POWERINT LXA10FP600

LXA10T600, LXA10FP600
Qspeed™ Family
600 V, 10 A X-Series PFC Diode
Product Summary
IF(AVG)
VRRM
QRR (Typ at 125 °C)
IRRM (Typ at 125 °C)
Softness tb/ta (Typ at 125 °C)
10
600
94
3.85
0.5
General Description
A
V
nC
A
This device has the lowest QRR of any 600V
Silicon diode.
Its recovery characteristics
increase efficiency, reduce EMI and eliminate
snubbers.
Applications
• Power Factor Correction (PFC) Boost Diode
• Motor drive circuits
• DC-AC Inverters
Pin Assignment
K
Features
K
K
•
•
•
•
A
A
TO-220AC
FullPak
LXA010T600
LXA10FP600
A
K
Low QRR, Low IRRM, Low tRR
High dIF/dt capable (1000A/µs)
Soft recovery
FullPak Insulation = 2500VRMS
Benefits
• Increases efficiency
• Eliminates need for snubber circuits
• Reduces EMI filter component size & count
• Enables extremely fast switching
RoHS Compliant
Package uses Lead-free plating and
Green mold compound.
Halogen free per IEC 61249-2-21.
Absolute Maximum Ratings
Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
Symbol
Parameter
VRRM
Peak repetitive reverse voltage
IF(AVG)
Average forward current
IFSM
IFSM
TJ(MAX)
TSTG
Non-repetitive peak surge current
Non-repetitive peak surge current
Maximum junction temperature
Storage temperature
Lead soldering temperature
PD
Power dissipation
Conditions
TJ = 150 °C, TC = 118°C (TO-220AC)
TJ = 150 °C, TC = 67°C (FullPak)
60 Hz, ½ cycle
½ cycle of t=28 µs Sinusoid, TC=25 °C
Leads at 1.6 mm from case, 10 sec
TC = 25 °C (TO-220AC)
TC = 25 °C (FullPak)
Rating
Units
600
10
V
A
70
350
150
–55 to 150
300
89
35
A
A
°C
°C
°C
W
W
Rating
Units
1.4
3.6
°C/W
°C/W
Thermal Resistance
Symbol
Resistance from:
Conditions
RθJC
RθJC
Junction to case
Junction to case
TO-220AC
FullPak
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January 2011
LXA10T600, LXA10FP600
Electrical Specifications at TJ= 25 °C (unless otherwise specified)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
-
1.2
2.4
2.1
51
250
3.0
-
µA
mA
V
V
pF
54
3.2
-
ns
ns
nC
nC
A
A
DC Characteristics
IR
Reverse current
VF
Forward voltage
CJ
Junction capacitance
VR = 600V, TJ = 25 °C
VR = 600V, TJ = 125 °C
IF = 10A, TJ = 25 °C
IF = 10A, TJ = 150 °C
VR = 10V, 1 MHz
Dynamic Characteristics
tRR
Reverse recovery time
dI/dt =200A/µs
VR=400V, IF=10A
QRR
Reverse recovery charge
dI/dt =200A/µs
VR=400V, IF=10A
IRRM
Maximum reverse
recovery current
dI/dt =200A/µs
VR=400V, IF=10A
S
t
Softness factor = b
dI/dt =200A/µs
VR=400V, IF=10A
ta
TJ=25 °C
TJ=125 °C
TJ=25 °C
TJ =125 °C
TJ =25 °C
TJ=125 °C
TJ =25 °C
TJ=125 °C
-
23
35
36
94
2.35
3.85
0.75
0.5
Note to component engineers: X-Series diodes employ Schottky technologies in their design and construction.
Therefore, Component Engineers should plan their test setups to be similar to those for traditional Schottky test setups.
(For additional details, see Application Note AN-300.)
