DATA SHEET ¡ ML54053 NAND Flash Memory Controller PRELIMINARY SECOND EDITION ISSUE DATE : JAN. 1999 E2Y0002-29-11 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. Printed in Japan Table of Contents 1. FEATURES ........................................................................................................... 2 2. BLOCK DIAGRAM ............................................................................................... 2 3. PIN SPECIFICATIONS ........................................................................................ 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 Host Interface ...................................................................................................... 3 NAND Flash Memory Interface .......................................................................... 4 Extended Bus Interface ...................................................................................... 5 Other Interfaces .................................................................................................. 5 Power Supply ....................................................................................................... 5 Pin Totals ............................................................................................................. 5 Pin Configuration ................................................................................................ 6 4. FUNCTIONS ........................................................................................................ 7 5. ATA REGISTERS ................................................................................................. 8 5.1 5.2 5.3 5.4 5.5 5.6 Memory Mapped Configuration ......................................................................... 8 I/O Mapped 16 Contiguous Registers Configuration ...................................... 9 Primary I/O Mapped Configuration ................................................................... 9 Secondary I/O Mapped Configuration ............................................................ 10 True IDE Mapped Configuration ...................................................................... 10 ATA Registers .................................................................................................... 11 5.6.1 Data Register (Write/Read) ...................................................................... 11 5.6.2 Error Register (Read Only) ....................................................................... 11 5.6.3 Feature Register (Write Only) ................................................................... 11 5.6.4 Sector Count Register (Write/Read) ........................................................ 11 5.6.5 Sector Number Register (Write/Read) ..................................................... 12 5.6.6 Cylinder Low Register (Write/Read) ......................................................... 12 5.6.7 Cylinder High Register (Write/Read) ........................................................ 12 5.6.8 Drive Head Register (Write/Read) ............................................................ 12 5.6.9 Status Register & Alternate Status Register (Read Only) ........................ 13 5.6.10 Device Control Register (Write Only) ....................................................... 13 5.6.11 Command Register (Write Only) .............................................................. 13 6. COMPACTFLASH INTERFACE ........................................................................ 14 6.1 6.2 6.3 6.4 6.5 6.6 6.7 ATA Commands (Standard) .............................................................................. 14 Commands for CompactFlash ......................................................................... 15 Vendor-Unique Commands .............................................................................. 15 Card Information Structure .............................................................................. 15 Identify Information ........................................................................................... 15 Number of Installed Memory Chips and CHS Structure................................ 