EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Feature ‧ ‧ ‧ ‧ ‧ ‧ ‧ ‧ This is a preliminary specification intended for design purposes and subject to change without prior notice. RoHS compliant. Chip LED package. Colorless diffiused resin. Wide viewing angle 140o. Brightness: 11.20 to 28.00 mcd at 20 mA. Qualification according to AEC-Q101. Precondition: Bases on JEDEC J-STD 020 Level 3. Useable in severe lead free processes with automotive reflow profile (IR reflow or wave soldering)) Applications ‧ ‧ ‧ ‧ ‧ ‧ ‧ Automotive backlighting or indicator: Dashboard, switch, audio and video equipments…etc. Backlight: LCD, switches, symbol, mobile phone and illuminated advertising. Display for indoor and outdoor application. Ideal for coupling into light guides. Substitution of traditional light. Optical indicator. General applications. Device Selection Guide Chip Emitted Color Resin Color Pale Green Water Clear Material AlGaInP Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 1 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Absolute Maximum Ratings (Ta=25℃) Rating Unit Parameter Symbol Reverse Voltage VR 5 V Forward Current IF 25 mA Peak Forward Current (Duty 1/10 @1KHz) IFP 60 mA Power Dissipation Pd 60 mW Junction Temperature Tj 115 ℃ Operating Temperature Topr -40 ~ +100 ℃ Storage Temperature Tstg -40 ~ +110 ℃ Rth J-A 800 K/W Rth J-S 450 K/W Thermal resistance Soldering Temperature Tsol ESD (Classification acc. AEC Q101) Everlight Electronics Co., Ltd. Device No:DSE-0000250 Reflow Soldering : 260 ℃ for 30 sec. Hand Soldering : 350 ℃ for 3 sec. ESDHBM 2000 V ESDMM 200 V http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 2 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity Iv 11.20 ----- 28.00 mcd IF=20mA Viewing Angle 2θ1/2 ----- 140 ----- deg IF=20mA Peak Wavelength λp ----- 561 ----- nm IF=20mA Dominant Wavelength λd 557.5 ---- 567.5 nm IF=20mA Spectrum Radiation Bandwidth ∆λ ----- 20 ----- nm IF=20mA Forward Voltage VF 1.75 ---- 2.35 V IF=20mA Reverse Current IR ----- ----- 50 µA VR=5V Temperature coefficient of λp TCλp ----- 0.13 ----- nm/K IF=20mA Temperature coefficient of λd TCλd ----- 0.08 ----- nm/K IF=20mA Temperature coefficient of VF TCV ----- -4.3 ----- mV/K IF=20mA Note: Tolerance of Luminous Intensity: ±11% Tolerance of Dominant Wavelength: ±1nm Tolerance of Forward Voltage: ±0.1V Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 3 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Bin Range of Luminous Intensity Bin Code Min. Max. L1 11.20 14.00 L2 14.00 18.00 M1 18.00 22.40 M2 22.40 28.00 Unit Condition mcd IF=20mA Unit Condition nm IF=20mA Note Tolerance of Luminous Intensity：±11% Bin Range of Dominant Wavelength Bin Code Min. Max. C10 557.5 559.5 C11 559.5 561.5 C12 561.5 563.5 C13 563.5 565.5 C14 565.5 567.5 Note: Tolerance of Dominant Wavelength: ±1nm Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 4 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Typical Electro-Optical Characteristics Curves Relative Intensity (%) Typical curve of spectral distribution: λp(nm) Note: V(λ)=Standard eye response curve View Angle Diagram characteristics of radiation Relative Intensity Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 5 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Dominant Wavelength vs. Forward Current (Ta=25℃) Forward Current (mA) Dominant Wavelength (nm) Forward Current vs. Forward Voltage (Ta=25℃) Forward Voltage (V) Forward current vs. Ambient and Solder Temperature Forward Current (mA) Relative Luminous Intensity Relative Luminous Intensity vs.Forward Current (Ta=25℃) Forward Current (mA) Forward Current (mA) Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Temperature (℃) Rev. 1 Created by: Wuhongmei Page: 6 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Relative Luminous Intensity vs. Relative Forward