TI SN74AUP2G00QDCURQ1

SN74AUP2G00-Q1
www.ti.com
SCES812 – JUNE 2010
LOW-POWER DUAL 2-INPUT POSITIVE-NAND GATE
Check for Samples: SN74AUP2G00-Q1
FEATURES
1
•
•
•
•
•
•
•
•
Qualified for Automotive Applications
Low Static-Power Consumption
(ICC = 1.7 mA Maximum)
Low Dynamic-Power Consumption
(Cpd = 4.3 pF Typ at 3.3 V)
Low Input Capacitance (Ci = 1.5 pF Typical)
Low Noise – Overshoot and Undershoot
<10% of VCC
Ioff Supports Partial-Power-Down Mode
Operation
Wide Operating VCC Range of 0.8 V to 3.6 V
Optimized for 3.3-V Operation
•
•
•
•
3.6-V I/O Tolerant to Support Mixed-Mode
Signal Operation
tpd = 5.9 ns Maximum at 3.3 V
Suitable for Point-to-Point Applications
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DCU PACKAGE
(TOP VIEW)
1A
1B
2Y
GND
1
8
VCC
2
7
3
6
4
5
1Y
2B
2A
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable
applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range
of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal
integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
Static-Power Consumption
(µA)
100%
40%
60%
3.3-V
(A)
Logic
40%
Voltage (V)
80%
80%
60%
Switching Characteristics
at 25 MHz(A)
Dynamic-Power Consumption
(pF)
100%
3.3-V
(A)
Logic
20%
20%
AUP
AUP
0%
(A)
0%
AUP
Single, dual, and triple gates
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
Input
0
5
(A)
Figure 1. AUP – The Lowest-Power Family
Output
10
15
20 25 30
Time (ns)
35
40
45
SN74AUP2Gxx data at CL = 15 pF.
Figure 2. Excellent Signal Integrity
The SN74AUP2G00 performs the Boolean function Y = A • B or Y = A + B in positive logic.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
SN74AUP2G00-Q1
SCES812 – JUNE 2010
www.ti.com
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 125°C
(1)
(2)
VSSOP – DCU
ORDERABLE PART NUMBER
Reel of 3000
SN74AUP2G00QDCURQ1
TOP-SIDE MARKING
SBTQ
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
FUNCTION TABLE
INPUTS
B
OUTPUT
Y
L
L
H
L
X
H
X
L
H
H
H
L
A
LOGIC DIAGRAM (POSITIVE LOGIC)
1
1A
7
1Y
2
1B
5
3
2A
6
2Y
2B
Pin number shown are for DCU and DQE packages.
2
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SCES812 – JUNE 2010
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
4.6
V
VI
Input voltage range (2)
–0.5
4.6
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
4.6
V
–0.5
VCC + 0.5
(2)
UNIT
VO
Output voltage range in the high or low state
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±20
mA
Continuous current through VCC or GND
±50
mA
220
°C/W
150
°C
qJA
Package thermal impedance, junction to free air
Tstg
Storage temperature range
(1)
(2)
(3)
DCU package (3)
–65
V
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
ESD PROTECTION
ESD
Electrostatic discharge rating
Human-Body Model (HBM)
MAX
UNIT
1000
V
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SCES812 – JUNE 2010
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RECOMMENDED OPERATING CONDITIONS (1)
VCC
Supply voltage
VCC = 0.8 V
VIH
High-level input voltage
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
MIN
MAX
0.8
3.6
UNIT
V
VCC
0.65 × VCC
V
1.6
2
VCC = 0.8 V
0
VCC = 1.1 V to 1.95 V
0.35 × VCC
VIL
Low-level input voltage
VI
Input voltage
0
3.6
VO
Output voltage
0
VCC
V
VCC = 0.8 V
–20
mA
VCC = 1.1 V
–1.1
VCC = 1.4 V
–1.7
VCC = 1.65
–1.9
VCC = 2.3 V
–3.1
VCC = 2.3 V to 2.7 V
0.7
VCC = 3 V to 3.6 V
IOH
High-level output current
IOL
Low-level output current
0.9
VCC = 3 V
–4
VCC = 0.8 V
20
VCC = 1.1 V
1.1
VCC = 1.4 V
1.7
VCC = 1.65 V
1.9
VCC = 2.3 V
3.1
VCC = 3 V
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
4
V
V
mA
mA
mA
4
VCC = 0.8 V to 3.6 V
–40
200
ns/V
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report Implications
of Slow or Floating CMOS Inputs, literature number SCBA004.