16 Modes ................................................................................................................. 17 6.7.1 Memory Mapped ..................................................................................... 17 6.7.2 I/O Mapped 16 Contiguous Registers ..................................................... 17 6.7.3 Primary I/O Mapped ................................................................................ 17 6.7.4 Secondary I/O Mapped ........................................................................... 17 6.7.5 True IDE ................................................................................................... 17 7. CHIP MODES .................................................................................................... 18 7.1 Types .................................................................................................................. 18 7.2 Settings .............................................................................................................. 18 7.3 Pin Assignment.................................................................................................. 18 8. ELECTRICAL CHARACTERISTICS .................................................................. 19 8.1 Absolute Maximum Ratings ............................................................................. 19 8.2 Recommended Operating Conditions ............................................................. 19 8.3 DC Characteristics ............................................................................................ 19 9. BUS SPECIFICATIONS ..................................................................................... 20 9.1 9.2 9.3 I/O Mode ........................................................................................................... 20 Bus Timing Specifications ............................................................................... 20 Power ON/OFF, Reset, Busy Timing .............................................................. 20 10. PACKAGE DIMENSIONS .................................................................................. 21 11. APPLICATION EXAMPLE ................................................................................. 22 E2F0019-29-13 Pr ¡ Semiconductor ML54053 ¡ Semiconductor el im This version: Jan. 1999 ML54053 ina ry Previous version: Nov. 1998 NAND Flash Memory Controller The ML54053 is a controller that integrates into a single chip a host interface that conforms to PCMCIA, the necessary functions to control NAND memory, and a microcontroller. Internal 256 byte RAM is provided for storage of the card information structure (CIS). A maximum of 4 chips of 64 Mbit or larger NAND flash memory can be controlled. CompactFlashTM is a trademark of SanDisk Corporation. 1/22 ¡ Semiconductor ML54053 1. FEATURES • Single chip controller with internal microcontroller (min. 4 cycles/instruction execution) • Operating voltage: 3.3 V, Interface voltage: 3.3 V/5 V • Internal 256B RAM for card information structure (CIS) storage • Conforms to CompactFlash specification • Auto-sleep mode support • True IDE Mode support • ECC system by BCH code (3-bit random error correction is possible for user data and ECC data) • Substitute control function (defect management function) • Debug mode support • High-speed operation via dual port bus control • Low power consumption due to single chip controller • Control of four NAND flash memories (64MB to 512MB) is possible • 120-pin TQFP package (TQFP120-P-1414-0.40-K) 2. BLOCK DIAGRAM External CPU Bus CompactFlash I/F ROM Host I/F PCMCIA ATA RAM Media I/F NAND Flash Bus MPU CIS ECC Internal RAM 2/22 ¡ Semiconductor ML54053 3. PIN SPECIFICATIONS Refer to Section 11, “Application Example” for specific connection examples. 