Voltage vs. Junction Temperature Junction Temperature 0.15 0.1 1.40 Relative Luminous Intensity Relative Luminous Intensity 1.80 1.00 0.60 0.20 -0.20 0.05 0 -0.05 -0.1 -0.15 -0.2 -20 0 20 40 60 80 100 120 -20 Junction Temperature (℃) Note: f(Tj) = Iv / Iv(25℃); IF =20mA Everlight Electronics Co., Ltd. Device No:DSE-0000250 0 20 40 60 80 100 120 Junction Temperature (℃) Note: △VF = VF - VF(25 ℃) = f(Tj); IF =20mA http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 7 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Package Dimension + 1.05 - Note: Tolerances unless mentioned ±0.1mm. Unit = mm Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 8 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Label Explanation ․CPN: Customer’s Product Number ․P/N: Product Number ․QTY: Packing Quantity ․CAT: Luminous Intensity Rank ․HUE: Dom. Wavelength Rank ․REF: Forward Voltage Rank ․LOT No: Lot Numbe Pb EVERLIGHT CPN : P N : XXXXXXXXXXXXX RoHS XXXXXXXXXXXXX CAT : XXX HUE : XXX REF : XXX QTY : XXX LOT NO : XXXXXXXXXX Reference : XXXXXXXX MADE IN TAIWAN Reel Dimensions Note: Unit = mm Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 9 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Carrier Tape Dimensions: Loaded Quantity 3000 pcs Per Reel Note: Tolerances unless mentioned ±0.1mm. Unit = mm Moisture Resistant Packaging Process and Materials Label Everlight Electronics Co., Ltd. Device No:DSE-0000250 Aluminum moisture-proof bag http://www.everlight.com Prepared date: 24-Oct-2008 Desiccant Rev. 1 Created by: Wuhongmei Label Page: 10 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Precautions for Use 1. Soldering Condition 1.1 (A) Maximum Body Case Temperature Profile for evaluation of Reflow Profile Note: Reference: IPC/JEDEC J-STD-020D Preheat Temperature min (Tsmin) 150 °C 200°C Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 60-120 seconds 3 °C/second max. Average ramp-up rate (Tsmax to Tp) Other Liquidus Temperature (TL) 217 °C Time above Liquidus Temperature (t L) 60-150 sec Peak Temperature (TP) 260°C Time within 5 °C of Actual Peak Temperature: TP - 5°C 30 s Ramp- Down Rate from Peak Temperature 6°C /second max. Time 25°C to peak temperature 8 minutes max. Reflow times 3 times All parameters are maximum body case temperature values and cannot be considered as a soldering profile. The body case temperature was measured by soldering a thermal couple to the soldering point of LEDs. Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 11 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM 1.05 (B) Recommend soldering pad Note: Tolerances unless mentioned ±0.1mm. Unit = mm 2. Current limiting A resistor should be used to limit current spikes that can be caused by voltage fluctuations. Otherwise damage could occur. 3. Storage 3.1 Moisture proof bag should only be opened immediately prior to usage. 3.2 Environment should be less than 30℃ and 60% RH when moisture proof bag is opened. 3.3 After opening the package MSL Conditions stated on page 1 of this spec should not be exceeded. 3.4 If the moisture sensitivity card indicates higher than acceptable moisture, the component should be baked at min. 60deg +/-5deg for 24 hours. 4. Iron Soldering Hand soldering is not recommended for regular production. These guidelines are for rework only. Soldering iron tip should contact each terminal no more than 3 sec at 350℃, using soldering iron with nominal power less than 25W. Allow min. 2 sec. between soldering intervals. 5. Usage Do not exceed the values given in this specification. Application Restrictions 1. High reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. If you have any concerns, please contact Everlight before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond the specification described in this document. Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 12 of 12