BCDSEMI AP2318DN

Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
General Description
Features
The AP2318 is a series of ultra low dropout regulators
optimized for low voltage applications where transient
response and minimum input voltage are critical.
·
·
·
·
The AP2318 provides current limit and thermal
shutdown. Its circuit includes a trimmed bandgap
reference to assure output voltage accuracy to be
within ±1%. On-chip thermal shutdown provides
protection against any combination of overload and
ambient temperatures that would create excessive
junction temperatures.
·
Wide Operating Voltage Ranges: 2.5V to 12V
Output Voltage Accuracy: ±1%
On-chip Thermal Shutdown
ESD: Human Body Model 3kV
Machine Model 600V
Operating Junction Temperature: -40oC to 125oC
Applications
·
·
·
·
·
The AP2318 has both fixed and adjustable versions.
The 1.3V fixed versions integrate the corresponding
resistor divider. The adjustable version can set the
output voltage through two external resistors.
Notebook
USB Device
Add-on Card
DVD Player
PC Motherboard
The AP2318 is available in the standard DFN-3×3-8
and SOIC-8 packages.
SOIC-8
DFN-3×3-8
Figure 1. Package Types of AP2318
Dec. 2010 Rev. 1. 5
BCD Semiconductor Manufacturing Limited
1
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
Pin Configuration
DN Package
(DFN-3x3-8)
M Package
(SOIC-8)
VIN 1
8
EN
NC
1
8
GND
VIN 2
7
NC
EN
2
7
ADJ/NC
VOUT 3
6
GND
VIN
3
6
VOUT
VOUT 4
5
ADJ/NC
VIN
4
5
NC
Figure 2. Pin Configuration of AP2318 (Top View)
Functional Block Diagram
VIN 1, 2 (3, 4)
EN
3, 4 (6)
VOUT
8 (2)
Enable
Bandgap
Reference
RC
Compensation
OVP
5 (7)
A1
Error
VFB Amplifier
Thermal
Shutdown
Current
Limit
ADJ/NC
B
A2
6 (8)
Connect A1 and A2, disconnect B: Fixed Voltage Version
Connect B, disconnect A1 and A2:Adjustable Voltage Version
GND
A (B)
A: DFN-3x3-8
B: SOIC-8
Figure 3. Functional Block Diagram of AP2318
Dec. 2010 Rev. 1. 5
BCD Semiconductor Manufacturing Limited
2
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
Pin Description
Pin Number
Pin Name
Function
DFN-3×3-8
SOIC-8
1, 2
3, 4
VIN
3, 4
6
VOUT
5
7
ADJ/NC
6
8
GND
7
1, 5
NC
No connection
8
2
EN
On/Off control
Input Voltage
Output Voltage
Adjust Voltage/No Connection
Ground
Ordering Information
AP2318
Package
SOIC-8
DFN-3×3-8
-
Circuit Type
E1: Lead Free
Package
M: SOIC-8
DN: DFN-3×3-8
TR: Tape and Reel
Temperature
Range
-40 to 125oC
-40 to 125oC
G1: Green
Blank: Tube
ADJ: Adjustable Output
1.3: Fixed Output 1.3V
Part Number
Lead Free
Marking ID
Green
Lead Free
Green
Packing
Type
AP2318M-ADJE1
AP2318M-ADJG1
2318M-ADJE1
2318M-ADJG1
Tube
AP2318M-ADJTRE1
AP2318M-ADJTRG1
2318M-ADJE1
2318M-ADJG1
Tape & Reel
AP2318M-1.3E1
AP2318M-1.3G1
2318M-1.3E1
2318M-1.3G1
Tube
AP2318M-1.3TRE1
AP2318M-1.3TRG1
2318M-1.3E1
2318M-1.3G1
Tape & Reel
AP2318DN-ADJTRE1
AP2318DN-ADJTRG1
F9E
B9E
Tape & Reel
AP2318DN-1.3TRE1
AP2318DN-1.3TRG1
F9B
B9B
Tape & Reel
BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with
"G1" suffix are available in green packages.
