TI TLC7725IPWG4

TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
www.ti.com
SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
Micropower Supply Voltage Supervisors
Check for Samples: TLC7701, TLC7725, TLC7703 , TLC7733, TLC7705
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
DRB PACKAGE
Power-On Reset Generator
Automatic Reset Generation After Voltage
Drop
Precision Voltage Sensor
Temperature-Compensated Voltage Reference
Programmable Delay Time by External
Capacitor
Supply Voltage Range . . . 2 V to 6 V
Defined RESET Output from VDD ≥ 1 V
Power-Down Control Support for Static RAM
With Battery Backup
Maximum Supply Current of 16 µA
Power Saving Totem-Pole Outputs
Temperature Range . . . Up to –55°C to 125°C
APPLICATIONS
•
Medical Imaging
DESCRIPTION
The TLC77xx family of micropower supply voltage
supervisors provide reset control, primarily in
microcomputer and microprocessor systems.
During power-on, RESET is asserted when VDD
reaches 1 V. After minimum VDD (≥2 V) is
established, the circuit monitors SENSE voltage and
keeps the reset outputs active as long as SENSE
voltage (VI(SENSE)) remains below the threshold
voltage. An internal timer delays return of the output
to the inactive state to ensure proper system reset.
The delay time, td, is determined by an external
capacitor:
td = 2.1 × 104 × CT
Where
CT is in farads
td is in seconds
SPACER
Except for the TLC7701, which can be customized with two external resistors, each supervisor has a fixed sense
threshold voltage set by an internal voltage divider. When SENSE voltage drops below the threshold voltage, the
outputs become active and stay in that state until SENSE voltage returns above threshold voltage and the delay
time, td, has expired.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1994–2012, Texas Instruments Incorporated
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
In addition to the power-on-reset and undervoltage-supervisor function, the TLC77xx adds power-down control
support for static RAM. When CONTROL is tied to GND, RESET will act as active high. The voltage monitor
contains additional logic intended for control of static memories with battery backup during power failure. By
driving the chip select (CS) of the memory circuit with the RESET output of the TLC77xx and with the CONTROL
driven by the memory bank select signal (CSH1) of the microprocessor (see Figure 10), the memory circuit is
automatically disabled during a power loss. (In this application the TLC77xx power has to be supplied by the
battery.)
The TLC77xxI is characterized for operation over a temperature range of –40°C to 85°C; the TLC77xxQ is
characterized for operation over a temperature range of –40°C to 125°C; and the TLC77xxM is characterized for
operation over the full Military temperature range of –55°C to 125°C.
The 3x3 mm DRB package is also available as a non-magnetic package for medical imaging application.
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
THRESHOLD
VOLTAGE
(V)
–40°C to
85°C
–40°C to
125°C
–55°C to
125°C
(1)
(2)
SMALL
OUTLINE (D) (1)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
CERAMIC
PLASTIC DIP
DUAL
(P)
FLATPACK (U)
THIN SHRINK
SMALL OUTLINE
(PW) (2)
SMALL OUTLINE
NO LEAD
(DRB)
1.1
TCLC7701ID
—
—
—
TCLC7701IP
TCLC7701IPWR
—
2.25
TLC7725ID
—
—
—
TLC7725IP
TLC7725IPWR
—
2.63
TLC7703ID
—
—
—
TLC7703IP
TLC7703IPWR
—
2.93
TLC7733ID
—
—
—
TLC7733IP
TLC7733IPWR
—
4.55
TLC7705ID
—
—
—
TLC7705IP
TLC7705IPWR
—
1.1
TLC7701IDBR
—
—
—
—
—
TLC7701IDRBT-NM
1.1
TLC7701QD
—
—
—
TLC7701QP
TLC7701QPWR
—
2.25
TLC7725QD
—
—
—
TLC7725QP
TLC7725QPWR
—
2.63
TLC7703QD
—
—
—
TLC7703QP
TLC7703QPWR
—
2.93
TLC7733QD
—
—
—
TLC7733QP
TLC7733QPWR
—
4.55
TLC7705QD
—
—
—
TLC7705QP
TLC7705QPWR
—
2.93
—
—
—
—
—
—
—
4.55
—
—
—
—
—
—
—
The D package is available taped and reeled. Add the suffix R to the device type when ordering (e.g., TLC7705QDR).
