MLSEP*** Series Multilayer Polymer ESD Suppressor MLSEP12A-0402 Features ESD protection for high speed data lines to IEC61000-4-2 ESD contact discharge typical 8KV, max 15KV IEC61000-4-2 ESD air discharge typical 15KV, max 25KV Multilayer structure Surface mount Extremely low capacitance Very low leakage current Fast response time Bi-directional ESD protection Lead free solder termination The best ESD protection for high frequency, low voltage applications Application High Definition Multi-Media Interface (HDMI) Digital Visual Interface (DVI) Display Port Interface Unified Display Interface (UDI) MDDI Ports Gigabit Ethernet USB2.0 and IEEE1394 interface Caution: This component is designed for signal line protection only, not intended to be used under bias, not for application with a power line. Electrical Characteristics Electrical Characteristics Parameter Symbol Conditions Min Typ Max Units Continuous operating voltage VDC --- --- --- 12 V Trigger voltage VT IEC61000-4-2 8KV contact discharge --- 300 --- V Clamping voltage VC IEC61000-4-2 8KV contact discharge --- 20 --- V Leakage current IL 12V VDC --- 0.10 10 nA Capacitance CP VR = 0V, f = 1MHz --- 0.15 0.3 pF Operating Temperature --- --- -40 --- 90 ℃ Storage Temperature --- --- -55 --- 150 ℃ ESD pulse withstand Pulses IEC61000-4-2 8KV contact discharge 2000 --- --- --- Notes: 1, Trigger and clamping voltage measure per IEC 61000-4-2, 8KV contact discharge method Polymer ESD Suppressor 1 MLSEP*** Series Multilayer Polymer ESD Suppressor MLSEP12A-0402 Typical PESD clamping for +8KV pulse per IEC61000-4-2 Design Recommendations for USB2.0 For USB2.0 port Design Recommendations for Antenna For antenna line Polymer ESD Suppressor 2 MLSEP*** Series Multilayer Polymer ESD Suppressor MLSEP12A-0402 Part Numbering MLSEP 12 A – 0402 Series EIA Size Operating Voltage Trigger Voltage Level Environmental Specifications Operation temperature: -40~90℃ Moisture Resistance, Steady state: MIL-STD-833,Method 1004.7,85% RH,85℃,1000hrs Thermal Shock: MIL-STD-202, Method 107G,-55℃ to 150℃, 30 min cycle,10 cycles. Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10HZ, 1 min. cycle, 2hrs each in X-Y-Z) Chemical Resistance: ASTM D-543, 4hrs @40℃, 3 solutions (H2O, detergent solution, deluxer ) Solder leach resistance and terminal adhesion: Per EIA-576 test Product Dimensions (mm) Length A Min Max 0.95 1.15 Width B Min Max 0.45 0.65 Height C Min Max 0.33 0.43 Terminal width D Min Max 0.25 0.35 Unit mm Recommended PAD Layout A Min 0.60 Polymer ESD Suppressor B Max 0.70 Min 0.45 3 C Max 0.55 Min 0.85 Unit Max 0.95 mm MLSEP*** Series Multilayer Polymer ESD Suppressor MLSEP12A-0402 Solder Reflow Recommendation Item A B C D E F Process Soak Start Soak time Soak end Peak Temp. Time above Cooling Description From ambient to soak temperature and soak start Soak time Soak end From soak temperature to Peak temperature Main heating time From main heating temperature to 100℃ Reach Temp. 150℃ - 180℃ --180℃ - 200℃ 260℃ 230℃ - 260℃ 100℃ Time or Rate 2℃ - 4℃ / sec 60s - 120s --2℃ - 3℃ / sec 40s - 60s Max. 4℃ / sec Notes: 1* Peak temperature can be high to 260℃, and the recommendation time is as below at 230℃ 40s ~ 60s at 240℃ 30s ~ 40s at 260℃ 5s ~ 10s 2* Recommended reflow methods: IR, Vapor phase oven, hot air oven, wave solder. 3* Devices can be cleaned using standard industry methods and solvents. 4* Component can withstand 270℃ 10 sec. 5* If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Package Information Tape & Reel: 10000pcs per reel. Polymer ESD Suppressor 4 Rev. letter D Date 2008-7-22 Design Check Audit Approve Tony Michael Ken Ken