UC1832 UC2832/3 UC3832/3 Precision Low Dropout Linear Controllers FEATURES DESCRIPTION • Precision 1% Reference • Over-Current Sense Threshold Accurate to 5% • Programmable Duty-Ratio Over-Current Protection • 4.5 V to 36 V Operation • 100mA Output Drive, Source, or Sink • Under-Voltage Lockout The UC2832 and UC3833 series of precision linear regulators include all the control functions required in the design of very low dropout linear regulators. Additionally, they feature an innovative duty-ratio current limiting technique which provides peak load capability while limiting the average power dissipation of the external pass transistor during fault conditions. When the load current reaches an accurately programmed threshold, a gated-astable timer is enabled, which switches the regulator’s pass device off and on at an externally programmable duty-ratio. During the on-time of the pass element, the output current is limited to a value slightly higher than the trip threshold of the duty-ratio timer. The constant-current-limit is programmable on the UCx832 to allow higher peak current during the on-time of the pass device. With duty-ratio control, high initial load demands and short circuit protection may both be accommodated without extra heat sinking or foldback current limiting. Additionally, if the timer pin is grounded, the duty-ratio timer is disabled, and the IC operates in constant-voltage/constant-current regulating mode. Additional Features of the UC2832 series: • Adjustable Current Limit to Current Sense Ratio • Separate +VIN terminal • Programmable Driver Current Limit • Access to VREF and E/A(+) • Logic-Level Disable Input These IC’s include a 2 Volt (±1%) reference, error amplifier, UVLO, and a high current driver that has both source and sink outputs, allowing the use of either NPN or PNP external pass transistors. Safe operation is assured by the inclusion of under-voltage lockout (UVLO) and thermal shutdown. The UC3833 family includes the basic functions of this design in a low-cost, 8pin mini-dip package, while the UC2832 series provides added versatility with the availability of 14 pins. Packaging options include plastic (N suffix), or ceramic (J suffix). Specified operating temperature ranges are: commercial (0°C to 70°C), order UC3832/3 (N or J); and industrial (–40°C to 85°C), order UC2832/3 (N or J). Surface mount packaging is also available. BLOCK DIAGRAMS UDG-92040 SLUS387A - JUNE 1994 - REVISED - MAY 2003 UC1832 UC2832/3 UC3832/3 ABSOLUTE MAXIMUM RATINGS Supply Voltage +VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40V Driver Output Current (Sink or Source) . . . . . . . . . . . . . 450mA Driver Sink to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . 40V TRC Pin Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to 3.2V Other Input Voltages. . . . . . . . . . . . . . . . . . . . . . . –0.3V to +VIN Operating Junction Temperature (note 2) . . . –55°C to +150°C Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . 300°C Note 1: Unless otherwise indicated, voltages are referenced to ground and currents are positive into, negative out of, the specified terminals. Note 2: See Unitrode Integrated Circuits databook for information regarding thermal specifications and limitations of packages. CONNECTION DIAGRAMS UC2832 UC3833 DIL-14 (Top View) J Or N Package DIL-8 (Top View) J Or N Package SOIC-16 (Top View) DW Package SOIC-16 (Top View) DW Package LCC-20 & PLCC-20 L & Q Package (Top View) PACKAGE PIN FUNCTION FUNCTION N/C +VIN Comp/Shutdown E/A(+) +2V REF N/C Gnd Logic Disable Limit Source N/C E/A(-) Sink VADJ N/C Timer RC Current Sense(-) Current Sense(+) LCC-20 & PLCC-20 L & Q Package (Top View) PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15-17 18 19 20 2 PACKAGE PIN FUNCTION FUNCTION +VIN & C/S(+) N/C N/C N/C Comp/Shutdown Gnd N/C N/C N/C Source N/C E/A(-) N/C N/C Sink Timer RC Current Sense(+) N/C PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18-20 UC1832 UC2832/3 UC3832/3 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, specifications hold for TA = 0°C to 70°C for the UC3832/3, –40°C to 85°C for the UC2832/3, +VIN = 15V, Driver sink = +VIN, C/S(+) voltage = +VIN. TA=TJ. PARAMETER Input Supply Supply Current TEST CONDITIONS MIN TYP MAX UNITS +VIN = 6 V 6.5 10 mA +VIN = 36 V 9.5 15 mA Logic Disable = 2 V (UCx832 only) 3.3 mA Reference Section Output Voltage (Note 3) Load Regulation (UCx832 only) Line