Advance Datasheet 1.0A High-side Power Distribution Switch with Enable and Flag General Description Features The AP2810 is an integrated high-side power switch that consists of N-Channel MOSFET, charge pump, over current & temperature and other related protection circuits. The switch’s low RDS (ON), 60mΩ, design easily to meet USB voltage drop requirements. It includes soft-start to limit inrush current, over-current protection, load short protection with fold-back, and thermal shutdown to avoid switch failure during hot plug-in. Under voltage lockout (UVLO) function is used to ensure the device remain off unless there is a valid input voltage present. A Flag output is available to indicate fault conditions to the local USB controller. • • • • • • • • • • • • • • The AP2810 is available in standard packages of SOIC-8 and MSOP-8. AP2810 Low MOSFET on Resistance: 60mΩ @VIN=5.0V Compliant to USB Specifications Operating Voltage Range: 2.7V to 5.5V Low Supply Current: 65µA (Typ) Low Shutdown Current: 1.0µA (Max) Guarantee 1.0A Continuous Load Current Limit: 1.1A (Min), 2.1A (Max) Under-voltage Lockout Logic Level Enable Pin: Available in Active-high or Active-low Version Over-current Protection Over Temperature Protection Load Short Protection with Fold-back No Reverse Current When Power off With Output Shutdown Pull-low Resistor for A/C Versions Applications • • • • • SOIC-8 USB Power Management USB Bus/Self Powered Hubs Hot-plug Power Supplies Battery-charger Circuits Notebooks, Motherboard PCs MSOP-8 Figure 1. Package Types of AP2810 Jul. 2012 Rev 1. 2 BCD Semiconductor Manufacturing Limited 1 Advance Datasheet 1.0A High-side Power Distribution Switch with Enable and Flag AP2810 Pin Configuration M/MM Package （SOIC-8/MSOP-8） Figure 2. Pin Configuration of AP2810 (Top View) Pin Descriptions Pin Number Pin Name 1 GND Ground 2, 3 VIN Supply input pin 4 Chip enable control input, active low or high 5 Fault flag pin, output with open drain, need a pull-up resistor in application, active low to indicate OCP or OTP 6, 7, 8 Jul. 2012 Function VOUT Switch output voltage Rev 1. 2 BCD Semiconductor Manufacturing Limited 2 Advance Datasheet 1.0A High-side Power Distribution Switch with Enable and Flag AP2810 Functional Block Diagram Figure 3. Functional Block Diagram of AP2810 Jul. 2012 Rev 1. 2 BCD Semiconductor Manufacturing Limited 3 Advance Datasheet 1.0A High-side Power Distribution Switch with Enable and Flag AP2810 Ordering Information AP2810 G1: Green Circuit Type TR: Tape & Reel Blank: Tube Condition A: Active High with Auto Discharge B: Active High without Auto Discharge C: Active Low with Auto Discharge D: Active Low without Auto Discharge Product Package Condition Package M: SOIC-8 MM: MSOP-8 Temperature Part Number Range Green SOIC-8 Active High AP2810A with Auto Discharge -40 to 85°C MSOP-8 SOIC-8 Active High AP2810B without Auto Discharge -40 to 85°C MSOP-8 SOIC-8 AP2810C MSOP-8 SOIC-8 AP2810D MSOP-8 Active Low with Auto Discharge Active Low without Auto Discharge -40 to 85°C -40 to 85°C Marking ID Green Packing Type AP2810AM-G1 2810AM-G1 Tube AP2810AMTR-G1 2810AM-G1 Tape & Reel AP2810AMM-G1 2810AMM-G1 Tube AP2810AMMTR-G1 2810AMM-G1 Tape & Reel AP2810BM-G1 2810BM-G1 Tube AP2810BMTR-G1 2810BM-G1 Tape & Reel AP2810BMM-G1 2810BMM-G1 Tube AP2810BMMTR-G1 2810BMM-G1 Tape & Reel AP2810CM-G1 2810CM-G1 Tube AP2810CMTR-G1 2810CM-G1 Tape & Reel AP2810CMM-G1 2810CMM-G1 Tube AP2810CMMTR-G1 2810CMM-G1 Tape & Reel AP2810DM-G1 2810DM-G1 Tube AP2810DMTR-G1 2810DM-G1 Tape & Reel AP2810DMM-G1 2810DMM-G1 Tube AP2810DMMTR-G1 2810DMM-G1 Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and Green. Jul. 2012 Rev 1. 