The PW package is only available left-end taped and reeled (indicated by the R suffix on the device type; e.g., TLC7705QPWR).
Table 1. FUNCTION TABLE
CONT
ROL
RESIN
VI(SENSE)>VIT+
RESE
T
RESET
L
L
L
L
H
H
H
H
L
L
H
H
L
L
H
H
False
True
False
True
False
True
False
True
H
H
H
L (1)
H
H
H
H
L
L
L
H (1)
L
L
L
H (1)
(1)
2
RESET and RESET states shown are valid for t > td.
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Copyright © 1994–2012, Texas Instruments Incorporated
Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
www.ti.com
SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
LOGIC SYMBOL
(1)
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Copyright © 1994–2012, Texas Instruments Incorporated
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Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705
3
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
TIMING DIAGRAM
4
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Copyright © 1994–2012, Texas Instruments Incorporated
Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
www.ti.com
SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VDD
Supply voltage
(2)
Input voltage range, CONTROL, RESIN, SENSE (2)
VALUE
UNIT
7
V
–0.3 to 7
V
IOL
Maximum low output current
10
mA
IOH
Maximum high output current,
–10
mA
IIK
Input clamp current, (VI < 0 or VI > VDD)
±10
mA
IOK
Output clamp current, (VO 0 or VO > VDD)
±10
mA
Continuous total power dissipation
Operating free-air
temperature range
TA
Tstg
(1)
See Dissipation Rating Table
TL77xxI
–40 to 84
°C
TL77xxQ
–40 to 125
°C
TL77xxM
–55 to 125
°C
–65 to 150
°C
Storage temperature range
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to GND.
(2)
DISSIPATION RATINGS
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 85°C
POWER RATING
TA = 125°C
POWER RATING
D
725 mW
5.8 mW/°C
377 mW
145 mW
FK
1375 mW
11.0 mW/°C
715 mW
275 mW
JG
1050 mW
8.4 mW/°C
546 mW
210 mW
DRB
P
1000 mW
8.0 mW/°C
520 mW
200 mW
PW
525 mW
4.2 mW/°C
273 mW
105 mW
U
700 mW
5.5 mW/°C
370 mW
150 mW
RECOMMENDED OPERATING CONDITIONS
at specified temperature range
MIN
MAX
VDD
Supply voltage
2
6
V
VI
Input voltage
0
VDD
V
(1)
VIH
High-level input voltage at RESIN and CONTROL
VIL
Low-level input voltage at RESIN and CONTROL (1)
IOH
High-level output current
IOL
Low-level output current
Δt/ΔV
input transition rise and fall rate at RESIN and CONTROL
TA
Operating free-air
temperature range
(1)
0.7×VDD
UNIT
V
0.2×VDD
–2
2
100
TLC77xxI
–40
85
TLC77xxQ
–40
125
TLC77xxM
–55
125
V
mA
mA
ns/ V
°C
To ensure a low supply current, VIL should be kept <0.3 V and VIH > VDD –0.3 V.
Copyright © 1994–2012, Texas Instruments Incorporated
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5
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
www.ti.com
ELECTRICAL CHARACTERISTICS
over recommended operating conditions (1) (unless otherwise noted)
PARAMETER
High-level output
voltage
VOH
TEST CONDITIONS
IOH = –20 µA
IOH = 2 –mA
Low-Level output
voltage
VOL
IOL = 20 µA
IOL = 2 mA
VDD = 2 V
1.8
VDD = 2.7 V
2.5
VDD = 4.5 V
4.3
VDD = 4.5 V
3.7
MAX
0.2
0.2
VDD = 4.5 V
0.2
VDD = 4.5 V
V
0.5
1.04
1.1
1.16
2.18
2.25
2.32
2.56
2.63
2.70
TLC7733
2.86
2.93
3
TLC7705
4.47
4.55
4.63
TLC7703
UNIT
V
VDD = 2.7 V
TLC7725
Negative-going input threshold voltage,
SENSE (2)
TYP
VDD = 2 V
TCLC7701
VIT–
TLC77xx
MIN
VDD = 2 V to 6 V
TCLC7701
mV
30
TLC7725
Vhus
Hysteresis voltage, SENSE
TLC7703
VDD = 2 V to 6 V
mV
70
TLC7733
TLC7705
Power-up reset voltage (3)
Vres
II
Input current
IOL = 20 µA
1
RESIN
VI = 0 V to VDD
2
CONTROL
VI = VDD
7
15
SENSE
VI = 5 V
5
10
SENSE, TLC7701 only
VI = 5 V
IDD
Supply current
IDD(d)
Supply current during td
VDD = 5 V, VCT = 0,
RESIN = VDD, SENSE = VDD,
CONTROL = 0 V, Outputs open
CI
Input capacitance, SENSE
VI = 0 V to VDD
6
µA
2
RESIN = VDD, SENSE = VDD ≥ VITmax + 0.2 V,
CONTROL = 0 V, Outputs open
(1)
(2)
(3)
V
9
16
µA
120
150
µA
50
pF
All characteristics are measured with CT = 0.1 µF.
