OKI Semiconductor MR27V401E FEDR27V401E-01-03 Issue Date: Jan. 15, 2004 524,288-Word × 8-Bit One Time PROM GENERAL DESCRIPTION The MR27V401E is a 4 Mbit electrically One Time Programmable Read-Only Memory organized as 524,288-word × 8-bit. The MR27V401E supports high speed asynchronous read operation using a single 3.3V power supply. FEATURES · 524,288-word × 8-bit · +3.3 V power supply · Access time 70 nS MAX · Operating current 25 mA MAX · Standby current 50 µA MAX · Input/Output TTL compatible · Three-state output · Packages: 32-pin plastic SOP (SOP32-P-525-1.27-K) (MR27V401EMA) 32-pin plastic TSOP (TSOP(1)32-P-0814-0.50-1K) (MR27V401ETA) 32-pin plastic DIP (DIP32-P-600-2.54) (MR27V401ERA) 1/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP PIN CONFIGURATION (TOP VIEW) VPP 1 32 VCC A16 2 31 A18 A15 3 30 A17 A12 4 29 A14 A7 5 28 A13 A6 6 27 A8 A5 7 26 A9 A4 8 25 A11 A3 9 24 OE A2 10 23 A10 A1 11 22 CE A0 12 21 D7 D0 13 20 D6 D1 14 19 D5 D2 15 18 D4 16 17 D3 VSS 32-pin SOP/DIP A4 A5 A6 A7 A12 A15 A16 VPP VCC A18 A17 A14 A13 A8 A9 A11 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 32-pin TSOP 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 A3 A2 A1 A0 D0 D1 D2 VSS D3 D4 D5 D6 Pin name A0 to A18 D7 CE A10 OE Functions Address input D0 to D7 Data output CE Chip enable OE Output enable VCC Power supply voltage VSS GND VPP Program power supply voltage 2/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP BLOCK DIAGRAM VPP CE OE PGM Row Decoder OE Memory Cell Matrix 524,288 × 8-Bit Multiplexer Column Decoder Address Buffer A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 CE Output Buffer D0 D1 D2 D3 D4 D5 D6 D7 FUNCTION TABLE CE OE Read L L Output disable L H Standby H ∗ Hi–Z Program L H DIN Program Inhibit H H Program verify H L Mode DC VCC D0 to D7 DOUT ** 9.75V 3.3 V 4.0V Hi–Z Hi–Z DOUT ∗: Don’t Care (H or L) ∗∗: Don’t Care (H or L or OPEN) 3/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP ABSOLUTE MAXIMUM RATINGS Parameter Symbol Operating temperature under bias Condition Ta Storage temperature — Tstg Input voltage VI Output voltage VO Power supply voltage VCC Program power supply voltage VPP Power dissipation per package PD relative to VSS Value Unit 0 to 70 °C –55 to 125 °C –0.5 to VCC+0.5 V –0.5 to VCC+0.5 V –0.5 to 5 V –0.5 to 11.5 V 1.0 W — RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70°C) Parameter Symbol VCC power supply voltage VCC VPP power supply voltage VPP Input “H” level VIH Input “L” level VIL Condition VCC = 3.0 to 3.6 V Min. Typ. Max. Unit 3.0 — 3.6 V –0.5 — VCC+0.5∗ V 2.2 — VCC+0.5∗ V –0.5∗∗ — 0.6 V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns. 4/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP ELECTRICAL CHARACTERISTICS DC Characteristics (VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C) parameter Input leakage current Symbol Condition Min. Typ. Max. Unit ILI VI = 0 to VCC — — 10 µA ILO VO = 0 to VCC — — 10 µA VCC power supply current ICCSC CE = VCC — — 50 µA (Standby) ICCST CE = VIH — — 1 mΑ ICCA CE = VIL, OE = VIH tc = 70 ns — — 25 mA VPP power supply current IPP VPP = VCC — — 10 µA Input “H” level VIH — 2.2 — VCC+0.5∗ V Input “L” level VIL — –0.5∗∗ — 0.6 V Output “H” level VOH IOH = –400 µA 2.4 — — V Output “L” level VOL IOL = 2.1 mA — — 0.4 V Output leakage current VCC power supply current (Read) Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns. AC Characteristics (VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C) Parameter Symbol Condition Min. Max. Unit tC — 70 — ns tACC CE = OE = VIL — 70 ns CE access time tCE OE = VIL — 70 ns 30 tOE CE = VIL — 35 ns tCHZ OE = VIL 0 30 ns tOHZ CE = VIL 0 25 ns tOH CE = OE = VIL 0 — ns Address cycle time Address access time Output disable time Output hold time Measurement conditions Input signal level-------------------------------- 0 V/3 V Input timing reference level ------------------ 0.8 V/2.0 V Output load -------------------------------------- 50 pF Output timing reference level---------------- 