COMCHIP CSRS045V0P-HF

Comchip
Low Capacitance ESD Protection Array
SMD Diode Specialist
CSRS045V0P-HF
RoHS Device
Halogen Free
SOT-143
Features
0.120(3.04)
0.110(2.80)
ESD Protected for 2 high speed I/O ports
IEC61000-4-2 (ESD) ±8kV (Contact) ,±15kV(Air).
0.080(2.02)
0.071(1.80)
0.038(0.96)BSC
IEC61000-4-4 (FET)(5/50ns) Level-3, 20A for I/O
0.055(1.40)
0.047(1.20)
40A for Power.
IEC61000-4-5 (Lightning) 6A(8/20uS)
Working voltage: 5V
0.0078(0.20)BSC
0.020(0.50)
0.014(0.35)
Low capacitance:1.2pF(Typ.).
Fast turn-on and Low clamping voltage.
0.043(1.10)
0.035(0.90)
Mechanical data
Case: SOT-143 standard package,
molded plastic.
0.035(0.89)
0.030(0.76)
Terminals: Solder plated, solderable per
MIL-STD-750,method 2026.
0.004(0.10)
0.002(0.05)
0.007(0.18)
0.004(0.09)
0.100(2.55)
0.089(2.25)
Weight: 0.0108 gram(approx.).
Circuit Diagram
0.024(0.60)
0.012(0.30)
4
Dimensions in inches and (millimeters)
2
3
1
Pin Configuration
VDD
I/O 2
4
3
1
2
GND
I/O 1
REV:B
Page 1
QW-JP002
Comchip Technology CO., LTD.
Comchip
Low Capacitance ESD Protection Array
SMD Diode Specialist
Maximum Rating (at TA=25°C unless otherwise noted)
Symbol
Value
Unit
Peak pulse current ( tp = 8/20 us)
IPP
6
A
Operating supply voltage
VDC
6
V
ESD per IEC 61000-4-2(Air)
ESD per IEC 61000-4-2(Contact)
VESD
17
12
kV
Lead soldering temperature
TSOL
260 ( 10 sec)
°C
Tj
-55 to +85
°C
TSTG
-55 to +150
°C
VIO
(GND -0.5) to (VDD +0.5)
V
Parameter
Operating temperature
Storage temperature
DC voltage at any I/O pin
Electrical Characteristics (at TA=25°C unless otherwise noted)
Parameter
Conditions
Symbol Min Typ Max Unit
Reverse stand-Off voltage
Pin 4 to Pin 1
VRWM
5
V
Reverse leakage current
VRWM = 5 V, T=25°C, Pin 4 to Pin 1
ILeak
2
uA
Channel leakage current
VPIN 4 = 5 V, VPIN 1 = 0V, T=25°C
ICH-Leak
1
uA
Diode breakdown voltage
IR = 1 mA,, T=25°C, Pin 4 to Pin 1
VBV
Forward voltage
IF = 15 mA,, T=25°C, Pin 1 to Pin 4
VF
0.8
1
V
VCL
8.1
9
V
Vhold
13
CIN
1.2
1.4
pF
CCROSS
0.1
0.12
pF
∆CIN
0.04
0.06
pF
Clamping voltage
IPP= 5 A, tp=8/20us, T=25°C,
Any Channel Pin to Ground
ESD Holding Voltage
IEC 61000-4-2 +6kV, T=25°C,
Contact mode Any channel
pin to ground
Channel Input Capacitance
Vpin4 = 5V,Vpin1= 0V, VIN=2.5V,
f = 1MHz,Any channel pin to ground
Channel to Channel Input Capacitance
Voltage of Channel Input Capacitance
Vpin4 = 5V,Vpin1= 0V, VIN=2.5V
f = 1MHz,Between channel pin
Vpin4 = 5V,Vpin1= 0V, VIN=2.5V
f = 1MHz,Channel_x pin to ground -
6.2
V
V
channel_y pin to ground
REV:B
Page 2
QW-JP002
Comchip Technology CO., LTD.
Comchip
Low Capacitance ESD Protection Array
SMD Diode Specialist
RATING AND CHARACTERISTIC CURVES (CSRS045V0P-HF)
Fig. 2 - Clamping voltage vs.