To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 mF) should be connected near the supply terminals.
The lowest supply voltage at which RESET becomes active. The symbol Vres is not currently listed within EIA or JEDEC standards for
semiconductor symbology. Rise time of VDD≥ 15 µs/V.
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Copyright © 1994–2012, Texas Instruments Incorporated
Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
www.ti.com
SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
ELECTRICAL CHARACTERISTICS
over recommended operating conditions (1) (unless otherwise noted)
PARAMETER
VDD = 2 V
IOH = –20 µA
VOH
VDD = 2.7 V
High-level output
voltage
VDD = 4.5 V
IOH = –2 µA
VDD = 4.5 V
VDD = 2 V
IOL = –20 µA
VOL
VDD = 2.7 V
Low-level output
voltage
VDD = 4.5 V
IOL = 2 mA
VIT–
Negative-going input threshold
voltage, SENSE (3)
Vhys
Hysteresis voltage, SENSE
Vres
II
IDD
Power-up reset voltage
Input current
VDD = 4.5 V
TLC7733
TLC7705
TA = 25°C
1.8
TA = –55°C to 125°C
1.7
TA = 25°C
2.5
TA = –55°C to 125°C
2.3
TA = 25°C
4.3
TA = –55°C to 125°C
4.2
TA = 25°C
3.7
TA = –55°C to 125°C
3.6
V
V
V
TA = 25°C
0.2
TA = –55°C to 125°C
0.2
TA = 25°C
0.2
TA = –55°C to 125°C
0.2
TA = 25°C
0.2
TA = –55°C to 125°C
0.2
TA = 25°C
0.5
TA = –55°C to 125°C
0.5
VDD = 2 V to 6 V
2.86
2.93
3.1
4.3
4.5
4.8
70
1
VI = 0 V to VDD
2
CONTROL
VI = VDD
7
15
SENSE
VI = 5 V
5
10
SENSE, TLC7701 only
VI = 5 V
TLC7705
Input capacitance, SENSE
V
V
V
V
V
µA
2
RESIN = VDD,
SENSE = VDD ≥ VITmax + 0.2 V
CONTROL = 0 V,
Outputs open
VCT = 0 ,
RESIN = VDD,
CONTROL = 0 V,
SENSE = VDD,
Outputs open
V
mV
IOL = 20 µA
Supply current
UNIT
V
RESIN
IDD(d) Supply current during td
(1)
(2)
(3)
MIN TYP (2) MAX
VDD = 2 V to 6 V
(2)
TLC7733
CI
TLC77xxM
TEST CONDITIONS
9
VDD = 3.3 V
16
µA
250
120
150
VDD = 5 V
VI = 0 V to VDD
50
µA
pF
All characteristics are measured with CT = 0.1 µF.
Typical values apply at TA = 25°C.
To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 mF) should be connected near the supply terminals.