3.1 Host Interface Signal Name Type Pin Count Description ha [10:0] I 11 Address bus (A10 is MSB, A0 is LSB) hd [15:0] B 16 Data bus (D15 is MSB, D0 is LSB) hcen [2:1] I 2 Card enable signal (hcen1 controls even addresses and hcen2 controls odd addresses. The combination of ha0, hcen1 and hcen2 allows even/odd addresses to be accessed by hd[7:0].) hiordn I 1 I/O read signal (control signal to read data from ATA registers) hiowrn I 1 I/O write signal (control signal to write data to ATA registers) hoen I 1 Output enable signal hwen I 1 Write enable signal hregn I 1 Register select & I/O Enable signal hirqn O 1 Interrupt request signal (when the card is configured as an I/O card) hstschgn O 1 Card status change signal (signal to change the status of the configuration status register) hinpackn O 1 Input port acknowledge signal (acknowledge signal during I/O read) hiois16n O 1 16-bit address enable signal (when the card is configured as an I/O card, hwaitn O 1 Wait signal hspkr B 1 Audio digital waveform signal this signal indicates that 16-bit addresses are enabled) hrst I 1 Reset signal hcseln I 1 Cable select signal (used only in True IDE Mode, GND: Master, X: Slave) Total 42 pins I: Input, O: Output, B: Bidirectional 3/22 ¡ Semiconductor ML54053 3.2 NAND Flash Memory Interface Signal Name Type Pin Count Description maio [7:0] B 8 Port A I/O bus macle O 1 Port A command latch enable signal (signal to control latching of an maale O 1 maren O 1 Port A read enable signal mawen O 1 Port A write enable signal (signal to latch data into a device) marbn I 1 Port A ready/busy signal (signal to check internal status of device) mbio [7:0] B 8 Port B I/O bus mbcle O 1 Port B command latch enable signal (signal to control latching of an operation command into a device) Port A address latch enable signal (signal to control latching of an address or input data into a device) operation command into a device) mbale O 1 Port B address latch enable signal (signal to control latching of an address or input data into a device) mbren O 1 Port B read enable signal mbwen O 1 Port B write enable signal (signal to latch data into a device) mbrbn I 1 Port B ready/busy signal (signal to check internal status of device) mcen [3:0] O 4 Chip enable signals mwpn O 1 Write protect signal (signal to forcibly prohibit write and erase operations) Total 31 pins 3.3 Extended Bus Interface The extended bus interface is a signal line for the ML54053’s internal microcontroller. The extended bus interface is used for purposes such as debugging. Signal Name Type xah [15:8] B Pin Count 8 Description Address bus for extended bus xad [7:0] B 8 Address/data bus for extended bus xrd B 1 Read signal for extended bus xwr B 1 Write signal for extended bus xale B 1 Address latch enable signal for extended bus xpsen I 1 Program store enable signal for extended bus xint O 1 Interrupt signal for extended bus xrst O 1 Reset signal for extended bus xclk O 1 Clock signal for extended bus Total 23 pins * In an external ROM connection mode, xah, xad, xrd, xwr, and xale are used to connect to external ROM. 4/22 ¡ Semiconductor ML54053 3.4 Other Interfaces Signal Name Type txd/pcfg [0] B Pin Count 1 Description Serial data I/O and chip mode setting rxd/pcfg [1] I 1 porn I 1 Power-on-reset signal (connect to power monitor circuit) xin I 1 Clock I/O (connect a crystal oscillator between xin and xout) xout O 1 Total 5 pins * The chip mode is determined depending upon the status of pcfg[1:0] when the porn signal rises. pcfg[1:0] = 11 : Normal mode pcfg[1:0] = 01 : External CPU connection mode pcfg[1:0] = 10 : External ROM connection mode pcfg[1:0] = 00 : Test mode (normally not used) 3.5 Power Supply Signal Name Type Pin Count VDD-CORE DC 2 VSS-CORE DC 2 VDD DC 6 VSS DC 9 Description Power supply for core Power supply for I/O pad Total 19 pins 3.6 Pin Totals Host Interface 42 NAND Flash Memory Interface 31 Extended Bus Interface 23 Other Interfaces 5 Power Supply 19 Total 120 5/22 ¡ Semiconductor ML54053 porn rxd txd xpsen xint xrst xclk xale xrdn xwrn xad7 VSS xad6 xad5 VDD-CORE xad4 VDD xad3 xad2 xad1 xad0 xa15 xa14 xa13 xa12 xa11 VSS xa10 xa9 xa8 3.7 Pin Configuration hd3 hd11 hd4 hd12 VDD hd5 hd13 hd6 hd14 VSS hd7 hd15 hce1n hce2n ha10 VSS-CORE hoen hiordn ha9 hiowrn ha8 hwen ha7 hirqn ha6 hcseln ha5 ha4 hrst ha3 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 ML54053 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 mbrbn mbio0 mbio7 mbio1 mbio6 VSS mbio2 mbio5 mbio3 VDD mbio4 VSS hd10 hiois16n VDD-CORE hd9 hd2 hd8 hd1 hstschgn VDD hd0 