Dec. 2010 Rev. 1. 5
BCD Semiconductor Manufacturing Limited
3
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Value
Unit
Input Voltage
VIN
15
V
TJ
150
TSTG
-65 to 150
oC
TLEAD
260
oC
Operating Junction Temperature
Storage Temperature Range
Lead Temperature (Soldering, 10sec)
θJA
Thermal Resistance (Note 2)
o
C
SOIC-8
135
DFN-3×3-8
120
oC/W
ESD (Human Body Model)
ESD
3000
V
ESD (Machine Model)
ESD
600
V
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods
may affect device reliability.
Note 2: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its operating ratings. The maximum allowable power dissipation is a
function of the maximum junction temperature, TJ(max), the junction-to-ambient thermal resistance,θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD(max)=(TJ(max) TA)/θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will
go into thermal shutdown.
Recommended Operating Conditions
Parameter
Symbol
Min
Max
Unit
Input Voltage
VIN
2.5
12
V
Enable Voltage
VEN
12
V
Operating Junction Temperature Range
TJ
-40
Dec. 2010 Rev. 1. 5
125
o
C
BCD Semiconductor Manufacturing Limited
4
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
Electrical Characteristics
Operating Conditions: 2.5V≤VIN≤12V, CIN=1µF, COUT=2.2µF, TJ=25oC, unless otherwise specified. (P≤Maximum Power Dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for
operation of -40oC to 125oC.
Parameter
Conditions
Symbol
Min
TJ=25oC
Typ
Max
Unit
Reference Voltage
VREF
AP2318-ADJ IOUT=10mA, VIN-VOUT=2V,
10mA≤IOUT≤600mA, VOUT+2V≤VIN ≤12V
0.792 0.800 0.808
0.784 0.800 0.816
V
Output Voltage
VOUT
IOUT=10mA, VIN=2.5V, TJ=25oC
10mA≤IOUT≤600mA, 2.5V≤VIN ≤12V
-1%
-2%
V
Maximum Output
Current
Line Regulation
IOUT(max) VIN-VOUT=2V
VRLINE
0.85
AP2318-ADJ
IOUT=10mA, VOUT+2V≤VIN≤12V
IOUT=10mA, 2.5V≤VIN ≤12V
Load Regulation
Dropout Voltage
Adjust Pin Current
Minimum Load
Current
VRLOAD
VDROP
AP2318-ADJ
VIN=VOUT+2V, 10mA≤IOUT≤600mA
VIN=2.5V, 10mA≤IOUT≤600mA
∆VOUT (∆VREF)=1%, IOUT=600mA
ILOAD(min) VOUT+2V≤VIN≤12V (ADJ only)
IQ
RMS Output Noise
(% of VOUT)
VNOI
1.2
A
0.05
0.2
%/V
1
6
mV
0.2
0.4
%
1
10
mV
0.35
IADJ
Quiescent Current
1%
2%
VIN=VOUT+2V, IOUT=0mA
TA=25oC, 10Hz≤f≤20kHz
Thermal Shutdown
Temperature
Thermal Shutdown
Hysteresis
V
0.05
1
µA
1.7
5
mA
250
µA
0.003
%
o
C
150
o
25
Enable Input Voltage
VEN
Enable Input Current
IEN
Thermal Resistance,
(Junction to Case)
θJC
Enable logic low
C
0.8
Enable logic high
V
2.25
VEN=2.25V
5
VEN=0.8V
DFN-3×3-8
15
SOIC-8
24
Dec. 2010 Rev. 1. 5
15
µA
4
µA
o
C/W
BCD Semiconductor Manufacturing Limited
5
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
Typical Performance Characteristics
1.30
0.90
AP2318-ADJ
VOUT=0.8V
Output Voltage (V)
0.86
0.84
ADJ short to GND
o
TC=25 C
0.82
VIN=2.8V
1.26
0.80
0.78
0.76
1.22
1.20
1.18
1.16
1.14
0.72
1.12
1.10
0
50
100
150
200
250
R1=3kΩ
R2=6.2kΩ
o
TC=25 C
VIN=3.2V
1.24
0.74
0.70
AP2318-ADJ
VOUT=1.2V
1.28
Output Voltage (V)
0.88
300
0
50
100
1.0
250
300
1.5
1.4
0.9
AP2318-ADJ
VOUT=1.2V
1.3
0.8
1.2
R1=3kΩ
R2=6.2kΩ
o
TC=25 C
1.1
