ICS ICS8520I-02

ICS8520I-02
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
GENERAL DESCRIPTION
FEATURES
The ICS8520I-02 is a low skew, high performance
1-to-16 Differential-to-LVHSTL Fanout Buffer and
HiPerClockS™
a member of the HiPerClockS™ family of
High Performance Clock Solutions from ICS. The
ICS8520I-02 has 1 differential clock input pair.
The CLK, nCLK pair can accept most standard differential
input levels.
• Sixteen differential LVHSTL compatible outputs
each with the ability to drive 50Ω to ground
ICS
• One differential CLK, nCLK input pair
• CLK, nCLK pair can accept the following differential
input levels: LVPECL, LVDS, LVHSTL, SSTL, HCSL
• Maximum output frequency: 500MHz
Guaranteed output skew, part-to-part skew and crossover
voltage characteristics make the ICS8520I-02 ideal for
nterfacing to today’s most advanced microprocessor and
static RAMs.
• Translates single ended input levels to LVHSTL
levels with resistor bias nCLK input
• VOH: 1.3V (maximum)
• 40% of VOH ≤ Vcrossover ≤ 60% of VOH
• Output skew: 110ps (maximum)
• Part-to-Part skew: 450ps (maximum)
• 3.3V core, 1.8V output operating supply voltages
• -40°C to 85°C ambient operating temperature
• Available in both standard and lead-free RoHS compliant
packages
BLOCK DIAGRAM
PIN ASSIGNMENT
Q0
nQ0
Q15
nQ15
Q1
nQ1
Q14
nQ14
Q2
nQ2
Q13
nQ13
Q3
nQ3
Q12
nQ12
Q4
nQ4
Q11
nQ11
Q5
nQ5
Q10
nQ10
Q6
nQ6
Q9
nQ9
Q7
nQ7
Q8
nQ8
VDDO
Q11
nQ11
Q10
nQ10
GND
Q9
nQ9
Q8
nQ8
VDDO
VDD
48 47 46 45 44 43 42 41 40 39 38 37
1
36
2
35
3
34
4
33
5
32
6
31
7
30
8
29
9
28
10
27
11
26
12
25
13 14 15 16 17 18 19 20 21 22 23 24
ICS8520I-02
CLK
VDDO
nQ0
Q0
nQ1
Q1
GND
nQ2
Q2
nQ3
Q3
VDDO
VDDO
nQ4
Q4
nQ5
Q5
GND
nQ6
Q6
nQ7
Q7
VDDO
VDD
8520DYI-02
nCLK
VDDO
Q15
nQ15
Q14
nQ14
GND
Q13
nQ13
Q12
nQ12
VDDO
CLK
nCLK
48-Lead TQFP, E-Pad
7mm x 7mm x 1.0mm body package
Y Package
Top View
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1
REV. B NOVEMBER 16, 2005
ICS8520I-02
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
TABLE 1. PIN DESCRIPTIONS
Number
1, 11, 14, 24,
25, 35, 38, 48
2, 3
Name
Type
Description
VDDO
Power
Output supply pins.
Q11, nQ11
Output
Differential output pair. LVHSTL interface levels.
4, 5
Q10, nQ10
Output
Differential output pair. LVHSTL interface levels.
6, 19, 30, 43
GND
Power
Power supply ground.
7, 8
Q9, nQ9
Output
Differential output pair. LVHSTL interface levels.
9, 10
Q8, nQ8
Output
Differential output pair. LVHSTL interface levels.
12, 13
VDD
Power
Power supply pins.
15, 16
Q7, nQ7
Output
Differential output pair. LVHSTL interface levels.
17, 18
Q6, nQ6
Output
Differential output pair. LVHSTL interface levels.
20, 21
Q5, nQ5
Output
Differential output pair. LVHSTL interface levels.
22, 23
Q4, nQ4
Output
Differential output pair. LVHSTL interface levels.
26, 27
Q3, nQ3
Output
Differential output pair. LVHSTL interface levels.
28, 29
Q2, nQ2
Output
Differential output pair. LVHSTL interface levels.
31, 32
Q1, nQ1
Output
Differential output pair. LVHSTL interface level
33, 34
Q0, nQ0
Output
Differential output pair. LVHSTL interface level
36
CLK
Input
37
nCLK
Input
Pulldown Non inver ting differential clock input.