hspkr VSS ha0 hregn ha1 hinpackn ha2 hwaitn 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 mwpn macle maale xout VSS xin maren mawen marbn VDD maio0 maio7 maio1 maio6 VSS VSS-CORE maio2 maio5 maio3 maio4 VDD mcen0 mcen1 mcen2 mcen3 VSS mbcle mbale mbren mbwen 120-Pin Plastic TQFP 6/22 ¡ Semiconductor ML54053 4. FUNCTIONS (1) Sector Formatter and Sequencer The sector formatter and sequencer control the logical format of the NAND flash memory and efficiently perform defect management (substitute processing). (2) CompactFlash Interface The PCMCIA interface conforms to CompactFlash specification. (3) Chip Modes An external ROM connection mode for the ML54053's internal microcontroller and an external CPU connection mode are supported. With these modes, evaluation can be performed efficiently. (4) Auto-Sleep Mode If there is no access from the host over a specific period of time, operation automatically transfers to the sleep mode. (5) Dual Port Bus Control Mode When erasing data or writing the same data, two port buses (Port A, Port B) can be utilized simultaneously for high-speed operation. 7/22 ¡ Semiconductor ML54053 5. ATA REGISTERS When a mode such as memory mode or I/O mode is configured, the host must use different addresses for access. 5.1 Memory Mapped Configuration -CE1 -CE2 -REG A10 A9-A4 A3-A0 Read (-OE = L) (000x) 16-bit Data 0 0 1 0 * 0 1 1 0 * 0 1 1 0 * 1 0 1 0 * 0 1 1 0 * 2h 0 1 1 0 * 3h 1 0 1 0 * 0 1 1 0 * 4h Cylinder Low 0 1 1 0 * 5h 1 0 1 0 * 0 1 1 0 * 0 1 1 0 * 1 0 1 0 * 0 0 1 0 * (100x) Duplicate Data 0 1 1 0 * 0 1 1 0 * 1 0 1 0 * 0 1 1 0 * 1 0 1 0 * 0 1 1 0 * Eh 0 1 1 0 * Fh 1 0 1 0 * 0 0 1 1 * 0 1 1 1 * (xxx0) Even Data 0 1 1 1 * (xxx1) Odd Data 1 0 1 1 * Write (-WE = L) D15 : D0 16-bit Data D15 : D0 D7 : D0 8-bit Data D7 : D0 0h 8-bit Data 1h Error D7 : D0 Features D7 : D0 (000x) Error D15 : D8 Features D15 : D8 Sector Count D7 : D0 Sector Count D7 : D0 Sector Number D7 : D0 Sector Number D7 : D0 (001x) Sector Number D15 : D8 Sector Number D15 : D8 D7 : D0 Cylinder Low D7 : D0 Cylinder High D7 : D0 Cylinder High D7 : D0 (010x) Cylinder High D15 : D8 Cylinder High D15 : D8 D7 : D0 Drive/Head D7 : D0 6h Drive/Head 7h Status D7 : D0 Command D7 : D0 (011x) Status D15 : D8 Command D15 : D8 D15 : D0 Duplicate Data D15 : D0 D7 : D0 Duplicate Even D7 : D0 8h Duplicate Even 9h Duplicate Odd D7 : D0 Duplicate Odd D7 : D0 (100x) Duplicate Odd D15 : D8 Duplicate Odd D15 : D8 Dh Duplicate Error D7 : D0 Duplicate Features D7 : D0 (110x) Duplicate Error D15 : D8 Duplicate Features D15 : D8 Alternate Status D7 : D0 Device Control D7 : D0 Drive Address D7 : D0 Not Used (111x) Drive Address D15 : D8 Not Used * * 16-bit Data Odd Data D15 : D0 16-bit Data D15 : D0 D7 : D0 Even Data D7 : D0 D7 : D0 Odd Data D7 : D0 D15 : D8 Odd Data D15 : D8 * Don't care 8/22 ¡ Semiconductor ML54053 5.2 I/O Mapped 16 Contiguous Registers Configuration -CE1 -CE2 -REG A9-A4 A3-A0 Read (-IORD = L) Write (-IOWR = L) 0 0 0 * 0h 16-bit Data D15 : D0 16-bit Data D15 : D0 0 1 0 * 0h 8-bit Data D7 : D0 8-bit Data D7 : D0 0 1 0 * 1h Error D7 : D0 Features D7 : D0 1 0 0 * (000x) Error D15 : D8 Features D15 : D8 0 1 0 * 2h Sector Count D7 : D0 Sector Count D7 : D0 0 1 0 * 3h Sector Number D7 : D0 Sector Number D7 : D0 1 0 0 * (001x) Sector Number D15 : D8 Sector Number D15 : D8 0 1 0 * 4h Cylinder Low D7 : D0 Cylinder Low D7 : D0 0 1 0 * 5h Cylinder High D7 : D0 Cylinder High D7 : D0 1 0 0 * (010x) Cylinder High D15 : D8 Cylinder High D15 : D8 0 1 0 * D7 : D0 Drive/Head D7 : D0 0 1 0 * 1 0 0 * 0 0 0 * 8h 0 1 0 * 8h 0 1 0 * 9h Duplicate Odd D7 : D0 Duplicate Odd D7 : D0 1 0 0 * (100x) Duplicate Odd D15 : D8 Duplicate Odd D15 : D8 0 1 0 * 1 0 0 * 0 1 0 * 0 1 0 * 1 0 0 * 6h Drive/Head 7h Status D7 : D0 Command D7 : D0 (011x) Status D15 : D8 Command D15 : D8 Duplicate Data D15 : D0 Duplicate Data D15 : D0 Duplicate Even D7 : D0 Duplicate Even D7 : D0 Dh Duplicate Error D7 : D0 Duplicate Features D7 : D0 (110x) Duplicate Error D15 : D8 Duplicate Features D15 : D8 D7 : D0 Device Control D7 : D0 Eh Alternate Status Fh Drive Address D7 : D0 Not Used (111x) Drive Address D15 : D8 Not Used * Don't care 5.3 Primary I/O Mapped Configuration -CE1 -CE2 -REG A9-A0 Read (-IORD = L) Write (-IOWR = L) 0 0 0 1F0h 16-bit Data D15 : D0 16-bit Data D15 : D0 0 1 0 1F0h 8-bit Data D7 : D0 8-bit Data D7 : D0 0 1 0 1F1h Error D7 : D0 Features D7 : D0 1 0 0 1F0h/1F1h Error D15 : D8 Features D15 : D8 0 1 0 1F2h Sector Count D7 : D0 Sector Count D7 : D0 0 1 0 1F3h Sector Number D7 : D0 Sector Number D7 : D0 1 0 0 1F2h/1F3h Sector Number D15 : D8 Sector Number D15 : D8 0 1 0 1F4h Cylinder Low D7 : D0 Cylinder Low D7 : D0 0 1 0 1F5h Cylinder High D7 : D0 Cylinder High D7 : D0 1 0 0 1F4h/1F5h Cylinder High D15 : D8 Cylinder High D15 : D8 0 1 0 1F6h Drive/Head D7 : D0 Drive/Head D7 : D0 0 1 0 1F7h Status D7 : D0 Command D7 : D0 1 0 0 1F6h/1F7h Status D15 : D8 Command D15 : D8 0 1 0 3F6h Alternate Status D7 : D0 Device Control D7 : D0 0 1 0 3F7h Drive Address D7 : D0 Not Used 1 0 0 3F6h/3F7h Drive Address D15 : D8 Not Used 9/22 ¡ Semiconductor ML54053 5.4 Secondary I/O Mapped Configuration -CE1 -CE2 -REG A9-A0 Read (-IORD = L) Write (-IOWR = L) 0 0 0 170h 16-bit Data D15 : D0 16-bit Data D15 : D0 0 1 0 170h 8-bit Data D7 : D0 8-bit Data D7 : D0 0 1 0 171h Error D7 : D0 Features D7 : D0 1 0 0 170h/171h Error D15 : D8 Features D15 : D8 0 1 0 172h Sector Count D7 : D0 Sector Count D7 : D0 0 1 0 173h Sector Number D7 : D0 Sector Number D7 : D0 1 0 0 172h/173h Sector Number D15 : D8 Sector Number D15 : D8 0 1 0 174h Cylinder Low D7 : D0 Cylinder Low D7 : D0 0 1 0 175h Cylinder High D7 : D0 Cylinder High D7 : D0 1 0 0 174h/175h Cylinder High D15 : D8 Cylinder High D15 : D8 0 1 0 176h Drive/Head D7 : D0 Drive/Head D7 : D0 0 1 0 177h Status D7 : D0 Command D7 : D0 1 0 0 176h/177h Status D15 : D8 Command D15 : D8 0 1 0 376h Alternate Status D7 : D0 Device Control D7 : D0 0 1 0 377h Drive Address D7 : D0 Not Used 1 0 0 376h/377h Drive Address D15 : D8 Not Used 5.5 True IDE Mapped Configuration • Command Block Register -CE1 -CE2 -REG A9-A3 A2-A0 Read (-IORD = L) Write (-IOWR = L) 0 1 0 * 0h 16-bit Data D15 : D0 16-bit Data D15 : D0 0 1 0 * 1h Error D7 : D0 Features D7 : D0 0 1 0 * 2h Sector Count D7 : D0 Sector Count D7 : D0 0 1 0 * 3h Sector Number D7 : D0 Sector Number D7 : D0 0 1 0 * 4h Cylinder Low D7 : D0 Cylinder Low D7 : D0 0 1 0 * 5h Cylinder High D7 : D0 Cylinder High D7 : D0 0 1 0 * 6h Drive/Head D7 : D0 Drive/Head D7 : D0 0 1 0 * 7h Status D7 : D0 Command D7 : D0 0 0 0 * (xxx) Not Used Not Used * Don't care • Control Block Register -CE1 -CE2 -REG A9-A3 A2-A0 Read (-IORD = L) Write (-IOWR = L) (xxx) High Impedance Not Used * (0xx) High Impedance Not Used * (10x) High Impedance Not Used 0 * 6h Alternate Status D17 : D0 Device Control 0 * 7h Drive Address D7 : D0 Not Used 1 1 0 * 1 0 0 1 0 0 1 0 1 0 D7 : D0 * Don't care 10/22 ¡ Semiconductor ML54053 5.6 ATA Registers ATA registers realize functions of the PC Card ATA Specifications. 5.6.1 Data Register (Write/Read) This 16-bit or 8-bit register is used in the transfer of data blocks between the internal data buffer and the host. Data can be transferred via consecutive 16-bit or 8-bit accesses to the data register. 5.6.2 Error Register (Read Only) Additional information regarding the cause of a processing error in the previously executed command is indicated. If the error bit of the status register has been set, the host must examine this register. D7 D6 D5 D4 D3 D2 D1 D0 BBK UNC 0 IDNF 0 ABRT 0 AMNF BBK UNC IDNF ABRT : : : : This bit is set when a Bad Block is detected. This bit is set when an Uncorrectable Error is encountered. The requested sector ID is in error or cannot be found. This bit is set if the command has been aborted or when an invalid command has been issued. AMNF : This bit is set in case of a general error. 