Copyright © 1994–2012, Texas Instruments Incorporated
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7
TLC7701, TLC7725, TLC7703
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SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
www.ti.com
SWITCHING CHARACTERISTICS
at VDD = 5 V, RL = 2 kΩ, CL = 50 pF, TA = 25°C (unless otherwise noted)
MEASURED
PARAMETER
td
Delay time
tPLH
Propagation delay time, lowto-high-level output
tPHL
Propagation delay time, highto-low-level output
tPLH
Propagation delay time, lowto-high-level output
tPHL
Propagation delay time, highto-low-level output
tPLH
Propagation delay time, lowto-high-level output
tPHL
Propagation delay time, highto-low-level output
tPLH
Propagation delay time, lowto-high-level output
tPHL
Propagation delay time, highto-low-level output
tPLH
Propagation delay time, lowto-high-level output
tPHL
Propagation delay time, highto-low-level output
Low-level minimum pulse
duration to switch RESET
and RESET
tr
Rise time
tf
Fall time
(1)
8
FROM
(INPUT)
TO
(OUTPUT)
VI(SENSE) ≥ VIT+
RESET
and
RESET
TLC77xx
TEST CONDITIONS
RESIN = 0.7 × VDD,
CONTROL = 0.2 × VDD, CT = 100 nF,
TA = Full range, See timing diagram
MIN
TYP
MAX
1.1
2.1
4.2
UNIT
ms
20
RESET
VIH = VIT+max + 0.2 V, VIL = VIT-min – 0.2 V,
RESIN = 0.7 × VDD, CONTROL = 0.2 × VDD,
CT = NC (1)
SENSE
5
µs
5
RESET
20
20
RESET
RESIN
RESET
CONTROL
RESET
VIH = 0.7 × VDD, VIL = 0.2 × VDD,
SENSE = VIT+max + 0.2 V,
CONTROL = 0.2 × VDD,
CT = NC (1)
VIH = 0.7 × VDD, VIL = 0.2 × VDD,
SENSE = VIT+max + 0.2 V, RESIN = 0.7 × VDD,
CT = NC (1)
SENSE
VIH = VIT+max + 0.2 V, VIL = VIT-min –0.2 V,
RESIN
VIL = 0.2 × VDD, VIH = 0.7 × VDD
RESET
and
RESET
µs
40
ns
45
20
µs
38
ns
38
ns
10% to 90%
90% to 10%
NC = No capacitor, and includes up to 100-pF probe and jig capacitance.
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Copyright © 1994–2012, Texas Instruments Incorporated
Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
www.ti.com
SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
SWITCHING CHARACTERISTICS
at VDD = 5 V, RL = 2 kΩ, CL = 50 pF, TA = 25°C (unless otherwise noted)
MEASURED
PARAMETER
td
Delay time
tPLH
Propagation delay
time, low-to-high-level
output
tPHL
tPLH
tPHL
tPLH
tPHL
Propagation delay
time, high-to-low-level
output
Propagation delay
time, low-to-high-level
output
Propagation delay
time, high-to-low-level
output
Propagation delay
time, low-to-high-level
output
Propagation delay
time, high-to-low-level
output
Low-level minimum
pulse duration
tr
tf
(1)
Rise time
Fall time
FROM
(INPUT)
TO
(OUTPUT)
VI(SENSE) ≥ VIT+
RESET
and
RESET
RESET
SENSE
RESET
RESET
SENSE
RESET
RESET
RESIN
RESET
RESET
RESIN
RESET
CONTROL
RESET
TLC77xxM
TEST CONDITIONS
RESIN = 2.7 V, CONTROL = 0.4 V,
CT = 100 nF, See timing diagram
VIH = VIT+max + 0.2 V,
VIL = VIT-min - 0.2 V,
RESIN = 2.7 V, CONTROL = 0.4 V,
CT = NC (1)
VIH = VIT+max + 0.2 V,
VIL = VIT-min - 0.2 V,
RESIN = 2.7 V, CONTROL = 0.4 V,
CT = NC (1)
VIH = 2.7 V, VIL = 0.4 V,
SENSE = VIT+max + 0.2 V,
CONTROL = 0.4 V,
CT = NC (1)
VIH = 2.7 V, VIL = 0.4 V,
SENSE = VIT+max + 0.2 V,
CONTROL = 0.4 V,
CT = NC (1)
VIH = 2.7 V, VIL = 0.4 V,
SENSE = VIT+max + 0.2 V,
RESIN = 2.7 V,
CT = NC (1)
SENSE
VIH = VIT+max + 0.2 V,
VIL = VIT-min - 0.2 V
RESIN
VIL = 0.4 V, VIH = 2.7 V
RESET
and
RESET
TA
Full range
TYP
MAX
1.1
2.1
4.2
25°C
20
Full range
24
25°C
5
Full range
7
25°C
5
Full range
7
25°C
20
Full range
24
25°C
20
Full range
24
25°C
45
Full range
65
25°C
40
Full range
60
25°C
20
Full range
24
25°C
38
Full range
58
25°C
38
Full Range
58
Full range
3
UNIT
ms
µs
µs
µs
µs
µs
ns
ns
µs
ns
ns
µs
1
10% to 90%
90% to 10%
MIN
8
Full range
4
ns/V
NC = No capacitor, and includes up to 100-pF probe and jig capacitance.
