GOOD-ARK MLSEP12A

MLSEP*** Series
Multilayer Polymer ESD Suppressor
MLSEP12A-1206A4
Features
„
ESD protection for high speed data lines to
IEC61000-4-2 ESD contact discharge typical 8KV, max 15KV
IEC61000-4-2 ESD air discharge typical 15KV, max 25KV
„
Multilayer structure
„
Surface mount
„
Extremely low capacitance
„
Very low leakage current
„
Fast response time
„
Bi-directional ESD protection
„
Lead free solder termination
„
The best ESD protection for high frequency, low voltage applications
Application
„
High Definition Multi-Media Interface (HDMI)
„
Digital Visual Interface (DVI)
„
Display Port Interface
„
Unified Display Interface (UDI)
„
MDDI Ports
„
Gigabit Ethernet
„
USB2.0 and IEEE1394 interface
Electrical Diagram
Caution: This component is designed for signal line protection only, not intended to be used under bias, not for application with a
power line.
Electrical Characteristics
Electrical Characteristics
Parameter
Symbol
Conditions
Min
Typ
Max
Units
Continuous operating voltage
VDC
---
---
---
12
V
Trigger voltage
VT
IEC61000-4-2 8KV contact discharge
---
300
---
V
Clamping voltage
VC
IEC61000-4-2 8KV contact discharge
---
20
---
V
Leakage current
IL
12V VDC
---
0.10
10
nA
Capacitance
CP
VR = 0V, f = 1MHz
---
0.15
0.3
pF
Operating Temperature
---
---
-40
---
90
℃
Storage Temperature
---
---
-55
---
150
℃
ESD pulse withstand
Pulses
IEC61000-4-2 8KV contact discharge
2000
---
---
---
Notes:
1, Trigger and clamping voltage measure per IEC 61000-4-2, 8KV direct discharge method
Polymer ESD Suppressor
1
www.goodark.com
MLSEP*** Series
Multilayer Polymer ESD Suppressor
MLSEP12A-1206A4
Typical PESD clamping for +8KV pulse per IEC61000-4-2
Design Recommendations for Dual USB2.0
Design Recommendations for I/O Port
Polymer ESD Suppressor
2
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MLSEP*** Series
Multilayer Polymer ESD Suppressor
MLSEP12A-1206A4
Environmental Specifications
Operation temperature: -40~90℃
Moisture Resistance, Steady state: MIL-STD-833,Method 1004.7,85% RH,85℃,1000hrs
Thermal Shock: MIL-STD-202,Method 107G,-55℃to150℃,30 min cycle,10 cycles.
Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10HZ, 1 min. cycle, 2hrs each in X-Y-Z)
Chemical Resistance: ASTM D-543, 4hrs @40℃, 3 solutions (H2O, detergent solution, deluxer )
Solder leach resistance and terminal adhesion: Per EIA-576 test
Part Numbering
Product Dimensions (mm)
A
B
D
C
E
Width A
Min
Max
1.50
1.70
Length B
Min
Max
3.52
3.72
Height C
Min
Max
0.33
0.43
Pad distance D
Min
Max
0.83
1.03
Terminal width E
Min
Max
0.52
0.62
Unit
mm
Recommended PAD Layout
A
Polymer ESD Suppressor
B
C
D
E
F
Unit
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
0.55
0.65
0.25
0.35
2.10
2.30
3.20
3.40
0.65
0.75
0.70
0.80
3
mm
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MLSEP*** Series
Multilayer Polymer ESD Suppressor
MLSEP12A-1206A4
Solder Reflow Recommendation
Item
A
B
C
D
E
F
Process
Soak Start
Soak time
Soak end
Peak Temp.
Time above
Cooling
Description
From ambient to soak temperature and soak start
Soak time
Soak end
From soak temperature to Peak temperature
Main heating time
From main heating temperature to 100℃
Reach Temp.
150℃ - 180℃
--180℃ - 200℃
260℃
230℃ - 260℃
100℃
Time or Rate
2℃ - 4℃ / sec
60s - 120s
--2℃ - 3℃ / sec
40s - 60s
Max. 4℃ / sec
Notes:
1* Peak temperature can be high to 260℃, and the recommendation time is as below
at 230℃
40s ~ 60s
at 240℃
30s ~ 40s
at 260℃
5s ~ 10s
2* Recommended reflow methods: IR, Vapor phase oven, hot air oven, wave solder.
3* Devices can be cleaned using standard industry methods and solvents.
4* Component can withstand 270℃ 10 sec.
5* If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Package Information
Tape & Reel: 3000pcs per reel.
Polymer ESD Suppressor
4
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