FEDW9045BB-01 1Semiconductor MBF9045BB This version: Sep. 2001 SAW Antenna Duplexer (700 to 1000 MHz) GENERAL DESCRIPTION The MBF9045BB is the SAW antenna duplexer for the frequency range of 700 to 1000 MHz. This SAW Duplexer integrates RF filters at Tx and Rx side, and matching circuit into PKG. This helps to save the space and weight greatly in the target application such as mobile telephone. This SAW Duplexer has very low insertion loss by using high quality package. Due to high harmonics characteristics, total number of components at RF circuit can be minimized. Thanks to high isolation performance, high sensitivity can be expected. Low insertion loss at Tx saves the power consumption of mobile telephone which prolong the battery life. FEATURES • Complying Standard AMPS, IS-95, IS-136 • Small package: 5mm x 5mm & less than 1.8 mm in height • PKG I/O Impedance: 50 Ω PRODUCT DESCRIPTION Package Type MBF9045BB 45B Rx Y XX X Tx ANT Construction Cap Glue Wire Chip Package Die Paste Cross-section of MBF9045BB 1/10 FEDW9045BB-01 1Semiconductor MBF9045BB PIN ASSIGNMENT & DESCRIPTION 9 10 11 8 7 45B 6 YXXX 5 12 Top view 4 1 2 3 1 2 3 4 10 13 11 5 Bottom view 6 12 9 8 7 CONNECTION 2: ANT (Antenna Pin) 5: Tx (Transmitting Terminal Pin) 11: Rx (Receiving Terminal Pin) 13: INDEX Mark (should not be soldered ) Others: GND (Ground Pin) 2/10 FEDW9045BB-01 1Semiconductor MBF9045BB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Rating Unit Min. Max. Ta –30 +85 °C Storage Temperature TSTG –40 +85 °C Maximum Input Power PIN — 1.2 W Operating Temperature RECOMMENDED OPERATING CONDITIONS Parameter Operating Temperature Symbol Ta Rating Min. Max. –30 +85 Unit °C 3/10 FEDW9045BB-01 1Semiconductor MBF9045BB ELECTRICAL CHARACTERISTICS Parameter (Ta = –30 to +85°C) Max. Unit/Notes Condition Mini. Typ. Insertion loss 824 to 849 MHz — 2.0 2.5 dB b) Passband ripple 824 to 849 MHz — 0.7 1.5 dB c) VSWR 824 to 849 MHz — 1.7 2.0 d) Absolute attenuation 869 to 894 MHz 40 45 — dB 1648 to 1698 MHz 10 16 — dB Insertion loss 869 to 894 MHz — 3.4 3.8 dB b) Passband ripple 869 to 894 MHz — 1.0 2.0 dB c) VSWR 869 to 894 MHz — 2.1 2.5 779 to 804 MHz 30 — — dB 824 to 849 MHz 50 53 — dB 979 to 1004 MHz 30 — — dB 1088 to 1113 MHz 30 — — dB 1648 to 1698 MHz 30 — — dB 2472 to 2547 MHz 20 — — dB 824 to 849 MHz 53 57 — dB 869 to 894 MHz 46 49 — dB — — — 1.2 W Tx → Antenna a) Antenna → Rx a) d) Absolute attenuation Isolation TX → RX a) Absolute attenuation Input Power a) Average power Note: Electrical characteristics described above is guaranteed by the following measurement and equipment condition. 1) Test board: See next page 2) Network analyzer: ADVANTEST R3767CH with 3 port test adapter (R3966K) or R3767CG 4/10 FEDW9045BB-01 1Semiconductor MBF9045BB Test Board 22.6±0.1 7.4 0.6 2.3 1.3 0.8 0.5 0.5 1.80 16.6±0.1 1.0 0.8 1.0 6.4 20 5/10 FEDW9045BB-01 1Semiconductor MBF9045BB MARKING Part Symbol 45B YXXX Lot Number Antenna Index Note) Lot Number Y: XXX: Last number of year Serial number 6/10 FEDW9045BB-01 1Semiconductor MBF9045BB REFLOW TEMPERATURE PROFILE The figure below shows recommended temperature profile of infrared reflow and air reflow. Other type of reflow is not recommended. The maximum reflow count is 2 times. Washing of this device after reflow process is prohibited. 250 235 to 240°C, 20 sec. max. Package surface Temperature (°C) 1 to 4°C/sec. 200 Preheat temperature: 120 to 150°C 20 sec.max 1 to 4°C/sec. 150 40 to 60 sec. 100 50 2 to 5°C/sec. Time (sec.) 7/10 FEDW9045BB-01 1Semiconductor MBF9045BB PACKAGE DIMENTION Unit: mm General tolerance: ±0.15 5.0 +0.2 9 5.0 10 11 8 +0.2 7 45B 6 YXXX 5 12 4 2 3 0.6* +0.1 1.7 1 *: Pin No.2,5,11 only 1.27 1.27 1 2 3 4 0.97 1.27 1.27 10 11 φ 0.6 5 12 6 0.6 9 8 7 0.6 8/10 FEDW9045BB-01 1Semiconductor MBF9045BB RECOMMENDATION FOR SOLDER PAD PATTERN The solder pad pattern should be designed by customers because it depends on the electrical performance of the customers’ system. Following is an example of solder pad pattern which is used in OKI’s package evaluation board. Please be noted that this is for reference purpose only. 25 µm 0.1 mm 0.1 mm 25 µm 0.5 mm 0.1 mm PCB pad pattern Metal mask pattern Pad of Device Please pay attention to the following items to maintain electrical performance. (1) Metal mask pattern for cream solder should be 25 µm smaller on each side. Metal mask is 0.15 mm in thickness. (2) As the impedance of Tx, Rx, ANT is designed for 50Ω, please consider this for the design of mother board. 9/10 FEDW9045BB-01 1Semiconductor MBF9045BB NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2001 Oki Electric Industry Co., Ltd. 10/10