Copyright © 1994–2012, Texas Instruments Incorporated
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9
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Figure 1. RESET and RESET Output Configurations
Figure 2. Input Pulse Definition Waveforms
10
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Copyright © 1994–2012, Texas Instruments Incorporated
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TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
www.ti.com
SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
TYPICAL CHARACTERISTICS
NORMALIZED INPUT THRESHOLD VOLTAGE
vs
TEMPERATURE
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
Figure 3.
Figure 4.
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
Figure 5.
Figure 6.
Copyright © 1994–2012, Texas Instruments Incorporated
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11
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
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TYPICAL CHARACTERISTICS (continued)
12
INPUT CURRENT
vs
INPUT VOLTAGE AT SENSE
MINIMUM PULSE DURATION AT SENSE
vs
SENSE THRESHOLD OVERDRIVE
Figure 7.
Figure 8.
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Copyright © 1994–2012, Texas Instruments Incorporated
Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
www.ti.com
SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
APPLICATION INFORMATION
Figure 9. Reset Controller in a Microcomputer System
Figure 10. Data Retention During Power Down Using Static CMOS RAMs
Copyright © 1994–2012, Texas Instruments Incorporated
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Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705
13
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
SLVS087M – DECEMBER 1994 – REVISED MARCH 2012
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Changes from Revision L (February 2003) to Revision M
•
14
Page
Updated the DRB package Pin Out dimensions and Ordering Information. ........................................................................ 1
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Copyright © 1994–2012, Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com
31-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-9750901Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629750901Q2A
TLC7733
MFKB
5962-9750901QPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
9750901QPA
TLC7733M
5962-9751301Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629751301Q2A
TLC7705
MFKB
5962-9751301QHA
ACTIVE
CFP
U
10
1
TBD
A42
N / A for Pkg Type
-55 to 125
9751301QHA
TLC7705M
5962-9751301QPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
9751301QPA
TLC7705M
TLC7701ID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7701I
TLC7701IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7701I
TLC7701IDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7701I
TLC7701IDRBT-NM
ACTIVE
SON
DRB
8
250
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
7701N
TLC7701IDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7701I
TLC7701IP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
TLC7701IP
TLC7701IPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
TLC7701IP
TLC7701IPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7701
TLC7701IPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7701
TLC7701IPWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
Call TI
-40 to 85
TLC7701IPWR
ACTIVE
TSSOP
PW
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
2000
Addendum-Page 1
Y7701
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
31-Oct-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TLC7701IPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7701
TLC7701QD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7701Q
TLC7701QDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7701Q
TLC7701QDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7701Q
TLC7701QDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7701Q
TLC7701QP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 125
TLC7701QP
TLC7701QPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 125
TLC7701QP
TLC7701QPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD701
TLC7701QPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD701
TLC7701QPWLE
PREVIEW
TSSOP
PW
8
TBD
Call TI
Call TI
-40 to 125
TLC7701QPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD701
TLC7701QPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD701
TLC7703-W
ACTIVE
WAFERSALE
YS
0
TBD
Call TI
Call TI
TLC7703ID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7703I
TLC7703IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7703I
TLC7703IDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7703I
TLC7703IDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7703I
TLC7703IP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
TLC7703IP
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
31-Oct-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TLC7703IPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC7703IPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7703
TLC7703IPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7703
TLC7703IPWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
Call TI
-40 to 85
TLC7703IPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7703
TLC7703IPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7703
TLC7703QD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7703Q
TLC7703QDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7703Q
TLC7703QPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD703
TLC7703QPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD703
TLC7705ID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7705I
TLC7705IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7705I
TLC7705IDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7705I
TLC7705IDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7705I
TLC7705IP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
TLC7705IP
TLC7705IPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
TLC7705IP
TLC7705IPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7705
TLC7705IPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7705
TLC7705IPWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
Call TI
Addendum-Page 3
-40 to 85
-40 to 85
TLC7703IP
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
31-Oct-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TLC7705IPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7705
TLC7705IPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7705
TLC7705MFKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629751301Q2A
TLC7705
MFKB
TLC7705MJG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
TLC7705
MJG
TLC7705MJGB
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
9751301QPA
TLC7705M
TLC7705MUB
ACTIVE
CFP
U
10
1
TBD
A42
N / A for Pkg Type
-55 to 125
9751301QHA
TLC7705M
TLC7705QD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7705Q
TLC7705QDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7705Q