2 BCD Semiconductor Manufacturing Limited 4 Advance Datasheet 1.0A High-side Power Distribution Switch with Enable and Flag AP2810 Absolute Maximum Ratings (Note 1) Parameter Power Supply Voltage Operating Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering,10 Seconds) Thermal Resistance Junction to Ambient Symbol Value Unit VIN 6.0 V TJ 150 ºC TSTG -65 to 150 ºC TLEAD 260 ºC θJA SOIC-8 135 MSOP-8 150 o C/W ESD (Machine Model) 200 V ESD (Human Body Model) 2000 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Supply Voltage Operating Ambient Range Jul. 2012 Temperature Symbol Min Max Unit VIN 2.7 5.5 V TA -40 85 °C Rev 1. 2 BCD Semiconductor Manufacturing Limited 5 Advance Datasheet 1.0A High-side Power Distribution Switch with Enable and Flag AP2810 Electrical Characteristics (VIN=5.0V, CIN=2.2µF, COUT=1.0µF, Typical TA=25°C, unless otherwise specified) Parameter Symbol Input Voltage Range VIN Switch On Resistance RDS(ON) Conditions Min Typ Max Unit 2.7 5.5 V 60 80 mΩ 1.5 2.1 A 85 µA VIN=5V, IOUT=1.0A Current Limit ILIMIT VOUT=4.0V Supply Current ISUPPLY VIN=5V, No Load 65 Fold-back Short Current ISHORT VOUT=0 0.6 Shutdown Supply Current Enable High Threshold Enable Low Threshold Input Input Enable Pin Input Current Under Voltage Lockout Threshold Voltage ISHUTDOWN VENL 0 1.0 V Force 0V to 5.0V at EN Pin -1.0 1.0 µA VIN Increasing from 0V 2.2 2.7 V IEN VUVLO RDISCHARGE tON Flag Delay Time tDFLG Flag Low Voltage VFLG Jul. 2012 ILEAKAGE Shutdown Shutdown µA V IREVERSE Thermal Temperature Thermal Hysteresis 1 5.5 Reverse Current Flag Leakage 0.1 1.6 VUVLOHY Output Turn-on Time Shutdown A VENH Under Voltage Hysteresis Output Pull Low Resistance after Shutdown Chip Disable, Mode 1.1 2.5 0.2 V Chip Disable, VOUT>VIN 0.1 1.0 µA AP2810A, AP2810C only 100 200 Ω From Enable Active to 90% of Output From Fault Condition to Flag Active ISINK=5mA 500 5 µs 10 15 ms 35 70 mV 1.0 µA Flag Disable, Force 5.0V TOTSD 150 o C THYOTSD 30 o C Rev 1. 2 BCD Semiconductor Manufacturing Limited 6 Advance Datasheet 1.0A High-side Power Distribution Switch with Enable and Flag AP2810 Typical Performance Characteristics 100 100 80 80 Supply Current (μA) Supply Current (μA) 90 VIN=5V Enable Active No Load 90 70 60 50 40 30 70 60 50 o 40 TA=-40 C 30 TA= 25 C o o TA= 85 C Enable Active 20 20 10 10 0 0 -40 -20 0 20 40 60 -10 1.0 80 1.5 2.0 2.5 o Figure 4. Supply Current vs. Ambient Temperature 3.5 4.0 4.5 5.0 5.5 Figure 5. Supply Current vs. Supply Voltage 1.8 2.0 1.9 o TA=25 C Enable Active VIN=3.3V VIN=5V Enable Active 1.7 Current Limit (A) 1.8 Current Limit (A) 3.0 Supply Voltage (V) Ambient Temperature ( C) 1.7 1.6 1.5 1.4 1.6 1.5 1.4 1.3 1.3 1.2 1.2 1.1 1.1 1.0 3.0 3.5 4.0 4.5 5.0 1.0 -40 5.5 Supply Voltage (V) 0 20 40 60 80 o Ambient Temperature ( C) Figure 6. Current Limit vs. Supply Voltage Jul. 2012 -20 Figure 7. Current Limit vs. Ambient Temperature Rev 1. 2 BCD Semiconductor Manufacturing Limited 7 Advance Datasheet 1.0A High-side Power Distribution Switch with Enable and Flag AP2810 Typical Performance Characteristics (Continued) 1.0 0.80 Output Short Current (A) Output Short Current (A) TA=25 C Enable Active 0.75 VIN=5V Enable Active 0.9 o 0.70 0.65 0.60 0.55 0.50 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.45 0.40 0.1 3.0 3.5 4.0 4.5 5.0 0.0 -40 5.5 -20 vs. 60 80 vs. 1.0 0.8 0.4 0.2 0.0 -0.2 -0.4 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.6 -0.8 -0.8 -20 0 20 40 60 VIN=3.5V VOUT=4.5V Disable Active 0.8 VIN=5V Disable Active 0.6 Reverse Current (μA) Shutdown Current (μA) 40 Figure 9. Output Short Current Ambient Temperature 1.0 -1.0 -40 80 -20 0 20 40 60 80 o o Ambient Temperature ( C) Ambient Temperature ( C) Figure 10. Shutdown Current vs. Ambient Temperature Jul. 2012 20 Ambient Temperature ( C) Figure 8. Output Short Current Input Voltage -1.0 -40 0 o Input Voltage (V) Figure 11. Reverse Current vs. Ambient Temperature Rev 1. 