0.7
Output Voltage (V)
Output Voltage (V)
200
Figure 5. Output Voltage vs. Output Current
(Conditions: VOUT=1.2V, R1=3kΩ, R2=6.2kΩ)
Figure 4. Output Voltage vs. Output Current
(Conditions: VOUT=0.8V, ADJ Short to GND)
AP2318-ADJ
VOUT=0.8V
0.6
0.5
ADJ short to GND
o
TC=25 C
0.4
0.3
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.2
VIN=3.2V
0.3
0.1
VIN=8V
0.2
0.0
150
Output Current (mA)
Output Current (mA)
150
300
450
600
750
900
1050
1200
1350
VIN=2.5V
VIN=12V
0.1
VIN=12V
0
VIN=3.2V
0.0
1500
Output Current (mA)
0
150
300
450
600
750
900
1050
1200
1350
1500
Output Current (mA)
Figure 6. Output Voltage vs. Output Current
(Conditions: VOUT=0.8V, ADJ Short to GND)
Figure 7. Output Voltage vs. Output Current
(Conditions: VOUT=1.2V, R1=3kΩ, R2=6.2kΩ)
Dec. 2010 Rev. 1. 5
BCD Semiconductor Manufacturing Limited
6
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
Typical Performance Characteristics (Continued)
1.1
1.5
1.4
1.3
0.9
1.2
0.8
1.1
Output Voltage (V)
Output Voltage (V)
1.0
0.7
AP2318-ADJ
VIN=2.8V
0.6
0.5
VOUT=0.8V
0.4
ADJ short to GND
0.3
o
TC=25 C
0.2
o
TC=-40 C
0.1
0.0
o
150
300
450
600
750
900
1050
1200
1350
AP2318-ADJ
VIN=3.2V
0.9
0.8
0.7
VOUT=1.2V
0.6
R1=3kΩ
R2=6.2kΩ
0.5
o
0.4
TC=25 C
0.3
TC=-40 C
0.2
TC=125 C
o
o
0.1
TC=125 C
0
1.0
0.0
1500
0
150
300
450
Output Current (mA)
600
750
900
1050
1200
1350
1500
Output Current (mA)
Figure 8. Output Voltage vs. Output Current
(Conditions: VOUT=0.8V, ADJ Short to GND)
Figure 9. Output Voltage vs. Output Current
(Conditions: VOUT=1.2V, R1=3kΩ, R2=6.2kΩ)
1.0
1.4
0.9
0.8
1.2
Output Voltage (V)
Output Voltage (V)
0.7
0.6
AP2318-ADJ
VOUT=0.8V
0.5
ADJ short to GND
o
TC=25 C
0.4
0.3
300mA
10mA
600mA
0.2
0.1
0.0
0
1
2
3
4
5
6
7
8
9
1.0
AP2318-ADJ
VOUT=1.2V
0.8
R1=3kΩ
R2=6.2kΩ
o
TC=25 C
300mA
10mA
600mA
0.6
0.4
0.2
10
11
0.0
12
Input Voltage (V)
0
1
2
3
4
5
6
7
8
9
10
11
12
Input Voltage (V)
Figure 10. Output Voltage vs. Input Voltage
(Conditions: VOUT=0.8V, ADJ Short to GND)
Figure 11. Output Voltage vs. Input Voltage
(Conditions: VOUT=1.2V, R1=3kΩ, R2=6.2kΩ)
Dec. 2010 Rev. 1. 5
BCD Semiconductor Manufacturing Limited
7
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
0.90
1.30
0.88
1.28
0.86
1.26
0.84
1.24
Output Voltage (V)
Output Voltage (V)
Typical Performance Characteristics (Continued)
0.82
0.80
0.78
0.76
AP2318-ADJ
VIN=2.8V
0.74
VOUT=0.8V
0.70
-40
-20
0
20
40
60
80
100
VOUT=1.2V
R1=3kΩ
R2=6.2kΩ
IOUT=10mA
1.22
1.20
1.18
1.16
1.14
ADJ short to GND
IOUT=10mA
0.72
AP2318-ADJ
VIN=3.2V
1.12
1.10
-40
120
-20
0
20
40
60
80
100
120
o
o
Case Temperature ( C)
Case Temperature ( C)
Figure 13. Output Voltage vs. Case Temperature
(Conditions: VOUT=1.2V, R1=3kΩ, R2=6.2kΩ)
Figure 12. Output Voltage vs. Case Temperature
(Conditions: VOUT=0.8V, ADJ Short to GND)
250
400
225
350
300
175
150
Supply Current (µA)
Supply Current (µA)
200
AP2318-ADJ
VOUT=0.8V
125
ADJ short to GND
No Load
100
o
T C=-40 C
75
o
T C=25 C
50
AP2318-ADJ
VOUT=1.2V
200
R1=3k Ω
R2=6.2k Ω
No Load
o
T C=-40 C
150
o
100
T C=25 C
o
o
T C=125 C
25
0
250
0
1
2
