PACKAGE OPTION ADDENDUM www.ti.com 18-Jun-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-86806012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI -55 to 125 596286806012A UC1846L/ 883B 5962-8680601EA ACTIVE CDIP J 16 1 TBD Call TI Call TI -55 to 125 5962-8680601EA UC1846J/883B UC1846J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 UC1846J UC1846J/80257 OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1846J/80364 OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1846J/80619 OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1846J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8680601EA UC1846J/883B UC1846L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596286806012A UC1846L/ 883B UC1847J OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1847J883B OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1847L OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 UC1847L883B OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 UC2846DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2846DW UC2846DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2846DW UC2846DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2846DW UC2846DWTR/81265 OBSOLETE SOIC DW 16 TBD Call TI Call TI UC2846DWTR/81265G4 OBSOLETE SOIC DW 16 TBD Call TI Call TI UC2846DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2846DW UC2846J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -40 to 85 UC2846J Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Jun-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) UC2846N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2846N UC2846NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2846N UC2846QTR ACTIVE PLCC FN 20 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 UC2846Q UC2846QTRG3 ACTIVE PLCC FN 20 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 UC2846Q UC2847DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2847DW UC2847DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2847DW UC2847N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2847N UC2847NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2847N UC3846DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3846DW UC3846DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3846DW UC3846DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3846DW UC3846DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3846DW UC3846J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type 0 to 70 UC3846J UC3846N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3846N UC3846NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3846N UC3846Q ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 70 UC3846Q UC3846QG3 ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 70 UC3846Q UC3846QTR ACTIVE PLCC FN 20 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 70 UC3846Q Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Jun-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) UC3846QTRG3 ACTIVE PLCC FN 20 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 70 UC3846Q UC3847DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3847DW UC3847DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3847DW UC3847J OBSOLETE CDIP J 16 TBD Call TI Call TI 0 to 70 UC3847N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3847N UC3847NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3847N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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OTHER QUALIFIED VERSIONS OF UC1846, UC1847, UC2846, UC2846M, UC3846, UC3846M, UC3847 : • Catalog: UC3846, UC3847, UC2846, UC3846M, UC3846 • Enhanced Product: UC1846-EP, UC1846-EP • Military: UC2846M, UC1846, UC1847 • Space: UC1846-SP, UC1846-SP NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Enhanced Product - Supports Defense, Aerospace and Medical Applications • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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