0.8 V/2.0 V 2.08 V 800 Ω Output 50 pF (Including scope and jig) 5/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP TIMING CHART (READ CYCLE) tC tC Address tOH tACC tCE CE tOE tCHZ tOH OE tOHZ tACC Valid Data D0 to D7 Hi-Z Valid Data Hi-Z 6/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP ELECTRICAL CHARACTERISTICS (PROGRAMMING OPERATION) DC Characteristics (Ta = 25°C ± 5°C) Parameter Symbol Condition Min. Typ. Max. Unit ILI VI = VCC+0.5 V — — 10 µA VPP power supply current (Program) IPP2 CE = VIL — — 50 mA VCC power supply current ICC — — — 80 mA Input “H” level VIH — 3.0 — VCC+0.5 V Input leakage current Input “L” level VIL — –0.5 — 0.8 V Output “H” level VOH IOH = –400 µA 2.4 — — V Output “L” level VOL IOL = 2.1 mA — — 0.45 V Program voltage VPP — 9.5 9.75 10.0 V VCC power supply voltage VCC — 3.9 4.0 4.1 V Voltage is relative to VSS. AC Characteristics (VCC = 4.0 V ± 0.1 V, VPP = 9.75 V ± 0.25 V, Ta = 25°C ± 5°C) Symbol Condition Min. Typ. Max. Unit Address set-up time Parameter tAS — 100 — — ns OE set-up time tOES — 2 — — µs Data set-up time tDS — 100 — — ns Address hold time tAH — 2 — — µs Data hold time tDH — 100 — — ns Output float delay time from OE tOHZ — 0 — 100 ns VPP voltage set-up time tVS — 2 — — µs Program pulse width tPW — 9 10 11 µs Data valid from OE tOE — — — 100 ns Address hold from OE high tAOH — 0 — — ns Pin Check Function Pin Check Function is to check contact between each device-pin and each socket-lead with EPROM programmer. Setting up address as following condition call the preprogrammed codes on device outputs. (VCC = 3.3 V ± 0.3 V, CE = VIL, OE = VIL, Ta = 25°C ± 5°C) A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 ∗ A10 A11 A12 A13 A14 A15 A16 A17 A18 DATA 0 1 0 1 0 1 0 1 0 VH 1 1 0 1 0 1 0 1 0 AA 1 0 1 0 1 0 1 0 1 VH∗ 0 0 1 0 1 0 1 0 1 55 Other conditions FF ∗: VH = 8 V ± 0.25 V 7/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP Consecutive Programming Waveforms A0 to A18 tAS tAH CE tPW High OE tDH tDS Din D0 to D7 Din tVS Vpp Consecutive Program Verify Waveforms A0 to A18 High CE tACC tAHO OE tOE D0 to D7 Vpp tOHZ Dout Dout 9.75 V 8/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP Program and Program Verify Cycle Waveforms A0 to A18 tAS tAHO CE tPW tOES OE tOHZ tDH tDS tOE tOHZ Dout Din D0 to D7 9.75 V Vpp Pin Capacitance (VCC = 3.3 V, Ta = 25°C, f = 1 MHz) Parameter Symbol Condition Min. Typ. Max. Input CIN1 VI = 0 V — — 8 Output COUT VO = 0 V — — 10 Unit pF 9/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP Programming/Verify Flow Chart Programming Verify Start Start Pin Check Pin Check NG Bad Insertion NG Bad Insertion PASS PASS Address = First Location Address = First Location VCC = 4.0 V VCC = 3.0 V/VPP = 3.0 V VPP = 9.75 V NG Verify PASS Program 10 µs VCC = 3.6 V/VPP = 3.6 V Increment Address NO Last Address? NG Verify YES PASS Address = First Location Device Passed Device Failed X=0 NG Verify(One Byte) X = X+1 PASS Increment Address NO YES Last Address? X = 2? YES NO VCC = 3.0 V/VPP = 3.0 V Verify Program 10 µs NG PASS Device Passed Device Failed 10/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP PACKAGE DIMENSIONS (Unit: mm) SOP32-P-525-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.32 TYP. 5/Fev. 10, 1997 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 11/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP (Unit: mm) TSOP(1)32-P-0814-0.50-1K Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.27 TYP. 3/Dec. 10, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 12/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP (Unit: mm) 13/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP REVISION HISTORY Page Previous Current Edition Edition Document No. Date FEDR27V401E-01-02 Sep. 2001 – – FEDR27V401E-01-03 Jan. 15, 2004 1, 2 1, 2, 13 Description Final edition 2 Added 32DIP package. 14/15 FEDR27V401E-01-03 OKI Semiconductor MR27V401E / OTP NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2004 Oki Electric Industry Co., Ltd. 15/15