF
11
–0.5%
Note: –3.0% SSC is selected for default by internal pull-up & down resistors.
Clock Frequency Table
XIN(MHz)
SSCCLKOUT(MHz)
48
48
*1
24
24
*1
CLKOUT(MHz)
48
*2
24
*2
Notes: 1. With spread spectrum modulation.
2. Without spread spectrum modulation.
Pin Descriptions
Pin name
No.
Type
Description
GND
3
Ground
GND pin
VDD
2
Power
Power supplies pin. Normally 3.3 V.
CLKOUT
7
Output
Normally 3.3 V reference clock output.
SSCCLKOUT
1
Output
Spread spectrum modulated clock output.
XIN
4
Input
Oscillator input.
XOUT
5
Output
Oscillator output.
SEL0
6
Input
SSC mode select pin. LVCMOS level input.
Pull-up by internal resistor. (100 kΩ).
SEL1
8
Input
SSC mode select pin. LVCMOS level input.
Pull–down by internal resistor (100 kΩ).
Rev.1, Sep. 2001, page 3 of 9
HD151TS302RP
Absolute Maximum Ratings
Item
Symbol
Ratings
Unit
Supply voltage
VDD
–0.5 to 4.6
V
VI
–0.5 to 4.6
V
VO
–0.5 to
VDD+0.5
V
Input clamp current
IIK
–50
mA
VI < 0
Output clamp current
IOK
–50
mA
VO < 0
Continuous output current
IO
±50
mA
VO = 0 to VDD
0.7
W
–65 to +150
°C
Input voltage
Output voltage
*1
Maximum power dissipation
at Ta = 55°C (in still air)
Storage temperature
Notes:
Tstg
Conditions
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage
to the device. These are stress ratings only, and functional operation of the device at these or
any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute maximum rated conditions for extended periods may affect device
reliability.
1. The input and output negative voltage ratings may be exceeded if the input and output clamp
current ratings are observed.
Recommended Operating Conditions
Item
Symbol
Min
Typ
Max
Unit Conditions
Supply voltage
VDD
3.135
3.3
3.465
V
DC input signal voltage
–0.3
—
VDD+0.3
V
High level input voltage
VIH
2.0
—
VDD+0.3
V
Low level input voltage
VIL
–0.3
—
0.8
V
Operating temperature
Ta
0
—
70
°C
45
50
55
%
Input clock duty cycle
Rev.1, Sep. 2001, page 4 of 9
HD151TS302RP
DC Electrical Characteristics
Ta = 0 to 70°C, VDD = 3.3 V±5%
Item
Symbol
Min
Typ
Max
Unit
Input low voltage
VIL
—
—
0.8
V
Input high voltage
VIH
2.0
—
—
V
Input current
II
—
—
±10
µA
—
—
±100
1
—
4
V / ns 20% – 80%
—
—
4
pF
SEL0, SEL1
—
7
—
mA
XIN = 24 MHz, CL = 0 pF,
VDD = 3.3 V
Input slew rate
Input capacitance
CI
Operating current
Test Conditions
VI = 0 V or 3.465 V,
VDD = 3.465 V, XIN pin
VI = 0 V or 3.465 V,
VDD = 3.465 V,
SEL0, SEL1 pins
DC Electrical Characteristics / Clock Output & SSC Clock Output
Ta = 0 to 70°C, VDD = 3.3 V±5%
Item
Symbol Min
Typ
Max
Unit
Test Conditions
Output voltage
VOH
3.1
—
—
V
IOH = –1 mA, VDD = 3.3 V
VOL
—
—
50
mV
IOL = 1 mA, VDD = 3.3 V
Rev.1, Sep. 2001, page 5 of 9
HD151TS302RP
AC Electrical Characteristics / Clock Output & SSC Clock Output
Ta = 25°C, VDD = 3.3 V, CL = 30 pF
Item
Symbol
Min
Typ
Max
Unit Test Conditions Notes
tCCS
—
| 250 |
| 300 |
ps
—
| 250 |
| 300 |
SSCCLKOUT,
Fig1, 48 MHz
—
| 250 |
| 300 |
SSCCLKOUT,
Fig1, 24 MHz
—
| 250 |
| 300 |
SSCCLKOUT,
Fig1, 48 MHz
—
| 250 |
| 300 |
CLKOUT,
Fig1, 24 MHz &
48 MHz
23.7
—
24.2
MHz SSCCLKOUT,
XIN = 24 MHz
47.0
—
48.7
SSCCLKOUT,
XIN = 48 MHz
23.1
—
24.2
SSCCLKOUT,
XIN = 24 MHz
45.9
—
48.7
SSCCLKOUT,
XIN = 48 MHz
23.8
—
24.2
CLKOUT,
24 MHz
47.3
—
48.7
CLKOUT,
48 MHz
1.0
—
—
V/ns @48 MHz
CLKOUT
45
50
55
%
—
30
—
Ω
Spread spectrum
*1
modulation frequency
—
33
—
KHz @48 MHz
SSCCLKOUT
Input clock frequency
10
—
60
MHz
—
—
2
ms
Cycle to cycle jitter
Output frequency
Slew rate
*1, 2
*1, 2
*1
Clock duty cycle
tSL
*1
Output impedance
Stabilization time
*1
*1,3
SSCCLKOUT,
Fig1, 24 MHz
SSC = –0.5%
SEL1:0 = 11
SSC = –3.0%
SEL1:0 = 01
SSC = –0.5%
SEL1:0 = 11
SSC = –3.0%
SEL1:0 = 01
0.4 V to 2.4 V
Notes: 1. Parameters are guaranteed by design and characterization. Not 100% tested in production.
2. Cycle to cycle jitter and output frequency are included spread spectrum modulation.
3. Stabilization time is the time required for the integrated circuit to obtain phase lock of its input
signal after power up.
Rev.1, Sep. 2001, page 6 of 9
HD151TS302RP
SSCCLKOUT
(or CLKOUT)
tcycle n
tcycle n+1
t CCS = (tcycle n) - (tcycle n+1)
Figure 1 Cycle to cycle jitter
Rev.1, Sep. 2001, page 7 of 9
HD151TS302RP
Package Dimensions
Unit: mm
3.90
4.89
5.15 Max
5
8
0.034
*0.22 +– 0.017
0.20 – 0.03
0.69 Max
1.73 Max
4
1
6.02 – 0.18
1.06
*0.42 +0.063
–0.064
0.40 ± 0.06
0.114
0.14 +– 0.038
0¡ – 8¡
1.27
+ 0.289
0.60 – 0.194
0.10
0.25 M
*Dimension including the plating thickness
Base material dimension
Rev.1, Sep. 2001, page 8 of 9
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
FP-8DC


0.08 g
HD151TS302RP
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copyright, trademark, or other intellectual property rights for information contained in this document.
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intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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Copyright © Hitachi, Ltd., 2001. All rights reserved. Printed in Japan.
Colophon 5.0
Rev.1, Sep. 2001, page 9 of 9