ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER GENERAL DESCRIPTION FEATURES The ICS85214 is a low skew, high performance ,&6 1-to-5 Differential-to-HSTL Fanout Buffer and a HiPerClockS™ member of the HiPerClockS™ family of High Performance Clock Solutions from ICS. The CLK0, nCLK0 pair can accept most standard differential input levels. The single ended CLK1 input accepts LVCMOS or LVTTL input levels. Guaranteed output and partto-part skew characteristics make the ICS85214 ideal for those clock distribution applications demanding well defined performance and repeatability. • 5 differential HSTL compatible outputs • Selectable differential CLK0, nCLK0 or LVCMOS/LVTTL clock inputs • CLK0, nCLK0 pair can accept the following differential input levels: LVDS, LVPECL, HSTL, SSTL, HCSL • CLK1 can accept the following input levels: LVCMOS or LVTTL • Output frequency up to 700MHz • Translates any single ended input signal to HSTL levels with resistor bias on nCLK0 input • Output skew: 30ps (maximum) • Part-to-part skew: 250ps (maximum) • Propagation delay: 1.8ns (maximum) • 3.3V core, 1.8V output operating supply • 0°C to 85°C ambient operating temperature • Industrial temperature information available upon request BLOCK DIAGRAM PIN ASSIGNMENT Q0 nQ0 Q1 nQ1 Q2 nQ2 Q3 nQ3 Q4 nQ4 D nCLK_EN Q LE CLK0 nCLK0 CLK1 00 1 Q0 nQ0 1 Q1 nQ1 CLK_SEL Q2 nQ2 20 19 18 17 16 15 14 13 12 11 VDDO nCLK_EN VDD nc CLK1 CLK0 nCLK0 nc CLK_SEL GND ICS85214 Q3 nQ3 20-Lead TSSOP 6.5mm x 4.4mm x 0.92mm package body G Package Top View Q4 nQ4 85214AG 1 2 3 4 5 6 7 8 9 10 www.icst.com/products/hiperclocks.html 1 REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER TABLE 1. PIN DESCRIPTIONS Number Name 1, 2 Q0, nQ0 Type Description Output Differential output pair. HSTL interface levels. 3, 4 Q1, nQ1 Output Differential output pair. HSTL interface levels. 5, 6 Q2, nQ2 Output Differential output pair. HSTL interface levels. 7, 8 Q3, nQ3 Output Differential output pair. HSTL interface levels. 9, 10 Q4, nQ4 Output 11 GND Power 12 CLK_SEL Input 13, 17 nc Unused 14 nCLK0 Input Differential output pair. HSTL interface levels. Power supply ground. Clock select input. When HIGH, selects CLK1 input. Pulldown When LOW, selects CLK0, nCLK0 input. LVTTL / LVCMOS interface levels. No connect. Pullup Inver ting differential clock input. 15 CLK0 Input Pulldown Non-inver ting differential clock input. 16 CLK1 Input Pulldown Clock input. LVTTL / LVCMOS interface levels. 18 VDD Power 19 nCLK_EN Input 20 VDDO Power Core supply pin. Synchronizing clock enable. When LOW, clock outputs follow clock input. Pulldown When HIGH, Q outputs are forced low, nQ outputs are forced high. LVTTL / LVCMOS interface levels. Output supply pin. NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values. TABLE 2. PIN CHARACTERISTICS Symbol Parameter Test Conditions Minimum Typical Maximum Units CIN Input Capacitance 4 pF RPULLUP Input Pullup Resistor 51 KΩ RPULLDOWN Input Pulldown Resistor 51 KΩ 85214AG www.icst.com/products/hiperclocks.html 2 REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER TABLE 3A. CONTROL INPUT FUNCTION TABLE Inputs Outputs nCLK_EN Q0:Q4 nQ0:nQ4 0 Enabled Enabled 1 Disabled; LOW Disabled; HIGH After nCLK_EN switches, the clock outputs are disabled or enabled following a rising and falling input clock edge as shown in Figure 1. In the active mode, the state of the outputs are a function of the CLK0, nCLK0 inputs as described in Table 3B. Enabled Disabled nCLK0 CLK0 nCLK_EN nQ0:nQ4 Q0:Q4 FIGURE 1. nCLK_EN TIMING DIAGRAM TABLE 3B. CLOCK INPUT FUNCTION TABLE Inputs Outputs Input to Output Mode Polarity HIGH Differential to Differential Non Inver ting HIGH LOW Differential to Differential Non Inver ting Biased; NOTE 1 LOW HIGH Single Ended to Differential Non Inver ting Biased; NOTE 1 HIGH LOW Single Ended to Differential Non Inver ting Biased; NOTE 1 0 HIGH LOW Single Ended to Differential Inver ting Biased; NOTE 1 1 LOW HIGH Single Ended to Differential Inver ting CLK0, CLK1 nCLK0 Q0:Q4 nQ0:nQ4 0 1 LOW 1 0 0 1 NOTE 1: Please refer to the Application Information section, "Wiring the Differential Input to Accept Single Ended Levels". 