3
4
5
6
7
T C=125 C
50
0
8
0
1
2
3
4
5
6
7
8
Input Voltage (V)
Input Voltage (V)
Figure 15. Supply Voltage vs. Input Voltage
(Conditions: VOUT=1.2V, R1=3kΩ, R2=6.2kΩ)
Figure 14. Supply Voltage vs. Input Voltage
(Conditions: VOUT=0.8V, ADJ Short to GND)
Dec. 2010 Rev. 1. 5
BCD Semiconductor Manufacturing Limited
8
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
Typical Performance Characteristics (Continued)
220
340
AP2318-ADJ
VIN=3.2V
336
212
AP2318-ADJ
VIN=2.8V
332
208
VOUT=0.8V
328
204
ADJ short to GND
No Load
Supply Current (µA)
Supply Current (µA)
216
200
196
192
320
316
312
308
184
304
-20
0
20
40
60
80
100
R1=3kΩ
R2=6.2kΩ
No Load
324
188
180
-40
VOUT=1.2V
300
-40
120
-20
0
o
18
16
16
14
12
AP2318-ADJ
VIN=2.8V
10
VOUT=0.8V
Supply Current (mA)
Supply Current (mA)
20
18
ADJ short to GND
o
TC=25 C
o
TC=-40 C
4
o
TC=125 C
2
0
0
150
300
450
600
750
900
1050
60
80
100
120
Figure 17. Supply current vs. Case Temperature
(Conditions: VOUT=1.2V, R1=3kΩ, R2=6.2kΩ)
20
6
40
Case Temperature ( C)
Figure 16. Supply Current vs. Case Temperature
(Conditions: VOUT=0.8V, ADJ Short to GND)
8
20
o
Case Temperature ( C)
1200
1350
1500
Output Current (mA)
14
AP2318-ADJ
VIN=3.2V
12
10
VOUT=1.2V
R1=3kΩ
R2=6.2kΩ
8
6
o
TC=25 C
o
4
TC=-40 C
2
TC=125 C
0
o
0
150
300
450
600
750
900
1050
1200
1350
1500
Output Current (mA)
Figure 18. Supply Current vs. Output Current
(Conditions: VOUT=0.8V, ADJ Short to GND)
Figure 19. Supply Current vs. Output Current
(Conditions: VOUT=1.2V, R1=3kΩ, R2=6.2kΩ)
Dec. 2010 Rev. 1. 5
BCD Semiconductor Manufacturing Limited
9
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
20
20
18
18
16
16
Supply Current (mA)
Supply Current (mA)
Typical Performance Characteristics (Continued)
14
AP2318-ADJ
VOUT=0.8V
12
ADJ short to GND
o
TC=25 C
10
8
VIN=3.2V
6
VIN=8V
VIN=12V
4
2
0
14
AP2318-ADJ
VOUT=1.2V
12
R1=3kΩ
R2=6.2kΩ
o
TC=25 C
10
8
6
VIN=3.2V
4
VIN=2.5V
VIN=12V
2
0
150
300
450
600
750
900
1050
1200
1350
0
1500
Output Current (mA)
0
150
300
450
600
750
900
1050
1200
1350
1500
Output Current (mA)
Figure 21. Supply Current vs. Output Current
(Conditions: VOUT=1.2V, R1=3kΩ, R2=6.2kΩ)
∆VOUT (100mV/Div)
∆VOUT (50mV/Div)
IOUT (200mA/Div)
IOUT (100mA/Div)
Figure 20. Supply Current vs. Output Current
(Conditions: VOUT=0.8V, ADJ Short to GND)
Time (200µs/Div)
Time (200µs/Div)
Figure 22. Load Transient Response
(Conditions: VIN=2.5V, VOUT=1.3V, IOUT=1mA to 300mA,
CIN=1µF, COUT=2.2µF)
Dec. 2010 Rev. 1. 5
Figure 23. Load Transient Response
(Conditions: VIN=2.5V, VOUT=1.8V, IOUT=1mA to 600mA,
CIN=1µF, COUT=2.2µF)
BCD Semiconductor Manufacturing Limited
10
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
∆VIN (50mV/Div)
∆VIN (50mV/Div)
∆VOUT (5V/Div)
∆VOUT (2V/Div)
Typical Performance Characteristics (Continued)
Figure 25. Line Transient Response
(Conditions: VIN=2.5V to 5V, VOUT=0.8V, IOUT=10mA,
CIN=0µF, COUT=2.2µF)
(Conditions: VIN=2.5V to 10V, VOUT=0.8V, IOUT=10mA,
CIN=0µF, COUT=2.2µF)
100
100
90
90
80
80
70
70
60
60
PSRR (dB)
PSRR (dB)
Figure 24. Line Transient Response