TLC7705QDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7705Q
TLC7705QDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7705Q
TLC7705QP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 125
TLC7705QP
TLC7705QPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 125
TLC7705QP
TLC7705QPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD705
TLC7705QPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD705
TLC7705QPWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
Call TI
-40 to 125
TLC7705QPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD705
TLC7705QPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD705
Addendum-Page 4
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
31-Oct-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TLC7725ID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7725I
TLC7725IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7725I
TLC7725IDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7725I
TLC7725IDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7725I
TLC7725IP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
TLC7725IP
TLC7725IPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
TLC7725IP
TLC7725IPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7725
TLC7725IPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7725
TLC7725IPWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
Call TI
-40 to 85
TLC7725IPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7725
TLC7725IPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7725
TLC7725QD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7725Q
TLC7725QDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7725Q
TLC7725QDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7725Q
TLC7725QDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7725Q
TLC7725QPWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
Call TI
-40 to 125
TLC7725QPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD725
TLC7725QPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD725
TLC7733ID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7733I
Addendum-Page 5
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
31-Oct-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TLC7733IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7733I
TLC7733IDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7733I
TLC7733IDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7733I
TLC7733IP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
TLC7733IP
TLC7733IPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
TLC7733IP
TLC7733IPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7733
TLC7733IPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7733
TLC7733IPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7733
TLC7733IPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7733
TLC7733MFKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629750901Q2A
TLC7733
MFKB
TLC7733MJG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
TLC7733
MJG
TLC7733MJGB
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
9750901QPA
TLC7733M
TLC7733QD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7733Q
TLC7733QDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7733Q
TLC7733QDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7733Q
TLC7733QDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7733Q
TLC7733QP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 125
TLC7733QP
Addendum-Page 6
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
31-Oct-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TLC7733QPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 125
TLC7733QP
TLC7733QPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD733
TLC7733QPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD733
TLC7733QPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD733
TLC7733QPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD733
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 7
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
31-Oct-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLC7701, TLC7705, TLC7705M, TLC7733, TLC7733M :
• Catalog: TLC7705, TLC7733
• Automotive: TLC7701-Q1, TLC7705-Q1, TLC7705-Q1, TLC7733-Q1, TLC7733-Q1
• Enhanced Product: TLC7701-EP, TLC7705-EP, TLC7705-EP, TLC7733-EP, TLC7733-EP
• Military: TLC7705M, TLC7733M
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
Addendum-Page 8
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TLC7701IDR
Package Package Pins
Type Drawing
SOIC
D
8
TLC7701IDRBT-NM
SON
DRB
TLC7701IPWR
TSSOP
PW
TLC7701QDR
SOIC
TLC7701QPWR
TSSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
8
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
TLC7703IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7703IPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
TLC7705IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7705IPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
TLC7705QDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7705QPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
TLC7725IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7725IPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
TLC7725QDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7725QPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
TLC7733IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7733IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7733IPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Oct-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TLC7733QDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7733QDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7733QPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLC7701IDR
SOIC
D
8
2500
367.0
367.0
35.0
TLC7701IDRBT-NM
SON
DRB
8
250
210.0
185.0
35.0
TLC7701IPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
TLC7701QDR
SOIC
D
8
2500
367.0
367.0
35.0
TLC7701QPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
TLC7703IDR
SOIC
D
8
2500
367.0
367.0
35.0
TLC7703IPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
TLC7705IDR
SOIC
D
8
2500
367.0
367.0
35.0
TLC7705IPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
TLC7705QDR
SOIC
D
8
2500
367.0
367.0
35.0
TLC7705QPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
TLC7725IDR
SOIC
D
8
2500
367.0
367.0
35.0
TLC7725IPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
TLC7725QDR
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Oct-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLC7725QPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
TLC7733IDR
SOIC
D
8
2500
367.0
367.0
35.0
TLC7733IDR
SOIC
D
8
2500
367.0
367.0
35.0
TLC7733IPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
TLC7733QDR
SOIC
D
8
2500
367.0
367.0
35.0
TLC7733QDR
SOIC
D
8
2500
367.0
367.0
35.0
TLC7733QPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
Pack Materials-Page 3
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8
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