85214AG www.icst.com/products/hiperclocks.html 3 REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER ABSOLUTE MAXIMUM RATINGS Supply Voltage, VDD 4.6V X Inputs, VDD -0.5V to VDD + 0.5 V Outputs, VDDO -0.5V to VDDO + 0.5V Package Thermal Impedance, θJA 73.2°C/W (0 lfpm) Storage Temperature, TSTG -65°C to 150°C NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = 0°C TO 85°C Symbol Parameter VDD Input Power Supply Voltage Test Conditions VDDO Output Power Supply Voltage IDD Power Supply Current Minimum Typical Maximum Units 3.135 3.3 3.465 V 1.6 1.8 2.0 V 80 mA TABLE 4B. LVCMOS / LVTTL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = 0°C TO 85°C Symbol VIH Parameter Input High Voltage VIL Input Low Voltage IIH Input High Current IIL Input Low Current Test Conditions nCLK_EN, CLK_SEL CLK1 Minimum Maximum Units 2 Typical VDD + 0.3 V 2 VDD + 0.3 V nCLK_EN, CLK_SEL -0.3 0.8 V CLK1 CLK1, CLK_SEL, nCLK_EN CLK1, CLK_SEL, nCLK_EN -0.3 1.3 V 150 µA VDD = VIN = 3.465V VDD = 3.465V, VIN = 0V -5 µA TABLE 4C. DIFFERENTIAL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = 0°C TO 85°C Symbol Parameter IIH Input High Current IIL Input Low Current Test Conditions Minimum Typical Units nCLK0 VDD = VIN = 3.465V 5 µA CLK0 VDD = VIN = 3.465V 150 µA nCLK0 VDD = 3.465V, VIN = 0V -150 CLK0 VDD = 3.465V, VIN = 0V -5 VPP Peak-to-Peak Input Voltage 0.15 Common Mode Input Voltage; 0.5 VCMR NOTE 1, 2 NOTE 1: For single ended applications the maximum input voltage for CLK0, nCLK0 is VDD + 0.3V. NOTE 2: Common mode voltage is defined as VIH. 85214AG Maximum www.icst.com/products/hiperclocks.html 4 µA µA 1.3 V VDD - 0.85 V REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER TABLE 4D. HSTL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = 0°C TO 85°C Symbol Parameter Output High Voltage; VOH NOTE 1 Output Low Voltage; VOL NOTE 1 VOX Test Conditions Output Crossover Voltage Minimum Maximum Units 1 1.4 V 0 0.4 V 38% x (VOH - VOL) + VOL 60% x (VOH - VOL) + VOL V 0.6 1.1 V Peak-to-Peak Output Voltage Swing NOTE 1: Outputs terminated with 50Ω to ground. VSWING Typical TABLE 5. AC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = 0°C TO 85°C Symbol Parameter Test Conditions fMAX Output Frequency tPD Propagation Delay; NOTE 1 Minimum Typical Maximum Units CLK0, nCLK0 700 MHz CLK1 300 MHZ 1.8 ns ƒ≤ 700MHz 1.0 t sk(o) Output Skew; NOTE 2, 4 30 ps t sk(pp) Par t-to-Par t Skew; NOTE 3, 4 250 ps tR Output Rise Time 20% to 80% 200 700 ps tF Output Fall Time 20% to 80% 200 700 ps o dc Output Duty Cycle 46 54 % CLK0, nCLK0 CLK1 45 55 All parameters measured at fMAX unless noted otherwise. The cycle to cycle jitter on the input will equal the jitter on the output. The par t does not add jitter. NOTE 1: Measured from either the differential input crossing point or VDD/2 to the differential output crossing point. NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at output differential cross points. NOTE 3: Defined as skew between outputs on different devices operating at the same supply voltages and with equal load conditions. Using the same type of inputs on each device, the outputs are measured at the differential cross points. NOTE 4: This parameter is defined in accordance with JEDEC Standard 65. 