VR
D1
DUT
L1
tRR
IF
dIF/dt
ta
15V
Pulse generator
tb
+
Rg
Q1
0
0.1xIRRM
IRRM
Figure 1. Reverse Recovery Definitions
Figure 2. Reverse Recovery Test Circuit
2
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Rev 1.1 01/11
LXA10T600, LXA10FP600
200
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
180
160
140
Tj=125C
Cj (pF)
IF (A)
Electrical Specifications at TJ= 25 °C (unless otherwise specified)
Tj=25C
120
100
80
60
40
20
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
20
40
60
80
250
50
140
160
180
dIF /dt=200A/us
45
dIF /dt=1000A/u
40
dIF /dt=500A/us
150
35
tR R (ns)
Q R R (nC)
120
Figure 4. Typical Cj vs VR
Figure 3. Typical IF vs VF
200
100
VR (V)
VF (V)
100
dIF /dt=200A/us
dIF /dt=500A/us
30
25
20
dIF /dt=1000A/us
15
10
50
5
0
0
0
2
4
6
8
10
12
14
16
18
20
0
22
2
4
6
8
10
14
16
18
20
22
Figure 6. Typical tRR vs IF at TJ = 125 °C
Figure 5. Typical QRR vs IF at TJ = 125 °
30
100
90
80
25
TO-220
TO-220
70
P (W)
20
IF(AV) (A)
12
IF (A)
IF (A)
15
FullPak
10
60
50
40
FullPak
30
20
5
10
0
0
25
50
75
100
125
o
Case Temperature, TC ( C)
Figure 7. DC Current Derating Curve
150
25
50
75
100
125
150
o
Case Temperature, TC ( C)
Figure 8. Power Derating Curve
3
Rev 1.1 01/11
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duty cycle=10%
55
50
45
40
35
30
25
20
15
10
5
0
duty cycle=30%
duty cycle=50%
DC
IF (PEAK) (A)
IF (PEAK) (A)
LXA10T600, LXA10FP600
25
50
75
100
T C(°C)
125
duty cycle=10%
55
50
45
40
35
30
25
20
15
10
5
0
150
duty cycle=30%
duty cycle=50%
DC
25
Figure 9. IF(PEAK) vs TC, f=70 kHz, TO-220
50
75
100
T C(°C)
125
150
Figure 10. IF(PEAK) vs TC, f=70 kHz, FullPak
LXA10T600
1
D= 0.5
D = 0.3
D= 0.1
0.1
Zth(j-c)/Rth(j-c)
D= 0.05
D= 0.02
D= 0.01
0.01
D=0.005
D=0.002
Single Pulse
0.001
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
t1(sec)
Figure 11. Normalized Maximum Transient Thermal Impedance, TO-220
4
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Rev 1.1 01/11
LXA10T600, LXA10FP600
LXA10FP600
1
D= 0.5
D = 0.3
0.1
D= 0.1
Zth(j-c)/Rth(j-c)
D= 0.05
D= 0.02
0.01
D= 0.01
D=0.005
D=0.002
0.001
Single Pulse
0.0001
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
t1(sec)
Figure 12. Normalized Maximum Transient Thermal Impedance, FullPak
5
Rev 1.1 01/11
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LXA10T600, LXA10FP600
Dimensional Outline Drawings
TO-220AC
Millimeters
Dim
MIN
MAX
A
4.32
4.70
A1
1.14
1.40
A2
2.03
2.79
C
0.34
0.610
D
9.65
10.67
E
2.49
2.59
E1
4.98
5.18
F
0.508
1.016
F1
1.14
1.78
H
14.71
16.51
H1
5.84
6.55
H2
8.51
9.25
H3
3.53
3.96
H4
2.54
3.05
L
12.70
14.22
L1
-
6.35
FullPak
A
D
H4
Millimeters
A1
H3 H1
H
H2
Dim
MIN
MAX
A
4.54
4.80
A1
2.57
2.83
A2
2.51
2.62
C
0.42
0.58
D
10.25
10.72
E
E1
F
L1
F1
L
F
C
A2
E
E1
2.54 (BSC)
5.08 (BSC)
0.624
0.776
F1
1.10
1.65
H
15.86
16.12
H1
6.06
6.56
H2
9.55
9.81
H3
2.95
3.05
H4
3.15
3.25
L
13.33
14.18
L1
3.18
3.43
6
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Rev 1.1 01/11
LXA10T600, LXA10FP600
Mechanical Mounting
Method
Maximum Torque / Pressure specification
Screw through hole in package tab
Clamp against package body
1 Newton Meter (nm) or 8.8 inch-pounds (lb-in)
12.3 kilogram-force per square centimeter (kgf/cm2) or 175 lbf/in2
Soldering time and temperature: This product has been designed for use with hightemperature, lead-free solder. The component leads can be subjected to a maximum
temperature of 300 °C, for up to 10 seconds. See Application Note AN-303, for more
details.
Ordering Information
Part Number
Package
Packing
LXA10T600, LXA10FP600
TO-220, FullPak
50 units/tube
The information contained in this document is subject to change without notice.
7
Rev 1.1 01/11
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LXA10T600, LXA10FP600
Revision
1.0
1.1
Notes
Released by Qspeed
Converted to Power Integrations Document
Date
06/10
01/11
8
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Rev 1.1 01/11
LXA10T600, LXA10FP600
For the latest updates, visit our website: www.powerint.com
Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability.
Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER
INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING,
WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS.
PATENT INFORMATION
The products and applications illustrated herein (including transformer construction and circuits external to the products)
may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications
assigned to Power Integrations. A complete list of Power Integrations’ patents may be found at www.powerint.com. Power
Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm.
The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS,
Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc.
Other trademarks are property of their respective companies. ©Copyright 2011 Power Integrations, Inc.
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