Peak pulse current
110
10.0
100
9.5
90
Clamping Voltage, ( V )
% of Rated Power or IPP
Fig. 1 - Power derating curve
80
70
60
50
40
30
20
9.0
8.5
8.0
7.5
7.0
6.5
6.0
I/O pin to GND pin
5.5
10
5.0
0
0
25
50
75
100
125
4.5
150
5.0
5.5
2.0
4.5
1.8
4.0
3.5
3.0
2.5
2.0
Waveform
Parameters:
tr=8 μs
td=20 μs
1.0
I/O pin to GND pin
0.5
6.5
7.0
Fig.4 - Typical variation of CIN v.s. VIN
5.0
Input Capacitance, ( pF )
Forward Voltage, ( V )
Fig.3 - Forward voltage v.s.
forward current
1.5
6.0
Peak pulse Current, ( A )
Ambient Temperature,TA ( °C )
1.6
1.4
1.2
1.0
0.8
VDD=5V, GND=0V, f=1MHz, T=25
O
C
0.6
0.4
0.2
0.0
0.0
4.5
5.0
5.5
6.0
6.5
0
7.0
1
2
Peak pulse Current, ( A )
Transmission Line Pulsing (TLP)
Current, ( A )
1.4
VDD=5V, GND=0V, V
IN
4
5
Fig. 6 - Transmission line pulsing
(TLP) measurement
1.5
1.3
3
Input Voltage, ( V )
Fig. 5 - Typical variation of CIN v.s.
temperature
Input Capacitance, ( pF )
Waveform
Parameters:
tr=8 μs
td=20 μs
=2.5V, f=1MHz
1.2
1.1
1.0
0.9
0.8
0.7
18
16
14
V_pulse
12
Pulse from a
transmission line
10
TLP_I
+
100ns
TLP_V
8
DUT
-
6
4
I/O to GND
2
0.6
0
0.5
0
20
40
60
80
Temperature, ( °C )
100
2
4
6
8
10
12
14
120
Transmission Line Pulsing (TLP) Voltage, ( V )
REV:B
Page 3
QW-JP002
Comchip Technology CO., LTD.
Comchip
Low Capacitance ESD Protection Array
SMD Diode Specialist
Reel Taping Specification
d
P0
E
Index hole
P1
T
F
W
B
P
A
C
12
o
0
D2
D1 D
W1
Trailer
Device
.......
.......
End
.......
.......
Leader
.......
.......
.......
.......
10 pitches (min)
Start
10 pitches (min)
Direction of Feed
SOT-143
SOT-143
SYMBOL
A
B
C
d
D
D1
D2
(mm)
3.19 ± 0.10
2.80 ± 0.10
1.31 ± 0.10
1.55 ± 0.10
178 ± 1
50.0 MIN.
13.0 ± 0.20
(inch)
0.126 ± 0.004
0.110 ± 0.004
0.052 ± 0.004
0.061 ± 0.004
7.008 ± 0.040
1.969 MIN.
0.512 ± 0.008
SYMBOL
E
F
P
P0
P1
W
W1
(mm)
1.75 ± 0.10
3.50 ± 0.05
4.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.05
8.00 ± 0.30
14.4 MAX.
(inch)
0.069 ± 0.004
0.138 ± 0.002
0.157 ± 0.004
0.157 ± 0.004
0.079 ± 0.002
0.315 ± 0.012
0.567 MAX
REV:B
Page 4
QW-JP002
Comchip Technology CO., LTD.
Comchip
Low Capacitance ESD Protection Array
SMD Diode Specialist
Marking Code
3
4
Part Number
Marking Code
CSRS045V0P-HF
C06XY
C06XY
1
C06 = Device code
X = Date Code
Y = Control Code
2
Suggested PAD Layout
SOT-143
SIZE
(mm)
(inch)
A
1.00
0.039
A1
1.40
0.055
A
A
C
D
E
B
1.40
0.055
C
1.92
0.076
C1
1.72
0.068
B
A1
D
2.20
0.087
E
0.80
0.031
F
3.60
0.142
F
C1
A
Standard Packaging
Qty Per Reel
Reel Size
(Pcs)
(inch)
3,000
7
Case Type
SOT-143
REV:B
Page 5
QW-JP002
Comchip Technology CO., LTD.