5.6.3 Feature Register (Write Only) This register is used to write information related to commands. D7 D6 D5 D4 D3 D2 D1 D0 Feature Bytes 5.6.4 Sector Count Register (Write/Read) This register is used to specify the number of sectors or address of logical blocks to be processed by a command. By reading this register after a command has been completed, the host can check the number of sectors not processed by the command. D7 D6 D5 D4 D3 D2 D1 D0 Sector Count 11/22 ¡ Semiconductor 5.6.5 ML54053 Sector Number Register (Write/Read) This register is used to specify the sector number or logical block address where processing by the command will begin. By reading this register after a command has been completed, the host can check the sector number or logical block address processed by the command. D7 D6 D5 D4 D3 D2 D1 D0 Sector Number/LBA7-LBA0 5.6.6 Cylinder Low Register (Write/Read) This register is used to specify the lower cylinder number or the logical block address where processing by the command will begin. By reading this register after a command has been completed, the host can check the last lower cylinder number or logical block address that was processed by the command. D7 D6 D5 D4 D3 D2 D1 D0 Cylinder Low/LBA15-LBA8 5.6.7 Cylinder High Register (Write/Read) This register is used to specify the upper cylinder number or the logical block address where processing by the command will begin. By reading this register after a command has been completed, the host can check the last upper cylinder number or logical block address that was processed by the command. D7 D6 D5 D4 D3 D2 D1 D0 Cylinder High/LBA23-LBA16 5.6.8 Drive Head Register (Write/Read) This register is used to specify the head number or the logical block address where processing by the command will begin. By reading this register after a command has been completed, the host can check the last upper head number or logical block address that was processed by the command. D7 D6 D5 D4 D3 D2 D1 D0 1 LBA 1 DRV# HS3/LBA27 HS2/LBA26 HS1/LBA25 HSO/LBA24 LBA: 1: LBA (logical block address) mode 0: CHS address mode DRV#: card number 0: drive 0 is selected 1: drive 1 is selected If the value of the Drive# bit of the socket copy register matches the value of this bit, this controller will execute the command. 12/22 ¡ Semiconductor 5.6.9 ML54053 Status Register & Alternate Status Register (Read Only) This register indicates the internal status of the controller. When the host reads this register, the controller clears pending interrupt requests. However, even if the alternate status register is read, interrupts requests will not be cleared. D7 D6 D5 D4 D3 D2 D1 D0 BUSY RDY DWF DSC DRQ CORR IDX ERR BUSY: RDY: DWF: DSC: DRQ: CORR: IDX: ERR: This bit is set in the following cases: • from the time when the host writes a command to the command register until processing of the command is completed • when hardware and software resets have been executed from the host This bit indicates Drive Ready. This bit is set when an error related to substitute processing occurs during access to the internal flash memory. If this bit is set, commands that follow may not execute properly. This bit is always set to 1. During execution of a command that involves data transfer, this bit is set once the transfer preparations are made. This bit indicates that a correctable error has occurred during access to flash memory. This bit is always set to 0. This bit is set when an error occurs during command execution. Detailed information is set in the error register. 5.6.10 Device Control Register (Write Only) This register is used to control interrupt requests from the card and to specify software reset. D7 D6 D5 D4 X SRST: -IEN: 5.6.11 D3 D2 D1 D0 1 SRST -IEN 0 D1 D0 While this bit is 1, the controller is in the reset state. 1: Interrupt signal mask, 0: Interrupt signal non-mask Command Register (Write Only) This register is used to set the command code. D7 D6 D5 D4 D3 D2 Command Code 13/22 ¡ Semiconductor ML54053 6. COMPACTFLASH INTERFACE 6.1 ATA Commands (Standard) Supported ATA commands are listed below. Command Code FR SC SN CY 98h, E5h — — — — Execute Drive Diagnostic 90h — — — — Format Track 50h — Check Power Mode ECh — Idle 97h, E3h — Idle Immediate 95h, E1h — 91h — Identify Drive Initialize Drive Parameters Read Buffer Read Long Sector — — — E4h — — 22h, 23h — — DH C/R/W C C W — — R — — C — — C — — C — — R R C4h — R Read Sector (s) 20h, 21h — R Read Verify Sector (s) 40h, 41h — Recalibrate 1xh — — Seek 7xh — — Read Multiple — C — C — — — C — — — C — — — — C — — — — W 32h, 33h — — C5h — W 30h, 31h — W — Set Sleep Mode 99h, E6h — Standby 96h, E2h — Standby Immediate 94h, E0h E8h