Pullup
Inver ting differential clock input.
39, 40
Q15, nQ15
Output
Differential output pair. LVHSTL interface levels.
41, 42
Q14, nQ14
Output
Differential output pair. LVHSTL interface levels.
44, 45
Q13, nQ13
Output
Differential output pair. LVHSTL interface levels.
46, 47
Q12, nQ12
Output
Differential output pair. LVHSTL interface levels.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
CIN
RPULLUP
RPULLDOWN
Parameter
Input Capacitance
Input Pullup Resistor
Input Pulldown Resistor
Test Conditions
Minimum
Typical
4
51
51
Maximum
Units
pF
kΩ
kΩ
TABLE 3. FUNCTION TABLE
Inputs
CLK
Outputs
nCLK
Q0:Q15
nQ0:nQ15
Input to Output Mode
Polarity
0
1
LOW
HIGH
Differential to Differential
Non Inver ting
1
0
HIGH
LOW
Differential to Differential
Non Inver ting
0
Biased; NOTE 1
LOW
HIGH
Single Ended to Differential
Non Inver ting
1
Biased; NOTE 1
HIGH
LOW
Single Ended to Differential
Non Inver ting
Biased; NOTE 1
0
HIGH
LOW
Single Ended to Differential
Inver ting
Biased; NOTE 1
1
LOW
HIGH
Single Ended to Differential
Inver ting
NOTE 1: Please refer to the Application Information Section, "Wiring the Differential input to accept single ended levels".
8520DYI-02
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REV. B NOVEMBER 16, 2005
ICS8520I-02
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VDD
4.6V
Inputs, VI
-0.5V to VDD + 0.5 V
Outputs, VO
-0.5V to VDDO + 0.5V
Package Thermal Impedance, θJA
27.6°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
Symbol
V DD
Parameter
Power Supply Voltage
VDDO
Output Supply Voltage
IDD
IDDO
Power Supply Current
Output Supply Current
Test Conditions
Minimum
3.135
Typical
3.3
Maximum
3.465
Units
V
1.6
1.8
2.0
V
190
10
mA
µA
TABLE 4B. DIFFERENTIAL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
Symbol
Parameter
IIH
Input High Current
IIL
Input Low Current
Test Conditions
CLK
Minimum
Typical
Maximum
Units
150
µA
VIN = VDD = 3.465V
nCLK
VIN = VDD = 3.465V
CLK
VIN = 0V, VDD = 3.465V
-5
5
nCLK
VIN = 0V, VDD = 3.465V
-150
µA
µA
µA
Peak-to-Peak Input Voltage
0.15
Common Mode Voltage Range;
GND + 0.5
VCMR
NOTE 1, 2
NOTE 1: Common mode voltage is defined as VIH.
NOTE 2: For single ended applications, the maximum input voltage for CLK, nCLK is VDD + 0.3V.
1.3
V
VDD - 0.85
V
VPP
TABLE 4C. LVHSTL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
Symbol Parameter
Output High Voltage;
VOH
NOTE 1
Output Low Voltage;
VOL
NOTE 1
VOX
Output Crossover Voltage
Test Conditions
Minimum
Typical
Maximum
Units
0.9
1.3
V
0
0.4
V
40% x (VOH–VOL) + VOL
60% x (VOH–VOL) + VOL
V
NOTE 1: Outputs terminated with 50Ω to ground.
8520DYI-02
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REV. B NOVEMBER 16, 2005
ICS8520I-02
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
TABLE 5. AC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
Symbol
fMAX
Parameter
Output Frequency
Test Conditions
tPD
Propagation Delay, Low-to-High; NOTE 1
tsk(o)
Output Skew; NOTE 2, 4
tsk(pp)
Par t-to-Par t Skew; NOTE 3, 4
tR/tF
Output Rise/Fall Time
odc
Output Duty Cycle
Minimum
Typical
1.1
1.35
Maximum
500
1.6
ns
110
ps
ƒ ≤ 300MHz
200
450
900
ps
ps
ƒ > 300MHz
IJ 133MHz
200
48
600
52
ps
%
54
55
%
%
133 < ƒ ≤ 300MHz
46
ƒ > 300MHz
45
NOTE 1: Measured from the differential input crossing point to the differential ouput crossing point.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential cross points.