2 BCD Semiconductor Manufacturing Limited 8 Advance Datasheet 1.0A High-side Power Distribution Switch with Enable and Flag AP2810 Typical Performance Characteristics (Continued) VEN (5V/div) VEN (5V/div) IINRUSH (1A/div) IINRUSH (20mA/div) VOUT (1V/div) VOUT (1V/div) Time(500µs/div) Time(500µs/div) Figure 12. Output Turn ON and Rise Time (CIN=1.0μF, COUT=1.0μF, No Load) Figure 13. Output Turn ON and Rise Time (CIN=1.0μF, COUT=1.0μF, RL=5.0Ω) VEN (5V/div) VEN (5V/div) VOUT (1V/div) IINRUSH (1A/div) VOUT (1V/div) COUT=470μF COUT=22μF COUT=220μF COUT=100μF Time(500µs/div) Time(5ms/div) Figure 14. Output Turn ON and Rise Time (CIN=1.0μF, COUT=100μF, No Load) Jul. 2012 COUT=1μF Figure 15. Output Turn OFF and Falling Time (VIN=5V, CIN=1.0μF, No Load) Rev 1. 2 BCD Semiconductor Manufacturing Limited 9 Advance Datasheet 1.0A High-side Power Distribution Switch with Enable and Flag AP2810 Typical Performance Characteristics (Continued) VEN (5V/div) VOUT (1V/div) VEN (5V/div) VOUT (1V/div) IOUT (1A/div) IOUT (1A/div) Time(2ms/div) Time(100ms/div) Figure 16. Output Turn OFF and Falling Time (VIN=5V, CIN=1.0μF, COUT=470μF, RL=5.0Ω) Figure 17. Output Short to GND Current (VIN=5V,CIN=1.0μF) VFLAG (1V/div) VOUT (1V/div) IOUT (1A/div) VFLAG (1V/div) VOUT (1V/div) IOUT (1A/div) Time(5ms/div) Time(5ms/div) Figure 18. FLAG Response During Over Current (VIN=5V, CIN=1.0μF, COUT=470μF) Jul. 2012 Figure 19. FLAG Response During Over Temperature (VIN=5V, CIN=1.0μF, COUT=220μF, RL=5.0Ω) Rev 1. 2 BCD Semiconductor Manufacturing Limited 10 Advance Datasheet 1.0A High-side Power Distribution Switch with Enable and Flag AP2810 Typical Application Note 2: 2.2μF input capacitor is enough in most application cases. If the VOUT is short to ground frequently during usage, large size input capacitor is necessary, recommend 22μF. Figure 20. Typical Application of AP2810 Jul. 2012 Rev 1. 2 BCD Semiconductor Manufacturing Limited 11 Advance Datasheet 1.0A High-side Power Distribution Switch with Enable and Flag AP2810 Mechanical Dimensions SOIC-8 4.700(0.185) 5.100(0.201) 7° Unit: mm(inch) 0.320(0.013) 1.350(0.053) 1.750(0.069) 8° 8° 7° 0.675(0.027) 0.725(0.029) D 5.800(0.228) 1.270(0.050) 6.200(0.244) TYP D 20:1 0.300(0.012) R0.150(0.006) 0.100(0.004) 0.800(0.031) 0.200(0.008) 0° 8° 1.000(0.039) 3.800(0.150) 4.000(0.157) 0.330(0.013) 0.510(0.020) 0.190(0.007) 0.250(0.010) 0.900(0.035) 1° 5° R0.150(0.006) 0.450(0.017) 0.800(0.031) Note: Eject hole, oriented hole and mold mark is optional. Jul. 2012 Rev 1. 2 BCD Semiconductor Manufacturing Limited 12 Advance Datasheet 1.0A High-side Power Distribution Switch with Enable and Flag AP2810 Mechanical Dimensions (Continued) 2.900(0.114) 3.100(0.122) 0.200(0.008) 0.000(0.000) 4.700(0.185) 5.100(0.201) Jul. 2012 Unit: mm(inch) 0.410(0.016) 0.650(0.026) MSOP-8 Rev 1. 2 BCD Semiconductor Manufacturing Limited 13 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com IMPORTANT NOTICE IMPORTANT NOTICE BCD Semiconductor BCD Semiconductor Manufacturing Manufacturing Limited Limited reserves reserves the the right right to to make make changes changes without without further further notice notice to to any any products products or or specifispecifications herein. cations herein. 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