TI CD74HC4051MM96EP

CD74HC4051-EP
ANALOG MULTIPLEXER/DEMULTIPLEXER
SCLS464 – SEPTEMBER 2002
D
D
D
D
D
D
D
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
Extended Temperature Performance of
–55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product Change Notification
Qualification Pedigree†
Wide Analog Input Voltage Range of
±5 V Max
Low ON Resistance
– 70 Ω Typical (VCC – VEE = 4.5 V)
– 40 Ω Typical (VCC – VEE = 9 V)
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
D
D
D
D
D
D
Low Crosstalk Between Switches
Fast Switching and Propagation Speeds
Break-Before-Make Switching
Operation Control Voltage = 2 V to 6 V
Switch Voltage = 0 V to 10 V
High Noise Immunity NIL = 30%, NIH = 30%
of VCC, VCC = 5 V
M PACKAGE
(TOP VIEW)
CHANNEL I/O A4
CHANNEL I/O A6
COM OUT/IN A
CHANNEL I/O A7
CHANNEL I/O A5
E
VEE
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
CHANNEL I/O A2
CHANNEL I/O A1
CHANNEL I/O A0
CHANNEL I/O A3
ADDRESS SEL S0
ADDRESS SEL S1
ADDRESS SEL S2
description
This device is a digitally controlled analog switch that utilizes silicon gate CMOS technology to achieve operating
speeds similar to LSTTL, with the low power consumption of standard CMOS integrated circuits.
This analog multiplexer/demultiplexer controls analog voltages that may vary across the voltage supply range
(i.e., VCC to VEE). These bidirectional switches allow any analog input to be used as an output and vice versa.
The switches have low ON resistance and low OFF leakages. In addition, the device has an enable control (E)
that, when high, disables all switches to their OFF state.
ORDERING INFORMATION
TA
PACKAGE‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
–55°C to 125°C
SOIC – M
Tape and reel
CD74HC4051MM96EP
HC4051MEP
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
CD74HC4051-EP
ANALOG MULTIPLEXER/DEMULTIPLEXER
SCLS464 – SEPTEMBER 2002
FUNCTION TABLE
INPUTS
ON
CHANNEL(S)
L
S2
L
S1
L
S0
L
L
L
L
H
A1
L
L
H
L
A2
L
L
H
H
A3
L
H
L
L
A4
L
H
L
H
A5
L
H
H
L
A6
L
H
H
H
A7
H
X
X
X
None
E
A0
X = Don’t care
logic diagram (positive logic)
CHANNEL I/O
VCC
A7
A6
A5
A4
A3
A2
A1
A0
16
4
2
5
1
12
15
14
13
TG
TG
S0 11
TG
Logic
Level
Conversion
S2
TG
Binary
To
1 of 8
Decoder
With
Enable
S1 10
9
3
TG
TG
TG
E
6
TG
2
8
7
GND
VEE
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
COM OUT/IN A
CD74HC4051-EP
ANALOG MULTIPLEXER/DEMULTIPLEXER
SCLS464 – SEPTEMBER 2002
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC – VEE (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 10.5 V
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Supply voltage range, VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.5 V to –7 V
Input clamp current, IIK (VI < –0.5 V or VI > VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < VEE – 0.5 V or VO > VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Switch current (VI > VEE – 0.5 V or VI < VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
VEE current, IEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
Package thermal impedance, θJA (see Note 2): M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature (during soldering):
At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max . . . . . . . . . . . . . . . . . . . . . . . 300°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages referenced to GND unless otherwise specified.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
VCC
MAX
UNIT
Supply voltage (see Note 4)
2
6
V
Supply voltage, VCC – VEE (see Figure 1)
2
10
V
VEE
Supply voltage, (see Note 4 and Figure 2)
0
–6
V
VIH
High-level input voltage
VIL
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
Input control voltage
tt
Input transition (rise and fall) time