Regulation TJ = 25°C, IDRIVER = 10 mA 1.98 2.00 2.02 V over temperature, IDRIVER = 10 mA 1.96 2.00 2.04 V IO = 0 to 10 m +VIN = 4.5 V to 36 V, IDRIVER = 10 m -10 Under-Voltage Lockout Threshold -5.0 0.033 0.5 mV mV/V 3.6 4.5 V 1.3 1.4 1.5 -5.0 -1.0 95 100 105 mV Over Temperature 93 110 100 135 107 170 mV mV Logic Disable Input (UCx832 only) Threshold Voltage Input Bias Current Logic Disable = 0 V V µA Current Sense Section Comparator Offset Amplifier Offset (UCx833 only) Amplifier Offset (UCx832 only) VADJ = Open 110 135 170 mV VADJ = 1 V 180 235 290 mV VADJ = 0 V 250 305 360 mV Input Bias Current VCM = +VIN 65 100 135 µA Input Offset Current (UCx832 only) VCM = +VIN -10 10 µA Amplifier CMRR (UCx832 only) Transconductance VCM = 4.1 V to + VIN + 0.3 ICOMP = ±100 µA VADJ Input Current (UCx832 only) VADJ = 0V 80 dB -10 65 -1 mS µA 0.25 1.0 µA -345 -270 -175 µA Timer Inactive Leakage Current C/S(+) = C/S(-) = +VIN; TRC pin = 2 V Active Pullup Current C/S(+) = +VIN, C/S(-) = +VIN - 0.4V; TRC pin = 0 V Duty Ratio (note 4) ontime/period, RT = 200k, CT = 0.27µF 4.8 % Period (notes 4,5) ontime + offtime, RT = 200k, CT = 0.27µF 36 ms Upper Trip Threshold (Vu) 1.8 V Lower Trip Threshold (Vl) Trip Threshold Ratio 0.9 2.0 V V/V Vu/Vl Error Amplifier Input Offset Voltage (UCx832 only) VCM = VCOMP = 2 V -8.0 Input Bias Current VCM = VCOMP = 2 V -4.5 Input Offset Current (UCx832 only) VCM = VCOMP = 2 V -1.5 AVOL VCOMP = 1 V to 13 V 50 CMRR (UCx832 only) VCM = 0V to +VIN - 3 V 60 80 dB PSRR (UCx832 only) Transconductance VCM = 2 V, +VIN = 4.5 V to 36 ICOMP = ±10 µA 90 4.3 dB mS VOH ICOMP = 0, Volts below +VIN .95 1.3 V VOL ICOMP = 0 .45 0.7 V IOH VCOMP = 2 V -500 -100 µA -700 3 8.0 mV µA -1.1 1.5 70 µA dB UC1832 UC2832/3 UC3832/3 ELECTRICAL CHARACTERISTICS (cont.) Unless otherwise stated, specifications hold for TA = 0°C to 70°C for the UC3832/3, –40°C to 85°C for the UC2832/3, +VIN = 15 V, Driver sink = +VIN, C/S(+) voltage = +VIN. TA=TJ. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS VCOMP = 2 V, C/S(-) = +VIN VCOMP = 2 V, C/S(-) = +VIN - 0.4 V 100 500 700 µA 2 6 Driver Limit & Source pins common; TJ = 25°C 200 300 400 mA Over Temperature 100 300 450 mA Error Amplifier (cont.) IOL mA Driver Maximum Current Limiting Voltage (UCx832 only) Driver Limit to Source voltage at current limit, ISOURCE = -10 mA; TJ = 25°C (Note 6) .72 V Internal Current Sense Resistance TJ = 25°C (Note 6) 2.4 Ω Pull-Up Current at Driver Sink Compensation/Shutdown = 0.4 V; Driver Sink = +VIN - 1V Compensation/Shutdown = 0.4 V, +VIN = 36 V; Driver Sink = 35 V Pull-Down Current at Driver Source Compensation/Shutdown = 0.4 V; Driver Source = 1 V Saturation Voltage Sink to Source Driver Source = 0 V; Driver Current = 100 mA Maximum Source Voltage Driver Sink = +VIN, Driver Current = 100 mA Volts below + VIN -800 -300 -100 µA -1000 -300 -75 µA 150 300 700 µA 1.5 V 3.0 V Source = 0 V, TA = 25°C Compensation/Shutdown = 0 V; ISOURCE = 100 µA, 25 µA +VIN = 3 V 1.6 V UVLO Sink Leakage +VIN = C/S(+) = C/S(-) = 2.5 V, Driver Sink = 15 V, Driver Maximum Reverse Source Voltage Thermal Shutdown 160 °C Note 3: On the UCx833 this voltage is defined as the regulating level at the error amplifier inverting input, with the error amplifier driving VSOURCE to 2 V. Note 4: These parameters are first-order supply-independent, however both may vary with supply for +VIN less than about 4 V. This supply variation will cause a slight change in the timer period and duty cycle, although a high off-time/on-time ratio will be maintained. Note 5: With recommended RT value of 200k, TOFF ≈ RT CT * ln(Vu/Vl) ±10%. Note 6: The internal current limiting voltage has a temperature dependence of approximately -2.0 mV/°C, or -2800 ppm/°C. The internal 2.4 Ω sense resistor has a temperature dependance of approximately +1500 ppm/°C. APPLICATION AND OPERATION INFORMATION NPN Pass (Local 100mA Regulator) (UCx833) UDG-92041-1 4 APPLICATION AND OPERATION INFORMATION (cont.) UC1832 UC2832/3 UC3832/3 PNP Pass (Low Drop-Out Regulator) (UCx833) UDG-92042-1 NPN Pass (Medium Power, Low Drop-Out Regulator) (UCx832) UDG-92043-1 Estimating Maximum Load Capacitance For any power supply, the rate at which the total output Current Sense Amplifier Offset Voltage and K= capacitance can be charged depends on the maximum 100mA output current available and on the nature of the load. For ≈1.35 for UCx833, and is variable from 1.35 to 3.05 a constant-current