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SCES812 – JUNE 2010
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VOH
TEST CONDITIONS
VCC
MIN
0.8 V to 3.6 V
VCC – 0.1
VCC – 0.1
1.1 V
0.75 × VCC
0.7 × VCC
IOH = –1.7 mA
1.4 V
1.11
1.03
IOH = –1.9 mA
1.65 V
1.32
1.3
2.05
1.97
2.3 V
IOH = –2.7 mA
3V
IOH = –4 mA
1.9
1.85
2.72
2.67
2.6
2.55
MAX
0.8 V to 3.6 V
0.1
0.1
IOL = 1.1 mA
1.1 V
0.3 × VCC
0.3 × VCC
IOL = 1.7 mA
1.4 V
0.31
0.37
IOL = 1.9 mA
1.65 V
0.31
0.35
0.31
0.33
0.44
0.45
0.31
0.33
2.3 V
IOL = 3.1 mA
IOL = 2.7 mA
3V
IOL = 4 mA
0.44
0.45
0 V to 3.6 V
0.1
V
0.5
mA
Ioff
VI or VO = 0 V to 3.6 V
0V
0.2
1.3
mA
ΔIoff
VI or VO = 0 V to 3.6 V
0 V to 0.2 V
0.2
2
mA
ICC
VI = GND or (VCC to 3.6 V),
IO = 0
0.8 V to 3.6 V
0.5
1.7
mA
ΔICC
VI = VCC – 0.6 V (1),
IO = 0
3.3 V
40
50
mA
Ci
VI = VCC or GND
Co
VO = GND
(1)
VI = GND to 3.6 V
UNIT
V
IOL = 20 mA
IOL = 2.3 mA
A or B input
MAX
IOH = –1.1 mA
IOH = –3.1 mA
II
TA = –40°C to 125°C
TYP
IOH = –20 mA
IOH = –2.3 mA
VOL
TA = 25°C
MIN
0V
1.5
3.6 V
1.5
0V
pF
3
pF
One input at VCC – 0.6 V, other input at VCC or GND
SWITCHING CHARACTERISTICS (1)
over recommended operating free-air temperature range, CL = 5 pF (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
MIN
0.8 V
tpd
(1)
A or B
Y
TA = –40°C to
125°C
TA = 25°C
TYP
MAX
MIN
MAX
UNIT
19.8
1.2 V ± 0.1 V
2.6
7.8
18.8
2.1
20.9
1.5 V ± 0.1 V
1.4
5.4
11.8
0.9
12.7
1.8 V ± 0.15 V
1
4.3
9
0.5
9.5
2.5 V ± 0.2 V
1
3
5.9
0.5
6.4
3.3 V ± 0.3 V
1
2.4
5.2
0.5
5.7
ns
Specified by design. Not production tested.
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SWITCHING CHARACTERISTICS (1)
over recommended operating free-air temperature range, CL = 10 pF (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
MIN
0.8 V
tpd
(1)
A or B
Y
TA = –40°C to
125°C
TA = 25°C
VCC
TYP
MAX
MIN
MAX
UNIT
23.1
1.2 V ± 0.1 V
1.5
8.9
21.1
1
22.1
1.5 V ± 0.1 V
1
6.3
13.2
0.5
13.7
1.8 V ± 0.15 V
1
5
10.1
0.5
10.6
2.5 V ± 0.2 V
1
3.6
7.4
0.5
7.9
3.3 V ± 0.3 V
1
2.9
5.5
0.5
6
ns
Specified by design. Not production tested.