50
40
50
40
AP2318-ADJ
VOUT=1.2V
30
AP2318-ADJ
VOUT=0.8V
20
VIN=3 to 4V
20
VIN=3 to 4V
10
CIN=1µF, COUT=2.2µF
10
30
0
10
ILOAD=10mA
100
1k
10k
0
10
100k
Frequency (Hz)
CIN=1µF, COUT=2.2µF
ILOAD=10mA
100
1k
10k
100k
Frequency (Hz)
Figure 27. PSRR vs. Frequency
Figure 26. PSRR vs. Frequency
Dec. 2010 Rev. 1. 5
BCD Semiconductor Manufacturing Limited
11
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
Typical Performance Characteristics (Continued)
1.4
1.2
1.1
1.2
1.0
Output Voltage (V)
Power Dissipation (W)
0.9
0.8
0.7
AP2318-ADJ
VIN=3.2V
0.6
VOUT=1.2V
0.5
0.2
R1=3kΩ
R2=6.2kΩ
SOIC-8
CIN=1µF
0.1
COUT=2.2µF
0.4
0.3
0.0
30
40
1.0
AP2318-ADJ
VOUT=1.2V
0.8
VIN=3.3V
0.6
R1=3kΩ
R2=6.2kΩ
o
TC=25 C
0.4
IOUT=10mA
50
0.2
60
70
80
90
100
110
0.0
0.0
120
o
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Enable Input Voltage (V)
Ambient Temperature ( C)
Figure 29. Output Voltage vs. Enable Input Voltage
(Conditions: VOUT=1.2V, R1=3kΩ, R2=6.2kΩ)
Figure 28. Power Dissipation vs. Ambient Temperature
(Conditions: VOUT=1.2V, R1=3kΩ, R2=6.2kΩ)
Dec. 2010 Rev. 1. 5
BCD Semiconductor Manufacturing Limited
12
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
Typical Applications
VOUT
VIN
VIN
VOUT
AP2318-ADJ
ADJ/
NC
EN
CIN
1µF
GND
+
R1
+
COUT
2.2µF
R2
Figure 30. Typical Applications of AP2318 ADJ Version, VOUT=0.8*(R1+R2)/R2
VIN=3.3V
VOUT=1.3V
VIN
VOUT
AP2318-1.3
EN
CIN
1µF
+
GND
ADJ/
NC
+
COUT
2.2µF
Figure 31. Typical Applications of AP2318 Fixed 1.3V Version, VOUT=1.3V
Dec. 2010 Rev. 1. 5
BCD Semiconductor Manufacturing Limited
13
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
Mechanical Dimensions
SOIC-8
4.700(0.185)
5.100(0.201)
7°
Unit: mm(inch)
0.320(0.013)
1.350(0.053)
1.750(0.069)
8°
8°
7°
0.675(0.027)
0.725(0.029)
D
5.800(0.228)
1.270(0.050)
6.200(0.244)
TYP
D
20:1
0.100(0.004)
R0.150(0.006)
0.300(0.012)
0.800(0.031)
φ
0.200(0.008)
0°
8°
1.000(0.039)
3.800(0.150)
4.000(0.157)
0.330(0.013)
0.510(0.020)
0.190(0.007)
0.250(0.010)
0.900(0.035)
1°
5°
R0.150(0.006)
0.450(0.017)
0.800(0.031)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2010 Rev. 1. 5
BCD Semiconductor Manufacturing Limited
14
Data Sheet
AP1117M
AP2318
600mA LOW DROPOUT LINEAR REGULATOR
600mA ULDO REGULATOR WITH ENABLE
Mechanical Dimensions (Continued)
DFN-3x3-8
Unit: mm(inch)
0.180(0.007)
0.300(0.012)
2.900(0.114)
3.100(0.122)
N5
0.650(0.026)
BSC
N8
0.375(0.015)
0.575(0.023)
2.900(0.114)
1.400(0.055)
3.100(0.122)
1.600(0.063)
2.200(0.087)
2.400(0.094)
Pin 1 Dot
by Marking
PIN #1
IDENTIFICATION
N4
N1
0.153(0.006)
0.253(0.010)
0.000(0.000)
0.700(0.028)
0.050(0.002)
0.800(0.031)
Dec. 2010 Rev. 1. 5
BCD Semiconductor Manufacturing Limited
15
BCD Semiconductor Manufacturing Limited
http://www.bcdsemi.com
IMPORTANT NOTICE
IMPORTANT
NOTICE
BCD Semiconductor
BCD
Semiconductor Manufacturing
Manufacturing Limited
Limited reserves
reserves the
the right
right to
to make
make changes
changes without
without further
further notice
notice to
to any
any products
products or
or specifispecifications herein.