Write Sector (s) C — C6h Write Multiple C — EFh Set Multiple Mode Write Long Sector — — Set Features Write Buffer C — FR: Features register SC: Sector count register CY: Cylinder register DH: Drive/head register C/R/W: C - Control, R - Read, W - Write : modified, valid — : invalid W SN: Sector number register 14/22 ¡ Semiconductor ML54053 6.2 Commands for CompactFlash Supported CompactFlash commands are listed below. Code FR SC SN CY Request Sense Command 03h — — — — Erase Sector (s) C0h — C Translate Sector 87h — R Wear Level F5h — Write Multiple w/o Erase CDh — W Write Sector (s) w/o Erase 38h — W — — DH — C/R/W C C 6.3 Vendor-Unique Commands Vendor-unique commands can be executed by writing “FFh” data to the command register when a value from the below chart has been written to the feature register. Command Code FR Description C/R/W Low Level Format FFh Undefined Initialization of substitute information, all sectors C Change Information FFh Undefined Change CIS/Identify information W Change Physical Cylinder FFh Undefined Set maximum value of physical cylinder C Read All FFh Undefined Read 528 bytes of the specified page R Un Lock FFh Undefined Vendor-unique commands that follow are valid C Change Physical Cylinder: Sets the maximum value of the user area that is accessible from the host. For details, refer to section 6.6, “Number of Installed Memory Chips and CHS Structure.” 6.4 Card Information Structure The desired card information structure (CIS) can be stored by the change information command. 6.5 Identify Information The desired identify information can be stored by the change information command. 15/22 ¡ Semiconductor ML54053 6.6 Number of Installed Memory Chips and CHS Structure NAND flash memory is erased in block units. Since block erasing is also performed during a 1page (sector) write, efficiency is increased during write operations by serially addressing sectors within the same block. The CHS structure and number of installed memory chips when using 64, 128, 256 and 512 Mbit memory are listed below (where C is the default value). The C value of the CHS address can be set by the change physical cylinder command (a vendor-unique command). • 64 Mbit Memory Capacity No. of Chips 8 CHS LBA Max. (Hex) C H S 1 1000 1 16 16000 (3E80) 16 2 1000 1 32 32000 (7D00) 32 4 1000 2 32 64000 (FA00) • 128 Mbit Memory Capacity No. of Chips 16 CHS LBA Max. (Hex) C H S 1 1000 1 32 32 2 1000 1 64 64000 (FA00) 64 4 1000 2 64 128000 (1F400) 32000 (7D00) • 256 Mbit Memory Capacity No. of Chips 32 CHS LBA Max. (Hex) C H S 1 1000 2 32 64000 (FA00) 64 2 1000 2 64 128000 (1F400) 128 4 1000 4 64 256000 (3E800) • 512 Mbit Memory Capacity No. of Chips 64 CHS LBA Max. (Hex) C H S 1 1000 4 32 128000 (1F400) 128 2 1000 4 64 256000 (3E800) 256 4 1000 8 64 512000 (7D000) 16/22 ¡ Semiconductor ML54053 6.7 Modes 6.7.1 Memory Mapped In the memory mapped mode, ATA registers appear in the 0 to 2K window of common memory space. 6.7.2 I/O Mapped 16 Contiguous Registers In the I/O mapped 16 contiguous registers mode, contiguous ATA registers appear in I/O space. 6.7.3 Primary I/O Mapped In the primary I/O mapped mode, ATA registers appear in 1F0h to 1F7h and 3F6h to 3F7h of the standard I/O address space. 6.7.4 Secondary I/O Mapped In the secondary I/O mapped mode, ATA registers appear in 170h to 177h and 376h to 377h of the standard I/O address space. 6.7.5 True IDE This mode is compatible with True IDE Mode. 17/22 ¡ Semiconductor ML54053 7. CHIP MODES 7.1 Types There are four types of chip modes. Note that default pin assignments change depending upon the chip mode. • Normal Mode This mode is normally used. • External ROM Connection Mode This mode is used for connection to external ROM. • External CPU Connection Mode This mode is used for debugging. When this mode is activated, the internal microcontroller does not operate. • Test Mode This mode is used for testing. The test mode is not normally used. 7.2 Settings Chip modes are determined by the status of pcfg[1:0] when the power-on-reset signal (porn signal) rises. pcfg [1 : 0] = 11 Normal Mode pcfg [1 : 0] = 01 External CPU Connection Mode pcfg [1 : 0] = 10 External ROM Connection