85214AG www.icst.com/products/hiperclocks.html 5 % REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER PARAMETER MEASUREMENT INFORMATION 1.8V±0.2V 3.3V±5% V DD VDD Qx SCOPE nCLK0 VDDO V V Cross Points PP HSTL CMR CLK0 nQx GND GND = 0V 3.3V/1.8V OUTPUT LOAD AC TEST CIRCUIT DIFFERENTIAL INPUT LEVEL nQx nQx PART 1 Qx Qx nQy nQy Qy PART 2 Qy tsk(pp) tsk(o) OUTPUT SKEW PART-TO-PART SKEW 80% 80% CLK1 VSW I N G Clock Outputs nQ0:nQ4 20% 20% tF tR Q0:Q4 tPD OUTPUT RISE/FALL TIME nCLK0 nQ0:nQ4 CLK0 Q0:Q4 Pulse Width t nQ0:nQ4 Q0:Q4 odc = tPD t PW t PERIOD odc, tPW & tPERIOD PROPAGATION DELAY 85214AG PERIOD www.icst.com/products/hiperclocks.html 6 REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER APPLICATION INFORMATION WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS Figure 2 shows how the differential input can be wired to accept single ended levels. The reference voltage V_REF = VDD/2 is generated by the bias resistors R1, R2 and C1. This bias circuit should be located as close as possible to the input pin. The ratio of R1 and R2 might need to be adjusted to position the V_REF in the center of the input voltage swing. For example, if the input clock swing is only 2.5V and VDD = 3.3V, V_REF should be 1.25V and R2/R1 = 0.609. VDD R1 1K CLK_IN + V_REF C1 0.1uF R2 1K FIGURE 2. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT 85214AG www.icst.com/products/hiperclocks.html 7 REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER DIFFERENTIAL CLOCK INPUT INTERFACE The CLK /nCLK accepts LVDS, LVPECL, HSTL, SSTL, HCSL and other differential signals. Both VSWING and VOH must meet the VPP and VCMR input requirements. Figures 3A to 3D show interface examples for the ICS85214 clock input driven by the most common driver types. The input interfaces suggested here are examples only. Please consult with the vendor of the driver component to confirm the driver termination requirements. For example in Figure 3A, the input termination applies for ICS HiPerClockS HSTL drivers. If you are using an HSTL driver from another vendor, use their termination recommendations. 3.3V 3.3V 3.3V 1.8V Zo = 50 Ohm CLK Zo = 50 Ohm CLK Zo = 50 Ohm nCLK Zo = 50 Ohm LVPECL nCLK HiPerClockS Input LVHSTL ICS HiPerClockS LVHSTL Driver R1 50 R1 50 HiPerClockS Input R2 50 R2 50 R3 50 FIGURE 3A. HIPERCLOCKS CLK/NCLK INPUT DRIVEN ICS HIPERCLOCKS LVHSTL DRIVER FIGURE 3B. HIPERCLOCKS CLK/NCLK INPUT DRIVEN 3.3V LVPECL DRIVER BY 3.3V 3.3V 3.3V 3.3V 3.3V R3 125 BY R4 125 Zo = 50 Ohm LVDS_Driv er Zo = 50 Ohm CLK CLK R1 100 Zo = 50 Ohm nCLK LVPECL R1 84 HiPerClockS Input Receiv er R2 84 FIGURE 3C. HIPERCLOCKS CLK/NCLK INPUT DRIVEN 3.3V LVPECL DRIVER 85214AG nCLK Zo = 50 Ohm FIGURE 3D. HIPERCLOCKS CLK/NCLK INPUT DRIVEN 3.3V LVDS DRIVER BY www.icst.com/products/hiperclocks.html 8 BY REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER SCHEMATIC EXAMPLE Figure 4 shows a schematic example of the ICS85214. In this example, the input is driven by an ICS HiPerClockS HSTL driver. The decoupling capacitors should be physically located near the power pin. For ICS85214, the unused outputs can be left floating. Zo = 50 + Zo = 50 R2 50 U1 1.8V R12 1K Zo = 50 Ohm 3.3V Zo = 50 Ohm C2 LVHSTL Driver R9 50 R10 50 11 12 13 14 15 16 17 18 19 1.8V 20 - GND CLK_SEL nc nCLK CLK SCLK nc VDD nCLK_EN VDDO nQ4 Q4 nQ3 Q3 nQ2 Q2 nQ1 Q1 nQ0 Q0 10 9 8 7 6 5 4 3 2 1 R1 50 Zo = 50 + Zo = 50 R4 50 R3 50 0.1u C1 0.1u ICS85214 Zo = 50 + R11 1K Zo = 50 R8 50 R7 50 FIGURE 4. ICS85214 HSTL BUFFER SCHEMATIC EXAMPLE 85214AG www.icst.com/products/hiperclocks.html 9 REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER POWER CONSIDERATIONS This section provides information on power dissipation and junction temperature for the ICS85214. Equations and example calculations are also provided. 