cations
herein. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
not assume
assume any
any responsibility
responsibility for
for use
use of
of any
any its
its products
products for
for any
any
particular purpose,
particular
purpose, nor
nor does
does BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited assume
assume any
any liability
liability arising
arising out
out of
of the
the application
application or
or use
use
of any
of
any its
its products
products or
or circuits.
circuits. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
not convey
convey any
any license
license under
under its
its patent
patent rights
rights or
or
other rights
other
rights nor
nor the
the rights
rights of
of others.
others.
MAIN SITE
SITE
MAIN
- Headquarters
BCD
Semiconductor Manufacturing Limited
BCD
Semiconductor
Manufacturing Limited
- Wafer
Fab
No.
1600, Zi
Xing Road,
Shanghai ZiZhu
Science-basedLimited
Industrial Park, 200241, China
Shanghai
SIM-BCD
Semiconductor
Manufacturing
Tel:
Fax: +86-21-24162277
800,+86-21-24162266,
Yi Shan Road, Shanghai
200233, China
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008
REGIONAL SALES OFFICE
Shenzhen OfficeSALES OFFICE
REGIONAL
- Wafer
FabSemiconductor Manufacturing Limited
BCD
Shanghai
SIM-BCD
Semiconductor Manufacturing Co., Ltd.
- IC Design
Group
800 Yi
Shan Road,
Shanghai
200233,
China Corporation
Advanced
Analog
Circuits
(Shanghai)
Tel: +86-21-6485
1491,YiFax:
0008200233, China
8F, Zone B, 900,
Shan+86-21-5450
Road, Shanghai
Tel: +86-21-6495 9539, Fax: +86-21-6485 9673
Taiwan Office
Shanghai
Semiconductor Manufacturing Co., Ltd., Shenzhen Office
BCD Taiwan
Semiconductor
Shenzhen SIM-BCD
Office
Office (Taiwan) Company Limited
Unit
A Room
1203, Skyworth
Bldg., Gaoxin
Ave.1.S., Nanshan
Shenzhen,
4F, 298-1,
Guang Road,(Taiwan)
Nei-Hu District,
Taipei,
Shanghai
SIM-BCD
Semiconductor
Manufacturing
Co., Ltd.District,
Shenzhen
Office
BCDRui
Semiconductor
Company
Limited
China
Taiwan
Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,
Tel:
+86-755-8826
Tel: +886-2-2656
2808
Room
E, 5F, Noble 7951
Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China
Taiwan
Fax:
+86-755-88267951
7865
Fax: +886-2-2656
28062808
Tel: +86-755-8826
Tel: +886-2-2656
Fax: +86-755-8826 7865
Fax: +886-2-2656 2806
USA Office
BCD Office
Semiconductor Corp.
USA
30920Semiconductor
Huntwood Ave.Corporation
Hayward,
BCD
CA 94544,
USA Ave. Hayward,
30920
Huntwood
Tel :94544,
+1-510-324-2988
CA
U.S.A
Fax:: +1-510-324-2988
+1-510-324-2788
Tel
Fax: +1-510-324-2788