SWITCHING CHARACTERISTICS (1)
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
MIN
0.8 V
tpd
(1)
A or B
Y
TA = –40°C to
125°C
TA = 25°C
VCC
TYP
MAX
MIN
MAX
21.7
3.1
24.8
UNIT
24.7
1.2 V ± 0.1 V
3.6
9.8
1.5 V ± 0.1 V
2.3
4.6
14
1.8
15.8
1.8 V ± 0.15 V
1.6
5.5
10.6
1.1
11.7
2.5 V ± 0.2 V
1
4
7
0.5
7.5
3.3 V ± 0.3 V
1
3.3
5.9
0.5
6.4
ns
Specified by design. Not production tested.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
MIN
0.8 V
tpd
A or B
Y
TA = –40°C to
125°C
TA = 25°C
VCC
TYP
MAX
MIN
MAX
UNIT
31.8
1.2 V ± 0.1 V
4.9
12.6
26.3
4.4
29
1.5 V ± 0.1 V
3.4
9
16.6
2.9
20
1.8 V ± 0.15 V
2.5
7.3
12.9
2
15.7
2.5 V ± 0.2 V
1.8
5.4
8.8
1.3
11.4
3.3 V ± 0.3 V
1.5
4.5
7
1
9.5
ns
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
Cpd
6
Power dissipation capacitance
TEST
CONDITIONS
f = 10 MHz
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VCC
TYP
0.8 V
4
1.2 V ± 0.1 V
4
1.5 V ± 0.1 V
4
1.8 V ± 0.15 V
4
2.5 V ± 0.2 V
4.1
3.3 V ± 0.3 V
4.3
UNIT
pF
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): SN74AUP2G00-Q1
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SCES812 – JUNE 2010
PARAMETER MEASUREMENT INFORMATION
(Propagation Delays, Setup and Hold Times, and Pulse Width)
From Output
Under Test
CL
(see Note A)
1 MΩ
LOAD CIRCUIT
CL
VM
VI
VCC = 0.8 V
VCC = 1.2 V
± 0.1 V
VCC = 1.5 V
± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
5, 10, 15, 30 pF
VCC/2
VCC
5, 10, 15, 30 pF
VCC/2
VCC
5, 10, 15, 30 pF
VCC/2
VCC
5, 10, 15, 30 pF
VCC/2
VCC
5, 10, 15, 30 pF
VCC/2
VCC
5, 10, 15, 30 pF
VCC/2
VCC
tw
VCC
Input
VCC/2
VCC/2
VI
VM
Input
0V
VM
VOLTAGE WAVEFORMS
PULSE DURATION
0V
tPHL
tPLH
VOH
VM
Output
VM
VOL
tPHL
VCC
Timing Input
0V
tPLH
tsu
VOH
Output
VCC/2
VM
th
VCC
VM
VOL
Data Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VCC/2
VCC/2
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
A.
CL includes probe and jig capacitance.
B.
Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output
control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the
output control.
C.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, for
propagation delays tr/tf = 3 ns, for setup and hold times and pulse width tr/tf = 1.2 ns.
D.
The outputs are measured one at a time, with one transition per measurement.
E.
tPLH and tPHL are the same as tpd.
F.
All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuit and Voltage Waveforms
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PARAMETER MEASUREMENT INFORMATION
(Enable and Disable Times)
2 x V CC
S1
5 kΩ
From Output
Under Test
GND
CL
(see Note A)
5 kΩ
TEST
S1
tPLZ/tPZL
tPHZ/tPZH
2 x V CC
GND
LOAD CIRCUIT
CL
VM
VI
V∆
VCC = 0.8 V
VCC = 1.2 V
± 0.1 V
VCC = 1.5 V
± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
5, 10, 15, 30 pF
VCC/2
VCC
0.1 V
5, 10, 15, 30 pF
VCC/2
VCC
0.1 V
5, 10, 15, 30 pF
VCC/2
VCC
0.1 V
5, 10, 15, 30 pF
VCC/2
VCC
0.15 V
5, 10, 15, 30 pF
VCC/2
VCC
0.15 V
5, 10, 15, 30 pF
VCC/2
VCC
0.3 V
VCC
Output
Control
Output
Waveform 1
S1 at 2 xV CC
(see Note B)
VCC/2
0V
tPZL
tPLZ
VCC
VCC/2
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VCC/2
VOL + V ∆
VOL
tPHZ
VCC/2
VOH - V ∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
A.
CL includes probe and jig capacitance.
B.
Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output
control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the
output control.
C.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf = 3 ns.
D.
The outputs are measured one at a time, with one transition per measurement.
E.
tPLZ and tPHZ are the same as tdis.
F.
tPLH and tPHL are the same as tpd.
G.
All parameters and waveforms are not applicable to all devices.
Figure 4. Load Circuit and Voltage Waveforms
8
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PACKAGE OPTION ADDENDUM
www.ti.com
15-Sep-2010
PACKAGING INFORMATION
Orderable Device
SN74AUP2G00QDCURQ1
Status
(1)
Package Type Package
Drawing
ACTIVE
US8
DCU
Pins
Package Qty
8
3000
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
(3)
Samples
(Requires Login)
Purchase Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74AUP2G00-Q1 :
• Catalog: SN74AUP2G00
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-May-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74AUP2G00QDCURQ
1
Package Package Pins
Type Drawing
US8
DCU
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
180.0
8.4
Pack Materials-Page 1
2.25
B0
(mm)
K0
(mm)
P1
(mm)
3.35
1.05
4.0
W
Pin1
(mm) Quadrant
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
6-May-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AUP2G00QDCURQ1
US8
DCU
8
3000
202.0
201.0
28.0
Pack Materials-Page 2
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
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