NOTE 3: Defined as skew between outputs on different devices operating at the same supply voltages
and with equal load conditions. Using the same type of inputs on each device, the outputs are measured
at the differential cross points.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
8520DYI-02
Units
MHz
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REV. B NOVEMBER 16, 2005
ICS8520I-02
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
PARAMETER MEASUREMENT INFORMATION
3.3V±5%
1.8V±0.2V
VDD
V DD
Qx
VDDO
SCOPE
nCLK
V
HSTL
Cross Points
PP
CLK
GND
V
CMR
nQx
GND
0V
3.3V/1.8V OUTPUT LOAD AC TEST CIRCUIT
DIFFERENTIAL INPUT LEVEL
nQx
Qx
PART 1
nQx
Qx
Qy
PART 2
nQy
nQy
Qy
tsk(pp)
tsk(o)
OUTPUT SKEW
PART-TO-PART SKEW
nCLK
80%
80%
CLK
VSW I N G
Clock
Outputs
20%
20%
nQ0:nQ15
tF
tR
Q0:Q15
tPD
OUTPUT RISE/FALL TIME
PROPAGATION DELAY
nQ0:nQ15
Q0:Q15
t PW
t
odc =
PERIOD
t PW
t PERIOD
x 100%
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
8520DYI-02
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REV. B NOVEMBER 16, 2005
ICS8520I-02
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
APPLICATION INFORMATION
DIFFERENTIAL CLOCK INPUT INTERFACE
The CLKx /nCLKx accepts LVDS, LVPECL, LVHSTL, SSTL,
HCSL and other differential signals. Both VSWING and V OH
must meet the VPP and VCMR input requirements. Figures 1A
to 1E show interface examples for the HiPerClockS CLKx/
nCLKx input driven by the most common driver types. The
input interfaces suggested here are examples only. Please
consult with the vendor of the driver component to confirm
the driver termination requirements. For example in Figure
1A, the input termination applies for ICS HiPerClockS
LVHSTL drivers. If you are using an LVHSTL driver from
another vendor, use their termination recommendation.
1.8V
3.3V
3.3V
3.3V
Zo = 50 Ohm
CLK
Zo = 50 Ohm
CLK
Zo = 50 Ohm
nCLK
Zo = 50 Ohm
nCLK
LVHSTL
ICS
HiPerClockS
LVHSTL Driver
R1
50
LVPECL
HiPerClockS
Input
R1
50
R2
50
HiPerClockS
Input
R2
50
R3
50
FIGURE 1A. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY
ICS HIPERCLOCKS LVHSTL DRIVER
3.3V
3.3V
3.3V
Zo = 50 Ohm
R3
125
FIGURE 1B. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY
3.3V LVPECL DRIVER
3.3V
3.3V
R4
125
Zo = 50 Ohm
LVDS_Driv er
CLK
CLK
R1
100
Zo = 50 Ohm
nCLK
LVPECL
R1
84
HiPerClockS
Input
Zo = 50 Ohm
nCLK
Receiv er
R2
84
FIGURE 1C. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY
3.3V LVPECL DRIVER
FIGURE 1D. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY
3.3V LVDS DRIVER
3.3V
3.3V
3.3V
LVPECL
Zo = 50 Ohm
C1
Zo = 50 Ohm
C2
R3
125
R4
125
CLK
nCLK
R5
100 - 200
R6
100 - 200
R1
84
HiPerClockS
Input
R2
84
R5,R6 locate near the driver pin.
FIGURE 1E. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY
3.3V LVPECL DRIVER WITH AC COUPLE
8520DYI-02
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REV. B NOVEMBER 16, 2005
ICS8520I-02
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
RECOMMENDATIONS FOR UNUSED OUTPUT PINS
OUTPUTS:
LVHSTL OUTPUT
All unused LVHSTL outputs can be left floating. We recommend
that there is no trace attached. Both sides of the differential
output pair should either be left floating or terminated.