0.5
1.35
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
V
1.8
0
Analog switch I/O voltage
V
4.2
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
Low-level input voltage
VI
VIS
1.5
3.15
VCC
VCC
VEE
0
1000
0
500
0
400
V
V
ns
TA
Operating free-air temperature
–55
125
°C
NOTES: 3. All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4. In certain applications, the external load resistor current may include both VCC and signal-line components. To avoid drawing VCC
current when switch current flows into the transmission gate inputs, the voltage drop across the bidirectional switch must not exceed
0.6 V (calculated from ron values shown in electrical characteristics table). No VCC current flows through RL if the switch current flows
into the COM OUT/IN A terminal.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
CD74HC4051-EP
ANALOG MULTIPLEXER/DEMULTIPLEXER
SCLS464 – SEPTEMBER 2002
recommended operating area as a function of supply voltages
8
(VCC – GND) – V
(VCC – GND) – V
8
6
HCT
HC
4
2
0
0
2
4
6
8
10
6
HCT
HC
4
2
0
12
0
–2
(VCC – VEE) – V
–4
–6
–8
(VEE – GND) – V
Figure 1
Figure 2
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VEE
VCC
MIN
VIS = VCC or VEE
ron
IO = 1 mA,
VI = VIH or VIL,
See Figure 8
VIS = VCC to VEE
∆ron
Between any two channels
IIZ
For switch OFF:
When VIS = VCC, VOS = VEE;
When VIS = VEE, VOS = VCC
For switch ON:
All applicable combinations of VIS and VOS
voltage levels,
VI = VIH or VIL
IIL
ICC
4
TYP
MAX
MIN
0V
4.5 V
70
160
240
0V
6V
60
140
210
–4.5 V
4.5 V
40
120
180
0V
4.5 V
90
180
270
0V
6V
80
160
240
–4.5 V
4.5 V
45
130
195
0V
4.5 V
10
0V
6V
8.5
–4.5 V
4.5 V
0V
6V
Ω
Ω
5
±0.2
±2
µA
–5 V
5V
±0.4
±4
0V
6V
±0.1
±1
0V
6V
8
160
When VIS = VCC,
VOS = VEE
–5 V
5V
16
320
POST OFFICE BOX 655303
UNIT
MAX
When VIS = VEE,
VOS = VCC
VI = VCC or GND
IO = 0,
VI = VCC or GND
TA = –55°C
TO 125°C
TA = 25°C
µA
µA
• DALLAS, TEXAS 75265
CD74HC4051-EP
ANALOG MULTIPLEXER/DEMULTIPLEXER
SCLS464 – SEPTEMBER 2002
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 7)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
VEE
VCC
CL = 15 pF
tpd
IN
OUT
0V
CL = 50 pF
–4.5 V
ADDRESS SEL or E
OUT
0V
CL = 50 pF
–4.5 V
CI
ADDRESS SEL or E
OUT
Control
MIN
MIN
MAX
5V
4
ns
60
90
12
18
6V
10
15
4.5 V
8
12
5V
19
2V
225
340
4.5 V
45
68
6V
38
57
4.5 V
32
48
5V
19
2V
225
340
0V
4.5 V
45
68
6V
38
57
–4.5 V
4.5 V
32
48
10
10
CL = 50 pF
CL = 50 pF
UNIT
MAX
2V
CL = 15 pF
tdis
TA = –55°C
TO 125°C
4.5 V
CL = 15 pF
ten
TA = 25°C
ns
ns
ns
pF
operating characteristics, VCC = 5 V, TA = 25°C, Input tr, tf = 6 ns
PARAMETER
Cpd
TYP
Power dissipation capacitance (see Note 5)
50
UNIT
pF
NOTE 5: Cpd is used to determine the dynamic power consumption, per package.
PD = Cpd VCC2 fI + Σ (CL + CS) VCC2 fO
fO = output frequency
fI = input frequency
CL = output load capacitance
CS = switch capacitance
VCC = supply voltage
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
CD74HC4051-EP
ANALOG MULTIPLEXER/DEMULTIPLEXER
SCLS464 – SEPTEMBER 2002
analog channel characteristics, TA = 25°C
PARAMETER
TEST CONDITIONS
CI
Switch input capacitance
CCOM
Common output capacitance
fmax
VEE
Minimum switch frequency
q
y
response at –3 dB
See Figure
g
3 and Figure
g
9,, and
Notes 6 and 7
Sine wave distortion
Sine-wave
See Figure 4
E or ADDRESS SEL to
switch feed-through noise
5 and Notes 7 and 8
See Figure 5,
Switch OFF signal
g
feed
through
See Figure
g
6 and Figure
g
10, and
Notes 7 and 8
VCC
MIN
TYP
MAX
UNIT
5
pF
25
pF
–2.25 V
2.25 V
145
–4.5 V
4.5 V
180
–2.25 V
2.25 V
0.035
–4.5 V
4.5 V
0.018
–2.25 V
2.25 V
(TBD)
–4.5 V
4.5 V
(TBD)
–2.25 V
2.25 V
–73
–4.5 V
4.5 V
–75
MHz
%
mV
dB
NOTES: 6. Adjust input voltage to obtain 0 dBm at VOS for fIN = 1 MHz.