Mode pcfg [1 : 0] = 00 Test Mode 7.3 Pin Assignment Interface Signal Name Normal Extended Bus xah [15 : 8] (Low-Level) O xah [15 : 8] I/O xah [15 : 8] I/O Extended Bus xad [7 : 0] (Low-Level) O xad [7 : 0] I/O xad [7 : 0] I/O Extended Bus xrd (Low-Level) O xrd O xrd I Extended Bus xwr (Low-Level) O xwr O xwr I Extended Bus xale (Low-Level) O xale O xale I Extended Bus xint (Low-Level) O (Low-Level) O xint O Extended Bus xpsenn (Low-Level) I (Low-Level) I xpsenn I Extended Bus xrst (Low-Level) O (Low-Level) O xrst O Extended Bus xclk (Low-Level) O (Low-Level) O xclk O External ROM Connection External CPU Connection 18/22 ¡ Semiconductor ML54053 8. ELECTRICAL CHARACTERISTICS 8.1 Absolute Maximum Ratings Parameter Power Supply Voltage Input Voltage Output Voltage Input Current Normal Buffer 5 V Tolerant Buffer Normal Buffer 5 V Tolerant Buffer Normal Buffer 5 V Tolerant Buffer Storage Temperature Symbol Condition Rating VDD –0.3 to +4.6 –0.3 to VDD + 0.3 VI –0.3 to +6.0 Tj = 25°C VO Unit V –0.3 to VDD + 0.3 The standard is –0.3 to +6.0 VSS = 0 V –10 to +10 II mA –6 to +6 Tstg –65 to +150 °C 8.2 Recommended Operating Conditions Symbol Range Unit Power Supply Voltage Parameter VDD 3.0 to 3.6 V Operating Temperature Tj –40 to +85 °C 8.3 DC Characteristics Parameter (VDD = 3.0 to 3.6 V, VSS = 0 V, Tj = –40 to +85°C) Symbol Condition TTL normal input Rating Min. Typ. Max. 2.0 — VDD + 0.3 High Level Input Voltage VIH 5 V tolerant input 2.0 — 5.5 Low Level Input Voltage VIL — –0.3 — +0.8 Vt+ — — 1.5 2.0 Schmitt Trigger Threshold Voltage Vt– — 0.7 1.0 — DVt Vt+ – Vt– 0.4 0.5 — High Level Output Voltage VOH Low Level Output Voltage VOL High Level Input Current IIH Low Level Input Current IIL IOZH Output Leakage Current Standby Power Supply Current IOZL IDDS IOH = –100 mA VDD – 0.2 — — IOL = 2, 4, 8 mA 2.4 — — IOH = –100 mA — — 0.2 IOL = 2, 4, 8 mA — — 0.4 VIH = VDD — 0.01 1 VIL = VSS –1 +0.01 — (50 kW pull-up) –170 –66 –15 VOL = VDD — 0.01 1 VOL = VSS –1 –0.01 — (50 kW pull-up) –170 –66 –15 Output open –10 — +10 Unit V mA Note 1 : Listed values are for a normal buffer and a 5 V tolerant buffer unless otherwise specified. Note 2 : Typical values are indicated for a typical condition at VDD = 3.3 V and Tj = 25°C. 19/22 ¡ Semiconductor ML54053 9. BUS SPECIFICATIONS 9.1 I/O Mode The I/O mode conforms to CompactFlash and IDE specifications. 9.2 Bus Timing Specifications Bus timing conforms to CompactFlash, IDE and NAND flash memory specifications. 9.3 Power ON/OFF, Reset, Busy Timing Parameter Symbol VI (CE) -CE Signal Level Specified Value Condition Min. Max. 0 V £ VCC < 2.0 V 0 VI Max. 2.0 V £ VCC < VIH VCC – 0.1 VI Max. VIH £ VCC VIH VI Max. Unit V tsu (RESET) — TBD ms Ready Release Delay Time td (BSY) — TBD ms -CE Recovery Time trec (VCC) — TBD ms tpr 10%Æ(VCC + 5%) 90% *1 TBD ms Reset Setup Time VCC Rise Time tpf (VCC – 5%) 90%Æ10% *1 TBD ms tw (RESET) — TBD ms th (Hi-Z RESET) — TBD ms ts (Hi-Z RESET) — TBD ms VCC Fall Time Reset Width *1: tpr and tpf are defined as the time of the “straight-line change from 10% to 90% of V CC”, and vice-versa. Even if the rise and fall waveforms are non-linear, the maximum slope of the waveform must meet these specifications. tpr tsu(RESET) tsu(CE) VIH 2V , VCC -CE1, -CE2 RESET th(Hi-Z RESET) td(BSY) tw(RESET) Hi-Z +RDY/-BSY tpf VCC trec(VCC) -CE1, -CE2 RESET ts(Hi-Z RESET) VIH 2V Hi-Z 20/22 ¡ Semiconductor ML54053 10. PACKAGE DIMENSIONS (Unit : mm) TQFP120-P-1414-0.40-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature, and times). 21/22 ¡ Semiconductor ML54053 11. APPLICATION EXAMPLE Connecter 5 to 3 Cnv VCC ML54053 A0-10 Address ha0-10 D0-15 Data -CE1 -CE2 -OE -WE RDY/-BSY/-IREQ WP/-IOIS16 -IORD -IOWR RST -WAIT -INPACK -REG SPKR -STSCHG A25 -CD1 -CD2 hd0-15 hcen1 hcen2 hoen hwen hirqn hiois16n hiordn hiowrn hrst hwaitn hinpackn hregn hspkr hstschgn hcseln maio0-7 Address/Data maren mawen marbn macle maale GND mbio0-7 Vlt Dct porn I/O1-8 -RE -WE R/-B CLE ALE 3 -WP -CE I/O1-8 -RE -WE R/-B CLE 2 ALE -WP -CE I/O1-8 -RE -WE R/-B CLE 4 ALE -WP -CE Address/Data mbren mbwen mbrbn mbcle mbale xin 20 MHz xout I/O1-8 -RE -WE R/-B CLE 1 ALE -WP -CE mwpn mcen0 mcen1 mcen2 mcen3 txd rxd 22/22