8520DYI-02
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REV. B NOVEMBER 16, 2005
ICS8520I-02
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8520I-02.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8520I-02 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VDD_MAX * IDD_MAX = 3.465V * 190mA = 658.4mW
Power (outputs)MAX = 32.6mW/Loaded Output pair
If all outputs are loaded, the total power is 16 * 32.6mW = 521.6mW
Total Power_MAX (3.465V, with all outputs switching) = 658.4mW + 521.6mW = 1180mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 22.6°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 1.18W * 22.6°C/W = 111.7°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 6. THERMAL RESISTANCE θJA
FOR
48-PIN TQFP, FORCED CONVECTION
θJA by Velocity (Linear Feet per Minute)
0
Multi-Layer PCB, JEDEC Standard Test Boards
27.6°C/W
200
500
22.6°C/W
20.7°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
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REV. B NOVEMBER 16, 2005
ICS8520I-02
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVHSTL output driver circuit and termination are shown in Figure 2.
VDDO
Q1
VOUT
RL
50Ω
FIGURE 2. LVHSTL DRIVER CIRCUIT
AND
TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load.
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = (V
Pd_L = (V
OH_MIN
OL_MAX
/R ) * (V
L
/R ) * (V
L
DDO_MAX
DDO_MAX
-V
)
-V
)
OH_MIN
OL_MAX
Pd_H = (0.9V/50Ω) * (2V - 0.9V) = 19.8mW
Pd_L = (0.4V/50Ω) * (2V - 0.4V) = 12.8mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 32.6mW
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REV. B NOVEMBER 16, 2005
ICS8520I-02
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
RELIABILITY INFORMATION
TABLE 7.
θJAVS. AIR FLOW TABLE FOR 48 LEAD TQFP, E-PAD
θJA by Velocity (Linear Feet per Minute)
0
Multi-Layer PCB, JEDEC Standard Test Boards
27.6°C/W
200
500
22.6°C/W
20.7°C/W
TRANSISTOR COUNT
The transistor count for ICS8520I-02 is: 1563
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REV. B NOVEMBER 16, 2005
ICS8520I-02
Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINE - Y SUFFIX
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
FOR
48 LEAD TQFP, E-PAD
-HD VERSION
HEAT SLUG DOWN
TABLE 8. PACKAGE DIMENSIONS
JEDEC VARIATION
ALL DIMENSIONS IN MILLIMETERS
SYMBOL
ABC - HD
MINIMUM
NOMINAL
MAXIMUM
48
N
A
--
--
1.20
A1
0.05
--
0.15
A2
0.95
1.00
1.05
b
0.17
0.22
0.27
c
0.09
0.20
D
9.00 BASIC
D1
7.00 BASIC
D2
5.50 BASIC
E
9.00 BASIC
E1
7.00 BASIC
E2
5.50 BASIC
0.5 BASIC
e
L
0.45
θ
0°
ccc
--
D3 & E3
2.00
0.60
0.75
7°
--
0.08
7.00
Reference Document: JEDEC Publication 95, MS-026
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REV. B NOVEMBER 16, 2005
ICS8520I-02
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
TABLE 9. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
-40°C to 85°C
ICS8520DYI-02
ICS8520DYI-02
48 Lead TQFP, E-Pad
tray
ICS8520DYI-02T
ICS8520DYI-02
48 Lead TQFP, E-Pad
1000 tape & reel
-40°C to 85°C
ICS8520DYI-02LF
TBD
48 Lead "Lead-Free" TQFP, E-Pad
tray
-40°C to 85°C
ICS8520DYI-02LFT
TBD
48 Lead TQFP, E-Pad
1000 tape & reel
-40°C to 85°C
NOTE: Par ts that are ordered with an "LF" suffix to the par t number are the Pb-Free configuration and are RoHS compliant.
The aforementioned trademark, HiPerClockS is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not
recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product
for use in life support devices or critical medical instruments.
8520DYI-02
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REV. B NOVEMBER 16, 2005
ICS8520I-02
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
REVISION HISTORY SHEET
Rev
B
B
8520DYI-02
Table
T2
T9
Page
2
10
1
7
9
12
Description of Change
Pin Characteristics Table - changed CIN 4pF max. to 4pF typical.
Corrected Package Dimensions and Package Outline.
Added lead-free bullet.
Added Recommendations for Unused Input and Output Pins.
Corrected Power Considerations, Power Dissipation calculation.
Ordering Information Table - added lead-free par t number and note.
Updated layout of datasheet.
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13
Date
11/19/04
11/16/05
REV. B NOVEMBER 16, 2005