3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT4P025-WN-A HIGH POWER LED ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES MT4P025-WN-A HIGH POWER LED Package Dimensions 2 7.6±0.5 L +1 L 4+ 7.6±0.5 +2 3+ 1 3 4 5.0±0.2 4.3 4.9±0.2 2.5 1.2±0.1 0.4±0.2 +0.4 2.4-0.2 5.08±0.3 5.08±0.3 Notes: 1. All dimensions are in mm. 2. Tolerance is ±0.25mm unless otherwise noted. Description LED Chip Part No. Lens Color Material 073:1$ ,Q*D16DSSKLUH Emitting Color 1HXWUDO:KLWH VER.: 03 :DWHU&OHDU Date: 2010/06/22 Page: 1/4 MT4P025-WN-A HIGH POWER LED Absolute Maximum Ratings at Ta=25 ℃ Parameter Symbol Rating Unit Power Dissipation ★ PD 108 mW Reverse Voltage ★ VR 5 V D.C. Forward Current★ If 30 mA If(Peak) 100 mA Operating Temperature Range Topr. -40 to +100 ℃ Storage Temperature Range Tstg. -40 to +100 ℃ Soldering Temperature (1.6mm from body) Tsld. Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) ★ Electric Static Discharge Threshold (HBM) ★ Dip Soldering: 260℃ for 5 sec. Hand Soldering: 350℃ for 3 sec. ESD 6000 V ★ The value are based on 1 die performance. Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Luminous Flux ★2 Φv If=20mA ★1 8.0 10.0 Forward Voltage★1 Vf If=20mA ★1 Correlated Colour Temperature★2 Reverse Current ★1 Color Rendering Index(Ra) Viewing Angle★2 Max. lm 3.2 3.6 36 3650 - 3750 37 3750 - 3850 3850 - 4000 40 4000 - 4150 41 4150 - 4300 38 CCT If=20mA ★1 Ir Vr=5V★1 CRI If=20mA ★1 2θ1/2 If=20mA ★1 Unit 50 V o K µA 70 25 deg Notes: 1.The datas tested by IS tester. 2. Customer’s special requirements are also welcome. 3. ★1 For each die 4. ★2 When all LED dies are operated simultaneously.. VER.: 03 Date: 2010/06/22 Page: 2/4 MT4P025-WN-A HIGH POWER LED Typical Electrical/Optical Characteristic Curves (25℃ Ambient Temperature Unless Otherwise Noted) Relative Response 1.2 1.0 0.8 0.6 0.4 0.2 0 300 400 500 600 Wavelength (nm) 700 800 Fig.1 WHITE LED Spectrum VS. WAVELENGTH 1 2 .0 1 0 .0 20 Luminous Flux(lm) Forward Current IF(mA) 25 15 10 8 .0 6 .0 4 .0 5 2 .0 2.8 3.0 3.2 3.4 3.6 0 3.8 2 0.0 1 0.0 0 .0 Applied Voltage (V) 3 0.0 4 0 .0 F o rw ard C u rrent (m A ) Forward Current VS. Applied Voltage Forward Current VS. Luminous Intensity 0° 50 10° 20° Forward Current IF(mA) 30° 40 40° 30 1.0 20 50° 0.9 0 60° 0.8 10 20 40 60 80 100 120 Ambient Temperature Ta (℃) 70° 80° 90° 0.7 0.5 Ambient Temperature VS. Forward Current 0.3 0.1 0.2 0.4 0.6 Radiation Diagram VER.: 03 Date: 2010/06/22 Page: 3/4 MT4P025-WN-A HIGH POWER LED Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip Soldering: Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) Hand Soldering : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 03 Date: 2010/06/22 Page: 4/4