current-limited power supply, the outwith VADJ for the UCx832. put will come up if the load asks for less than the maxiFor a worst-case constant-current load of value just less mum available short-circuit limit current. than ITH, CMAX can be estimated from: To guarantee recovery of a duty-ratio current-limited TON CMAX = ((K−1)ITH) ( ), power supply from a short-circuited load condition, there VOUT is a maximum total output capacitance which can be where VOUT is the nominal regulator output voltage. charged for a given unit ON time. The design value of ON time can be adjusted by changing the timing capacitor. For a resistive load of value RL, the value of CMAX can be estimated from: Nominally, TON = 0.693 x 10k x CT. TON 1 CMAX = • . Typically, the IC regulates output current to a maximum of RL VOUT In [(1− ) −1] IMAX = K x ITH, where ITH is the timer trip-point current, K • ITH • RL 5 UC1832 UC2832/3 UC3832/3 APPLICATION AND OPERATION INFORMATION (cont.) Current Sense Amplifier Offset Voltage vs VADJ UCx832/33 Timer Function UCx832/33 Current Sense Input Configuration Load current, timing capacitor voltage, and output voltage of the regulator under fault conditions. 6 APPLICATION AND OPERATION INFORMATION (cont.) UNITRODE CORPORATION 7 CONTINENTAL BLVD. • MERRIMACK, NH 03054 TEL. (603) 424-2410 • FAX (603) 424-3460 7 UC1832 UC2832/3 UC3832/3 PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) (Requires Login) 5962-9326501M2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-9326501MCA ACTIVE CDIP J 14 1 TBD Call TI Call TI 5962-9326501V2A ACTIVE LCCC FK 20 1 TBD 5962-9326501VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type UC1832J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type UC1832J883B ACTIVE CDIP J 14 1 TBD UC1832L883B ACTIVE LCCC FK 20 1 TBD UC2832DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2832DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2832DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2832DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2833DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2833DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2833DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2833DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TBD POST-PLATE N / A for Pkg Type UC2833J OBSOLETE CDIP JG 8 UC2833N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC2833NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3832DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3832DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 1 Call TI Samples Call TI PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) UC3832DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3832DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3832N ACTIVE PDIP N 14 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3832NG4 ACTIVE PDIP N 14 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3833DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3833DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3833DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3833DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3833J OBSOLETE CDIP JG 8 UC3833N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3833NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type TBD Call TI Samples (Requires Login) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com (3) 28-Aug-2012 MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF UC1832, UC1832-SP, UC2832, UC3832, UC3833 : • Catalog: UC3832, UC1832 • Enhanced Product: UC2832-EP • Military: UC1832, UC1833 • Space: UC1832-SP NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Enhanced Product - Supports Defense, Aerospace and Medical Applications • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UC2832DWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 UC2833DWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 UC3832DWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 UC3833DWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UC2832DWTR SOIC DW 16 2000 367.0 367.0 38.0 UC2833DWTR SOIC DW 16 2000 367.0 367.0 38.0 UC3832DWTR SOIC DW 16 2000 367.0 367.0 38.0 UC3833DWTR SOIC DW 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MCER001A – JANUARY 1995 – REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0°–15° 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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