1. Power Dissipation. The total power dissipation for the ICS85214 is the sum of the core power plus the power dissipated in the load(s). The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results. NOTE: Please refer to Section 3 for details on calculating power dissipated in the load. • • Power (core)MAX = VDD_MAX * IDD_MAX = 3.465V * 80mA = 227.2mW Power (outputs)MAX = 32.8mW/Loaded Output pair If all outputs are loaded, the total power is 5 * 32.8mW = 164mW Total Power_MAX (3.465V, with all outputs switching) = 227.2mW + 164mW = 391.2mW 2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C. The equation for Tj is as follows: Tj = θJA * Pd_total + TA Tj = Junction Temperature θJA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used . Assuming a moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below. Therefore, Tj for an ambient temperature of 85°C with all outputs switching is: 85°C + 0.391W * 66.6°C/W = 111°C. This is well below the limit of 125°C This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and the type of board (single layer or multi-layer). TABLE 6. THERMAL RESISTANCE qJA FOR 20-PIN TSSOP, FORCED CONVECTION qJA by Velocity (Linear Feet per Minute) 0 Single-Layer PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 114.5°C/W 73.2°C/W 200 500 98.0°C/W 66.6°C/W 88.0°C/W 63.5°C/W NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs. 85214AG www.icst.com/products/hiperclocks.html 10 REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER 3. Calculations and Equations. The purpose of this section is to derive the power dissipated into the load. HSTL output driver circuit and termination are shown in Figure 5. VDDO Q1 VOUT RL 50Ω FIGURE 5. HSTL DRIVER CIRCUIT AND TERMINATION To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load. Pd_H is power dissipation when the output drives high. Pd_L is the power dissipation when the output drives low. Pd_H = (V OH_MIN Pd_L = (V OL_MAX /R ) * (V L -V DDO_MAX /R ) * (V L -V DDO_MAX ) OH_MIN ) OL_MAX Pd_H = (1.0V/50Ω) * (2V - 1.0V) = 20mW Pd_L = (0.4V/50Ω) * (2V - 0.4V) = 12.8mW Total Power Dissipation per output pair = Pd_H + Pd_L = 32.8mW 85214AG www.icst.com/products/hiperclocks.html 11 REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER RELIABILITY INFORMATION TABLE 7. θJAVS. AIR FLOW TABLE qJA by Velocity (Linear Feet per Minute) 0 Single-Layer PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 114.5°C/W 73.2°C/W 200 500 98.0°C/W 66.6°C/W 88.0°C/W 63.5°C/W NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs. TRANSISTOR COUNT The transistor count for ICS85214 is: 674 85214AG www.icst.com/products/hiperclocks.html 12 REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER PACKAGE OUTLINE - G SUFFIX TABLE 8. PACKAGE DIMENSIONS Millimeters SYMBOL Minimum N A Maximum 20 -- 1.20 A1 0.05 0.15 A2 0.80 1.05 b 0.19 0.30 c 0.09 0.20 D 6.40 6.60 E E1 6.40 BASIC 4.30 e 4.50 0.65 BASIC L 0.45 0.75 α 0° 8° aaa -- 0.10 Reference Document: JEDEC Publication 95, MO-153 85214AG www.icst.com/products/hiperclocks.html 13 REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER TABLE 9. ORDERING INFORMATION Part/Order Number Marking Package Count Temperature ICS85214AG ICS85214AG 20 lead TSSOP 72 per tube 0°C to 85°C ICS85214AG ICS85214AG 20 Lead TSSOP on Tape and Reel 2500 0°C to 85°C While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or critical medical instruments. 85214AG www.icst.com/products/hiperclocks.html 14 REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER REVISION HISTORY SHEET Rev A 85214AG Table Page 2 2 Description of Change Throughout data sheet changed LVHSTL to HSTL. Pin Characteristics Table - changed CIN 4pF max. to 4pF typical. www.icst.com/products/hiperclocks.html 15 Date 7/17/03 REV. A JULY 17, 2003 ICS85214 Integrated Circuit Systems, Inc. LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL FANOUT BUFFER REVISION HISTORY SHEET Rev A 85214AG Table Page 2 2 Description of Change Throughout data sheet changed LVHSTL to HSTL. Pin Characteristics Table - changed CIN 4pF max. to 4pF typical. www.icst.com/products/hiperclocks.html 15 Date 7/17/03 REV. A JULY 17, 2003