05131 SFC05-4 Only One Name Means ProTek’Tion™ 300w flip chip tvs array Description The SFC05-4 is a 5 Volt, flip chip transient voltage suppressor (TVS) array designed to provide protection for power bus, data, control or I/O lines. Rated at 300 Watts peak pulse power for an 8/20µs waveshape, this device protects 4 unidirectional lines. This device is a type of chip scale package (CSP) that can be mounted onto a printed circuit board or in a connector requiring a limited amount of space and is compatible with “pick and place” equipment for automatic assembly. The SFC05-4 is compatible with IEC 61000-4-2 (ESD), 61000-4-4(EFT) and 61000-4-5(Surge) requirements. quad package Features applications • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV • Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns • Compatible with IEC 61000-4-5 (Surge): 24A, 8/20µs - Level 2(Line Gnd) & Level 3 (Line - Line) • ESD Protection > 25 kilovolts • 300 Watts Peak Pulse Power per Line (tp = 8/20µs) • Protects up to 4 Unidirectional Lines • RoHS Compliant • REACH Compliant • Cellular Phones • SMART Phones • PCMCIA Cards • Ground Positioning System (GPS) Mechanical characteristics • Quad Flip Chip Package • Approximate Weight: 0.73 milligrams • Lead-Free Plating • Solder Reflow Temperature: • Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C • Flammability Rating UL 94V-0 • 8mm Tape per EIA Standard 481 • Top Contacts: Solder Bump 0.004” in Height (Nominal) PIN CONFIGURATION 05131.R8 2/11 6 5 4 1 2 TOP VIEW 3 Page 1 www.protekdevices.com 05131 SFC05-4 Only One Name Means ProTek’Tion™ typical device characteristics MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature SYMBOL VALUE UNITS PPP 300 Watts TA -55 to 150 °C TSTG -55 to 150 °C ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER SFC05-4 05131.R8 2/11 RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE @ 1mA V(BR) VOLTS MAXIMUM CLAMPING VOLTAGE (Fig. 2) @ I P = 5A VC VOLTS MAXIMUM CLAMPING VOLTAGE (Fig. 2) V WM VOLTS 5.0 6.0 9.5 Page 2 MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE @ 8/20µs VC @ I PP @V WM ID µA @0V, 1MHz Cj pF 11.0V @ 24.0A 10 150 www.protekdevices.com 05131 SFC05-4 Only One Name Means ProTek’Tion™ typical device characteristics figure 1 peak pulse power vs pulse time PPP - Peak Pulse Power - Watts 10,000 1,000 300W, 8/20µs Waveform 100 10 0.1 10 100 td - Pulse Duration - µs Peak Value IPP 80 100 TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs e-t 60 40 10,000 figure 3 power derating curve Peak Pulse Power 8/20µs 80 % Of Rated Power tf 100 td = t/(IPP/2) 60 40 20 20 0 1,000 figure 2 pulse wave form 120 IPP - Peak Pulse Current - % of IPP 1 0 05131.R8 2/11 5 10 15 t - Time - µs 20 25 0 30 Page 3 Average Power 0 25 50 75 100 125 TA - Ambient Temperature - °C 150 www.protekdevices.com 05131 SFC05-4 Only One Name Means ProTek’Tion™ typical device characteristics figure 4 overshoot & clamping voltage 35 5 Volts per Division 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (Waveshape) figure 5 typical clamping voltage vs peak pulse current VC - Clamping Voltage - Volts 12 8 4 0 0 05131.R8 2/11 5 10 IPP - Peak Pulse Current - Amps Page 4 15 20 www.protekdevices.com 05131 SFC05-4 Only One Name Means ProTek’Tion™ spice model figure 1 spice model for I/O ABD GND ABD - Avalanche Breakdown Diode (TVS) table 1 - spice parameters 05131.R8 2/11 parameter unit abd(tvs) BV V 6 IBV µA 1 Cjo pF 20 IS A 1E-12 Vj V - M - 0.33 N - 1 RS Ohms 0.28 TT s 1E-8 EG eV 1.11 Page 5 www.protekdevices.com 05131 SFC05-4 Only One Name Means ProTek’Tion™ SOLDER REFLOW INFORMATION printed circuit board recommendations parameter value Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask Defined Pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.150mm Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) 0.330mm Round Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance - Edge To Corner Ball ±50µm Solder Ball Side Coplanarity ±20µm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Soldering Maximum Temperature 270°C Requirements recommended non-solder mask defined pad illustration Temperature: TP for Lead-Free (Sn/Ag/Cu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area and plating. Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. Maximum Solder Reflow (35-53°C Above Maximum Solder Melt Temp) TP Solder Melt (Maximum Temp) Temperature - °C Ramp-Up Ramp-Down Preheat (Stay Below Flux Activation Temp) 30-60 seconds 05131.R8 2/11 Ramp-Up 15 seconds (Minimize) Page 6 Solder-Time 15-20 seconds Ramp-Down www.protekdevices.com 05131 SFC05-4 Only One Name Means ProTek’Tion™ quad package information outline dimensions dim millimeters min inches max min max A 0.510 0.020 B 0.510 0.020 C 0.98 E F 0.038 1.53 0.058 0.10 0.003 0.15 SQ 1.47 G H 1.02 0.006 SQ 0.15 0.076 I 0.040 0.060 0.006 0.419 0.004 0.0165 Notes 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). B TOP A C SIDE G F END 05131.R8 2/11 E H I Page 7 www.protekdevices.com 05131 SFC05-4 Only One Name Means ProTek’Tion™ quad package information option 1 - layout dimensions dim millimeters min max A inches min max A 0.305 0.012 B 0.457 0.018 C 0.203 0.008 D 0.254 0.010 E 0.510 0.020 F 0.990 0.039 G 0.510 0.020 DIE SOLDER BUMPS C F E B G Notes 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 3. Preferred: Using 0.1mm (0.004”) stencil. D SOLDER PRINT 0.010” - 0.012” DIA. option 2 - layout dimensions dim millimeters min max A inches min max A 0.51 0.020 F 0.15 SQ 0.006 SQ G 0.71 0.028 H 0.99 0.039 I 0.51 0.020 DIE SOLDER BUMPS D C E Notes 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 3. Preferred: Using 0.1mm (0.004”) stencil. B SOLDER PRINT 0.014” [0.36] DIA. 05131.R8 2/11 Page 8 www.protekdevices.com 05131 SFC05-4 Only One Name Means ProTek’Tion™ TAPE AND REEL information D t P2 Top Cover Tape 10 Pitches Cumulative Tolerance on tape ± 0.2 E P0 A0 F K0 W B0 P User Direction of Feed specifications Reel Dia. Tape Width 178(7”) 8 A0 B0 K0 D E F P0 P2 P tmax 0.80 ± 0.10 1.20 ± 0.10 0.70 ± 0.10 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.30 4.00 ± 0.12 2.00 ± 0.10 2.00 ± 0.10 Notes 1. 2. 3. 4. 5. 6. W 0.25 tape & reel orientation Dimensions in millimeters. Top view of tape. Solder bumps are face down in tape package. Orientation: preferred stencil - 0.1mm (0.004”). Surface mount product is taped and reeled in accordance with EIA 481. 8mm plastic tape: 7” Reels - 5,000 pieces per reel. Marking on Reel - part number, date code and lot number. 1 6 2 5 3 4 Package outline, pad layout and tape specifications per document number 06039.R2 9/09. ORDERING INFORMATION base PART NUMBER LEADFREE SUFFIX TAPE SUFFIX QTY/REEL REEL SIZE TUBE qty SFC05-4 -LF -T75-1 5,000 7” n/a 05131.R8 2/11 Page 9 www.protekdevices.com 05131 SFC05-4 Only One Name Means ProTek’Tion™ company information COMPANY PROFILE ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), inductive switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide application specific protection solutions for all electronic equipment/systems. ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products. CONTACT US Corporate Headquarters 2929 South Fair Lane Tempe, Arizona 85282 USA By Telephone General: 602-431-8101 Sales: 602-414-5109 Customer Service: 602-414-5114 By Fax General: 602-431-2288 By E-mail: Sales: [email protected] Customer Service: [email protected] Technical Support: [email protected] Web www.protekdevices.com www.protekanalog.com COPYRIGHT © ProTek Devices 2007 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”. 05131.R8 2/11 Page 10 www.protekdevices.com