PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) JM38510/30109B2A ACTIVE LCCC FK 20 1 TBD JM38510/30109BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/30109BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/30109BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/30109BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/30109SEA ACTIVE CDIP J 16 25 TBD A42 N / A for Pkg Type JM38510/30109SEA ACTIVE CDIP J 16 25 TBD A42 N / A for Pkg Type JM38510/30109SFA ACTIVE CFP W 16 25 TBD A42 N / A for Pkg Type JM38510/30109SFA ACTIVE CFP W 16 25 TBD A42 N / A for Pkg Type M38510/30109B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type M38510/30109B2A ACTIVE LCCC FK 20 1 TBD M38510/30109BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type M38510/30109BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type M38510/30109BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type M38510/30109BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type M38510/30109SEA ACTIVE CDIP J 16 25 TBD A42 N / A for Pkg Type M38510/30109SEA ACTIVE CDIP J 16 25 TBD A42 N / A for Pkg Type M38510/30109SFA ACTIVE CFP W 16 25 TBD A42 N / A for Pkg Type M38510/30109SFA ACTIVE CFP W 16 25 TBD A42 N / A for Pkg Type SN54LS109AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54LS109AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN74109N OBSOLETE PDIP N 16 TBD Call TI Call TI SN74109N OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS109AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 (3) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 23-Mar-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS109AN ACTIVE PDIP N 16 OBSOLETE PDIP N 16 TBD TBD Call TI Call TI Call TI Call TI SN74LS109AN3 OBSOLETE PDIP N 16 SN74LS109ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS109ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS109ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS109ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54LS109AFK ACTIVE LCCC FK 20 1 TBD Addendum-Page 2 Samples (Requires Login) SN74LS109ADG4 SN74LS109AN3 (3) POST-PLATE N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 23-Mar-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) SNJ54LS109AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS109AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54LS109AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54LS109AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SNJ54LS109AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54LS109A, SN54LS109A-SP, SN74LS109A : • Catalog: SN74LS109A, SN54LS109A • Military: SN54LS109A Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 • Space: SN54LS109A-SP NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS109ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LS109ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS109ADR SN74LS109ANSR SOIC D 16 2500 333.2 345.9 28.6 SO NS 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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