7. VIS is centered at (VCC – VEE)/2.
8. Adjust input for 0 dBm.
PARAMETER MEASUREMENT INFORMATION
VCC
VCC
VIS
VI = VIH
VIS
0.1 mF
VOS
SWITCH
ON
50 Ω
10 pF
dB
METER
SINEWAVE
VIS
10 mF
SWITCH
ON
VOS
10k Ω
50 pF
DISTORTION
METER
VCC/2
VCC/2
fIS = 1 kHz to 10 kHz
Figure 3. Frequency-Response Test Circuit
6
POST OFFICE BOX 655303
Figure 4. Sine-Wave Distortion Test Circuit
• DALLAS, TEXAS 75265
CD74HC4051-EP
ANALOG MULTIPLEXER/DEMULTIPLEXER
SCLS464 – SEPTEMBER 2002
PARAMETER MEASUREMENT INFORMATION
E
VCC
V OS
600 Ω
VCC/2
SWITCH
ALTERNATING
ON AND OFF
tr, tf ≤ 6 ns
fCONT = 1 MHz
50% DUTY
CYCLE
fIS ≥ 1-MHz SINE WAVE
R = 50 Ω
C = 10 pF
V P–P
VCC
0.1 µF
V OS
SWITCH
V IS
600 Ω
VC = VIL
V OS
OFF
50 pF
SCOPE
R
R
VCC/2
VCC/2
C
dB
METER
VCC/2
Figure 5. Control to Switch Feed-Through Noise
Test Circuit
POST OFFICE BOX 655303
Figure 6. Switch OFF Signal Feed-Through
Test Circuit
• DALLAS, TEXAS 75265
7
CD74HC4051-EP
ANALOG MULTIPLEXER/DEMULTIPLEXER
SCLS464 – SEPTEMBER 2002
PARAMETER MEASUREMENT INFORMATION
VCC
Test
Point
From Output
Under Test
PARAMETER
S1
ten
RL = 1 kΩ
tdis
CL
(see Note A)
S2
S1
S2
tPZH
Open
Closed
tPZL
Closed
Open
tPHZ
Open
Closed
tPLZ
Closed
Open
Open
Open
tpd
VEE
LOAD CIRCUIT
Input
50% VCC
50% VCC
tPLH
tPHL
VCC
VEE
In-Phase
Output
50%
10%
90%
90%
tr
tPHL
Out-of-Phase
Output
90%
VOH
50% VCC
10%
VOL
tf
50% VCC
10%
tf
50%
10%
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50% VCC
0V
tPLZ
≈VCC
Output
Waveform 1
(see Note B)
50% VCC
Output
Waveform 2
(see Note B)
10%
VOL
tPHZ
tPZH
VOH
VOL
50% VCC
tPZL
tPLH
90%
VCC
Output
Control
50% VCC
90%
VOH
≈0 V
VOLTAGE WAVEFORMS
OUTPUT ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. For clock inputs, fmax is measured with the input duty cycle at 50%.
E. The outputs are measured one at a time with one input transition per measurement.
F. tPLZ and tPHZ are the same as tdis.
G. tPZL and tPZH are the same as ten.
H. tPLH and tPHL are the same as tpd.
Figure 7. Load Circuit and Voltage Waveforms
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
CD74HC4051-EP
ANALOG MULTIPLEXER/DEMULTIPLEXER
SCLS464 – SEPTEMBER 2002
TYPICAL CHARACTERISTICS
120
ON Resistance – Ω
100
80
V CC – V EE = 4.5 V
60
V CC – V EE = 6 V
40
V CC – VEE = 9 V
20
1
2
3
4
5
6
7
8
9
Input Signal Voltage – V
Figure 8. Typical ON Resistance vs Input Signal Voltage
0
0
VCC = 4.5 V
GND = –4.5 V
VEE = –4.5 V
RL = 50 Ω
PIN 12 TO 3
–4
–20
dB
dB
–2
VCC = 2.25 V
GND = –2.25 V
VEE = –2.25 V
RL = 50 Ω
PIN 12 TO 3
–6
–40
–60
VCC = 4.5 V
GND = –4.5 V
VEE = –4.5 V
RL = 50 Ω
PIN 12 TO 3
–80
–8
–10
10K
VCC = 2.25 V
GND = –2.25 V
VEE = –2.25 V
RL = 50 Ω
PIN 12 TO 3
100K
1M
10M
100M
–100
10K
100K
Frequency – Hz
1M
10M
100M
Frequency – Hz
Figure 9. Channel ON Bandwidth
POST OFFICE BOX 655303
Figure 10. Channel OFF Feed Through
• DALLAS, TEXAS 75265
9
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD74HC4051MM96EP
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03606-01XE
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD74HC4051-EP :
CD74HC4051
• Catalog:
CD74HC4051-Q1
• Automotive:
• Military: CD54HC4051
NOTE: Qualified Version Definitions:
- TI's standard catalog product
• Catalog
- Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Automotive
• Military - QML certified for Military and Defense Applications
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CD74HC4051MM96EP
Package Package Pins
Type Drawing
SOIC
D
16
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
6.5
10.3
2.1
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD74HC4051MM96EP
SOIC
D
16
2500
333.2
345.9
28.6
Pack Materials-Page 2
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DLP® Products
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DSP
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Logic
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Microcontrollers
microcontroller.ti.com
Video and Imaging
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RFID
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